CN216141483U - Easily peeled thermal viscosity reduction protective film - Google Patents
Easily peeled thermal viscosity reduction protective film Download PDFInfo
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- CN216141483U CN216141483U CN202120909578.4U CN202120909578U CN216141483U CN 216141483 U CN216141483 U CN 216141483U CN 202120909578 U CN202120909578 U CN 202120909578U CN 216141483 U CN216141483 U CN 216141483U
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- peel
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Abstract
The utility model relates to the technical field of protective films, in particular to an easily-stripped thermal anti-adhesion protective film. The easily-stripped thermal-release protective film is not easy to shrink, wrinkle or deform, is easy to strip, and does not have the phenomenon of adhesive residue.
Description
Technical Field
The utility model relates to the technical field of protective films, in particular to an easily-stripped thermal-viscosity-reduction protective film.
Background
The adhesive reducing film is a special adhesive tape which has strong viscosity in a normal state, is usually used in the field of packaging, is used for grinding and cutting wafers, and can also be used for grooving, cutting, pickling and the like of various coated glass and common glass. The viscosity of the anti-adhesive film in the prior art is sharply reduced after heating, but the condition of residual adhesive after peeling exists, so that the quality of a workpiece is influenced, and another process is added for subsequent adhesive removal.
CN210012792U discloses a UV adhesive reducing film, but the adhesive reducing film can only remove the adhesive from the adhesive reducing film under specific UV conditions.
CN206635285U discloses an antistatic support protective film, which has antistatic function, but the protective film has large thickness and poor peeling effect.
Therefore, it is necessary to develop an easily peelable thermal adhesion-reducing protective film to meet the market demand.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the prior art, the utility model provides an easily-stripped thermal-release protective film, which is prepared from a base material layer, a pressure-sensitive adhesive layer, a thermal-release layer and an easily-stripped layer.
In a preferred embodiment, the thermal anti-sticking protective film is formed by sequentially laminating a substrate layer, a pressure-sensitive adhesive layer, a thermal anti-sticking layer and an easy-to-peel layer in the order from top to bottom.
As a preferred embodiment, the raw material for preparing the substrate layer is selected from at least one of a PVC substrate, a PET substrate, a PO substrate, a PVC substrate, and a PET substrate.
Preferably, the preparation raw material of the substrate layer is selected from PET substrates.
As a preferred embodiment, the raw material for preparing the pressure-sensitive adhesive layer is selected from acrylate pressure-sensitive adhesives, silicone pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives and polyacrylate pressure-sensitive adhesives.
Preferably, the raw material for preparing the pressure-sensitive adhesive layer is selected from acrylate pressure-sensitive adhesives.
As a preferred embodiment, the raw material for preparing the thermal anti-sticking layer is selected from heat-sensitive adhesive materials.
As a preferred embodiment, the easy-release layer is selected from polyester release films.
In a preferred embodiment, the thermal de-bonding layer has a thickness of not less than 18 μm.
The applicant found through experiments that when the thickness of the thermal adhesive reduction layer is less than 18 μm, although the thermal adhesive reduction protective film is more easily peeled off after being heated, the adhesive force between the thermal adhesive reduction layer and the pressure-sensitive adhesive layer is greatly reduced, and the film is delaminated.
In a preferred embodiment, the thickness of the easy-stripping layer is 22-55 μm.
As a preferred embodiment, the thickness ratio of the substrate layer to the pressure-sensitive adhesive layer is 10: 1.
when the thickness ratio of the base material layer to the pressure-sensitive adhesive layer is 10: 1, the pressure-sensitive adhesive layer can be used for bonding the substrate layer completely, and the stripping effect cannot be influenced by the fact that the thermal-release protective film is too thick due to too thick pressure-sensitive adhesive layer.
As a preferred embodiment, the total thickness of the thermal adhesion-reducing layer and the easy-release layer accounts for 20 to 40% of the total thickness of the thermal adhesion-reducing protective film.
The applicant finds through experiments that when the total thickness of the thermal de-bonding layer and the easy-peeling layer accounts for 20-40% of the total thickness of the thermal de-bonding protective film, the protective effect on the base material can be achieved, the peeling effect cannot be influenced due to the fact that the adhesive layer is too thick, the film layers can be tightly attached, and the phenomena of layering, wrinkling and edge rising cannot occur.
Compared with the prior art, the utility model has the following beneficial effects:
1. the easily peelable thermal adhesion reduction protective film of the present invention has excellent stability and retractability, is less likely to break when the film is stretched, and does not cause breakage of a wafer when expanded.
2. The easily-stripped thermal-release protective film is not easy to shrink, wrinkle or deform.
3. The easily-stripped thermal-release protective film is easy to strip and does not have the phenomenon of adhesive residue.
Drawings
FIG. 1 is a schematic view of an easily peelable thermal de-bonding protective film;
the reference numbers in the figures illustrate:
1-substrate layer, 2-pressure sensitive adhesive layer, 3-thermal anti-sticking layer, and 4-easy stripping layer.
Detailed Description
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
PET substrate purchased from Shenzhen Xin Rui Bao photoelectricity Limited
Acrylic pressure sensitive adhesives are available from Shandong Han Master New materials Co Ltd
Heat sensitive adhesive Material purchased from Xijinan Hui Chuan chemical Co., Ltd
Polyester release film was purchased from Dongxin composite Co., Ltd, Dongguan
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
The embodiment provides an easily-stripped thermal anti-adhesion protective film, which comprises a base material layer, a pressure-sensitive adhesive layer, a thermal anti-adhesion layer and an easily-stripped layer; the thermal anti-sticking protective film is formed by sequentially laminating a base material layer, a pressure-sensitive adhesive layer, a thermal anti-sticking layer and an easy-to-peel layer in a sequence from top to bottom.
The preparation raw material of the substrate layer is selected from a PET substrate, and the thickness of the preparation raw material is 150 micrometers.
The raw materials for preparing the pressure-sensitive adhesive layer are selected from acrylate pressure-sensitive adhesives, and the thickness of the pressure-sensitive adhesive layer is 15 micrometers.
The preparation raw material of the thermal anti-sticking layer is selected from a thermal sensitive adhesive material, and the thickness of the thermal anti-sticking layer is 20 micrometers.
The easy-to-peel layer is a polyester release film with the thickness of 25 mu m.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may modify or change the technical content disclosed above into an equivalent embodiment with equivalent changes, but all those modifications, equivalents and changes made to the above embodiment according to the technical spirit of the present invention are still within the protection scope of the present invention.
Claims (7)
1. An easily peelable thermal de-bonding protective film characterized in that: the thermal anti-sticking protective film comprises a base material layer, a pressure-sensitive adhesive layer, a thermal anti-sticking layer and an easy-to-peel layer;
the thermal anti-sticking protective film is formed by sequentially laminating a base material layer, a pressure-sensitive adhesive layer, a thermal anti-sticking layer and an easy-to-peel layer in a sequence from top to bottom.
2. The easy-to-peel thermal release protective film according to claim 1, wherein: the preparation raw material of the thermal anti-sticking layer is selected from a thermal sensitive adhesive material.
3. The easy-to-peel thermal release protective film according to claim 1, wherein: the easy-to-peel layer is selected from polyester release films.
4. The easy-to-peel thermal release protective film according to claim 1, wherein: the thickness of the thermal anti-sticking layer is not less than 18 mu m.
5. The easy-to-peel thermal release protective film according to claim 1, wherein: the thickness of the easy-stripping layer is 22-55 μm.
6. The easy-to-peel thermal release protective film according to claim 1, wherein: the thickness ratio of the base material layer to the pressure-sensitive adhesive layer is 10: 1.
7. the easy-to-peel thermal release protective film according to claim 1, wherein: the total thickness of the thermal viscosity-reducing layer and the easy-release layer accounts for 20-40% of the total thickness of the thermal viscosity-reducing protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120909578.4U CN216141483U (en) | 2021-04-28 | 2021-04-28 | Easily peeled thermal viscosity reduction protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120909578.4U CN216141483U (en) | 2021-04-28 | 2021-04-28 | Easily peeled thermal viscosity reduction protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216141483U true CN216141483U (en) | 2022-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120909578.4U Active CN216141483U (en) | 2021-04-28 | 2021-04-28 | Easily peeled thermal viscosity reduction protective film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216141483U (en) |
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2021
- 2021-04-28 CN CN202120909578.4U patent/CN216141483U/en active Active
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