JP2004002805A - Self adhesive processing sheet - Google Patents
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- JP2004002805A JP2004002805A JP2003107177A JP2003107177A JP2004002805A JP 2004002805 A JP2004002805 A JP 2004002805A JP 2003107177 A JP2003107177 A JP 2003107177A JP 2003107177 A JP2003107177 A JP 2003107177A JP 2004002805 A JP2004002805 A JP 2004002805A
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、ステッカー、ラベルなどに用いる粘着加工シートに関する。
【０００２】
【従来の技術】
従来の粘着加工シートは、シート基材に粘着剤を平坦に塗布して形成された粘着シート体と、その平坦な粘着剤塗布面に貼合された剥離シートから構成されている。剥離シートの剥離処理面は平坦面になっており、剥離シートを剥がし、粘着剤塗布面を被粘着体に貼り使用するものである。
【０００３】
【発明が解決しようとする課題】
このような粘着加工シートは、粘着シート基材と被粘着体との間に空気を巻き込むことが多く、空気溜まり部分がいわゆるフクレとなり、貼り付けた粘着シート基材の表面側に凸部が生じ、そのため著しく外観を損ねるという問題があった。特に、粘着シート基材の面積が大きい場合、また、被粘着体の表面が平滑である場合に顕著であった。
また、上記粘着シート基材を貼り付ける位置を間違えた場合、貼り直しをしなければならないが、一旦貼り付けた粘着シート基材は、強固な粘着力を有するため、貼り直しのために剥がした場合に粘着シート基材が破れたりしわが入ったり、剥離後の粘着強度が低下したりして再度貼り付けることが困難であった。
上記のような問題を解決するために、特許文献１、特許文献２などでこれまでに様々な粘着加工シートが提案されている。しかしそれらの技術は通常の粘着加工シートよりも生産性が劣り、コスト高であった。
そこで本発明は、上述の問題を解決して貼着時または貼着後にフクレを生じることがなく、且つ生産性に優れて安価な粘着加工シートを提供することを目的とした。
【０００４】
【特許文献１】
特開平０３−２４３６７７号公報
【特許文献２】
実開平０６−０２００４３号公報
【０００５】
【課題を解決するための手段】
本発明者らは、上記課題を解決するために鋭意研究を行った結果、シート基材Ａと、多数の小突起部ｂを有する粘着剤層Ｂと、この多数の小突起部ｂに対応して密着する厚み方向に貫通した多数の穿孔構造を有する剥離シートＣから構成される粘着加工シートが施工性に優れることを見い出し、本発明を完成するに至った。
すなわち本発明は、シート基材Ａ、多数の小突起部ｂを有する粘着剤層Ｂ、およびこの多数の小突起部ｂに対応して密着する厚み方向に貫通した多数の穿孔構造を有する剥離シートＣから構成したことを特徴とする粘着加工シートを提供するものである。
【０００６】
本発明の好ましい実施態様では、小突起部ｂが、上記粘着剤層Ｂの基本平坦面から突出し、該小突起部ｂの高さ寸法Ｈが１〜１５０μｍの範囲であることが好ましい。また、剥離シートＣの穿孔数が、５個／ｃｍ２ 以上の頻度で分布していることが好ましく、剥離シートＣの肉厚が５〜１５０μｍであることが好ましく、剥離シートＣの穿孔径が５〜２０００μｍであることが好ましい。
さらに、剥離シートＣの厚み方向に貫通した穿孔構造がダイヤモンド粒子付きローラー、熱針、抜き刃を利用した機械的穿孔法、レーザー光穿孔法、電子照射穿孔法、プラズマ穿孔法、高圧放電穿孔法から選ばれた、少なくとも一つの穿孔法を用いて穿孔処理されたことも含むものである。
剥離シートＣの厚み方向に貫通した穿孔構造を付与することにより、粘着加工時に粘着剤層Ｂの粘着剤が穿孔部に流入し、多数の独立した小突起部ｂが形成される。この小突起部ｂを設けることにより、粘着剤層Ｂの粘着面を被粘着体に軽く貼り付けた際、粘着剤層Ｂ上の小突起部ｂのみが被粘着体に粘着し、粘着面と被粘着体との間に隙間が生じる。
【０００７】
このような構造を付与することで粘着剤層の基準面と被粘着体との間に外部に連通する隙間が生じる。この結果、外部に連通する隙間から空気を外部に容易に抜くことができ、いわゆるフクレを生じることなく貼り付けることができる。
更に、粘着剤層Ｂの粘着面を被粘着体に軽く貼り付けた場合、粘着剤層Ｂ上の小突起部ｂの先端部のみが被粘着体に密着しているため密着面積が小となる。このため、貼り替え直す際に、再び剥がして貼り直すことが容易にできる。また、再剥離に伴う粘着強度の低下を抑えることが可能となる。
また、剥離シートＣの多数の穿孔を有する剥離処理面に粘着剤を塗布することにより、多数の小突起部ｂを有する粘着剤層Ｂを容易に形成することができる。
【０００８】
【発明の実施の形態】
（シート基材Ａ）
シート基材Ａの材質としては、特に制限はなく、天然紙、プラスチックフィルム、不織布など各種素材が適用できる。特に、ポリオレフィン、ポリエチレンテレフタレートなどのプラスチックフィルム、またはポリオレフィン、ポリエチレンテレフタレートからなる合成紙は、再剥離時、剥離助剤を使用しなくても、破壊せず、きれいに剥離できるのため好ましい。
シート基材Ａの肉厚は３０〜５００μｍであり、好ましくは４０〜４００μｍである。
【０００９】
（剥離シートＣ）
剥離シートＣの材質は特に制限はなく、天然紙を基材としたものでも、プラスチックを基材としたものでも良い。例を挙げれば、グラシン紙、上質紙、コーテッド紙、ポリエチレン、ポリプロピレン、ポリエチレンテレフタレート、ポリアミド等のプラスチックフィルム、又はこれらのプラスチックを紙に片面又は両面にラミネートしたラミネート紙、金属箔、又は金属箔と紙、プラスチックフィルムとの貼り合わせ品等が挙げられる。
【００１０】
本発明の剥離シートＣの肉厚は、取扱強度、穿孔容易性等の点から、その肉厚は５〜１５０μｍが好ましく、より好ましくは１０〜１３０μｍであり、その表面は平滑であることが好ましいが、剥離性能のコントロール上、粗面であってもかまわない。剥離シートＣの肉厚が５μｍ未満では、粘着加工時貼合圧力が高い場合、または粘着加工後ロール状態で保管した際のロールの巻き締まりにより、穿孔から粘着剤層Ｂが漏れ出し、下巻き部のシート基材Ａに粘着するため好ましくない。また、１５０μｍを超えては剥離シートＣのコストが高くなるため好ましくない。
剥離シートＣ上に剥離剤を塗布する前に、剥離シートＣ表面にコロナ放電、フレーム処理、オゾン処理等の表面処理を行なっても良い。
なお、剥離剤としては、シリコン樹脂、フッ素樹脂、アミノアルキド樹脂、ポリエステル樹脂等があり、エマルジョンや溶剤型または無溶剤型として使用されるが、好ましくはシリコン樹脂である。
【００１１】
（穿孔処理）
本発明の剥離シートＣに設けられる穿孔構造は、厚み方向に貫通していることが必須であり、剥離シートＣの肉厚の範囲内で使用する粘着剤層の粘度を調整することにより容易に小突起部ｂの高さＨをコントロールすることができる。これは例えば剥離シートにエンボス加工を施して剥離シートに凹部を形成し、次に剥離シートに粘着剤を塗布し凹部に対応した粘着剤の凸部を設ける方法の場合、粘着剤の凸部高さをコントロールするためには、対応する剥離シートの凹部の深さに応じて各種のエンボス加工ロールが必要になることに比較して、本発明の剥離シートＣを用いれば粘着シート基材の使用目的に応じて小突起部ｂの高さＨを非常に簡便に調整できる。
【００１２】
剥離シートＣを貫通し穿孔構造を形成する方法として、ダイヤモンド粒子付きローラー、熱針、抜き刃を利用した機械的穿孔法、レ−ザ−光穿孔法、電子照射穿孔法、プラズマ穿孔法、高圧放電穿孔法から選ばれた少なくとも一つの穿孔法が適用でき、剥離シートＣの材質、肉厚、通過速度、穿孔径に応じて適宜選択することができる。
剥離シートＣに形成する穿孔数は、５個／ｃｍ２ 以上の頻度で剥離シートＣ上に分布していることが好ましい。より好ましくは５〜１０，０００個／ｃｍ２ である。穿孔数が５個／ｃｍ２ 未満である場合、被着体に粘着加工シートを軽く貼り付けた際、形成される小突起部の数が不足して、被着体と粘着剤層の間の隙間が潰れやすくなるため空気が抜けず、結果としてフクレが生じやすくなる。また穿孔は剥離シートＣ上に均等に分布していることが、穿孔数が少なくても上記フクレが生じない点で好ましい。
穿孔径は５〜２０００μｍであることが好ましく、より好ましくは１０〜１５００μｍである。穿孔径が５μｍ未満では、粘着加工時、穿孔へ粘着剤が流入せず、本発明の目的である粘着剤層Ｂ上に小突起ｂが生じにくくなるため好ましくない。また、２０００μｍより大きい場合、穿孔から粘着剤が漏れ出し下巻き部のシート基材Ａに粘着するため好ましくない。
【００１３】
（粘着剤層Ｂ）
本発明の粘着剤層Ｂの種類や厚さ（塗工量）は、シート基材Ａの種類や使用される環境、粘着の強度等により種々選択が可能である。
一般に用いられる水系もしくは溶剤系の粘着剤を塗工し、乾燥して形成でき、天然ゴム系、合成ゴム系、アクリル系等が使用でき、これらの合成高分子系粘着剤は、有機溶媒溶液や、ディスパージョンやエマルジョンといった水に分散された形態で使用可能である。
塗工方法：
粘着剤の塗工方式は何ら限定されないが、例えば、コンマコート塗工、リバースコート塗工、グラビアコート塗工、リバースグラビア塗工、キスコート塗工、ナイフコート塗工、バーコート塗工、カーテンコート塗工および工程紙にこれらの方式で塗布したものを転写させる転写法などが挙げられる。
【００１４】
小突起部ｂの作成方法：
粘着層Ｂに設ける小突起部ｂは、穿孔処理した剥離シートＣを用いることによって、粘着剤塗工加工時、穿孔へ粘着剤が流入し形成される。
更に剥離シートＣに設けられる穿孔構造が厚み方向に貫通しているため、剥離シートＣの肉厚の範囲内で使用する粘着剤層の粘度を調整することにより容易に小突起部ｂの高さＨをコントロールすることができる。
小突起部ｂの高さＨは１〜１５０μｍが好ましく、より好ましくは５〜１００μｍ、更に好ましくは２６〜８０μｍである。小突起部ｂの高さＨが１μｍ未満では剥離シートを剥がして粘着加工シートを被粘着体に張り付け時、フクレが発生し易くなる。また１５０μｍを超えて大きい場合には、被粘着体に貼り付け時、表面凹凸が発生するため好ましくない。
【００１５】
【実施例】
以下に実施例などを挙げて本発明をさらに具体的に説明するが、本発明はこれらの実施例などにより何ら限定されるものではない。
（実施例１）
肉厚６０μｍのポリプロピレンフィルム（東洋紡績（株）製、商品名；パイレンＰ２７６１）を熱針穿孔法を用いて貫通穿孔処理し、この片面にシリコン処理を施し、剥離シートＣとした。孔径は４００μｍ、孔数は６０個／ｃｍ２ であった。この剥離シートＣのシリコン面に粘着剤層Ｂとして、溶剤系アクリル系粘着剤を乾燥後の塗工量が３０ｇ／ｍ２ となるようにコンマコーターで塗工し、乾燥して、粘着シート（Ｂ＋Ｃ）とした。シート基材Ａとして肉厚８０μｍの合成紙（（株）ユポ・コーポレーション製、商品名；ユポＳＧＳ−８０）と粘着シート（Ｂ＋Ｃ）を貼合し粘着加工シートを得た。得られた粘着加工シートの物性を表１に示した。
【００１６】
〔小突起部ｂ高さ〕
穿孔部断面をミクロトームにて切り出し、市販のイオンコーターでイオンエッジング及び金蒸着した後、走査型電子顕微鏡（日立ハイテクノロジー社製、Ｓ−３０００Ｎ）にて、断面形態から算出した。
〔施工性〕
本発明の粘着加工シートの剥離シートＣを剥がし、透明で高平滑なガラス板に軽く貼り付けた後、再剥離し、再剥離し易さを判定した。また、軽く貼り付けた後、バレンを使用して、手で圧着した際のフクレを目視し、以下のように判定した。
○ ： 再剥離し易く、フクレが見られない
△ ： 再剥離、フクレ発生のいずれかに難点がある
× ： 再剥離し難く、フクレ発生する
〔粘着剤層Ｂのはみ出し〕
本発明の粘着加工シートの穿孔面と肉厚６０μｍのポリプロピレンフィルム（東洋紡製、商品名；パイレンＰ２７６１）を重ね、温度５０℃、５ｋｇ／ｃｍ２ 加圧下、２４時間処理し、判定した。
○ ： 穿孔面とポリプロピレンフィルムが粘着しない
× ： 穿孔面とポリプロピレンフィルムが粘着する
【００１７】
（実施例２）
市販の肉厚１９０μｍの粘着加工シート（商品名：ＸＪＰ−１９０、（株）ユポ・コーポレーション製）の剥離シートを剥がし、この粘着加工シートの粘着剤層面と実施例１で得た剥離シートＣのシリコーン処理面が接する様に積層し、粘着加工シートを得た。得られた粘着加工シートの物性を表１に示す。
【００１８】
（実施例３）
肉厚４０μｍのポリプロピレンフィルム（東洋紡績（株）製、商品名；パイレンＰ２１６１）を熱針穿孔法を用いて貫通穿孔処理し、この片面にシリコン処理を施し、剥離シートＣとした。孔径は４００μｍ、孔数は６０個／ｃｍ２ であった。この片面にシリコン処理を施し、剥離シートＣとした。次にシート基材Ａとして肉厚８０μｍの合成紙（（株）ユポ・コーポレーション製、商品名；ユポＳＧＳ−８０）に粘着剤層Ｂとして、溶剤系アクリル系粘着剤を乾燥後の塗工量が３０ｇ／ｍ２ となるようにコンマコーターで塗工し、粘着シート（Ａ＋Ｂ）とした。前述の剥離シートＣのシリコン面と粘着シート（Ａ＋Ｂ）を貼合し粘着加工シートを得た。得られた粘着加工シートの物性を表１に示した。
【００１９】
（比較例１）
肉厚６０μｍのポリプロピレンフィルム（東洋紡績（株）製、商品名；パイレンＰ２７６１）の片面にシリコン処理を施し、剥離シートＣとした以外は実施例１と同様の操作を行い、粘着加工シートを得た。得られた粘着加工シートの物性を表１に示した。
【００２０】
【表１】
【発明の効果】
表１から明らかなように、本発明の粘着加工シートを使用することにより、再剥離が容易で、且つシート施工時にフクレの発生しないため、大判のステッカー、ラベル、タックシートに利用可能である。
【図面の簡単な説明】
【図１】本発明の粘着加工シートの基本構成断面図である。
【図２】本発明の剥離シートＣの形態の概略図である。
【符号の説明】
１ シート基材Ａ
２ 粘着剤層Ｂ
３ 小突起部ｂ
４ 剥離シートＣ
Ｈ 小突起部ｂの高さ寸法[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an adhesive sheet used for stickers, labels, and the like.
[0002]
[Prior art]
A conventional pressure-sensitive adhesive sheet is composed of a pressure-sensitive adhesive sheet formed by applying a pressure-sensitive adhesive to a sheet base material, and a release sheet bonded to the flat pressure-sensitive adhesive-coated surface. The release-treated surface of the release sheet is flat, the release sheet is peeled off, and the pressure-sensitive adhesive-coated surface is used by sticking to the adherend.
[0003]
[Problems to be solved by the invention]
Such pressure-sensitive adhesive sheets often involve air between the pressure-sensitive adhesive sheet substrate and the adherend, so that the air pockets become so-called blisters, and a convex portion is formed on the surface side of the pressure-sensitive adhesive sheet substrate. Therefore, there is a problem that the appearance is significantly impaired. In particular, it was remarkable when the area of the pressure-sensitive adhesive sheet substrate was large and when the surface of the pressure-sensitive adhesive body was smooth.
In addition, if the position of the pressure-sensitive adhesive sheet substrate is incorrectly attached, the pressure-sensitive adhesive sheet substrate must be re-applied, but once the pressure-sensitive adhesive sheet substrate has a strong adhesive force, it is peeled off for re-applying. In such a case, the adhesive sheet substrate was broken or wrinkled, or the adhesive strength after peeling was reduced, so that it was difficult to attach the adhesive sheet again.
In order to solve the above-described problems, various pressure-sensitive adhesive sheets have been proposed in
Therefore, an object of the present invention is to solve the above-mentioned problem and to provide an inexpensive pressure-sensitive adhesive sheet which does not cause blisters at the time of adhering or after adhering, has excellent productivity, and is inexpensive.
[0004]
[Patent Document 1]
JP 03-243677 A [Patent Document 2]
Japanese Utility Model Laid-Open No. 06-020043 [0005]
[Means for Solving the Problems]
The present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, the sheet base material A, the pressure-sensitive adhesive layer B having a large number of small projections b, and the large number of small projections b It has been found that a pressure-sensitive adhesive sheet composed of a release sheet C having a large number of perforated structures penetrating in the thickness direction in which it adheres closely has excellent workability, and has completed the present invention.
That is, the present invention provides a release sheet having a sheet base material A, an adhesive layer B having a large number of small projections b, and a large number of perforated structures penetrating in a thickness direction in close contact with the large number of small projections b. C. A pressure-sensitive adhesive sheet characterized by comprising C.
[0006]
In a preferred embodiment of the present invention, it is preferable that the small protrusion b protrudes from the basic flat surface of the pressure-sensitive adhesive layer B, and the height H of the small protrusion b is in the range of 1 to 150 μm. Further, the number of perforations of the release sheet C is preferably distributed at a frequency of 5 / cm 2 or more, the thickness of the release sheet C is preferably 5 to 150 μm, and the perforation diameter of the release sheet C is preferably It is preferably from 5 to 2000 μm.
Further, the perforation structure penetrating in the thickness direction of the release sheet C is a mechanical perforation method using a roller with diamond particles, a hot needle, a punching blade, a laser beam perforation method, an electron irradiation perforation method, a plasma perforation method, a high pressure discharge perforation method. This includes the case where the piercing process is performed using at least one piercing method selected from the group consisting of:
By providing a perforated structure penetrating in the thickness direction of the release sheet C, the pressure-sensitive adhesive of the pressure-sensitive adhesive layer B flows into the perforated portion at the time of pressure-sensitive adhesive processing, and a large number of independent small protrusions b are formed. By providing the small protrusions b, when the adhesive surface of the pressure-sensitive adhesive layer B is lightly attached to the adherend, only the small protrusions b on the pressure-sensitive adhesive layer B adhere to the adherend, and the adhesive surface A gap is generated between the object and the adherend.
[0007]
By providing such a structure, a gap communicating with the outside is generated between the reference surface of the pressure-sensitive adhesive layer and the adherend. As a result, the air can be easily extracted to the outside from the gap communicating with the outside, and the air can be attached without causing so-called blisters.
Furthermore, when the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer B is lightly stuck to the pressure-sensitive adhesive body, only the tip of the small protrusion b on the pressure-sensitive adhesive layer B is in close contact with the pressure-sensitive adhesive body, so that the adhesion area is small. . For this reason, when re-attaching, it can be easily peeled off and re-attached. In addition, it is possible to suppress a decrease in adhesive strength due to re-peeling.
In addition, by applying the pressure-sensitive adhesive to the release-treated surface of the release sheet C having a large number of perforations, the pressure-sensitive adhesive layer B having a large number of small projections b can be easily formed.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
(Sheet substrate A)
The material of the sheet substrate A is not particularly limited, and various materials such as natural paper, plastic film, and nonwoven fabric can be applied. In particular, a plastic film such as a polyolefin or polyethylene terephthalate, or a synthetic paper made of polyolefin or polyethylene terephthalate is preferable because it can be peeled cleanly without re-peeling without using a release aid.
The thickness of the sheet substrate A is 30 to 500 μm, and preferably 40 to 400 μm.
[0009]
(Release sheet C)
The material of the release sheet C is not particularly limited, and may be a material based on natural paper or a material based on plastic. Examples include glassine paper, woodfree paper, coated paper, polyethylene, polypropylene, polyethylene terephthalate, plastic films such as polyamide, or laminated paper, metal foil, or metal foil obtained by laminating these plastics on one or both sides of paper. Examples thereof include products bonded to paper and a plastic film.
[0010]
The thickness of the release sheet C of the present invention is preferably from 5 to 150 μm, more preferably from 10 to 130 μm, and its surface is preferably smooth from the viewpoint of handling strength, ease of perforation, and the like. However, a rough surface may be used for controlling the peeling performance. When the thickness of the release sheet C is less than 5 μm, the pressure-sensitive adhesive layer B leaks from the perforations due to a high bonding pressure during the adhesive processing or a tight tightening of the roll when stored in a roll state after the adhesive processing, and the lower winding is performed. Is unfavorable because it adheres to the sheet base A of the part. On the other hand, when the thickness exceeds 150 μm, the cost of the release sheet C increases, which is not preferable.
Before applying the release agent on the release sheet C, the surface of the release sheet C may be subjected to surface treatment such as corona discharge, flame treatment, and ozone treatment.
The release agent may be a silicone resin, a fluorine resin, an amino alkyd resin, a polyester resin, or the like, and is used as an emulsion, a solvent type, or a non-solvent type, but is preferably a silicon resin.
[0011]
(Punching process)
It is essential that the perforated structure provided in the release sheet C of the present invention penetrates in the thickness direction, and can be easily adjusted by adjusting the viscosity of the pressure-sensitive adhesive layer used within the thickness range of the release sheet C. The height H of the small protrusion b can be controlled. For example, in the case of embossing the release sheet to form a concave portion in the release sheet, and then applying an adhesive to the release sheet and providing a convex portion of the adhesive corresponding to the concave portion, the height of the convex portion of the adhesive is set. In order to control the thickness, various embossing rolls are required according to the depth of the corresponding concave portion of the release sheet. The height H of the small protrusion b can be adjusted very easily according to the purpose.
[0012]
As a method for forming a perforated structure by penetrating the release sheet C, a mechanical perforation method using a roller with diamond particles, a hot needle, a punching blade, a laser light perforation method, an electron irradiation perforation method, a plasma perforation method, a high pressure method At least one perforation method selected from the electric discharge perforation method can be applied, and can be appropriately selected according to the material, thickness, passage speed, and perforation diameter of the release sheet C.
The number of perforations formed in the release sheet C is preferably distributed on the release sheet C at a frequency of 5 / cm 2 or more. More preferably, it is 5 to 10,000 / cm 2 . When the number of perforations is less than 5 / cm 2 , when the pressure-sensitive adhesive sheet is lightly attached to the adherend, the number of small projections formed is insufficient, and the gap between the adherend and the pressure-sensitive adhesive layer is insufficient. Since the gap is easily crushed, air does not escape, and as a result, blisters are easily generated. Further, it is preferable that the perforations are evenly distributed on the release sheet C, since the blistering does not occur even if the number of perforations is small.
The perforation diameter is preferably from 5 to 2000 μm, more preferably from 10 to 1500 μm. If the diameter of the perforations is less than 5 μm, the adhesive does not flow into the perforations during the adhesive processing, and the small protrusions b on the pressure-sensitive adhesive layer B, which is the object of the present invention, are not easily formed, which is not preferable. On the other hand, if it is larger than 2000 μm, the pressure-sensitive adhesive leaks from the perforations and adheres to the sheet substrate A in the lower winding portion, which is not preferable.
[0013]
(Adhesive layer B)
The type and thickness (coating amount) of the pressure-sensitive adhesive layer B of the present invention can be variously selected depending on the type of the sheet substrate A, the environment in which it is used, the adhesive strength, and the like.
A commonly used aqueous or solvent-based adhesive can be applied and dried to form a natural rubber-based, synthetic rubber-based, or acrylic-based adhesive.These synthetic polymer-based adhesives can be used in organic solvent solutions and It can be used in a form dispersed in water, such as a dispersion or an emulsion.
Coating method:
The coating method of the adhesive is not limited at all. For example, comma coating, reverse coating, gravure coating, reverse gravure coating, kiss coating, knife coating, bar coating, curtain coating A transfer method for transferring a coating and process paper coated by these methods is exemplified.
[0014]
How to make small projections b:
The small protrusions b provided on the adhesive layer B are formed by using the release sheet C that has been subjected to the perforation processing, and the pressure-sensitive adhesive flows into the perforations at the time of applying the adhesive.
Further, since the perforated structure provided on the release sheet C penetrates in the thickness direction, the height of the small protrusion b can be easily adjusted by adjusting the viscosity of the pressure-sensitive adhesive layer used within the thickness range of the release sheet C. H can be controlled.
The height H of the small protrusion b is preferably 1 to 150 μm, more preferably 5 to 100 μm, and further preferably 26 to 80 μm. If the height H of the small projections b is less than 1 μm, blisters are likely to occur when the release sheet is peeled off and the pressure-sensitive adhesive sheet is adhered to the adherend. On the other hand, when it is larger than 150 μm, it is not preferable because surface irregularities occur when it is attached to the adherend.
[0015]
【Example】
Hereinafter, the present invention will be described more specifically with reference to Examples and the like, but the present invention is not limited to these Examples and the like.
(Example 1)
A polypropylene film having a thickness of 60 μm (manufactured by Toyobo Co., Ltd., trade name: Pyren P2761) was through-pierced using a hot-needle perforation method, and one surface thereof was subjected to silicon treatment to obtain a release sheet C. The hole diameter was 400 μm, and the number of holes was 60 / cm 2 . As a pressure-sensitive adhesive layer B on the silicon surface of the release sheet C, a solvent-based acrylic pressure-sensitive adhesive is applied with a comma coater so that the coating amount after drying is 30 g / m 2, and the pressure-sensitive adhesive sheet ( B + C). An adhesive sheet (B + C) was adhered to a synthetic paper (product name: YUPO SGS-80, manufactured by YUPO Corporation) having a thickness of 80 μm as the sheet substrate A to obtain an adhesive processed sheet. Table 1 shows the physical properties of the obtained pressure-sensitive adhesive sheet.
[0016]
[Small protrusion b height]
The cross section of the perforated portion was cut out with a microtome, ion-edged and gold-deposited with a commercially available ion coater, and then calculated from the cross-sectional form with a scanning electron microscope (S-3000N, manufactured by Hitachi High-Technologies Corporation).
[Workability]
The release sheet C of the pressure-sensitive adhesive sheet of the present invention was peeled off, lightly affixed to a transparent and smooth glass plate, then re-peeled, and the ease of re-peeling was determined. Also, after lightly affixing, blisters when crimped by hand using a valen were visually observed and judged as follows.
：: easy to peel off, no blisters are observed. △: difficulty in either peeling or blistering. ×: difficult to peel again, blistering. [Protrusion of adhesive layer B]
A perforated surface of the pressure-sensitive adhesive sheet of the present invention and a polypropylene film (manufactured by Toyobo, trade name: Pyren P2761) having a thickness of 60 µm were overlapped, treated at 50 ° C under a pressure of 5 kg / cm 2 for 24 hours, and judged.
：: Perforated surface and polypropylene film do not adhere. ×: Perforated surface and polypropylene film adhere.
(Example 2)
A release sheet of a commercially available pressure-sensitive adhesive sheet having a thickness of 190 μm (trade name: XJP-190, manufactured by YUPO Corporation) was peeled off, and the pressure-sensitive adhesive layer surface of the pressure-sensitive adhesive sheet and the release sheet C obtained in Example 1 were removed. Lamination was performed so that the silicone-treated surfaces were in contact with each other to obtain a pressure-sensitive adhesive sheet. Table 1 shows the physical properties of the obtained pressure-sensitive adhesive sheet.
[0018]
(Example 3)
A 40 μm-thick polypropylene film (manufactured by Toyobo Co., Ltd., trade name: Pyren P2161) was subjected to a perforation treatment using a hot needle perforation method, and one surface thereof was subjected to a silicon treatment to obtain a release sheet C. The hole diameter was 400 μm, and the number of holes was 60 / cm 2 . This one side was subjected to a silicon treatment to obtain a release sheet C. Next, a coating amount after drying a solvent-based acrylic pressure-sensitive adhesive as a pressure-sensitive adhesive layer B on a synthetic paper (product name; YUPO SGS-80, manufactured by YUPO Corporation) having a thickness of 80 μm as the sheet substrate A was used. Was adjusted to 30 g / m 2 with a comma coater to obtain an adhesive sheet (A + B). The pressure-sensitive adhesive sheet (A + B) was bonded to the silicon surface of the release sheet C to obtain a pressure-sensitive adhesive sheet. Table 1 shows the physical properties of the obtained pressure-sensitive adhesive sheet.
[0019]
(Comparative Example 1)
The same operation as in Example 1 was performed except that one side of a polypropylene film having a wall thickness of 60 μm (manufactured by Toyobo Co., Ltd., trade name: Pyren P2761) was subjected to silicon treatment to obtain a release sheet C, and an adhesive processed sheet was obtained. Was. Table 1 shows the physical properties of the obtained pressure-sensitive adhesive sheet.
[0020]
[Table 1]
【The invention's effect】
As is clear from Table 1, the use of the pressure-sensitive adhesive sheet of the present invention facilitates re-peeling and does not cause blistering during sheet construction, so that it can be used for large-sized stickers, labels, and tack sheets.
[Brief description of the drawings]
FIG. 1 is a sectional view of the basic structure of an adhesive sheet according to the present invention.
FIG. 2 is a schematic view of a form of a release sheet C of the present invention.
[Explanation of symbols]
1 Sheet base material A
2 Adhesive layer B
3 Small protrusion b
4 Release sheet C
H Height dimension of small protrusion b
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2003107177A JP4346339B2 (en) | 2002-04-11 | 2003-04-11 | Adhesive processing sheet |
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| JP2002109588 | 2002-04-11 | ||
| JP2003107177A JP4346339B2 (en) | 2002-04-11 | 2003-04-11 | Adhesive processing sheet |
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| JP2004002805A true JP2004002805A (en) | 2004-01-08 |
| JP4346339B2 JP4346339B2 (en) | 2009-10-21 |
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| JP2003107177A Expired - Fee Related JP4346339B2 (en) | 2002-04-11 | 2003-04-11 | Adhesive processing sheet |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2005123860A1 (en) * | 2004-06-22 | 2005-12-29 | Lintec Corporation | Adhesive sheet manufacturing method |
| JP2006022256A (en) * | 2004-07-09 | 2006-01-26 | Oji Tac Hanbai Kk | Double-sided pressure sensitive adhesive sheet, its manufacturing process and laminate |
| JP2009035602A (en) * | 2007-07-31 | 2009-02-19 | Three M Innovative Properties Co | Pressure-sensitive adhesive composition having improved initial tackiness |
| WO2012066777A1 (en) * | 2010-11-19 | 2012-05-24 | 日東電工株式会社 | Protective film for use on wheel and protective-film layered body for use on wheel |
| JP2017075307A (en) * | 2015-10-14 | 2017-04-20 | 日東電工株式会社 | Adhesive tape with separator, and separator |
| WO2017065275A1 (en) * | 2015-10-14 | 2017-04-20 | 日東電工株式会社 | Separator-fitted adhesive tape and separator |
| JP2019052270A (en) * | 2017-09-19 | 2019-04-04 | 日東電工株式会社 | Adhesive tape with separator, manufacturing method of adhesive tape, and separator with through hole |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005123860A1 (en) * | 2004-06-22 | 2005-12-29 | Lintec Corporation | Adhesive sheet manufacturing method |
| US7968039B2 (en) | 2004-06-22 | 2011-06-28 | Lintec Corporation | Method of producing pressure-sensitive adhesive sheet |
| KR101192253B1 (en) | 2004-06-22 | 2012-10-17 | 린텍 가부시키가이샤 | Adhesive sheet manufacturing method |
| JP2006022256A (en) * | 2004-07-09 | 2006-01-26 | Oji Tac Hanbai Kk | Double-sided pressure sensitive adhesive sheet, its manufacturing process and laminate |
| JP4690670B2 (en) * | 2004-07-09 | 2011-06-01 | 王子タック株式会社 | Double-sided pressure-sensitive adhesive sheet and method for producing the same |
| JP2009035602A (en) * | 2007-07-31 | 2009-02-19 | Three M Innovative Properties Co | Pressure-sensitive adhesive composition having improved initial tackiness |
| WO2012066777A1 (en) * | 2010-11-19 | 2012-05-24 | 日東電工株式会社 | Protective film for use on wheel and protective-film layered body for use on wheel |
| JP2017075307A (en) * | 2015-10-14 | 2017-04-20 | 日東電工株式会社 | Adhesive tape with separator, and separator |
| WO2017065275A1 (en) * | 2015-10-14 | 2017-04-20 | 日東電工株式会社 | Separator-fitted adhesive tape and separator |
| CN108137998A (en) * | 2015-10-14 | 2018-06-08 | 日东电工株式会社 | Adhesive tape and diaphragm with diaphragm |
| JP2019052270A (en) * | 2017-09-19 | 2019-04-04 | 日東電工株式会社 | Adhesive tape with separator, manufacturing method of adhesive tape, and separator with through hole |
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