CN216140838U - Automatic centering transfer table of automatic trimming machine - Google Patents
Automatic centering transfer table of automatic trimming machine Download PDFInfo
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- CN216140838U CN216140838U CN202121851292.1U CN202121851292U CN216140838U CN 216140838 U CN216140838 U CN 216140838U CN 202121851292 U CN202121851292 U CN 202121851292U CN 216140838 U CN216140838 U CN 216140838U
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Abstract
The utility model provides an automatic centering transfer table of an automatic edge removing machine, which comprises a centering mechanism and a balancing mechanism, wherein the centering mechanism comprises a silicon wafer sucker and an XY adjusting table arranged at the lower part of the centering mechanism and used for adjusting the silicon wafer sucker to be centered with an external sucker, two silicon wafer clamping jaws are symmetrically arranged around the silicon wafer sucker, the two silicon wafer clamping jaws are connected through a parallel clamping jaw electric cylinder and move oppositely to execute a grabbing action, a silicon wafer is arranged on the upper surface of the silicon wafer sucker, a silicon wafer fixing structure is arranged corresponding to the silicon wafer, the balancing mechanism comprises a balancing plate and a fixing plate arranged at the lower side of the balancing plate, the fixing plate is horizontally arranged, the balancing plate is provided with a balancing component corresponding to the fixing plate, and the centering mechanism is arranged at the upper side of the balancing plate. The centering mechanism realizes automatic centering of the silicon wafer to the center of the sucking disc, and meanwhile, the balance mechanism ensures that the plane of the silicon wafer is relatively parallel to the lower surface of the external sucking disc, so that the silicon wafer can be prevented from being crushed when the external sucking disc sucks the silicon wafer, the efficiency is improved, and the labor cost is saved.
Description
Technical Field
The utility model belongs to the field of silicon wafer production, and particularly relates to an automatic centering transfer table of an automatic trimming machine.
Background
The conventional silicon wafer centering transfer table is provided with an XY adjusting table, so that the external sucker can take a silicon wafer, the non-parallel condition of a platform for placing the silicon wafer and the external sucker can occur, the external sucker can damage the silicon wafer by pressing when the silicon wafer is sucked by the external sucker, extra loss is caused, a coarse positioning centering measure is lacked, the XY adjusting table can move in a large range to realize centering, the efficiency is low, and the labor cost is increased.
SUMMERY OF THE UTILITY MODEL
In view of the above, the utility model aims to provide an automatic centering transfer table of an automatic trimming machine, so as to solve the problems that the silicon wafer is not parallel to an external sucker, the silicon wafer is damaged due to pressure, coarse adjustment, centering and positioning are lacked, and the efficiency is low.
In order to achieve the purpose, the technical scheme of the utility model is realized as follows:
an automatic centering transfer table of an automatic trimming machine comprises a centering mechanism and a balance mechanism arranged on the lower side of the centering mechanism, wherein the centering mechanism comprises a silicon wafer sucker, an XY adjusting table arranged on the lower part of the centering mechanism and used for adjusting the silicon wafer sucker to be centered with an external sucker, two silicon wafer clamping jaws are symmetrically arranged around the silicon wafer sucker and connected through a parallel clamping jaw electric cylinder and move oppositely to execute a grabbing action, a silicon wafer is arranged on the upper surface of the silicon wafer sucker, a silicon wafer fixing structure is arranged corresponding to the silicon wafer,
the balance mechanism comprises a balance plate and a fixing plate arranged on the lower side of the balance plate, the fixing plate is horizontally arranged, the balance plate is provided with a balance assembly corresponding to the fixing plate, and the centering mechanism is arranged on the upper side of the balance plate.
Further, the silicon wafer clamping jaw comprises a connecting plate and a vertical column vertically arranged on the connecting plate, the connecting plate is fixedly connected with a driving rod on one side of a parallel clamping jaw electric cylinder, and the parallel clamping jaw electric cylinder is arranged on the lower side of the silicon wafer sucking disc;
two upright columns are arranged on the connecting plate, the distance between the two upright columns on the same connecting plate is arranged corresponding to the size of the silicon wafer, and the connecting line of the end parts of the two upright columns on the same connecting plate is vertical to the pushing direction of the driving rod;
the silicon wafer sucker is provided with an avoiding groove corresponding to the upright post.
Furthermore, the fixed knot constructs including vacuum pump, silicon chip sucking disc outer fringe side is provided with the interface, silicon chip sucking disc upper surface corresponds the silicon chip lower surface and sets up the evacuation opening, the interface passes through the evacuation pipe connection with the vacuum pump.
Further, the silicon wafer sucker is disc-shaped, a U-shaped groove is formed in the upper portion of the silicon wafer sucker, one end, open to the U-shaped groove, of the U-shaped groove faces the outer side of the silicon wafer sucker, and one end, closed to the U-shaped groove, of the U-shaped groove is arc-shaped and coaxial with the silicon wafer sucker.
Furthermore, the centering mechanism comprises a bottom plate, vertical plates are vertically arranged on two sides of the upper surface of the bottom plate, the upper ends of the vertical plates are fixedly connected with the lower surface of the silicon wafer sucker, and the lower surface of the bottom plate is connected with an xy adjusting table;
the external sucker is connected with a centering tool, the centering tool is vertically provided with a cylinder corresponding to the arc of the u-shaped groove, and the diameter of the circular hole in the middle of the silicon wafer corresponds to the diameter of the cylinder.
Furthermore, a plurality of adjusting screws are arranged on the fixing plate close to the outer edge at equal intervals, the upper ends of the adjusting screws are abutted to the lower surface of the fixing plate, and the other section of the adjusting screw extends out of a threaded hole arranged on the fixing plate and corresponding to the adjusting screw;
the fixed plate and the balance plate are correspondingly provided with linear displacement sensors, and the linear displacement sensors are arranged at intervals close to the outer edges of the fixed plate.
Furthermore, a plurality of spring pilot bolts are vertically arranged on the periphery of the balance plate close to the outer edge at equal intervals, bolt through holes are formed in the fixed plate corresponding to the spring pilot bolts, springs are sleeved on the spring pilot bolts correspondingly, and the springs are arranged between the fixed plate and the balance plate;
the bolt cap of the spring pilot bolt is arranged on the lower side of the fixing plate, a circular ring is arranged between the bolt cap and the lower surface of the fixing plate, and the inner diameter of the circular ring corresponds to the diameter of the bolt rod.
Furthermore, a pair of vertical plates is vertically arranged in the middle of the lower surface of the fixing plate, long strip plates are fixedly arranged at the lower ends of the vertical plates, and screw through holes are vertically formed in four corners of each long strip plate.
Compared with the prior art, the automatic centering transfer table of the automatic trimming machine has the following beneficial effects:
(1) the centering mechanism disclosed by the utility model realizes automatic centering of the silicon wafer to the center of the sucking disc, the centering precision is +/-0.04 mm, and meanwhile, the balance mechanism ensures that the plane of the silicon wafer is relatively parallel to the lower surface of the external sucking disc, so that the silicon wafer can be prevented from being crushed when the external sucking disc sucks the silicon wafer, the labor force is reduced, the efficiency is improved, and the labor cost is saved.
(2) The connecting plate is provided with two stand columns, the distance between the two stand columns on the same connecting plate is set to correspond to the size of the silicon wafer, the distance between the two stand columns of the silicon wafer clamping jaw can be changed to be suitable for 2 different products of silicon wafers (8 inches and 6 inches), and the practicability is high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:
fig. 1 is a schematic view of an overall structure of an automatic centering transfer table of an automatic trimming machine according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a silicon wafer chuck according to an embodiment of the present invention.
Description of reference numerals:
1-silicon wafer chuck; 11-avoidance grooves; 12-U type sink; 121-circular arc; a 2-XY conditioning stage; 3-a silicon wafer clamping jaw; 31-parallel jaw electric cylinder; 311-a drive rod; 32-a connecting plate; 33-upright post; 4-silicon chip fixing structure; 41-interface; 42-vacuum-pumping opening; 5-a balance plate; 6, fixing a plate; 61-vertical plate; 62-long strip plate; 7-a balancing component; 71-adjusting screw; 72-linear displacement sensor; 73-spring pilot bolt; 731-ring; 74-a spring; 8-a bottom plate; 81-vertical plate; 9-centering tooling; 91-cylinder.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in figures 1 and 2, the automatic centering transfer table of the automatic trimming machine comprises a centering mechanism and a balance mechanism arranged at the lower side of the centering mechanism, wherein the centering mechanism comprises a silicon wafer sucker 1, an XY adjusting table 2 arranged at the lower part of the centering mechanism and used for adjusting the centering of the silicon wafer sucker 1 and an external sucker, two silicon wafer clamping jaws 3 are symmetrically arranged around the silicon wafer sucker 1, the two silicon wafer clamping jaws 3 are connected through a parallel clamping jaw electric cylinder 31 and move oppositely to execute a grabbing action, a silicon wafer is arranged on the upper surface of the silicon wafer sucker 1, a silicon wafer fixing structure 4 is arranged corresponding to the silicon wafer,
the balance mechanism comprises a balance plate 5 and a fixing plate 6 arranged on the lower side of the balance plate 5, the fixing plate 6 is horizontally arranged, the balance plate 5 is provided with a balance assembly 7 corresponding to the fixing plate 6, and the centering mechanism is arranged on the upper side of the balance plate 5.
As shown in fig. 1 and fig. 2, the silicon wafer clamping jaw 3 includes a connecting plate 32 and a column 33 vertically arranged on the connecting plate 32, the connecting plate 32 is fixedly connected with a driving rod 311 on one side of a parallel clamping jaw electric cylinder 31, and the parallel clamping jaw electric cylinder 31 is arranged on the lower side of the silicon wafer suction cup 1;
the connecting plate 32 is provided with two columns 33, the distance between the two columns 33 on the same connecting plate 32 is set corresponding to the size of a silicon wafer, and a connecting line of the end parts of the two columns 33 on the same connecting plate 32 is vertical to the pushing direction of the driving rod 311;
the silicon wafer sucker 1 is provided with an avoiding groove 11 corresponding to the upright column 33.
The distance of two columns 33 of the silicon wafer clamping jaw 3 can be suitable for 8-inch and 6-inch silicon wafers of 2 different products, and the practicability is high.
As shown in fig. 1 and 2, the fixing structure includes a vacuum pump, an interface 41 is disposed on an outer edge side of the silicon wafer chuck 1, a vacuum opening 42 is disposed on an upper surface of the silicon wafer chuck 1 corresponding to a lower surface of the silicon wafer, the interface 41 is connected to the vacuum pump through a vacuum pipeline, and the vacuum opening 42 is communicated with the interface 41.
After the silicon wafer and the silicon wafer sucker 1 are coaxially positioned, the vacuum pump vacuumizes, and then the silicon wafer can be fixed on the upper surface of the silicon wafer sucker 1.
As shown in fig. 1 and 2, the silicon wafer chuck 1 is a disc shape, a U-shaped sinking groove 12 is arranged at the upper part of the silicon wafer chuck 1, one open end of the U-shaped sinking groove 12 faces the outer side of the silicon wafer chuck 1, and one closed end of the U-shaped sinking groove 12 is an arc 121 and is coaxial with the silicon wafer chuck 1.
The silicon chip is placed on the upper surface of the silicon chip attaching sucker, and the U-shaped sinking groove 12 avoids the clamping hand of the feeding robot, so that the silicon chip is convenient to place.
As shown in fig. 1 and 2, the centering mechanism comprises a bottom plate 8, wherein two sides of the upper surface of the bottom plate are vertically provided with a vertical plate 81, the upper end of the vertical plate 81 is fixedly connected with the lower surface of the silicon wafer sucker 1, and the lower surface of the bottom plate 8 is connected with the upper end of an XY adjusting table 2;
the external sucker is connected with a centering tool 9, the centering tool 9 is vertically provided with a cylinder 91 corresponding to the U-shaped sunken groove 12 arc 121, and the diameter of the middle circular hole of the silicon wafer corresponds to the diameter of the cylinder 91.
And manually adjusting the XY adjusting table 2, and enabling the cylinder of the centering tool 9 to correspond to the arc 121 and then to descend. The upper end face of the cylinder of the centering tool 9 is coaxially and fixedly provided with a connecting column, and the centering tool 9 is connected with an external sucker through the connecting column.
As shown in fig. 1 and 2, a plurality of adjusting screws 71 are further equidistantly arranged on the fixing plate 6 near the outer edge, the upper ends of the adjusting screws 71 are abutted against the lower surface of the fixing plate 6, and the other sections of the adjusting screws extend out of threaded holes arranged on the fixing plate 6 corresponding to the adjusting screws;
the fixed plate 6 and the balance plate 5 are also correspondingly provided with linear displacement sensors 72, and the linear displacement sensors 72 are arranged at intervals close to the outer edge of the fixed plate 6.
As shown in fig. 1 and 2, a plurality of spring guide bolts 73 are vertically arranged on the balance plate 5 near the outer periphery at equal intervals, bolt through holes are arranged on the fixed plate 6 corresponding to the spring guide bolts 73, springs 74 are correspondingly sleeved on the spring guide bolts 73, and the springs 74 are arranged between the fixed plate 6 and the balance plate 5;
the bolt cap of the spring pilot bolt 73 is arranged at the lower side of the fixing plate 6, a circular ring 731 is arranged between the bolt cap and the lower surface of the fixing plate 6, and the inner diameter of the circular ring 731 corresponds to the diameter of the bolt rod.
As shown in fig. 1 and 2, a pair of vertical plates 61 is vertically disposed in the middle of the lower surface of the fixed plate 6, a strip plate 62 is fixedly disposed at the lower end of each vertical plate, and screw through holes are vertically disposed at four corners of the strip plate.
The working process is as follows:
as shown in fig. 1 and 2, firstly, the parallelism is adjusted to make the external chuck move downwards for a certain distance, the silicon wafer chuck 1 is compressed, at this time, the linear displacement sensor 72 displays different values, and the adjusting screw 71 is adjusted to make the values of the linear displacement sensor substantially consistent. The surface of the external sucker is relatively parallel to the surface of the silicon wafer sucker 1.
The silicon wafer clamping jaw 3 is opened at the initial position, a feeding robot places the silicon wafer on the silicon wafer sucker 1, the silicon wafer clamping jaw 3 is closed, positioned and centered on the silicon wafer, the vacuum pump is opened, the silicon wafer is sucked by the silicon wafer sucker 1, and the silicon wafer clamping jaw 3 is opened.
The external sucker drives the centering tool 9 to move downwards, the cylinder of the centering tool 9 is matched with the central hole of the sucker, and the center XY direction is precisely adjusted by the XY adjusting table 2, so that the center of the external sucker is centered with the center of the silicon wafer sucker 1.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. The utility model provides an automatic edging machine automatic centering transfer table which characterized in that: comprises a centering mechanism and a balance mechanism arranged on the lower side of the centering mechanism, wherein the centering mechanism comprises a silicon wafer sucker (1), an XY adjusting table (2) arranged on the lower part of the centering mechanism and used for adjusting the silicon wafer sucker (1) to be centered with an external sucker, two silicon wafer clamping jaws (3) are symmetrically arranged around the silicon wafer sucker (1), the two silicon wafer clamping jaws (3) are connected through a parallel clamping jaw electric cylinder (31) and move oppositely to execute a grabbing action, a silicon wafer is arranged on the upper surface of the silicon wafer sucker (1), a silicon wafer fixing structure (4) is arranged corresponding to the silicon wafer,
the balance mechanism comprises a balance plate (5) and a fixing plate (6) arranged on the lower side of the balance plate (5), the fixing plate (6) is horizontally arranged, a balance assembly (7) is arranged on the balance plate (5) corresponding to the fixing plate (6), and the centering mechanism is arranged on the upper side of the balance plate (5).
2. The automatic centering transfer table of the automatic trimming machine according to claim 1, wherein: the silicon wafer clamping jaw (3) comprises a connecting plate (32) and a stand column (33) vertically arranged on the connecting plate (32), the connecting plate (32) is fixedly connected with a driving rod (311) on one side of a parallel clamping jaw electric cylinder (31), and the parallel clamping jaw electric cylinder (31) is arranged on the lower side of the silicon wafer sucking disc (1);
two upright posts (33) are arranged on the connecting plate (32), the distance between the two upright posts (33) on the same connecting plate (32) is arranged corresponding to the size of a silicon wafer, and a connecting line of the end parts of the two upright posts (33) on the same connecting plate (32) is vertical to the pushing direction of the driving rod (311);
the silicon wafer sucker (1) is provided with an avoiding groove (11) corresponding to the upright post (33).
3. The automatic centering transfer table of the automatic trimming machine according to claim 1, wherein: the fixing structure comprises a vacuum pump, an interface (41) is arranged on the outer edge side of the silicon wafer sucker (1), a vacuumizing opening (42) is formed in the upper surface of the silicon wafer sucker (1) corresponding to the lower surface of the silicon wafer, the interface (41) is connected with the vacuum pump through a vacuumizing pipeline, and the vacuumizing opening (42) is communicated with the interface (41).
4. The automatic centering transfer table of the automatic trimming machine according to claim 1, wherein: the silicon wafer sucker (1) is in a disc shape, a U-shaped sinking groove (12) is formed in the upper portion of the silicon wafer sucker (1), one end, facing the outer side of the silicon wafer sucker (1), of an opening of the U-shaped sinking groove (12) is provided with an arc (121), and the end, closed, of the U-shaped sinking groove (12) is coaxial with the silicon wafer sucker (1).
5. The automatic centering transfer table of the automatic trimming machine according to claim 4, wherein: the centering mechanism comprises a bottom plate (8), vertical plates (81) are vertically arranged on two sides of the upper surface of the bottom plate, the upper ends of the vertical plates (81) are fixedly connected with the lower surface of the silicon wafer sucker (1), and the lower surface of the bottom plate (8) is connected with the upper end of the XY adjusting table (2);
the outer sucker is connected with a centering tool (9), the centering tool (9) is vertically provided with a cylinder (91) corresponding to the arc (121) of the U-shaped sinking groove (12), and the diameter of the circular hole in the middle of the silicon wafer corresponds to that of the cylinder (91).
6. The automatic centering transfer table of the automatic trimming machine according to claim 1, wherein: a plurality of adjusting screws (71) are further arranged on the fixing plate (6) close to the outer edge at equal intervals, the upper ends of the adjusting screws (71) are abutted to the lower surface of the fixing plate (6), and the other section of the adjusting screws extends out of threaded holes which are formed in the fixing plate (6) and correspond to the adjusting screws;
the fixed plate (6) and the balance plate (5) are correspondingly provided with linear displacement sensors (72), and the linear displacement sensors (72) are arranged at intervals of the outer edges of the adjacent fixed plate (6).
7. The automatic centering transfer table of the automatic trimming machine according to claim 1, wherein: a plurality of spring guide bolts (73) are vertically arranged on the balance plate (5) close to the periphery of the outer edge at equal intervals, bolt through holes are formed in the fixed plate (6) corresponding to the spring guide bolts (73), springs (74) are correspondingly sleeved on the spring guide bolts (73), and the springs (74) are arranged between the fixed plate (6) and the balance plate (5);
the bolt cap of spring pilot bolt (73) sets up in the downside of fixed plate (6), set up ring (731) between bolt cap and fixed plate (6) lower surface, ring (731) internal diameter corresponds with the shank of bolt diameter.
8. The automatic centering transfer table of the automatic trimming machine according to claim 1, wherein: a pair of vertical plates (61) is vertically arranged in the middle of the lower surface of the fixing plate (6), long strip plates (62) are fixedly arranged at the lower ends of the vertical plates, and screw through holes are vertically formed in four corners of each long strip plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121851292.1U CN216140838U (en) | 2021-08-09 | 2021-08-09 | Automatic centering transfer table of automatic trimming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121851292.1U CN216140838U (en) | 2021-08-09 | 2021-08-09 | Automatic centering transfer table of automatic trimming machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216140838U true CN216140838U (en) | 2022-03-29 |
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ID=80805411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121851292.1U Active CN216140838U (en) | 2021-08-09 | 2021-08-09 | Automatic centering transfer table of automatic trimming machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216140838U (en) |
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2021
- 2021-08-09 CN CN202121851292.1U patent/CN216140838U/en active Active
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