CN216134772U - Network security isolation device - Google Patents
Network security isolation device Download PDFInfo
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- CN216134772U CN216134772U CN202122081995.7U CN202122081995U CN216134772U CN 216134772 U CN216134772 U CN 216134772U CN 202122081995 U CN202122081995 U CN 202122081995U CN 216134772 U CN216134772 U CN 216134772U
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Abstract
The utility model mainly relates to the technical field of network safety, in particular to a network safety isolation device, which comprises an isolation device body, wherein a main board structure is arranged in the isolation device body, a first heat dissipation mechanism and a second heat dissipation mechanism are fixedly arranged on the lower surface of the main board structure, the first heat dissipation mechanism and the second heat dissipation mechanism are both connected with heat dissipation fins, the upper surface of a soaking plate is directly contacted with the main board structure, the first heat dissipation mechanism and the second heat dissipation mechanism are arranged, the heat of a chip on the main board structure enters the soaking plate through heat conduction, heat conduction liquid in the soaking plate can rapidly absorb the heat and gasify the heat into steam to take away a large amount of heat energy on the chip of the main board structure, the heat of the main board structure enters the heat pipe through heat conduction, the heat conduction liquid in the heat pipe is heated and evaporated to be guided to the heat dissipation fins, and an ambient air entering from an air inlet is blown onto the heat dissipation fins when a heat dissipation fan runs, the temperature on the radiating fins is reduced, so that the chips on the mainboard structure are effectively cooled.
Description
Technical Field
The utility model mainly relates to the technical field of network security, in particular to a network security isolation device.
Background
With the rapid development of computer technology, information networks have become an important guarantee for social development, network security refers to that hardware, software and data in the network system are protected, including that the system continuously, reliably and normally operates, network service is not interrupted, information in the system is not damaged, changed or leaked due to accidental or malicious behaviors, but with the rapid development of the internet, information of each local area network is leaked or attacked by computer hackers, the existing firewall technology does not realize thorough isolation between networks, and the security is not very good.
At present, an isolation device is often needed for guaranteeing network security, the isolation device is equipment for protecting and deploying the network security, the network in use is protected, the attack of external unsafe information is prevented, the security is relatively improved, and the use is more convenient.
SUMMERY OF THE UTILITY MODEL
According to the network safety isolation device, the first heat dissipation mechanism, the second heat dissipation mechanism and the refrigeration mechanism are arranged to effectively dissipate heat and cool a chip on the mainboard structure, so that the conditions of damage or crash and the like caused by internal overheating of the device are avoided.
The utility model provides the following technical scheme: a network safety isolation device comprises an isolation device body, wherein a main board structure is arranged in the isolation device body, a first heat dissipation mechanism and a second heat dissipation mechanism are fixedly arranged on the lower surface of the main board structure, the rear ends of the first heat dissipation mechanism and the second heat dissipation mechanism and the left end of the first heat dissipation mechanism and the right end of the second heat dissipation mechanism are respectively connected with heat dissipation fins, the side walls of the heat dissipation fins are fixedly connected with the tail ends of the heat pipes, the heat pipes are fixedly arranged below a soaking plate through fixing blocks, the upper surface of the soaking plate is directly contacted with the main board structure, the top ends of the heat dissipation fins penetrate through the side walls of the isolation device body and are provided with openings, the lower parts of the first heat dissipation mechanism and the second heat dissipation mechanism penetrate through the bottom wall of the isolation device body and are provided with air inlets, a support plate is fixedly arranged in the isolation device body, and a refrigeration mechanism is fixedly arranged on the support plate, and heat dissipation fans are arranged in the first heat dissipation mechanism and the second heat dissipation mechanism.
The refrigeration mechanism is internally provided with a semiconductor refrigeration piece, the semiconductor refrigeration piece is positioned above the mainboard structure and is in contact with the back surface of the mainboard, a fixed frame is fixedly arranged in the refrigeration mechanism, a heat extraction fan is fixedly arranged in the middle of the fixed frame, and the refrigeration mechanism is provided with an air outlet through the top wall of the isolation device body; refrigeration mechanism cools down the chip with it contact temperature is too high, guarantees that chip normal operating does not receive the influence of high temperature, the heat extraction fan will the inside heat of refrigeration mechanism is taken away and is discharged from the air outlet, reduces refrigeration mechanism's inside heat avoids refrigeration mechanism refrigeration efficiency to descend.
Wherein the number of the heat pipes is set to be a plurality; the heat pipes can better collect heat on the main board structure and lead in the heat pipes to the radiating fins, heat conducting liquid is filled in the heat pipes, the heat conducting liquid collects the heat on the main board structure, the heat conducting liquid is heated and evaporated to guide the radiating fins, the temperature on the radiating fins is reduced by blowing air through the radiating fan, the heat conducting liquid is cooled and then becomes liquid to flow back to the original position, the heat conducting liquid can carry a large amount of heat, and the heat conducting effect is good.
The isolating device body is also provided with a plug wire port, a plug board port and a signal lamp; the plug wire mouth is used for inserting the connection network line, and the plug wire mouth is used for connecting the power, the signal lamp can light when the inside high temperature of isolating device body for remind the user the too high condition of isolating device body temperature, in time use stopping.
The support plate is fixedly provided with a contact temperature sensor, and the contact temperature sensor is in contact with the back surface of the main board structure; the contact temperature sensor can transmit temperature data on the mainboard structure to a display screen on the surface of the isolation device body in real time, and simultaneously transmit the temperature data to a control module on the mainboard structure, and when the temperature is too high, the control module issues an instruction to control the first heat dissipation mechanism, the second heat dissipation mechanism and the refrigeration mechanism to operate so as to dissipate heat and cool down chips on the mainboard structure.
Wherein, the surface of the soaking plate is thinly coated with a heat-conducting silicone grease layer; the heat-conducting silicone grease layer has good heat conduction, temperature resistance and insulation performance, and heat generated by the chip on the mainboard structure can be better collected and cooled by the first heat dissipation mechanism and the second heat dissipation mechanism.
The inner sides of the opening and the air inlet are fixedly provided with dust screens, and the dust screens are fixed at the top ends of the radiating fins; the dust screen can block dust particles in the environment and prevent the dust particles from accumulating on the radiating fins, so that the radiating effect of the radiating fins is influenced.
The utility model has the beneficial effects that:
(1) the device is provided with a first heat dissipation mechanism and a second heat dissipation mechanism, heat of a chip on a mainboard structure enters a soaking plate through heat conduction, heat conducting liquid in the soaking plate can rapidly absorb the heat and gasify the heat into steam to take away a large amount of heat energy on the chip of the mainboard structure, the heat of the mainboard structure enters the heat pipe through the heat conduction, the heat conducting liquid in the heat pipe is heated and evaporated to guide heat dissipation fins, a heat dissipation fan blows ambient air entering from an air inlet onto the heat dissipation fins when running to exchange the heat on the heat dissipation fins into the air, so that the temperature on the heat dissipation fins is reduced, the chip on the mainboard structure is effectively dissipated and cooled, the damage or the dead halt and other conditions caused by overheating in the device are avoided, a semiconductor refrigeration sheet is contained in the refrigeration mechanism to cool the mainboard structure, and a heat dissipation fan fixed in the refrigeration mechanism takes away the heat in the refrigeration mechanism, the heat dissipation is accelerated, and the heat dissipation effect of the device is further improved;
(2) the dustproof net is fixedly arranged on the inner sides of the opening and the air inlet, dust particles in the environment can be blocked by the dustproof net, the dust particles are prevented from being accumulated on the radiating fins, and the radiating effect of the radiating fins cannot be influenced.
The parts of the device not involved are the same as or can be implemented using prior art.
Drawings
FIG. 1 is a sectional view of the utility model from below;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is a rear view of the present invention;
fig. 4 is a left side view of the present invention.
In the figure: 1. an isolation device body; 2. a motherboard structure; 3. a first heat dissipation mechanism; 4. a second heat dissipation mechanism; 5. heat dissipation fins; 6. a heat pipe; 7. a vapor chamber; 8. a dust screen; 9. an opening; 10. an air inlet; 11. a support plate; 12. a refrigeration mechanism; 13. a wire plugging port; 14. a board inserting port; 15. a signal lamp; 16. a semiconductor refrigeration sheet; 17. a fixed mount; 18. a heat exhaust fan; 19. an air outlet; 20. a contact temperature sensor.
Detailed Description
Referring to fig. 1-4, the present invention provides the following technical solutions: a network safety isolation device comprises an isolation device body 1, a main board structure 2 is arranged inside the isolation device body 1, a first heat dissipation mechanism 3 and a second heat dissipation mechanism 4 are fixedly arranged on the lower surface of the main board structure 2, the rear ends of the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 and the left end of the first heat dissipation mechanism 3 and the right end of the second heat dissipation mechanism are connected with heat dissipation fins 5, the side walls of the heat dissipation fins 5 are fixedly connected with the tail ends of heat pipes 6, the heat pipes 6 are fixedly arranged below a soaking plate 7 through fixing blocks, the upper surface of the soaking plate 7 is directly contacted with the main board structure 2, the top ends of the heat dissipation fins 5 penetrate through the side walls of the isolation device body 1 and are provided with openings 9, the lower parts of the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 penetrate through the bottom wall of the isolation device body 1 and are provided with air inlets 10, a support plate 11 is fixedly arranged inside the isolation device body 1, a refrigerating mechanism 12 is fixedly mounted on the supporting plate 11, and heat dissipation fans are mounted inside the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4.
The interior of the refrigeration mechanism 12 contains a semiconductor refrigeration piece 16, the semiconductor refrigeration piece 16 is positioned above the main board structure 2 and contacts with the back of the main board, a fixed frame 17 is fixedly installed in the refrigeration mechanism 12, a heat exhaust fan 18 is fixedly installed in the middle of the fixed frame 17, and the refrigeration mechanism 12 is provided with an air outlet 19 penetrating through the top wall of the isolation device body 1; refrigerating mechanism 12 cools down the chip with it contact temperature is too high, guarantees that chip normal operating does not receive the influence of high temperature, heat extraction fan 18 will refrigerating mechanism 12 inside heat is taken away and is discharged from air outlet 19, reduces refrigerating mechanism 12's inside heat avoids refrigerating mechanism 12 refrigeration efficiency to descend.
The number of the heat pipes 6 is set to be a plurality; the heat pipes 6 can better collect heat on the main board structure 2 and lead the heat to the radiating fins 5, heat conducting liquid is filled in the heat pipes 6 and collects the heat on the main board structure 2, the heat conducting liquid is heated and evaporated to lead the radiating fins 5, the temperature of the radiating fins 5 is reduced by blowing air through the radiating fan, the heat conducting liquid is changed into liquid to flow back to the original position after being cooled, the heat conducting liquid can carry a large amount of heat, and the heat conducting effect is good.
The isolating device body 1 is also provided with a plug wire port 13, a plug board port 14 and a signal lamp 15; plug wire mouth 13 is used for inserting the connection net twine, and picture peg mouth 14 is used for connecting the power, signal lamp 15 can light when the inside high temperature of isolating device body for remind the user isolating device body 1 condition of high temperature, in time stop using.
A contact temperature sensor 20 is fixedly mounted on the support plate 11, and the contact temperature sensor 20 is in contact with the back surface of the main board structure 2; contact temperature sensor 20 can be in real time with still transmit the control module on mainboard structure 2 when the temperature data on the mainboard structure 2 reaches the display screen on isolating device body 1 surface and shows, when the high temperature control module issues the operation of first heat dissipation mechanism 3 of instruction control and second heat dissipation mechanism 4 and refrigeration mechanism 12 and dispels the heat the cooling to the chip on mainboard structure 2.
The surface of the soaking plate 7 is thinly coated with a heat-conducting silicone layer; the heat conduction silicone grease layer has good heat conduction, temperature resistance and insulating property, and the heat generated by the chip on the main board structure 2 can be better collected and cooled by the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4.
The inner sides of the opening 9 and the air inlet 10 are fixedly provided with dust screens 8, and the dust screens 8 are fixed at the top ends of the radiating fins 5; the dust screen 8 can block dust particles in the environment, and prevent the dust particles from accumulating on the heat dissipation fins 5, thereby affecting the heat dissipation effect of the heat dissipation fins 5.
The working principle and the using process of the utility model are as follows: in the using process of the device, after a worker finishes connecting the plug wire port 13 and the plug board port 14, the isolating device body 1 starts to work, in the working process, the contact type temperature sensor 20 transmits temperature data on the main board structure 2 to a display screen on the surface of the isolating device body 1 for display and simultaneously transmits the temperature data to the control module on the main board structure 2, when the temperature on the main board structure 2 reaches a set maximum temperature, the signal lamp 15 at the top of the isolating device body 1 is lightened, the control module issues instructions to control the first heat dissipation mechanism 3, the second heat dissipation mechanism 4 and the refrigeration mechanism 12 to operate to dissipate heat and cool chips on the main board structure 2, the heat of the chips on the main board structure 2 enters the soaking plate 7 through heat conduction, heat conducting liquid in the soaking plate 7 can rapidly absorb the heat and gasify the heat into steam, and take away a large amount of heat energy on the chips on the main board structure 2, the heat of the main board structure 2 enters the heat pipe 6 through heat conduction, the heat conducting liquid inside the heat pipe 6 is heated and evaporated so as to be guided to the heat radiating fins 5, when the heat radiating fan operates, the ambient air entering from the air inlet 10 is blown onto the heat radiating fins 5, the temperature on the heat radiating fins 5 is reduced, the heat conducting liquid is changed into liquid after being cooled and flows back to the original position, the heat conducting liquid can carry a large amount of heat, the heat conducting effect is good, meanwhile, the semiconductor refrigerating sheet 16 is arranged inside the refrigerating mechanism 12 to cool the main board structure 2, the heat discharging fan 18 fixed inside the refrigerating mechanism 12 takes away the heat inside the refrigerating mechanism 12 to accelerate heat dissipation, the normal operation of the chip is guaranteed not affected by high temperature, in the process that the temperature on the main board structure 2 is continuously reduced, the contact temperature sensor 20 continuously transmits the temperature data on the main board structure 2 to the display screen, when the temperature on the main board structure 2 reaches the set minimum temperature, the signal lamp 15 at the top of the isolation device body 1 is turned off, and the first heat dissipation mechanism 3, the second heat dissipation mechanism 4 and the refrigeration mechanism 12 are controlled to be closed to stop heat dissipation and cooling of the chip on the main board structure 2 through the control module in the isolation device body 1.
Claims (7)
1. The utility model provides a network security isolating device, includes the isolating device body, its characterized in that: a main board structure is arranged in the isolation device body, a first heat dissipation mechanism and a second heat dissipation mechanism are fixedly arranged on the lower surface of the main board structure, the rear ends of the first heat dissipation mechanism and the second heat dissipation mechanism and the left end of the first heat dissipation mechanism and the right end of the second heat dissipation mechanism are connected with the heat dissipation fins, the side walls of the radiating fins are fixedly connected with the tail end of the heat pipe, the heat pipe is fixedly arranged below the soaking plate through a fixing block, the upper surface of the soaking plate is directly contacted with the main board structure, the top ends of the radiating fins are provided with openings penetrating through the side wall of the isolation device body, an air inlet is arranged below the first heat dissipation mechanism and the second heat dissipation mechanism and penetrates through the bottom wall of the isolation device body, the isolating device comprises an isolating device body, and is characterized in that a supporting plate is fixedly mounted inside the isolating device body, a refrigerating mechanism is fixedly mounted on the supporting plate, and cooling fans are mounted inside a first cooling mechanism and a second cooling mechanism.
2. The network security isolation device of claim 1, wherein: the refrigerating mechanism is internally provided with a semiconductor refrigerating sheet which is positioned above the main board structure and is in contact with the back surface of the main board, a fixed frame is fixedly arranged in the refrigerating mechanism, a heat extraction fan is fixedly arranged in the middle of the fixed frame, and the refrigerating mechanism is provided with an air outlet through the top wall of the isolation device body; refrigeration mechanism cools down the chip with it contact temperature is too high, guarantees that chip normal operating does not receive the influence of high temperature, the heat extraction fan will the inside heat of refrigeration mechanism is taken away and is discharged from the air outlet, reduces refrigeration mechanism's inside heat avoids refrigeration mechanism refrigeration efficiency to descend.
3. The network security isolation device of claim 1, wherein: the number of the heat pipes is set to be a plurality; the heat pipes can better collect heat on the main board structure and lead in the heat pipes to the radiating fins, heat conducting liquid is filled in the heat pipes, the heat conducting liquid collects the heat on the main board structure, the heat conducting liquid is heated and evaporated to guide the radiating fins, the temperature on the radiating fins is reduced by blowing air through the radiating fan, the heat conducting liquid is cooled and then becomes liquid to flow back to the original position, the heat conducting liquid can carry a large amount of heat, and the heat conducting effect is good.
4. The network security isolation device of claim 1, wherein: the isolating device body is also provided with a plug wire port, a plug board port and a signal lamp; the plug wire mouth is used for inserting the connection network line, and the plug wire mouth is used for connecting the power, the signal lamp can light when the inside high temperature of isolating device body for remind the user the too high condition of isolating device body temperature, in time use stopping.
5. The network security isolation device of claim 1, wherein: a contact temperature sensor is fixedly mounted on the supporting plate and is in contact with the back surface of the main board structure; the contact temperature sensor can transmit temperature data on the mainboard structure to a display screen on the surface of the isolation device body in real time, and simultaneously transmit the temperature data to a control module on the mainboard structure, and when the temperature is too high, the control module issues an instruction to control the first heat dissipation mechanism, the second heat dissipation mechanism and the refrigeration mechanism to operate so as to dissipate heat and cool down chips on the mainboard structure.
6. The network security isolation device of claim 1, wherein: the surface of the soaking plate is thinly coated with a heat-conducting silicone grease layer; the heat-conducting silicone grease layer has good heat conduction, temperature resistance and insulation performance, and heat generated by the chip on the mainboard structure can be better collected and cooled by the first heat dissipation mechanism and the second heat dissipation mechanism.
7. The network security isolation device of claim 1, wherein: the inner sides of the opening and the air inlet are fixedly provided with dust screens, and the dust screens are fixed at the top ends of the radiating fins; the dust screen can block dust particles in the environment and prevent the dust particles from accumulating on the radiating fins, so that the radiating effect of the radiating fins is influenced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122081995.7U CN216134772U (en) | 2021-08-31 | 2021-08-31 | Network security isolation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122081995.7U CN216134772U (en) | 2021-08-31 | 2021-08-31 | Network security isolation device |
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| Publication Number | Publication Date |
|---|---|
| CN216134772U true CN216134772U (en) | 2022-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122081995.7U Active CN216134772U (en) | 2021-08-31 | 2021-08-31 | Network security isolation device |
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| CN (1) | CN216134772U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115296080A (en) * | 2022-08-30 | 2022-11-04 | 常州机电职业技术学院 | Internet of things network controller |
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- 2021-08-31 CN CN202122081995.7U patent/CN216134772U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115296080A (en) * | 2022-08-30 | 2022-11-04 | 常州机电职业技术学院 | Internet of things network controller |
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