CN216099760U

CN216099760U - Wafer cutting machine is used in electronic chip production

Info

Publication number: CN216099760U
Application number: CN202122402249.3U
Authority: CN
Inventors: 陈玉强
Original assignee: Maanshan Sipaikechuang Technology Co ltd
Current assignee: Maanshan Sipaikechuang Technology Co ltd
Priority date: 2021-10-07
Filing date: 2021-10-07
Publication date: 2022-03-22
Anticipated expiration: 2031-10-07

Abstract

The utility model relates to the technical field of electronic chips and discloses a wafer cutting machine for electronic chip production, which comprises a base, wherein a collecting tank is arranged on the top surface of the base, a drain pipe is arranged at the bottom of the collecting tank and penetrates through one side of the base, the drain pipe is fixedly connected with the base, a filter screen is fixedly arranged on the inner wall of one end, connected with the collecting tank, of the drain pipe, a spraying device is arranged on the top surface of the base, and a cutting device is arranged on the spraying device. According to the utility model, the cutting device is arranged, the motor drives the cutting blade to rotate, and the silicon crystal bar is carried by the metal rod to cut, so that continuous and efficient cutting can be realized, and the problems that the existing diamond cutting method directly cuts the silicon crystal bar, the silicon crystal bar is not easy to fix, the cutting is difficult to continuously perform, and the cutting efficiency is low are solved.

Description

Wafer cutting machine is used in electronic chip production

Technical Field

The utility model relates to the technical field of electronic chips, in particular to a wafer cutting machine for electronic chip production.

Background

Currently, with the continuous development of silicon wafer chip technology, the integration level of chips is higher and higher, the size of a single-grain chip is smaller and smaller, and the number of chips on a unit area is more and more, so that new requirements on a chip cutting mode and cutting efficiency are provided; the traditional wafer cutting technology mainly comprises a diamond cutting method and a chemical etching method; the existing diamond cutting method directly cuts the silicon crystal bar, the silicon crystal bar is not easy to fix, the cutting is difficult to be continuously carried out, and the cutting efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer cutting machine for electronic chip production, which aims to solve the problems in the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer cutting machine is used in electronic chip production, includes the base, the collecting vat has been seted up on the top surface of base, the bottom of collecting vat is provided with the drain pipe, the drain pipe runs through one side of base, just drain pipe and base fixed connection, fixed mounting has the filter screen on the one end inner wall of water piping connection collecting vat, be provided with sprinkler on the top surface of base, the last cutting device that is provided with of sprinkler.

Preferably, sprinkler includes water tank, water pump, plastic tubing, shower nozzle, inlet tube, valve, the outer wall bottom surface of water tank and the top surface fixed connection of base, water pump fixed mounting is on the inner wall bottom surface of water tank, the one end of plastic tubing and the delivery port fixed connection of water pump, the one end and the shower nozzle fixed connection of water pump are kept away from to the plastic tubing, spray deionized water to cutting blade in cutting device course of operation, make the cutting effect better.

Preferably, the cutting device comprises a motor, a rotating rod, a cutting blade, a driving wheel, a transmission chain, a driven wheel, a rotating shaft, a metal rod, a piston, a spring, a slider and an L-shaped rod, the motor is fixedly arranged on the top surface of the outer wall of the water tank, one end of the rotating rod is fixedly connected with the output end of the motor through a shaft coupling, the cutting blade is fixedly arranged at one end of the rotating rod far away from the motor, the driving wheel is sleeved on the rotating rod, the driving wheel is fixedly connected with the rotating rod, the transmission chain is sleeved on the driving wheel and the driven wheel, the inner wall of the transmission chain is engaged with the driving wheel and the driven wheel, one end of the rotating shaft is fixedly connected with one side of the driven wheel, one end of the rotating shaft far away from the driven wheel is connected with the outer wall of one side of the water tank through a bearing, the metal rod is fixedly connected with one side of the driven wheel far away from the rotating shaft, and one end of the metal rod far away from the driven wheel is provided with a chute, in the one end threaded connection spout of piston, the one end of spring and the one end fixed connection that the piston is located the spout, the one end of piston and one side fixed connection of slider are kept away from to the spring, slider sliding connection is in the spout, the one end fixed connection of L type pole is on the one side outer wall that the pivot is connected to the water tank, in the recess of seting up on the metal pole was set up to the other end setting of L type pole, the spout of seting up on the metal pole is linked together with the recess, carries the silicon crystal stick through the metal pole and cuts when driving cutting blade pivoted through the motor, can continuous high efficiency cutting, has solved current diamond cutting method and has directly cut the silicon crystal stick, and the silicon crystal stick is difficult for fixing, and the cutting is difficult to go on in succession, problem that cutting efficiency is low.

Preferably, the inner wall bottom surface of collecting vat is the inclined plane setting, drain pipe fixed connection is in the lowest of the inner wall inclined plane of collecting vat, and the slope sets up the wafer of being convenient for collect and cutting out, and the water discharge collecting vat that the drain pipe sprayed when conveniently will cutting, and the filter screen prevents that the wafer from following waste water and discharging together.

Preferably, the plastic tubing run through the water tank and with water tank fixed connection, one section that the plastic tubing is located the water tank inside is plastic hose, the one end that the plastic tubing is located the water tank outside is the plastics hard tube, and the water pump is conveniently connected to plastic hose, and the convenient fixed shower nozzle position of plastics hard tube carries out the accurate spraying.

Preferably, the inlet tube runs through one side of water tank, just plastic tubing and water tank fixed connection, valve fixed mounting is on the inlet tube, and when the water storage capacity was not enough in the water tank, open the valve, infuse deionized water in to the water tank through the water inlet.

The utility model provides a wafer cutting machine for electronic chip production. The method has the following beneficial effects:

(1) according to the utility model, by arranging the cutting device, the cutting blade is driven by the motor to rotate, and meanwhile, the silicon crystal bar is carried by the metal rod for cutting, so that continuous and efficient cutting can be realized, and the problems that the silicon crystal bar is not easy to fix, the cutting is difficult to continuously perform and the cutting efficiency is low when the existing diamond cutting method directly cuts the silicon crystal bar are solved.

(2) The spraying device is arranged, so that deionized water is sprayed to the cutting blade in the working process of the cutting device, and the cutting effect is better.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

FIG. 3 is an enlarged view of the spraying apparatus of the present invention;

fig. 4 is an enlarged view of the cutting device of the present invention.

In the figure: 1. a base; 2. collecting tank; 3. a drain pipe; 4. filtering with a screen; 5. a spraying device; 501. a water tank; 502. a water pump; 503. a water pipe; 504. a spray head; 505. a water inlet pipe; 506. a valve; 6. a cutting device; 601. a motor; 602. a rotating rod; 603. a cutting blade; 604. a driving wheel; 605. a drive chain; 606. a driven wheel; 607. a rotating shaft; 608. a metal rod; 609. a piston; 6010. a spring; 6011. a slider; 6012. an L-shaped rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 4, the present invention provides a technical solution: the utility model provides a wafer cutting machine is used in electronic chip production, the on-line screen storage device comprises a base 1, collecting vat 2 has been seted up on base 1's the top surface, collecting vat 2's bottom is provided with drain pipe 3, drain pipe 3 runs through one side of base 1, and drain pipe 3 and base 1 fixed connection, fixed mounting has filter screen 4 on the one end inner wall of collecting vat 2 is connected to drain pipe 3, collecting vat 2's inner wall bottom surface is the inclined plane setting, drain pipe 3 fixed connection is in the lower of collecting vat 2's inner wall inclined plane, the slope sets up the wafer of being convenient for collect and cutting out, drain pipe 3 conveniently discharges collecting vat 2 with the water that sprays when cutting, filter screen 4 prevents that the wafer from following waste water and discharging together, be provided with sprinkler 5 on base 1's the top surface, spray cutting blade 603 in cutting device 6 working process, make the cutting effect better, sprinkler 5 includes water tank 501, water pump 502, plastic tubing 503, spray, The spray head 504, the water inlet pipe 505 and the valve 506, the bottom surface of the outer wall of the water tank 501 is fixedly connected with the top surface of the base 1, the water pump 502 is fixedly installed on the bottom surface of the inner wall of the water tank 501, one end of the plastic pipe 503 is fixedly connected with the water outlet of the water pump 502, one end of the plastic pipe 503 far away from the water pump 502 is fixedly connected with the spray head 504, the plastic pipe 503 penetrates through the water tank 501 and is fixedly connected with the water tank 501, one section of the plastic pipe 503 positioned inside the water tank 501 is a plastic hose, one end of the plastic pipe 503 positioned outside the water tank 501 is a plastic hard pipe, the plastic hose is conveniently connected with the water pump 502, the position of the spray head 504 is conveniently fixed by the plastic hard pipe, accurate spraying is carried out, the water inlet pipe 505 penetrates through one side of the water tank 501, the plastic pipe 503 is fixedly connected with the water tank 501, the valve 506 is fixedly installed on the water inlet pipe 505, when the water storage capacity in the water tank 501 is insufficient, the valve 506 is opened, deionized water is infused into the water tank 501 through the water inlet pipe 505, the spraying device 5 is provided with a cutting device 6, the cutting device 6 comprises a motor 601, a rotating rod 602, a cutting blade 603, a driving wheel 604, a transmission chain 605, a driven wheel 606, a rotating shaft 607, a metal rod 608, a piston 609, a spring 6010, a sliding block 6011 and an L-shaped rod 6012, the motor 601 drives the cutting blade 603 to rotate and simultaneously carries a silicon crystal rod through the metal rod 608 for cutting, continuous and efficient cutting can be achieved, the problems that the silicon crystal rod is directly cut by the existing diamond cutting method, the silicon crystal rod is not easy to fix and difficult to continuously cut and the cutting efficiency is low are solved, the motor 601 is fixedly arranged on the top surface of the outer wall of the water tank 501, one end of the rotating rod 602 is fixedly connected with the output end of the motor 601 through a coupler, the motor 601 drives the rotating rod 602 to rotate, the cutting blade 603 is fixedly arranged at one end of the rotating rod 602, which is far away from the motor 601, the rotating rod 602 drives the cutting blade 603 to rotate, a driving wheel 604 is sleeved on the rotating rod 602, the driving wheel 604 is fixedly connected with the rotating rod 602, the rotating rod 602 rotates to drive the driving wheel 604 to rotate, a transmission chain 605 is sleeved on the driving wheel 604 and the driven wheel 606, the inner wall of the transmission chain 605 is meshed with both the driving wheel 604 and the driven wheel 606, the driving wheel 604 rotates to drive the driven wheel 606 to rotate through the transmission chain 605, one end of a rotating shaft 607 is fixedly connected with one side of the driven wheel 606, one end of the rotating shaft 607 far away from the driven wheel 606 is rotatably connected on the outer wall of one side of the water tank 501 through a bearing, a metal rod 608 is fixedly connected on one side of the driven wheel 606 far away from the rotating shaft 607, the driven wheel 606 rotates to drive the metal rod 608 to rotate, one end of the metal rod 608 far away from the driven wheel 606 is provided with a sliding groove, one end of a piston 609 is in the sliding groove in a threaded connection manner, one end of a spring 6010 is fixedly connected with one end of the piston 609 in the sliding groove, one end of the spring 6010 far away from the piston 609 is fixedly connected with one side of a sliding block 6011, slide block 6011 is slidably connected in the chute, one end fixed connection of L-shaped pole 6012 is on the outer wall of one side that pivot 607 is connected to water tank 501, the other end setting of L-shaped pole 6012 is in the recess of seting up on metal pole 608, the spout of seting up on metal pole 608 is linked together with the recess, the silicon crystal stick that places in making metal pole 608 in the rotatory process of metal pole 608 is cut into the wafer by cutting blade 603, L-shaped pole 6012 extrudes the wafer that cuts out metal pole 608 in the rotatory process of metal pole 608, make the wafer drop to in collecting tank 2, spring 6010 drives slide block 6011 and advances the silicon crystal stick of cutting forward, continue to cut.

In use, the water pump 502 is started, the water pump 502 pumps deionized water in the water tank 501, the deionized water is sprayed onto the cutting blade 603 through the plastic pipe 503 and the spray head 504, and when the water storage amount in the water tank 501 is insufficient, the valve 506 is opened, and the deionized water is infused into the water tank 501 through the water inlet pipe 505; the motor 601 is started, the motor 601 drives the rotating rod 602 to rotate, the rotating rod 602 drives the cutting blade 603 to rotate for cutting, the rotating rod 602 drives the driving wheel 604 to rotate, the driving wheel 604 rotates to drive the driven wheel 606 to rotate through the transmission chain 605, the driven wheel 606 rotates to drive the metal rod 608 to rotate, the silicon crystal bar placed in the metal rod 608 is cut into a wafer by the cutting blade 603 in the rotating process of the metal rod 608, the L-shaped rod 6012 extrudes the cut wafer out of the metal rod 608 in the rotating process of the metal rod 608, the wafer drops into the collecting groove 2, and the spring 6010 drives the sliding block 6011 to push the cut silicon crystal bar forward to continue cutting.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer cutting machine is used in electronic chip production, includes base (1), its characterized in that: the collecting vat (2) has been seted up on the top surface of base (1), the bottom of collecting vat (2) is provided with drain pipe (3), drain pipe (3) run through one side of base (1), just drain pipe (3) and base (1) fixed connection, fixed mounting has filter screen (4) on the one end inner wall that collecting vat (2) was connected in drain pipe (3), be provided with sprinkler (5) on the top surface of base (1), be provided with cutting device (6) on sprinkler (5).

2. The wafer cutting machine for producing electronic chips according to claim 1, wherein: sprinkler (5) include water tank (501), water pump (502), plastic tubing (503), shower nozzle (504), inlet tube (505), valve (506), the top surface fixed connection of the outer wall bottom surface of water tank (501) and base (1), water pump (502) fixed mounting is on the inner wall bottom surface of water tank (501), the one end of plastic tubing (503) and the delivery port fixed connection of water pump (502), the one end and shower nozzle (504) fixed connection of water pump (502) are kept away from in plastic tubing (503).

3. The wafer cutting machine for producing electronic chips according to claim 2, wherein: the cutting device (6) comprises a motor (601), a rotating rod (602), a cutting blade (603), a driving wheel (604), a transmission chain (605), a driven wheel (606), a rotating shaft (607), a metal rod (608), a piston (609), a spring (6010), a sliding block (6011) and an L-shaped rod (6012), wherein the motor (601) is fixedly installed on the top surface of the outer wall of the water tank (501), one end of the rotating rod (602) is fixedly connected with the output end of the motor (601) through a coupler, the cutting blade (603) is fixedly installed at one end, far away from the motor (601), of the rotating rod (602) is sleeved with the driving wheel (604), the driving wheel (604) is fixedly connected with the rotating rod (602), the transmission chain (605) is sleeved on the driving wheel (604) and the driven wheel (606), and the inner wall of the transmission chain (605) is engaged with the driving wheel (604) and the driven wheel (606), one end of the rotating shaft (607) is fixedly connected with one side of the driven wheel (606), one end of the rotating shaft (607), which is far away from the driven wheel (606), is rotatably connected to the outer wall of one side of the water tank (501) through a bearing, one end of the rotating shaft (607), which is far away from the driven wheel (606), is fixedly connected to one side of the rotating shaft (607), one end of the metal rod (608), which is far away from the driven wheel (606), is provided with a sliding groove, one end of the piston (609) is in threaded connection with the sliding groove, one end of the spring (6010) is fixedly connected with one end of the piston (609), which is located in the sliding groove, one end of the spring (6010), which is far away from the piston (609), is fixedly connected to one side of the sliding block (6011), the sliding block (6011) is in the sliding groove, one end of the L-shaped rod (6012) is fixedly connected to one side of the rotating shaft (607) of the water tank (501), and the other end of the L-shaped rod (6012) is arranged in a groove formed in the metal rod (608), the sliding groove formed in the metal rod (608) is communicated with the groove.

4. The wafer cutting machine for producing electronic chips according to claim 1, wherein: the bottom surface of the inner wall of the collecting tank (2) is an inclined plane, and the drain pipe (3) is fixedly connected to the lowest position of the inclined plane of the inner wall of the collecting tank (2).

5. The wafer cutting machine for producing electronic chips according to claim 2, wherein: plastic tubing (503) run through water tank (501) and with water tank (501) fixed connection, plastic tubing (503) are located one section of water tank (501) inside and are the plastic hose, plastic tubing (503) are located the outside one end of water tank (501) and are the plastics hard tube.

6. The wafer cutting machine for producing electronic chips according to claim 2, wherein: the water inlet pipe (505) penetrates through one side of the water tank (501), the plastic pipe (503) is fixedly connected with the water tank (501), and the valve (506) is fixedly installed on the water inlet pipe (505).