CN216098509U - Vacuum chuck for clamping silicon part - Google Patents
Vacuum chuck for clamping silicon part Download PDFInfo
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- CN216098509U CN216098509U CN202122262568.9U CN202122262568U CN216098509U CN 216098509 U CN216098509 U CN 216098509U CN 202122262568 U CN202122262568 U CN 202122262568U CN 216098509 U CN216098509 U CN 216098509U
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- silicon part
- vacuum chuck
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Abstract
The utility model relates to the technical field of silicon part clamping, in particular to a vacuum chuck for clamping a silicon part, which comprises a top cover and a base which are hermetically connected, wherein a plurality of annular gas channels are arranged in the base and are sequentially sleeved, and two adjacent annular gas channels are communicated with each other; a plurality of annular adsorption rings are arranged on the top cover and are sequentially sleeved, the annular gas channel is communicated with the annular adsorption rings, and the annular adsorption rings are used for adsorbing the silicon part on the top cover. This vacuum chuck, through placing the silicon part on vacuum chuck's top cap surface utilize the negative pressure to adsorb the silicon part on the top cap, the danger of high temperature wax sticking operation when having avoided the silicon part clamping simultaneously of having eliminated the possibility that produces the mar, the intensity and the degree of difficulty that have alleviateed personnel's operation have simultaneously lightened personnel, personnel need not to carry the heavier sticking plate of quality again, thereby need not to glue the wax operation again and improved the clamping efficiency of silicon part, and the silicon part of adaptation different specifications, the commonality is strong.
Description
Technical Field
The utility model relates to the technical field of silicon part clamping, in particular to a vacuum chuck for clamping a silicon part.
Background
In the process of processing the silicon part, the defects of variable shape, complex processing part, easy occurrence of damage, edge breakage and the like on the surface exist, and the problem that the processing precision of the silicon part is difficult to ensure due to difficult clamping in the processing of the silicon part exists.
Generally, a traditional silicon part is fixed in a sticking mode, but a tool needs to be heated, so that certain dangerousness exists, and the consumed fixing time is long. In addition, a layer of wax film can be formed on the surfaces of the part and the sticky plate, the processing precision of the silicon part can be influenced to a certain extent, the possibility of scratching the surface of the silicon part can exist when the silicon part is unloaded, and the applicability of the fixing piece is poor due to the fact that the silicon part is different in size.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In view of the above disadvantages and shortcomings of the prior art, the present invention provides a vacuum chuck for clamping a silicon part, which solves the technical problems of difficulty in clamping a silicon part, low processing precision and poor applicability.
(II) technical scheme
In order to achieve the purpose, the utility model adopts the main technical scheme that:
the embodiment of the utility model provides a vacuum chuck for clamping a silicon part, which comprises a top cover and a base which are connected in a sealing way; a plurality of annular gas channels are arranged in the base, the annular gas channels are sequentially sleeved, and two adjacent annular gas channels are communicated with each other; the top cover is provided with a plurality of annular adsorption rings which are sequentially sleeved, and the annular gas channel is communicated with the annular adsorption rings; the annular adsorption ring is used for adsorbing the silicon component on the top cover.
Preferably, each annular adsorption ring comprises a plurality of adsorption holes arranged at intervals.
Preferably, the plastic packaging film is further included; the plastic packaging film cover is arranged above the top cover, the plastic packaging film is provided with a vent hole corresponding to the silicon part, and the vent hole is communicated with the adsorption hole.
Preferably, the device also comprises a vacuum pump, a gas compression pump and a pressure gauge; the vacuum pump is communicated with the outermost annular gas channel in the plurality of annular gas channels through a first connecting pipe; the gas compression pump is communicated with the outermost annular gas channel in the plurality of annular gas channels through a second connecting pipe; the pressure gauge is communicated with the outermost annular gas channel in the plurality of annular gas channels through a third connecting pipe.
Preferably, the communication positions between every two adjacent annular gas channels in the plurality of annular gas channels are staggered with the communication positions between the other two adjacent annular gas channels.
Preferably, a mounting hole is provided at a central position of the top cover.
Preferably, the top cover is provided with radial positioning hole groups around the center, and each positioning hole group comprises a plurality of positioning holes arranged at intervals.
Preferably, a sealing ring is provided between the top cover and the base.
Preferably, the distance between two adjacent annular adsorption rings is 3-15 mm.
Preferably, the top cover is removably connected to the base.
(III) advantageous effects
The utility model has the beneficial effects that:
according to the vacuum chuck for clamping the silicon part, the silicon part is placed on the surface of the top cover of the vacuum chuck, and is adsorbed on the top cover by using the negative pressure, so that the possibility of scratches is eliminated, the danger of high-temperature wax sticking operation during the clamping of the silicon part is avoided, the intensity and difficulty of the operation of personnel are reduced, the personnel do not need to carry a sticky plate with heavier weight and carry out wax sticking operation, the clamping efficiency of the silicon part is improved, the vacuum chuck is suitable for silicon parts with different specifications, and the universality is strong.
Drawings
FIG. 1 is a top view of the overcap of the present invention;
fig. 2 is a top view of the base.
[ description of reference ]
1: a top cover; 11: an adsorption hole; 12: mounting holes; 13: positioning holes;
2: a base; 21: an annular gas passage;
3: a first connecting pipe;
4: a second connecting pipe;
5: and a third connecting pipe.
Detailed Description
In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
The embodiment provides a vacuum chuck for clamping a silicon part, which comprises a top cover 1 and a base 2 which are hermetically connected, wherein the top cover 1 and the base 2 are detachably connected through bolts. As shown in fig. 2, a plurality of annular gas channels are provided in the base 2, the plurality of annular gas channels are sequentially sleeved, and two adjacent annular gas channels are communicated with each other. As shown in fig. 1, a plurality of annular adsorption rings are formed on the top cover 1, the plurality of annular adsorption rings are sequentially sleeved, the annular gas channel 21 is communicated with the annular adsorption rings, and the annular adsorption rings are used for adsorbing silicon parts on the top cover 1. Wherein, every annular adsorption ring all includes the adsorption hole 11 that a plurality of intervals set up on top cap 1, and the cross section of adsorption hole 11 is circular structure. It should be noted that the silicon part is generally of a ring-shaped configuration in this embodiment.
The utility model provides a vacuum chuck for silicon part clamping, through placing the silicon part on vacuum chuck's top cap 1 surface utilize the negative pressure to adsorb the silicon part on top cap 1, the danger of high temperature wax sticking operation when having avoided the silicon part clamping simultaneously of having eliminated the possibility that produces the mar, the intensity and the degree of difficulty of personnel's operation have been alleviateed simultaneously, personnel need not to carry the heavier sticky board of quality again, thereby the clamping efficiency of silicon part has been improved to the operation of need not to glue the wax again, and adapt to the silicon part of different specifications, therefore the commonality is strong.
Because the gas channels of the vacuum chuck are arranged in a ring shape and the communication positions between every two adjacent ring-shaped gas channels 21 are staggered with the communication positions between other two adjacent ring-shaped gas channels 21 in the plurality of ring-shaped gas channels 21. The pressure on the surface of the whole top cover 1 is the same, the phenomenon that the pressure of a single point is higher and no pressure exists in other positions is avoided, and the stability of the vacuum chuck for clamping parts is further ensured.
In order to guarantee the adsorption effect of the vacuum chuck, the vacuum chuck further comprises a plastic package film, the plastic package film is covered above the top cover 1, the plastic package film is only provided with air holes at positions corresponding to the silicon parts, and the air holes are communicated with the adsorption holes 11, so that the adsorption effect of the chuck is improved. In the practical application process, the silicon parts are different in size, so that the plastic packaging film can be correspondingly provided with the vent holes according to the size of the silicon parts.
Of course, the vacuum chuck further includes a vacuum pump for providing a negative pressure state to the vacuum chuck and a gas compression pump (not shown) for providing a positive pressure purge to the vacuum chuck, wherein the vacuum pump is communicated with the outermost annular gas passage of the plurality of annular gas passages 21 through the first connection pipe 3, and the gas compression pump is communicated with the outermost annular gas passage of the plurality of annular gas passages 21 through the second connection pipe 4. After the vacuum chuck is used for multiple times, in order to prevent dust from blocking the adsorption holes 11, the gas compression pump is started to introduce air into the annular gas channel and output the air from the adsorption holes 11, so that the dust in the adsorption holes 11 is removed.
In order to ensure the gas pressure in the vacuum chuck, a pressure gauge is further included, and the pressure gauge is communicated with the outermost annular gas channel in the plurality of annular gas channels 21 through a third connecting pipe 5.
A rectangular mounting hole 12 is formed in the center of the top cover 1 to facilitate the mounting of the vacuum chuck.
The top cover 1 is provided with radial positioning holes 13 around the center, each positioning hole 13 comprises a plurality of positioning holes 13 arranged at intervals, and the silicon part is connected with the positioning holes 13 through bolts, so that the rapid positioning of any silicon part can be realized.
In order to ensure the sealing effect of the vacuum chuck, a sealing ring is arranged between the top cover 1 and the base 2.
In the practical application process, the whole vacuum chuck is of a rectangular structure, the side length can be 200-500mm, the distance between two adjacent annular adsorption rings is 3-15mm, and the diameter of the adsorption hole 11 is 0.8-3 mm.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.
Claims (10)
1. A vacuum chuck for clamping a silicon part is characterized by comprising a top cover (1) and a base (2) which are connected in a sealing way;
a plurality of annular gas channels (21) are arranged in the base (2), the annular gas channels (21) are sequentially sleeved, and two adjacent annular gas channels (21) are communicated with each other;
the top cover (1) is provided with a plurality of annular adsorption rings, the annular adsorption rings are sequentially sleeved, and the annular gas channel (21) is communicated with the annular adsorption rings;
the annular adsorption ring is used for adsorbing the silicon component on the top cover.
2. The vacuum chuck for clamping a silicon part according to claim 1, wherein:
each annular adsorption ring comprises a plurality of adsorption holes (11) arranged at intervals.
3. The vacuum chuck for clamping a silicon part according to claim 2, wherein:
also comprises a plastic packaging film;
the plastic packaging film cover is arranged above the top cover (1), the plastic packaging film is provided with air holes corresponding to the silicon parts, and the air holes are communicated with the adsorption holes (11).
4. A vacuum chuck for chucking a silicon part according to any one of claims 1 to 3, wherein:
the device also comprises a vacuum pump, a gas compression pump and a pressure gauge;
the vacuum pump is communicated with the outermost annular gas channel (21) of the plurality of annular gas channels (21) through a first connecting pipe (3);
the gas compression pump is communicated with the annular gas channel (21) at the outermost layer of the plurality of annular gas channels (21) through a second connecting pipe (4);
the pressure gauge is communicated with the outermost annular gas channel (21) in the annular gas channels (21) through a third connecting pipe (5).
5. The vacuum chuck for clamping a silicon part according to claim 1, wherein:
in the plurality of annular gas channels (21), the communication positions between every two adjacent annular gas channels (21) are staggered with the communication positions between the other two adjacent annular gas channels (21).
6. The vacuum chuck for clamping a silicon part according to claim 1, wherein:
and a mounting hole (12) is formed in the center of the top cover (1).
7. The vacuum chuck for clamping a silicon part according to claim 6, wherein:
and radial positioning hole groups are arranged on the top cover (1) around the central position, and each positioning hole group comprises a plurality of positioning holes (13) arranged at intervals.
8. The vacuum chuck for clamping a silicon part according to claim 1, wherein:
and a sealing ring is arranged between the top cover (1) and the base (2).
9. The vacuum chuck for clamping a silicon part according to claim 1, wherein:
the distance between two adjacent annular adsorption rings is 3-15 mm.
10. The vacuum chuck for clamping a silicon part according to claim 1, wherein:
the top cover (1) is detachably connected with the base (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122262568.9U CN216098509U (en) | 2021-09-17 | 2021-09-17 | Vacuum chuck for clamping silicon part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122262568.9U CN216098509U (en) | 2021-09-17 | 2021-09-17 | Vacuum chuck for clamping silicon part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216098509U true CN216098509U (en) | 2022-03-22 |
Family
ID=80734601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122262568.9U Active CN216098509U (en) | 2021-09-17 | 2021-09-17 | Vacuum chuck for clamping silicon part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216098509U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114883240A (en) * | 2022-07-12 | 2022-08-09 | 中科领航医疗科技有限公司 | Low-pressure-difference steady-state vacuum chuck based on stepped conical flow channel |
-
2021
- 2021-09-17 CN CN202122262568.9U patent/CN216098509U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114883240A (en) * | 2022-07-12 | 2022-08-09 | 中科领航医疗科技有限公司 | Low-pressure-difference steady-state vacuum chuck based on stepped conical flow channel |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230713 Address after: 121000 No.46 a, Zhongxin Road, Taihe District, Jinzhou City, Liaoning Province Patentee after: Jinzhou Jinghe Semiconductor Co.,Ltd. Address before: 121000 No.46 a, Zhongxin Road, Taihe District, Jinzhou City, Liaoning Province Patentee before: JINZHOU THINKON SEMICONDUCTOR Co.,Ltd. |
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| TR01 | Transfer of patent right |