CN216094586U - Scaling powder coating device - Google Patents
Scaling powder coating device Download PDFInfo
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- CN216094586U CN216094586U CN202122313709.5U CN202122313709U CN216094586U CN 216094586 U CN216094586 U CN 216094586U CN 202122313709 U CN202122313709 U CN 202122313709U CN 216094586 U CN216094586 U CN 216094586U
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Abstract
The utility model provides a soldering flux coating device, which comprises: the glue scraping plate, the at least one glue box, the glue scraping driving mechanism and the at least one glue injection mechanism are arranged on the frame; the glue box is positioned above the glue scraping plate, the glue box is attached to the glue scraping plate, a glue storage cavity is formed in the glue box, a glue scraping opening is formed in the bottom surface of the glue box and is communicated with the glue storage cavity, at least one glue groove is formed in the upper surface of the glue scraping plate, and the glue scraping driving mechanism is connected with the glue scraping plate; the glue box is used for storing soldering flux through the glue storage cavity; the glue scraping driving mechanism is used for driving the glue scraping plate to move relative to the glue box so that soldering flux in the glue box enters the glue groove through the glue scraping opening and forms a glue film in the glue groove under the driving of the glue scraping plate; the glue injection mechanism is used for adding soldering flux into the glue storage cavity. The utility model realizes automatic adding of the soldering flux into the rubber box, reduces the labor cost and improves the chip packaging efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor device packaging, in particular to a soldering flux coating device.
Background
With the continuous development of modern information technology, integrated circuit chips are increasingly developing towards high density and high performance. In order to meet the packaging requirements of integrated circuit chips, advanced packaging technologies such as 2.5D and 3D packaging are developed.
Advanced packaging techniques in the prior art often require that a flux be applied to one side of a chip to be packaged, and then the chip to be packaged is fixed on a substrate by a die bonder or a flip chip machine. And need use gluey box and frictioning board to mutually support at the in-process of coating scaling powder, wherein glue the box and provide the scaling powder through gluing the inslot to frictioning board to make frictioning board prepare the even glued membrane of thickness through gluing the box removal relatively and supply the chip to use. However, when adding the soldering flux into the glue box, the whole device is often required to be stopped, and then the new soldering flux is injected into the glue box in a manual glue injection mode, so that the packaging efficiency of the chip is reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the soldering flux coating device provided by the utility model realizes the operation of automatically adding the soldering flux into the glue box by arranging the glue injection mechanism, reduces the labor cost and improves the chip packaging efficiency.
The utility model provides a soldering flux coating device, comprising: the glue scraping plate, the at least one glue box, the glue scraping driving mechanism and the at least one glue injection mechanism are arranged on the frame;
the glue box is positioned above the glue scraping plate, the glue box is attached to the glue scraping plate, a glue storage cavity is formed in the glue box, a glue scraping opening is formed in the bottom surface of the glue box and is communicated with the glue storage cavity, at least one glue groove is formed in the upper surface of the glue scraping plate, and the glue scraping driving mechanism is connected with the glue scraping plate;
the glue box is used for storing soldering flux through the glue storage cavity;
the glue scraping driving mechanism is used for driving the glue scraping plate to move relative to the glue box so that soldering flux in the glue box enters the glue groove through the glue scraping opening and forms a glue film in the glue groove under the driving of the glue scraping plate;
the glue injection mechanism is used for adding soldering flux into the glue storage cavity.
Optionally, the glue injection mechanism includes: the glue injection needle cylinder, the piston and the power-assisted part;
the glue injection needle cylinder is filled with soldering flux, the piston is positioned in the glue injection needle cylinder, and the power assisting piece is connected with the piston;
the power assisting element is used for pushing the piston so that the piston pushes the soldering flux in the glue injection needle cylinder to the glue storage cavity.
Optionally, the flux coating device further comprises: a work table;
the lower part of the rubber scraping plate is provided with a sliding seat, the sliding seat is connected with the workbench in a sliding manner, and the rubber scraping plate is fixedly connected with the sliding seat in a detachable manner.
Optionally, the rubber scraping plate is inserted into the sliding seat through a positioning pin;
the sliding seat is magnetically connected with the rubber scraping plate.
Optionally, a support seat is fixedly arranged on the workbench;
the glue box is detachably and fixedly connected with the supporting seat.
Optionally, the rubber box is located above the supporting seat, and the rubber box is inserted into the supporting seat through a positioning pin;
the supporting seat is magnetically connected with the rubber box.
Optionally, the glue injection mechanism further includes: a support frame;
the support frame is connected with the workbench in a sliding mode along a first direction, the sliding seat is connected with the workbench in a sliding mode along a second direction, and the first direction is intersected with the second direction;
the support frame is used for supporting the glue injection needle cylinder.
Optionally, the glue injection mechanism further includes: a positioning member;
the positioning piece is fixedly connected with the workbench and used for fixing the support frame when the glue injection needle cylinder moves to the glue injection station;
and the glue injection station is a position where the glue injection needle cylinder adds soldering flux into the glue storage cavity.
Optionally, a limiting member is further fixedly arranged on the workbench;
the limiting piece is positioned on one side of the supporting frame far away from the rubber box;
the limiting piece is used for limiting the sliding range of the support frame along the first direction.
Optionally, in a case that the number of the glue grooves is plural, the plural glue grooves are arranged along the second direction;
and under the condition that the number of the glue boxes is multiple, the glue boxes are arranged along the second direction.
Optionally, the flux coating apparatus further comprises: a leveling mechanism;
the glue scraping plate is positioned above the workbench;
the leveling mechanism is used for adjusting the inclination degree of the rubber scraping plate relative to the horizontal plane.
Optionally, the work table comprises: a base plate and a base;
the bottom plate is positioned above the base, the bottom plate is provided with a tightening hole and a tightening groove, the tightening hole and the tightening groove both penetrate through the upper surface of the bottom plate and the lower surface of the bottom plate, one end of the tightening groove is communicated with the tightening hole, and the other end of the tightening groove is communicated with the outer side surface of the bottom plate;
the leveling mechanism includes: the adjusting screw, the hollow nut and the locking screw;
the top of adjusting screw with the top of cavity nut is inconsistent, the bottom of adjusting screw passes cavity nut and base threaded connection, the cavity nut pass through the lock hoop hole with bottom plate threaded connection, the one end of locking screw is followed the side of bottom plate runs through the lock hoop groove along the horizontal direction, the one end and the bottom plate threaded connection that the locking screw runs through the lock hoop groove, and the other end and the bottom plate of locking screw are inconsistent.
Optionally, a boss is arranged on one side of the base plate, which faces the base, and the upper surface of the base abuts against the boss.
Optionally, the glue injection needle cylinder is located right above the glue box.
Optionally, the flux coating device further comprises: a glue amount monitor;
the monitoring end of the glue amount monitor faces the glue storage cavity;
the glue amount monitor is used for monitoring the residual amount of the soldering flux in the glue box and triggering the glue injection mechanism to add the soldering flux into the glue storage cavity when the residual amount is smaller than a threshold value.
Optionally, the glue groove comprises a plurality of bottom surfaces, and the bottom surfaces are different from each other in distance from the upper surface of the glue scraping plate.
According to the soldering flux coating device provided by the embodiment of the utility model, the operation of automatically adding the soldering flux into the glue box is realized by arranging the glue injection mechanism, so that the packaging of the chip is not required to be suspended, and the soldering flux is manually added into the glue box, so that the labor cost is reduced, and the chip packaging efficiency is improved.
Drawings
FIGS. 1 and 2 are perspective views of a flux applying apparatus according to an embodiment of the present application;
FIG. 3 is a front view of a flux applying apparatus according to an embodiment of the present application;
FIG. 4 is a top view of a doctor blade according to an embodiment of the present application;
FIG. 5 is a partial cross-sectional view of a flux applying apparatus according to an embodiment of the present application;
FIG. 6 is a bottom view of the base plate of an embodiment of the present application;
fig. 7 is a perspective view of a hollow nut according to an embodiment of the present application.
Reference numerals
1. A work table; 11. a base plate; 111. a tightening hole; 112. a hoop tightening groove; 12. a base; 13. a working bevel; 2. scraping a rubber plate; 21. a glue groove; 3. a glue box; 31. a glue storage cavity; 4. a glue scraping driving mechanism; 5. a glue injection mechanism; 51. a support frame; 52. a glue injection needle cylinder; 53. a power assist member; 54. a positioning member; 6. a leveling mechanism; 61. an adjusting screw; 611. a screw; 612. a nut; 62. a hollow nut; 63. locking the screw; 64. a gasket; 71. a slide base; 72. a supporting seat; 73. a limiting member; 74. a set screw; 75. a boss; 8. glue amount monitor.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is to be noted that, in the present invention, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The present embodiment provides a flux applying apparatus, referring to fig. 1 and 2, including: workstation 1, frictioning board 2, at least one glue box 3, frictioning actuating mechanism 4 and at least one injecting glue mechanism 5.
With reference to fig. 3, the glue scraping plate 2, the at least one glue box 3, the glue scraping driving mechanism 4 and the at least one glue injection mechanism 5 are all disposed above the workbench 1. Wherein, the number of the glue grooves 21 is not less than that of the glue boxes 3; the glue box 3 is positioned above the glue scraping plate 2, the glue box 3 is attached to the glue scraping plate 2, a glue storage cavity 31 is formed in the glue box 3, a glue scraping opening is formed in the bottom surface of the glue box 3 and is communicated with the glue storage cavity 31, at least one glue groove 21 is formed in the upper surface of the glue scraping plate 2, and the glue scraping driving mechanism 4 is connected with the glue scraping plate 2; the glue box 3 is used for storing soldering flux through the glue storage cavity 31; the scraping driving mechanism 4 is used for driving the scraping plate 2 to move relative to the glue box 3, so that the soldering flux in the glue box 3 enters the glue groove 21 through the scraping opening, and a glue film is formed in the glue groove 21 under the driving of the scraping plate 2; the glue injection mechanism 5 is used for adding soldering flux into the glue storage cavity 31.
Scrape the below of offset plate 2 and be provided with slide 71, slide 71 through corresponding slide rail along the second direction with workstation 1 slides and connects, scrape offset plate 2 with fixed connection can be dismantled to slide 71, slide 71 all is provided with supporting seat 72 along the relative both sides of second direction, supporting seat 72 passes through screw and workstation 1 fixed connection, glues the top that box 3 is located supporting seat 72, glue box 3 with fixed connection can be dismantled to supporting seat 72, injecting glue mechanism 5 slides along first direction and workstation 1 through corresponding slide rail and is connected.
In this embodiment, the first direction is a front-back direction, and the second direction is a left-right direction; the number of the glue boxes 3, the glue injection mechanisms 5 and the glue grooves 21 is two; each glue box 3 is installed through two supporting seats 72 respectively positioned at two sides of the sliding seat 71; the two glue injection mechanisms 5 are connected with the workbench 1 in a sliding manner along the front-back direction at the rear side of the sliding seat 71. The glue box 3 and the supporting seat 72 can be detachably and fixedly connected through screws or magnets, and the glue scraping plate 2 and the sliding seat 71 can also be detachably and fixedly connected through screws or magnets. In this embodiment, the glue box 3 and the supporting seat 72, and the glue scraping plate 2 and the sliding seat 71 are all detachably and fixedly connected through a magnet; the glue box 3 and the supporting seat 72 as well as the glue scraping plate 2 and the sliding seat 71 are correspondingly positioned and installed through positioning pins.
Specifically, the support base 72 and the slide base 71 are embedded with magnets, and the magnets may be permanent magnets or soft magnets. In this embodiment, the magnet is a permanent magnet. In the positioning installation of the sliding seat 71 and the rubber scraping plate 2, a vertically-placed first positioning pin is fixedly arranged on the upper surface of the sliding seat 71, a first positioning hole is formed in the lower surface of the rubber scraping plate 2, the first positioning pin is matched with the first positioning hole, and the first positioning pin is connected with the sliding seat 71 in an inserting mode through the first positioning hole, so that the sliding seat 71 and the rubber scraping plate 2 are installed in a positioning mode along the vertical direction. In this embodiment, the upper surface of the sliding base 71 is fixedly provided with three first positioning pins vertically arranged along the left-right direction, and the sliding base 71 is installed with the rubber scraping plate 2 through the three first positioning pins. The positions of the first positioning pin and the first positioning hole can be interchanged, which is not limited in this embodiment.
In the positioning installation of the rubber box 3 and the supporting seat 72, a vertically placed second positioning pin is respectively fixedly arranged at the front end and the rear end of the rubber box 3, a second positioning hole is formed in the upper surface of the supporting seat 72, and the second positioning pin is inserted into the sliding seat 71 through the second positioning hole, so that the positioning installation of the rubber box 3 and the supporting seat 72 along the up-down direction is realized.
In this embodiment, can be convenient for glue box 3 and scrape loading and the dismantlement of offset plate 2 through adopting magnet to realize gluing box 3 and scraping the fixed of offset plate 2, through to adopting along upper and lower direction to glue box 3 and scrape offset plate 2 and fix a position the installation then can realize gluing box 3 and scraping the swift stable installation of offset plate 2 under the effect of corresponding magnet.
Referring to fig. 4, each of the glue grooves 21 includes a plurality of bottom surfaces, which are spaced apart from the upper surface of the squeegee 2 by different distances. Every gluey groove 21 through setting up on scraping offset plate 2 possesses a plurality of depths, so can form the glued membrane of different thickness in gluey groove 21 to need not to change scraping offset plate 2 when dipping glue to the bump of co-altitude not on the chip, enlarged scaling powder coating device's range of application, reduced scraping offset plate 2's use cost. In the present embodiment, each glue groove 21 includes four bottom surfaces with different heights and the same size. The depth of the glue groove 21 on the glue scraping plate 2 can be made according to the height of the bump of the chip, and the embodiment is not limited specifically. Wherein, the depth tolerance of the rubber groove 21 is within +/-2 μm, the roughness of the upper surface of the rubber scraping plate 2 is above grade 13, and the hardness of the rubber scraping plate 2 is more than 54 HRC.
With reference to fig. 1 to 3, the glue injection mechanism 5 includes: the support frame 51, injecting glue syringe 52, piston and helping hand piece 53. The glue injection needle cylinder 52 is filled with soldering flux, the piston is positioned in the glue injection needle cylinder 52 and is connected with the glue injection needle cylinder 52 in a sliding manner, and the power assisting piece 53 is fixedly connected with the piston; the boosting member 53 is used for pushing the piston, so that the piston pushes the soldering flux in the glue injection needle cylinder 52 to make the opening of the glue injection needle cylinder 52 enter the glue storage cavity 31. Wherein, the supporting frame 51 is connected with the workbench 1 in a sliding way along the front and back direction; the glue injection needle cylinder 52 and the power assisting piece 53 are both fixedly connected with the support frame 51. The boosting part 53 can be an air cylinder or an electric push rod.
In the present embodiment, the upper surface of the glue box 3 is provided with a glue injection opening, and the opening of the glue injection syringe 52 faces the glue injection opening; the power assisting part 53 is a cylinder, a movable rod of the cylinder is vertically downwards fixedly connected with the piston, and a shell of the cylinder is fixedly connected with the supporting frame 51.
The assisting element 53 pushes the piston, so that the time for adding the soldering flux into the glue storage cavity 31 by the glue injection mechanism 5 can be determined by monitoring the residual amount of the soldering flux in the glue storage cavity 31 or setting a time interval. In the embodiment, the flux coating device monitors the residual amount of the flux in the glue storage cavity 31 to determine the time when the glue injection mechanism 5 adds the flux to the glue storage cavity 31.
Specifically, the flux coating device further comprises: glue amount monitor 8. The monitoring end of the glue amount monitor 8 faces the glue storage cavity 31. The glue amount monitor 8 is used for monitoring the residual amount of the soldering flux in the glue box 3 and triggering the glue injection mechanism 5 to add the soldering flux into the glue storage cavity 31 when the residual amount is smaller than a threshold value. The glue amount monitor 8 may be a camera or a sensor or the like. In this embodiment, the glue amount monitor 8 is a glue amount monitoring sensor, and the glue amount monitoring sensor monitors the position of the upper surface of the soldering flux in the glue storage cavity 31 through the glue injection opening, so as to determine whether the remaining amount of the soldering flux is smaller than a threshold value, and this embodiment does not specifically limit the threshold value. The automation of the soldering flux coating device can be further improved by arranging the glue amount monitor 8, so that the soldering flux coating device can work continuously without manually monitoring the glue amount remained in the glue box 3.
Further, the glue injection mechanism 5 further comprises: the positioning member 54. The positioning element 54 is fixedly connected to the workbench 1, and the positioning element 54 is used for fixing the support frame 51 when the glue injection syringe 52 moves to the glue injection station. The glue injection station is a position where the glue injection needle cylinder 52 adds soldering flux into the glue storage cavity 31. In the present embodiment, the glue injection syringe 52 is located right above the glue cartridge 3 when the glue injection syringe 52 moves to the glue injection station.
The positioning member 54 may be a screw, a positioning pin, or an elbow clip. In the present embodiment, the positioning member 54 is an elbow clip. The elbow clamp seat is fixedly connected with the workbench 1 and located on the right side of the support frame 51, the elbow clamp wrench is pulled to enable the elbow clamp push rod to be abutted against the rear side face of the support frame 51, the front side face of the support frame 51 is abutted against the corresponding support seat 72, and therefore the support frame 51 is fixed, and the glue injection needle cylinder 52 is located at the glue injection station. When the glue injection needle cylinder 52 needs to be moved out of the glue injection station, the elbow clamp wrench only needs to be pulled in the opposite direction, the elbow clamp push rod can be separated from the support frame 51, and meanwhile, the position of the elbow clamp push rod is adjusted, so that the elbow clamp push rod is moved to the right side of the support frame 51, the support frame 51 can move backwards along the corresponding slide rail, and the glue injection needle cylinder 52 is moved out of the glue injection station. The present embodiment does not limit the structure of the elbow clip. Can slide relatively workstation 1 through setting up injecting glue mechanism 5, then can provide the space of loading and unloading for gluing box 3 and frictioning board 2 so to further improve the loading and unloading efficiency who glues box 3 and frictioning board 2.
Further, a limiting member 73 is further fixedly disposed on the working table 1. The limiting piece 73 is positioned on one side of the supporting frame 51 far away from the rubber box 3; the limiting member 73 is used for limiting the sliding range of the support frame 51 along the first direction. In this embodiment, the limiting member 73 is a stopper, and the limiting member 73 is located right behind the supporting frame 51 and is fixedly connected to the workbench 1. The limiting member 73 is not particularly limited in the present embodiment. When the supporting frame 51 abuts against the limiting member 73, the glue injection syringe 52 is completely removed from the glue injection station. The stopper 73 prevents the support frame 51 from coming off the table 1.
Further, the flux coating apparatus further includes: and a leveling mechanism 6. The leveling mechanism 6 is connected with the workbench 1. The leveling mechanism 6 is used for adjusting the inclination degree of the frictioning plate 2 relative to the horizontal plane.
With reference to fig. 5 and 6, the leveling mechanism 6 includes: an adjusting screw 61, a hollow nut 62 and a locking screw 63. The adjustment screw 61 includes: a threaded rod 611 and a nut 612. The work table 1 includes: a base plate 11 and a base 12.
The bottom plate 11 is located above the base 12. The bottom plate 11 is provided with a tightening hole 111 and a tightening groove 112. The tightening hole 111 and the tightening groove 112 penetrate through the upper surface of the bottom plate 11 and the lower surface of the bottom plate 11; one end of the tightening groove 112 penetrates through the tightening hole 111 along the horizontal direction; the other end of the tightening groove 112 communicates with the outer side surface of the base plate 11, and a tightening opening is formed.
With reference to fig. 5 to 7, one end of the screw 611 is fixedly connected to the nut 612, and the other end of the screw 611 passes through the through hole inside the hollow nut 62 and is in threaded connection with the base 12; the nut 612 is located above the hollow nut 62 and abuts the top end of the hollow nut 62. The side surface of the hollow nut 62 is provided with an external thread (not shown in the figure), the bottom plate 11 is provided with an internal thread matched with the external thread of the hollow nut 62 at the position of the tightening hole 111, and the hollow nut 62 is in threaded connection with the bottom plate 11 through the tightening hole 111. In the present embodiment, the side surface of the hollow nut 62 includes: connecting portion and driving surface. The external thread of the hollow nut 62 is arranged on the connecting portion, and the driving surface is provided with a plane. A gasket 64 is arranged above the hollow nut 62, and the nut 612 is abutted against the hollow nut 62 through the gasket 64.
The locking screw 63 is located on the side of the tightening hole 111 facing the tightening opening. One end of the locking screw 63 penetrates through the tightening groove 112 from the front side surface of the bottom plate 11 along the horizontal direction and is in threaded connection with the bottom plate 11; the other end of the locking screw 63 abuts against the bottom plate 11.
In the adjustment scrape the in-process of the inclination of offset plate 2 relative horizontal plane, rotate hollow nut 62 through the driving surface, make hollow nut 62 relative bottom plate 11 upwards or move down, thereby make adjusting screw 61 relative bottom plate 11 upwards or move down, and then make bottom plate 11 relative base 12 downward or tilt up in the position department of lock ring screw, thereby realize scraping the adjustment of the inclination of offset plate 2 relative horizontal plane, and then realize gluey groove 21 and the paster head that is used for driving the chip to dip in gluey parallels, the success rate of dipping in gluey has been guaranteed.
A boss 75 is provided on a side of the base plate 11 facing the base 12. The upper surface of the base 12 abuts against the boss 75. In this embodiment, the boss 75 is fixedly connected to the base plate 11. The boss 75 is arranged to leave a gap between the bottom plate 11 and the base 12, thereby facilitating the adjustment of the inclination degree of the squeegee 2 relative to the horizontal plane.
Further, a fixing screw 74 is further provided on the table 1. The fixing screw 74 penetrates through the bottom plate 11 in the vertical direction and is in threaded connection with the base 12, and the top of the fixing screw 74 abuts against the bottom plate 11. In this embodiment, the fixing screw 74 simultaneously penetrates the boss 75. The fixing screw 74 can ensure that the boss 75 is stably positioned between the base plate 11 and the base 12, and the phenomenon of edge warping caused by the adjustment of the tightening screw is avoided.
In the present embodiment, the leveling mechanisms 6 are two in number. The two leveling mechanisms 6 are respectively positioned at the front side and the rear side of the rubber scraping plate 2, and the fixing screw 74 is positioned at the rear side of the rubber scraping plate 2. This forms a fixed point and two adjustment points on the table 1. The positions of one fixed point and two adjusting points on the workbench 1 are distributed in a shape of a waist triangle, an equilateral triangle or a right-angled triangle. The bottom plate 11 with the base 12 is provided with work inclined plane 13, work inclined plane 13 does the bottom plate 11 with base 12 forms a side. The two adjustment points are located on the side of the fixing point facing the working ramp 13. In the embodiment, the positions of one fixed point and two adjusting points on the workbench 1 are distributed in a shape of a waist triangle; the work slope 13 is a side surface of the left front side of the table 1. Therefore, the occupied area of the workbench 1 is smaller, and an operator can conveniently adjust the devices on the workbench 1.
In addition, the squeegee drive mechanism 4 may be driven by a linear drive or a crank drive. In this embodiment, the frictioning driving mechanism 4 adopts a linear drive, the frictioning starting mechanism is a screw transmission mechanism, and the specific structure of the screw transmission mechanism is not limited in this embodiment. The screw transmission mechanism is fixedly arranged on the workbench 1, and a screw female seat of the screw transmission mechanism is fixedly connected with the sliding seat 71. In the present embodiment, the squeegee 2 is moved cyclically in the left-right direction by the squeegee drive mechanism 4.
Scaling powder coating device provides one and dips in gluey station in this embodiment and supplies the chip to dip in gluey, dip in gluey station and be located two positions of gluing 3 middles of box. The specific glue scraping process is as follows:
after the chip and the glue film in the right glue groove 21 are dipped, the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move rightwards, the glue groove 21 on the left side passes through the lower part of the left glue box 3, and the glue film is moved to a glue dipping station under the scraping brush at the bottom of the left glue box 3; at this time, the glue box 3 on the right side injects the soldering flux into the glue groove 21 on the right side, and the glue scraping driving mechanism 4 continues to drive the glue scraping plate 2 to move rightwards; when the glue film is moved to the glue dipping station by the glue box 3 on the left side, the glue scraping plate 2 stops moving rightwards, at the moment, the glue groove 21 on the right side moves to the right side of the glue box 3 on the right side, and the chip mounting head drives a new chip to continue glue dipping at the glue dipping station; after the new chip is dipped with glue, the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move leftwards, the glue groove 21 on the right side passes under the glue box 3 on the right side, and the glue film is moved to a glue dipping station under the scraping brush at the bottom of the glue box 3 on the right side; the two glue tanks 21 can alternately provide corresponding glue films for the chips to dip glue at the glue dipping station. And the soldering flux coating device can quickly finish the glue dipping process of the chip by matching with a large-lead screw driving structure.
In an alternative embodiment, the flux coating device provides two glue dipping stations for the chips to be dipped, and the two glue dipping stations are located on the right side or the left side of the corresponding glue box 3. Take two glue dipping stations to be located the corresponding 3 right sides of gluey box as the example, specific frictioning in-process is as follows:
when the two glue grooves 21 are both positioned under the corresponding glue box 3, the soldering flux flows into the glue grooves 21 from the bottom of the glue box 3; after the glue groove 21 is filled with the soldering flux, the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move rightwards, and two glue films formed under the scraping brush at the bottom of the left glue box 3 move to corresponding glue dipping stations for glue dipping; after the completion dips in and glues, frictioning actuating mechanism 4 drives frictioning board 2 and moves left to make gluey groove 21 remove under corresponding gluey box 3, load the scaling powder again, so two gluey grooves 21 of circulation reciprocating can provide the glued membrane simultaneously and dip in and glue.
Alternatively, before the glue scraping driving mechanism 4 is driven to drive the glue scraping plate 2 to move rightwards, the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move leftwards, so that the glue groove 21 moves to the left side of the corresponding glue box 3.
In an alternative embodiment, the number of the glue boxes 3 is one, the number of the glue grooves 21 is two, the soldering flux coating device provides two glue dipping stations for the chips to dip glue, and the two glue dipping stations are respectively located on the left side and the right side of the glue boxes 3. Wherein, the left glue groove 21 passes through the glue film to the chip through the left glue dipping station; the right glue groove 21 passes through the glue film to the chip through the right glue dipping station. The specific glue scraping process is as follows:
when the right glue groove 21 moves to the right glue dipping station to provide glue films for the corresponding chips to be dipped, the left glue groove 21 is positioned right below the glue box 3, and the soldering flux flows into the left glue groove 21 through the glue scraping opening; after the right glue groove 21 finishes glue dipping, the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move leftwards, and at the moment, the scaling powder in the left glue groove 21 forms a glue film under the scraping brush of the glue box 3 and moves to the left glue dipping station; when the left glue groove 21 moves to the left glue dipping station, the right glue groove 21 is positioned right below the glue box 3, and the soldering flux flows into the left glue groove 21 through the glue scraping opening; after the left glue groove 21 finishes glue dipping, the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move rightwards, and at the moment, the scaling powder in the right glue groove 21 forms a glue film under the scraping brush of the glue box 3 and moves towards the right glue dipping station; the two glue tanks 21 can alternately provide corresponding glue films at two different glue dipping stations for dipping the chips.
Alternatively, after the right glue groove 21 finishes dipping glue, and before the operation of "the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move left" is executed, the glue scraping driving mechanism 4 further continues to drive the glue scraping plate 2 to move right, so that the left glue groove 21 moves the right side of the glue box 3. Similarly, after the glue groove 21 on the left side finishes dipping glue, and before the operation of "the glue scraping driving mechanism 4 drives the glue scraping plate 2 to move right" is executed, the glue scraping driving mechanism 4 further continues to drive the glue scraping plate 2 to move left, so that the glue groove 21 on the right side moves the left side of the glue box 3. So can make the scaling powder in the gluey groove 21 pass through the brush of hanging of gluing box 3 many times to guarantee the homogeneity of glued membrane.
In an alternative embodiment, the flux coating apparatus further comprises; and a control module. The control module is electrically connected with the glue injection mechanism 5 and the glue amount monitor 8. In this alternative embodiment, the control module is electrically connected to the booster 53 in the glue injection mechanism 5. When the control module monitors that the residual quantity of the soldering flux in the glue box 3 is smaller than the threshold value through the glue quantity monitor 8, the control module triggers the power assisting part 53 to push the piston to move downwards so as to add the soldering flux into the glue storage cavity 31.
In an alternative embodiment, this alternative embodiment differs from the previous alternative embodiment in that: the glue amount monitor 8 is replaced with a timing module. The timing module is used for sending glue injection signals to the control module at specified time intervals, and the control module controls the glue injection mechanism 5 to add soldering flux into the glue storage cavity 31 after receiving the glue injection signals.
This scaling powder coating device simple structure, space utilization is high, has realized the automatic operation to adding the scaling powder in gluing box 3 through setting up injecting glue mechanism 5, need not so to halt the encapsulation of chip and add the scaling powder in gluing box 3 by the manual work to reduced the cost of labor, improved the efficiency of chip encapsulation.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (14)
1. A flux coating apparatus, comprising: the glue scraping plate, the at least one glue box, the glue scraping driving mechanism and the at least one glue injection mechanism are arranged on the frame;
the glue box is positioned above the glue scraping plate, the glue box is attached to the glue scraping plate, a glue storage cavity is formed in the glue box, a glue scraping opening is formed in the bottom surface of the glue box and is communicated with the glue storage cavity, at least one glue groove is formed in the upper surface of the glue scraping plate, and the glue scraping driving mechanism is connected with the glue scraping plate;
the glue box is used for storing soldering flux through the glue storage cavity;
the glue scraping driving mechanism is used for driving the glue scraping plate to move relative to the glue box so that soldering flux in the glue box enters the glue groove through the glue scraping opening and forms a glue film in the glue groove under the driving of the glue scraping plate;
the glue injection mechanism is used for adding soldering flux into the glue storage cavity.
2. The flux coating apparatus of claim 1, wherein the glue injection mechanism comprises: the glue injection needle cylinder, the piston and the power-assisted part;
the glue injection needle cylinder is filled with soldering flux, the piston is positioned in the glue injection needle cylinder, and the power assisting piece is connected with the piston;
the power assisting element is used for pushing the piston so that the piston pushes the soldering flux in the glue injection needle cylinder to the glue storage cavity.
3. The flux coating apparatus of claim 2, further comprising: a work table;
the lower part of the rubber scraping plate is provided with a sliding seat, the sliding seat is connected with the workbench in a sliding manner, and the rubber scraping plate is fixedly connected with the sliding seat in a detachable manner.
4. The flux coating apparatus of claim 3, wherein the squeegee is inserted into the carriage by a positioning pin;
the sliding seat is magnetically connected with the rubber scraping plate.
5. The flux coating apparatus of claim 3, wherein a support base is fixedly disposed on the worktable;
the glue box is detachably and fixedly connected with the supporting seat.
6. The flux coating apparatus of claim 5, wherein the cartridge is located above the support base, and the cartridge is inserted into the support base through a positioning pin;
the supporting seat is magnetically connected with the rubber box.
7. The flux coating apparatus of claim 3, wherein the glue injection mechanism further comprises: a support frame;
the support frame is connected with the workbench in a sliding mode along a first direction, the sliding seat is connected with the workbench in a sliding mode along a second direction, and the first direction is intersected with the second direction;
the support frame is used for supporting the glue injection needle cylinder.
8. The flux coating apparatus of claim 7, wherein the glue injection mechanism further comprises: a positioning member;
the positioning piece is fixedly connected with the workbench and used for fixing the support frame when the glue injection needle cylinder moves to the glue injection station;
and the glue injection station is a position where the glue injection needle cylinder adds soldering flux into the glue storage cavity.
9. The flux coating apparatus of claim 7, wherein in case that the number of the glue grooves is plural, the plural glue grooves are arranged in the second direction;
and under the condition that the number of the glue boxes is multiple, the glue boxes are arranged along the second direction.
10. The flux coating apparatus of claim 3, further comprising: a leveling mechanism;
the glue scraping plate is positioned above the workbench;
the leveling mechanism is used for adjusting the inclination degree of the rubber scraping plate relative to the horizontal plane.
11. The flux coating apparatus of claim 10, wherein the stage comprises: a base plate and a base;
the bottom plate is positioned above the base, the bottom plate is provided with a tightening hole and a tightening groove, the tightening hole and the tightening groove both penetrate through the upper surface of the bottom plate and the lower surface of the bottom plate, one end of the tightening groove is communicated with the tightening hole, and the other end of the tightening groove is communicated with the outer side surface of the bottom plate;
the leveling mechanism includes: the adjusting screw, the hollow nut and the locking screw;
the top of adjusting screw with the top of cavity nut is inconsistent, the bottom of adjusting screw passes cavity nut and base threaded connection, the cavity nut pass through the lock hoop hole with bottom plate threaded connection, the one end of locking screw is followed the side of bottom plate runs through the lock hoop groove along the horizontal direction, the one end and the bottom plate threaded connection that the locking screw runs through the lock hoop groove, and the other end and the bottom plate of locking screw are inconsistent.
12. The flux coating apparatus of claim 2, wherein the glue injection syringe is positioned directly above the glue cartridge.
13. The flux coating apparatus of claim 1, further comprising: a glue amount monitor;
the monitoring end of the glue amount monitor faces the glue storage cavity;
the glue amount monitor is used for monitoring the residual amount of the soldering flux in the glue box and triggering the glue injection mechanism to add the soldering flux into the glue storage cavity when the residual amount is smaller than a threshold value.
14. The flux applying apparatus as set forth in claim 1, wherein the glue groove includes a plurality of bottom surfaces which are spaced from the upper surface of the squeegee by different distances.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122313709.5U CN216094586U (en) | 2021-09-24 | 2021-09-24 | Scaling powder coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122313709.5U CN216094586U (en) | 2021-09-24 | 2021-09-24 | Scaling powder coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216094586U true CN216094586U (en) | 2022-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122313709.5U Active CN216094586U (en) | 2021-09-24 | 2021-09-24 | Scaling powder coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216094586U (en) |
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2021
- 2021-09-24 CN CN202122313709.5U patent/CN216094586U/en active Active
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