CN216084852U

CN216084852U - Packaging structure of dynamic random access memory

Info

Publication number: CN216084852U
Application number: CN202121695426.5U
Authority: CN
Inventors: 岳宗莲; 阮建军
Original assignee: Shenzhen Shijiexin Electronic Technology Co ltd
Current assignee: Shenzhen Shijiexin Electronic Technology Co ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2022-03-18
Anticipated expiration: 2031-07-22

Abstract

The utility model relates to the technical field of memories, in particular to a packaging structure of a dynamic random access memory, which comprises an upper sealing cover and a lower sealing cover, wherein a second heat-conducting plate is arranged on the inner wall of the top of the upper sealing cover, a first heat-conducting plate is arranged on the inner wall of the bottom of the lower sealing cover, heat radiating fins which are distributed at equal intervals are arranged on the outer walls of the ends, far away from each other, of the first heat-conducting plate and the second heat-conducting plate, a storage chip is arranged in the upper sealing cover and the lower sealing cover, supporting rods are arranged on four corners of the bottom of the lower sealing cover, connecting blocks are arranged on the outer walls of two sides of the storage chip, and limiting grooves matched with the supporting rods are arranged at two ends of the outer wall of the top of the connecting blocks. And the quick fixation of the memory chip is realized.

Description

Packaging structure of dynamic random access memory

Technical Field

The utility model relates to the technical field of memories, in particular to a packaging structure of a dynamic random access memory.

Background

As electronic devices such as personal computers, mobile phones, digital cameras, digital video cameras, and personal digital assistants are sold and digital audiovisual multimedia is enjoyed, the demand for electronic storage devices such as hard disks and memory cards has increased dramatically.

In the prior art, the following problems exist:

(1) most of electronic dynamic random access memories in the current market do not have a heat dissipation function, so that the service life of the memories is shortened;

(2) most of the existing memories are of an integrated structure, so that internal components cannot be conveniently disassembled to be overhauled, and the use of the memories has limitations.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a package structure of a dynamic random access memory, so as to solve the problems mentioned in the background art.

The technical scheme of the utility model is as follows: the utility model provides a DRAM's packaging structure, includes upper seal lid and lower seal lid, the second heat-conducting plate is installed to upper seal lid top inner wall, and the inner wall of lower seal lid bottom installs first heat-conducting plate, and the fin that the equidistance distributes is all installed to the one end outer wall that first heat-conducting plate and second heat-conducting plate kept away from each other, and the inside of upper seal lid and lower seal lid is provided with storage chip, and four turnings in lower seal lid bottom all are provided with the bracing piece.

Preferably, the connecting block is all installed to storage chip both sides outer wall, and connecting block top outer wall both ends all seted up with bracing piece assorted spacing groove, and the wire is all installed to storage chip both sides outer wall, go up sealed lid and seal down both sides outer wall all seted up with wire width assorted spread groove.

Preferably, four corners of the inner wall of the top of the upper sealing cover are provided with sealing cylinders matched with the circumferential outer wall of the supporting rod.

Preferably, the outer walls of the two sides of the upper sealing cover are both provided with upper thread blocks, and the outer walls of the two ends of the upper sealing cover are both provided with pins distributed equidistantly.

Preferably, lower thread blocks are arranged at two ends of the outer walls of two sides of the lower sealing cover, and the outer diameters of the lower thread blocks are matched with those of the upper thread blocks.

Preferably, two fixing nuts are arranged on two sides of the lower sealing cover, and the inner diameters of the fixing nuts are matched with the outer diameters of the lower thread block and the upper thread block.

Preferably, the sliding groove is formed in the inner wall of the top of the connecting groove in the upper sealing cover, the inner wall of the sliding groove is connected with the extrusion plate in a sliding mode, the outer wall of the top of the extrusion plate is provided with the telescopic spring, and the outer wall of the top of the telescopic spring is fixedly connected with the inner wall of the top of the sliding groove.

Preferably, the sliding grooves are formed in the inner walls of the two sides of the lower sealing cover, the sliding grooves are connected with sliding plates in a sliding mode, a supporting plate is installed on the outer wall of one side, opposite to the two sliding plates, of the supporting plate, a limiting frame is installed on the outer wall of the top of the supporting plate, fixing springs distributed equidistantly are installed on the outer wall of the bottom of the sliding plate, and the outer wall of the bottom of the fixing springs is fixedly connected with the inner wall of the bottom of the sliding groove.

The utility model provides a packaging structure of a dynamic random access memory by improving, compared with the prior art, the packaging structure has the following improvements and advantages: comprises the following steps.

One is as follows: according to the utility model, the storage chip is inserted into the supporting rod through the limiting groove on the connecting block by the supporting rod arranged on the lower sealing cover, and then the sealing cylinder on the upper sealing cover is inserted into the supporting rod, so that the limiting function is achieved, and the storage chip can be rapidly fixed;

the second step is as follows: according to the utility model, the upper thread block arranged on the upper sealing cover is matched with the lower thread block on the lower sealing cover, the lower sealing cover and the upper sealing cover can be quickly fixed through the fixing nut, so that the internal part can be maintained and treated conveniently next time, and the storage chip in work can be cooled through the second heat-conducting plate arranged on the upper sealing cover, the first heat-conducting plate arranged on the lower sealing cover and the radiating fins, so that the contact with the outside air is avoided, the air dust is prevented from accumulating on the surface of the storage chip, and the service life is prolonged.

Drawings

The utility model is further explained below with reference to the figures and examples:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic cross-sectional view of the upper sealing cover of the present invention;

FIG. 3 is a cross-sectional view of the lower sealing cap of the present invention;

FIG. 4 is a schematic view of a package structure seal of the present invention;

FIG. 5 is a schematic cross-sectional view of a sealing cap according to example 2 of the present invention;

FIG. 6 is a schematic sectional view of a lower sealing cap according to example 3 of the present invention;

description of reference numerals:

1. a lower sealing cover; 2. fixing a nut; 3. a wire; 4. an upper thread block; 5. an upper sealing cover; 6. a heat sink; 7. connecting blocks; 8. a lower thread block; 9. a support bar; 10. a memory chip; 11. a first heat-conducting plate; 12. a second heat-conducting plate; 13. a sealing cylinder; 14. a pressing plate; 15. a tension spring; 16. a sliding groove; 17. a pin; 18. fixing the spring; 19. a sliding plate; 20. a support plate; 21. and a limiting frame.

Detailed Description

The present invention is described in detail below, and technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model provides a packaging structure of a dynamic random access memory by improvement, and the technical scheme of the utility model is as follows:

example 1

As shown in fig. 1-4, an encapsulating structure of a dynamic random access memory comprises an upper sealing cover 5 and a lower sealing cover 1, a second heat conducting plate 12 is installed on the inner wall of the top of the upper sealing cover 5, a first heat conducting plate 11 is installed on the inner wall of the bottom of the lower sealing cover 1, radiating fins 6 which are distributed equidistantly are installed on the outer walls of one ends, away from each other, of the first heat conducting plate 11 and the second heat conducting plate 12, a storage chip 10 is arranged inside the upper sealing cover 5 and the lower sealing cover 1, supporting rods 9 are arranged at four corners of the bottom of the lower sealing cover 1, the storage chip 10 in work can be cooled, contact with the outside air is avoided, air dust is prevented from accumulating on the surface of the storage chip, and the service life is prolonged.

Further, connecting block 7 is all installed to memory chip 10 both sides outer wall, and connecting block 7 top outer wall both ends all seted up with bracing piece 9 assorted spacing groove, and wire 3 is all installed to memory chip 10 both sides outer wall, go up sealed

lid

5 and 1 both sides outer wall of lower sealing lid all seted up with 3 width assorted spread grooves of wire, make things convenient for the connection installation of wire 3.

Further, four corners of the inner wall of the top of the upper sealing cover 5 are provided with sealing cylinders 13 matched with the circumferential outer wall of the supporting rod 9, and the storage chip 10 can be extruded.

Furthermore, the two ends of the outer walls of the two sides of the upper sealing cover 5 are both provided with upper thread blocks 4, and the outer walls of the two ends of the upper sealing cover 5 are both provided with pins 17 distributed at equal intervals.

Further, lower thread blocks 8 are mounted at two ends of the outer wall of two sides of the lower sealing cover 1, the outer diameters of the lower thread blocks 8 are matched with the outer diameters of the upper thread blocks 4, and the lower thread blocks 8 are located right below the corresponding upper thread blocks 4.

Further, 1 both sides of lower sealing lid all are provided with two fixation nut 2, and fixation nut 2's internal diameter and the external diameter phase-match of lower thread piece 8 and last thread piece 4, can be fast with lower sealing lid 1 and the quick fixed of last sealing lid 5, and the convenience is maintained the processing to inside next time.

The working principle is as follows: through setting up bracing piece 9 on lower sealing cover 1, insert storage chip 10 on bracing piece 9 through the spacing groove on connecting block 7, then sealed 13 on the sealed lid 5 of going up inserts on bracing piece 9, spacing function has been played, and realized quick the quick fixed to storage chip 10, through setting up last screw block 4 on last sealed lid 1, lower screw block 8 on the sealed lid 1 of cooperation down, can fix sealed lid 1 and last sealed lid 5 fast down through fixation nut 2, convenient next time maintains the processing to inside, through setting up second heat-conducting plate 12 on last sealed lid 5, first heat-conducting plate 11 and fin 6 on the sealed lid 1 of down, can dispel the heat the cooling to storage chip 10 in service, and avoid contacting with the outside air, avoid the air dust to collect and collect on its surface, service life is improved.

Example 2

Based on the package structure of the dynamic random access memory provided in the first embodiment of the present application, a second embodiment of the present application provides another package structure of the dynamic random access memory. The second embodiment is merely a preferred way of the first embodiment, and the implementation of the second embodiment does not affect the implementation of the first embodiment alone.

The second embodiment of the present invention will be further described with reference to the drawings and the following description.

As shown in fig. 1-5, sliding groove 16 has been seted up to the spread groove top inner wall on the sealed lid 5 of going up, and sliding groove 16 inner wall sliding connection has stripper plate 14, and expanding spring 15 is installed to stripper plate 14 top outer wall, and expanding spring 15 top outer wall and sliding groove 16 top inner wall fixed connection can extrude sealed wire 3, avoid external dust to enter into inside through the spread groove, have further improved sealed effect.

Example 3

Based on the package structure of the dynamic random access memory provided in the first embodiment of the present application, a third embodiment of the present application provides another package structure of the dynamic random access memory. The third embodiment is only a preferable mode of the first and second embodiments, and the implementation of the third embodiment does not affect the individual implementations of the first and second embodiments.

As shown in fig. 1-6, the inner walls of the two sides of the lower sealing cover 1 are both provided with sliding grooves, and the inner walls of the sliding grooves are slidably connected with sliding plates 19, the outer wall of one side opposite to the two sliding plates 19 is provided with a supporting plate 20, the outer wall of the top of the supporting plate 20 is provided with a limiting frame 21, the outer wall of the bottom of the sliding plate 19 is provided with fixing springs 18 distributed at equal intervals, the outer wall of the bottom of the fixing spring 18 is fixedly connected with the inner wall of the bottom of the sliding groove, so that the memory chip 10 can be placed on the supporting plate 20, the limiting frame 21 limits the memory chip 10, and the fixing efficiency is improved, and when the memory chip is fixed, the upper sealing cover 5 can extrude the memory chip 10, and at the moment, the sliding plate 19 and the fixed spring 18 are driven to move downwards, so that the buffer function is achieved, the memory chip 10 can be protected in a buffer mode during working, the memory chip 10 is prevented from being damaged during collision, and the use safety of the memory chip 10 is improved.

The previous description is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A packaging structure of a dynamic random access memory is characterized in that: including last sealed lid (5) and lower sealing cover (1), second heat-conducting plate (12) are installed to last sealed lid (5) top inner wall, and lower sealing cover (1) bottom inner wall installs first heat-conducting plate (11), and fin (6) that the equidistance distributes are all installed to the one end outer wall that first heat-conducting plate (11) and second heat-conducting plate (12) kept away from each other, and the inside of going up sealed lid (5) and lower sealing cover (1) is provided with memory chip (10), and four turnings in lower sealing cover (1) bottom all are provided with bracing piece (9).

2. The package structure of DRAM according to claim 1, wherein: connecting block (7) are all installed to memory chip (10) both sides outer wall, and connecting block (7) top outer wall both ends all seted up with bracing piece (9) assorted spacing groove, and wire (3) are all installed to memory chip (10) both sides outer wall, go up sealed lid (5) and seal down lid (1) both sides outer wall and all seted up with wire (3) width assorted spread groove.

3. The package structure of DRAM according to claim 2, wherein: and four corners of the inner wall of the top of the upper sealing cover (5) are provided with sealing cylinders (13) matched with the circumferential outer wall of the support rod (9).

4. The package structure of DRAM according to claim 1, wherein: the upper sealing cover is characterized in that the two ends of the outer walls of the two sides of the upper sealing cover (5) are respectively provided with an upper thread block (4), and the outer walls of the two ends of the upper sealing cover (5) are respectively provided with pins (17) which are distributed equidistantly.

5. The package structure of DRAM according to claim 4, wherein: lower thread blocks (8) are installed at two ends of the outer walls of two sides of the lower sealing cover (1), and the outer diameters of the lower thread blocks (8) and the upper thread blocks (4) are matched.

6. The package structure of DRAM according to claim 5, wherein: two fixing nuts (2) are arranged on two sides of the lower sealing cover (1), and the inner diameters of the fixing nuts (2) are matched with the outer diameters of the lower thread block (8) and the upper thread block (4).

7. The package structure of DRAM according to claim 1, wherein: go up connecting groove top inner wall on sealed lid (5) and seted up sliding tray (16), and sliding tray (16) inner wall sliding connection has stripper plate (14), and expanding spring (15) are installed to stripper plate (14) top outer wall, expanding spring (15) top outer wall and sliding tray (16) top inner wall fixed connection.

8. The package structure of DRAM according to claim 1, wherein: the inner walls of two sides of the lower sealing cover (1) are both provided with sliding grooves, the inner walls of the sliding grooves are connected with sliding plates (19) in a sliding mode, a supporting plate (20) is installed on the outer wall of one side, opposite to the two sliding plates (19), of the supporting plate (20), the outer wall of the top of the supporting plate (20) is provided with a limiting frame (21), fixing springs (18) distributed equidistantly are installed on the outer wall of the bottom of the sliding plates (19), and the outer wall of the bottom of each fixing spring (18) is fixedly connected with the inner wall of the bottom of each sliding groove.