CN216084810U - Semiconductor etching machine with drying function - Google Patents
Semiconductor etching machine with drying function Download PDFInfo
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- CN216084810U CN216084810U CN202122245097.0U CN202122245097U CN216084810U CN 216084810 U CN216084810 U CN 216084810U CN 202122245097 U CN202122245097 U CN 202122245097U CN 216084810 U CN216084810 U CN 216084810U
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Abstract
The utility model discloses a semiconductor etching machine with a drying function, which comprises an etching machine body, wherein a water pump is arranged on the central axis of the bottom of the etching machine body, liquid inlet pipes are arranged at the output ends of the water pump, the number of the liquid inlet pipes is two, the two liquid inlet pipes are positioned on two sides of the outer wall of the etching machine body, and water storage tanks are arranged on two sides of the outer wall of the etching machine body. According to the utility model, the etching liquid in the etching machine body is pumped by the water pump through the circulating guide pipes on the two sides of the bottom of the flow guide table and is conveyed into the water storage tank through the liquid inlet pipe, and the etching liquid is sprayed to the semiconductor through the spray head, so that the circulating spraying etching is formed, the etching efficiency is improved, the processing quality of the semiconductor is improved, the air guide pipe conveys air into the heating tank, after the air guide pipe is heated, the hot air is discharged out of the etching machine body through the air outlet to dry the semiconductor, so that the semiconductor is uniformly dried by the hot air, the drying efficiency is improved, and the working efficiency of a user is improved.
Description
Technical Field
The utility model relates to the field of semiconductor etching machines, in particular to a semiconductor etching machine with a drying function.
Background
The etchers can be classified into chemical etchers and electrolytic etchers. In chemical etching, chemical solutions are used to achieve the purpose of etching through chemical reactions, chemical etchers are techniques for removing materials by chemical reactions or physical impact, etchers are mainly used in the aerospace, mechanical, and signage industries, and etcher techniques are widely used for processing weight-saving instrument panels, nameplates, and thin workpieces that are difficult to process by conventional processing methods. Etching is an indispensable technique in semiconductor and circuit board manufacturing. Various metals such as: the surface of iron, copper, aluminum, titanium, stainless steel, zinc plate, etc. and metal products is etched with pattern, pattern and geometric shape and can be hollowed out accurately. But also can etch and cut thin plates specially aiming at domestic and imported stainless steel of various models, and is widely applied to industrial purposes such as gold card label processing, mobile phone key processing, stainless steel filter screen processing, stainless steel elevator decorative plate processing, metal lead frame processing, metal glasses leg wire processing, circuit board processing, decorative metal plate processing and the like nowadays.
The existing semiconductor etching machine is not provided with a drying structure, so that after the semiconductor is dried all the time, a user needs to wait for the semiconductor to be dried naturally, a large amount of time is consumed by the user, the working efficiency of the user is reduced, and the user experience is reduced.
Therefore, it is necessary to provide a semiconductor etching machine with a drying function to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a semiconductor etching machine with a drying function, wherein etching liquid in an etching machine body is extracted by circulating guide pipes on two sides of the bottom of a flow guide table through a water pump, the etching liquid is conveyed into a water storage tank through a liquid inlet pipe, the etching liquid is sprayed to a semiconductor through a spray head to form circulating spraying etching, wind is conveyed into a heating tank through a wind guide pipe, after the heating, hot wind is discharged out of the etching machine body through an air outlet to dry the semiconductor, and therefore the defects in the technology are overcome.
In order to achieve the above purpose, the utility model provides the following technical scheme: a semiconductor etching machine with a drying function comprises an etching machine body, wherein a water pump is arranged on the central axis of the bottom of the etching machine body, liquid inlet pipes are arranged at the output ends of the water pump, the number of the liquid inlet pipes is two, and the two liquid inlet pipes are positioned on two sides of the outer wall of the etching machine body;
the etching machine comprises an etching machine body, wherein water storage tanks are arranged on two sides of the outer wall of the etching machine body, the two water storage tanks are symmetrically arranged on the central axis of the etching machine body, a liquid inlet pipe penetrates through the water storage tanks and extends to the bottom end of the inner wall of each water storage tank, a plurality of spray heads are arranged on the inner wall of each water storage tank, and the spray heads penetrate through the etching machine body and extend to the inner wall of the etching machine body;
the bottom end of the inner wall of the etching machine body is provided with a flow guide table, two sides of the inner wall of the flow guide table are obliquely arranged, two sides of the bottom of the flow guide table are respectively provided with a circulating conduit, the circulating conduit penetrates through the flow guide table and extends to the bottom of the etching machine body, the circulating conduit is fixedly connected with a liquid inlet pipe, the top of the flow guide table is provided with a support plate, through holes are formed in the inner wall of the support plate, the number of the through holes is multiple, a screw rod is arranged on the central axis of the top of the support plate, a fixed plate is movably sleeved on the outer wall of the screw rod, and placing tables are respectively arranged on two sides of the top of the fixed plate;
the etching machine comprises an etching machine body and is characterized in that a heating box is arranged at the top end of the inner wall of the etching machine body, a fan is arranged on one side of the top of the etching machine body, an air guide pipe is arranged at the output end of the fan, the air guide pipe penetrates through the etching machine body and extends to one side of the inner wall of the heating box, an air outlet is formed in the bottom end of the inner wall of the heating box, the number of the air outlets is set to be multiple, and heating wires are arranged on the inner wall of the heating box.
Preferably, the two sides of the outer wall of the spray head are both provided with positioning blocks, the positioning blocks are fixedly connected with the inner wall of the etching machine body, the two sides of the outer wall of the spray head are both provided with rotating shafts, the rotating shafts penetrate through the positioning blocks, and the inner wall of each rotating shaft is in threaded connection with a fixing bolt.
Preferably, a liquid discharge pipe is arranged on one side, far away from the circulating guide pipe, of the inner wall of the etching machine body, the liquid discharge pipe is located on one side of the top of the flow guide table, the screw rod penetrates through the heating box, and a second bearing is arranged at the joint of the screw rod and the heating box.
Preferably, the screw rod runs through the etching machine body and extends to the top of the etching machine body, first bearings are arranged at the joints of the screw rod, the etching machine body and the supporting plate, a motor is arranged on the central axis of the top of the etching machine body, and the output shaft of the motor corresponds to the screw rod.
Preferably, the cross-sectional shape of the placing table is set to be U-shaped, a fastening plate is arranged on one side of the inner wall of the placing table, an adjusting bolt is arranged on one side of the outer wall of the fastening plate, the adjusting bolt penetrates through the placing table and extends to one side of the outer wall of the placing table, and a third bearing is arranged at the joint of the adjusting bolt and the placing table.
Preferably, the etching machine body bottom is equipped with the base, the equal fixedly connected with support column in base top four corners department, support column and etching machine body fixed connection, the sealing door has been handed over to etching machine body inner wall one side.
In the technical scheme, the utility model provides the following technical effects and advantages:
drive the fixed plate through the screw rod rotation and will place the downtake backup pad top of the inside semiconductor of platform, through the water pump with the circulation pipe of water conservancy diversion platform bottom both sides with this internal etching solution extraction of etching machine through the feed liquor pipe transport to the storage water tank inside, and spray the etching solution to the semiconductor through the shower nozzle, form the circulation and spray the etching, the efficiency of etching is improved, thereby the quality of semiconductor processing has been improved, carry wind to the heating cabinet inside through the guide duct, after heating, dry the semiconductor through the inside hot-blast exhaust etching machine body of air exit, make hot-blast even stoving semiconductor, the efficiency of drying is improved, user's work efficiency has been improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
FIG. 1 is a cross-sectional view of the overall construction of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a schematic view of a connection structure of a nozzle and a positioning block according to the present invention;
FIG. 4 is a sectional view showing the internal structure of the heating chamber of the present invention;
FIG. 5 is a schematic view of the connection structure of the placing table and the fixing plate of the present invention;
FIG. 6 is an enlarged view of the structure of FIG. 1A according to the present invention.
Description of reference numerals:
1. an etching machine body; 2. a water pump; 3. a liquid inlet pipe; 4. a water storage tank; 5. a spray head; 6. a rotating shaft; 7. positioning blocks; 8. fixing the bolt; 9. a flow guide table; 10. a circulation conduit; 11. a liquid discharge pipe; 12. a support plate; 13. a through hole; 14. a screw; 15. a motor; 16. a heating box; 17. a fan; 18. an air guide pipe; 19. an air outlet; 20. an electric heating wire; 21. a fixing plate; 22. a placing table; 23. a fastening plate; 24. adjusting the bolt; 25. a sealing door; 26. a base; 27. and (4) a support column.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
The utility model provides a semiconductor etching machine with a drying function, which comprises an etching machine body 1, wherein a water pump 2 is arranged at the central axis of the bottom of the etching machine body 1, a liquid inlet pipe 3 is arranged at the output end of the water pump 2, the number of the liquid inlet pipes 3 is two, and the two liquid inlet pipes 3 are positioned at two sides of the outer wall of the etching machine body 1;
the etching machine comprises an etching machine body 1, wherein water storage tanks 4 are arranged on two sides of the outer wall of the etching machine body 1, the two water storage tanks 4 are symmetrically arranged on the central axis of the etching machine body 1, a liquid inlet pipe 3 penetrates through the water storage tanks 4 and extends to the bottom end of the inner wall of each water storage tank 4, nozzles 5 are arranged on the inner wall of each water storage tank 4, the number of the nozzles 5 is multiple, and the nozzles 5 penetrate through the etching machine body 1 and extend to the inner wall of the etching machine body 1;
the bottom end of the inner wall of the etching machine body 1 is provided with a flow guide table 9, two sides of the inner wall of the flow guide table 9 are obliquely arranged, two sides of the bottom of the flow guide table 9 are respectively provided with a circulating conduit 10, the circulating conduit 10 penetrates through the flow guide table 9 and extends to the bottom of the etching machine body 1, the circulating conduit 10 is fixedly connected with a liquid inlet pipe 3, the top of the flow guide table 9 is provided with a support plate 12, the inner wall of the support plate 12 is provided with a plurality of through holes 13, the central axis of the top of the support plate 12 is provided with a screw 14, the outer wall of the screw 14 is movably sleeved with a fixing plate 21, and two sides of the top of the fixing plate 21 are respectively provided with a placing table 22;
the etching machine comprises an etching machine body 1 and is characterized in that a heating box 16 is arranged at the top end of the inner wall of the etching machine body 1, a fan 17 is arranged on one side of the top of the etching machine body 1, an air guide pipe 18 is arranged at the output end of the fan 17, the air guide pipe 18 penetrates through the etching machine body 1 and extends to one side of the inner wall of the heating box 16, an air outlet 19 is formed in the bottom end of the inner wall of the heating box 16, the number of the air outlets 19 is multiple, and heating wires 20 are arranged on the inner wall of the heating box 16.
Further, in the above technical scheme, the two sides of the outer wall of the spray nozzle 5 are both provided with the positioning blocks 7, the positioning blocks 7 are fixedly connected with the inner wall of the etching machine body 1, the two sides of the outer wall of the spray nozzle 5 are both provided with the rotating shaft 6, the rotating shaft 6 penetrates through the positioning blocks 7, and the inner wall of the rotating shaft 6 is in threaded connection with the fixing bolt 8.
Further, in the above technical solution, a liquid discharge pipe 11 is arranged on one side of the inner wall of the etching machine body 1, which is far away from the circulation duct 10, the liquid discharge pipe 11 is located on one side of the top of the diversion table 9, the screw 14 penetrates through the heating box 16, and a second bearing is arranged at a connection position of the screw 14 and the heating box 16.
Further, in the above technical scheme, the screw 14 penetrates through the etching machine body 1 and extends to the top of the etching machine body 1, the joints of the screw 14, the etching machine body 1 and the support plate 12 are both provided with first bearings, the central axis of the top of the etching machine body 1 is provided with the motor 15, and the output shaft of the motor 15 corresponds to the screw 14.
Further, in the above technical solution, the cross-sectional shape of the placing table 22 is a U shape, a fastening plate 23 is disposed on one side of an inner wall of the placing table 22, an adjusting bolt 24 is disposed on one side of an outer wall of the fastening plate 23, the adjusting bolt 14 penetrates through the placing table 22 and extends to one side of the outer wall of the placing table 22, and a third bearing is disposed at a connection position of the adjusting bolt 14 and the placing table 22.
Further, in the above technical scheme, the bottom of the etching machine body 1 is provided with a base 26, four corners of the top of the base 26 are fixedly connected with supporting columns 27, the supporting columns 27 are fixedly connected with the etching machine body 1, and one side of the inner wall of the etching machine body 1 is crossed with a sealing door 25.
This practical theory of operation:
referring to the attached drawings 1-6 of the specification, when the etching machine is used, firstly, the sealing door 25 is opened, etching liquid is poured in the etching machine body 1, then a semiconductor material is placed in the placing table 22, then the fastening plate 23 is driven to move through the adjusting bolt 24 to clamp and fix a semiconductor to be processed, then the motor 15 is started, the screw 14 is driven to rotate by the output shaft of the motor 15, so that the screw 14 rotates to drive the fixing plate 21 to lower the semiconductor in the placing table 22 to the top of the supporting plate 12, then the water pump 2 is started, the etching liquid in the etching machine body 1 is pumped by the circulating pipes 10 on two sides of the bottom of the flow guide table 9 through the water pump 2 and is conveyed to the inside of the water storage tank 4 through the liquid inlet pipe 3, and is sprayed to the semiconductor through the spray head 5 to form circulating spraying etching, the time required by the etching process is shortened, and the etching efficiency is improved, thereby the quality of semiconductor processing has been improved, after the semiconductor etching finishes, rises fixed plate 21, then starts fan 17, through the guide duct 18 with wind transport to the heating cabinet 16 inside, then through heating wire 20 with it after heating, through the setting of a plurality of exhaust outlets 19 with the inside semiconductor of hot-blast exhaust etching machine body 1 dry, make hot-blast even stoving semiconductor, improved the efficiency of drying, improved user's work efficiency.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.
Claims (6)
1. The utility model provides a semiconductor etching machine with stoving function, includes etching machine body (1), its characterized in that: a water pump (2) is arranged on the central axis of the bottom of the etching machine body (1), liquid inlet pipes (3) are arranged at the output ends of the water pump (2), the number of the liquid inlet pipes (3) is two, and the two liquid inlet pipes (3) are positioned on two sides of the outer wall of the etching machine body (1);
the etching machine comprises an etching machine body (1), wherein water storage tanks (4) are arranged on two sides of the outer wall of the etching machine body (1), the two water storage tanks (4) are symmetrically arranged on the central axis of the etching machine body (1), a liquid inlet pipe (3) penetrates through the water storage tanks (4) and extends to the bottom end of the inner wall of the water storage tanks (4), spray heads (5) are arranged on the inner wall of the water storage tanks (4), the number of the spray heads (5) is multiple, and the spray heads (5) penetrate through the etching machine body (1) and extend to the inner wall of the etching machine body (1);
the bottom end of the inner wall of the etching machine body (1) is provided with a flow guide table (9), two sides of the inner wall of the flow guide table (9) are obliquely arranged, two sides of the bottom of the flow guide table (9) are respectively provided with a circulating pipe (10), the circulating pipes (10) penetrate through the flow guide table (9) and extend to the bottom of the etching machine body (1), the circulating pipes (10) are fixedly connected with the liquid inlet pipe (3), the top of the flow guide table (9) is provided with a support plate (12), the inner wall of the support plate (12) is provided with a plurality of through holes (13), the central axis of the top of the support plate (12) is provided with a screw (14), the outer wall of the screw (14) is movably sleeved with a fixing plate (21), and two sides of the top of the fixing plate (21) are respectively provided with a placing table (22);
the etching machine is characterized in that a heating box (16) is arranged at the top end of the inner wall of the etching machine body (1), a fan (17) is arranged on one side of the top of the etching machine body (1), an air guide pipe (18) is arranged at the output end of the fan (17), the air guide pipe (18) penetrates through the etching machine body (1) and extends to one side of the inner wall of the heating box (16), air outlets (19) are formed in the bottom end of the inner wall of the heating box (16), the number of the air outlets (19) is set to be multiple, and heating wires (20) are arranged on the inner wall of the heating box (16).
2. The semiconductor etching machine with drying function according to claim 1, characterized in that: shower nozzle (5) outer wall both sides all are equipped with locating piece (7), locating piece (7) and etching machine body (1) inner wall fixed connection, shower nozzle (5) outer wall both sides all are equipped with pivot (6), locating piece (7) are run through in pivot (6), pivot (6) inner wall threaded connection has fixing bolt (8).
3. The semiconductor etching machine with drying function according to claim 1, characterized in that: a liquid discharge pipe (11) is arranged on one side, away from the circulating guide pipe (10), of the inner wall of the etching machine body (1), the liquid discharge pipe (11) is located on one side of the top of the flow guide table (9), the screw rod (14) penetrates through the heating box (16), and a second bearing is arranged at the joint of the screw rod (14) and the heating box (16).
4. The semiconductor etching machine with drying function according to claim 1, characterized in that: the etching machine is characterized in that the screw rod (14) penetrates through the etching machine body (1) and extends to the top of the etching machine body (1), first bearings are arranged at the joints of the screw rod (14) and the etching machine body (1) and the supporting plate (12), a motor (15) is arranged on the central axis of the top of the etching machine body (1), and the output shaft of the motor (15) corresponds to the screw rod (14).
5. The semiconductor etching machine with drying function according to claim 1, characterized in that: the cross-sectional shape of the placing table (22) is set to be U-shaped, a fastening plate (23) is arranged on one side of the inner wall of the placing table (22), an adjusting bolt (24) is arranged on one side of the outer wall of the fastening plate (23), the adjusting bolt (24) penetrates through the placing table (22) and extends to one side of the outer wall of the placing table (22), and a third bearing is arranged at the joint of the adjusting bolt (24) and the placing table (22).
6. The semiconductor etching machine with drying function according to claim 1, characterized in that: etching machine body (1) bottom is equipped with base (26), equal fixedly connected with support column (27) in base (26) top four corners department, support column (27) and etching machine body (1) fixed connection, handing-over has sealing door (25) on one side of etching machine body (1) inner wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122245097.0U CN216084810U (en) | 2021-09-16 | 2021-09-16 | Semiconductor etching machine with drying function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122245097.0U CN216084810U (en) | 2021-09-16 | 2021-09-16 | Semiconductor etching machine with drying function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216084810U true CN216084810U (en) | 2022-03-18 |
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ID=80676987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122245097.0U Active CN216084810U (en) | 2021-09-16 | 2021-09-16 | Semiconductor etching machine with drying function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216084810U (en) |
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2021
- 2021-09-16 CN CN202122245097.0U patent/CN216084810U/en active Active
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