CN216083652U

CN216083652U - Three-dimensional touch panel

Info

Publication number: CN216083652U
Application number: CN202121950085.1U
Authority: CN
Inventors: 付嘉欣; 王发玉; 金秀芳; 罗富怀
Original assignee: Dongguan Mingxuan Technology Co ltd
Current assignee: Dongguan Mingxuan Technology Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-03-18
Anticipated expiration: 2031-08-19

Abstract

The utility model provides a three-dimensional touch panel, which comprises: a three-dimensional touch sensing module; a pressure sensing module; a signal detection and processing module; the three-dimensional touch sensing module is arranged on the upper end face of the signal detection and processing module, and the pressure sensing module is arranged on the lower end face of the signal detection and processing module. The utility model can synchronously realize the functions of three dimensions of human body touch identification and pressure sensing detection, and solves the problems of high difficulty in mass production, complex production process, high cost and measurement error caused by extrusion on a pressure sensing module in the installation process; moreover, the force-sensitive capacitor, the strain gauge and the like are eliminated, the detection of the pressure sensing module is combined through the deformation of the substrate layer, the sensing detection of the pressure in the Z direction is realized, and compared with the force-sensitive capacitor, the force-sensitive capacitor has the advantages of small detectable deformation displacement, large dynamic working range and suitability for large-scale mass production; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved.

Description

Three-dimensional touch panel

Technical Field

The utility model relates to the technical field of touch panels, in particular to a three-dimensional touch panel.

Background

With the development of intelligent technology, the application of touch panels has become very wide, such as: smart phones, automotive interiors, tablet computers, household appliances, smart watches, electronic readers, virtual keyboards, industrial control panels, and the like.

The one-dimensional input touch panel can replace a mechanical key panel, the mechanical key panel is complex in structure and short in service life, fatigue, damage and key failure are prone to occurring, the mechanical key panel is rigid in appearance design and shape, difficult to bend, difficult to prevent water, afraid of oil stains and high in comprehensive cost. The two-dimensional input touch panel further enriches human-computer interaction modes, such as a touch screen, a touch pad, a touch slider, a touch roller and the like. A two-dimensional coordinate system (X, Y) can be virtually established on the surface where the two-dimensional input touch panel is located, coordinate positions of touch points in the X direction and the Y direction can be accurately calculated through the processing chip, and therefore display amplification/reduction/rotation/translation, single-press/double-click/hand-wave/multi-finger touch/proximity sensing and other gesture recognition operations are achieved, and the effect of various touch functions is achieved.

The touch panel with one-dimensional and two-dimensional input is the most mature and widely applied capacitive touch sensing technology at present, and the touch panel applying the technology has the remarkable advantages of simple structural design, flexible appearance and shape, long service life, high reliability, flexible panel, good dust and water resistance, low comprehensive cost and the like.

However, the capacitive touch sensing technology must rely on human body, and for some capacitive keys easily touched by human body, double confirmation such as automobile steering wheel key board, window keys, dome lamp control keys and the like is required, and hidden touch keys, touch plane coordinate keys such as vehicle-mounted mouse, 3D remote controller, keyless mobile phone and the like, three-dimensional touch input in X direction, Y direction and Z direction is required.

Regarding the technical scheme of touch panel Z direction input, the utility model discloses the people finds that above-mentioned technique has following technical problem at least at the in-process of realizing utility model technical scheme in the embodiment of this application:

chinese patent CN201810013731.8 discloses a "three-dimensional projection touch control method, a controller, and a household appliance", which adds a set of touch recognition functions to four directions, i.e., upper, lower, left, and right sides of a touch panel generating two-dimensional coordinate values (X, Y) to generate a depth coordinate value, thereby implementing input in the Z direction of a space, where the input in the Z direction is capacitive sensing operation such as movement of a finger in the space above the touch panel, and is not a touch action actually pressing on the touch panel, and thus is not a Z-direction touch function, and is prone to misoperation.

The other technical scheme is touch panel Z-direction pressure induction detection. The pressure sensing detection methods are various and comprise infrared rays, mechanical springs, force sensitive resistors, force sensitive capacitors, strain gauges and the like. The infrared pressure-sensitive detection structure is complex, the cost is high, the detection precision is not high, and the anti-interference capability is poor. Mechanical springs and strain gauges typically have large dimensions on the order of a few millimeters or more, require displacements of a few tens of microns to activate the force sensor and have low sensitivity. The force-sensitive resistor and the force-sensitive capacitor are very sensitive to pre-pressing mechanical acting force caused in the production and assembly processes of products, the sensor has large change and the dynamic working range is small. The touch panel is usually integrally assembled, the above detection methods are obviously not used, and a pressure sensing detection solution with simple structure, small detectable deformation displacement, high sensitivity, strong anti-interference capability and low production cost is needed in the industry.

At present, the three-dimensional input touch panel is in a demand rising period and is limited by a pressure sensing detection technology, and the three-dimensional input touch panel cannot be produced in a large scale. Chinese patent CN201510639990.8 discloses a detection method for capacitive three-dimensional detection module, which describes a capacitive three-dimensional detection method, wherein two-dimensional touch control uses an upper/lower layer structure to form mutual capacitance sensing control to determine the position coordinates of a touch point, and in fact, a touch pad can also determine the touch function in a self-capacitance manner. The pressure-sensitive detection of this patent uses a piezoelectric pressure sensor including a first pressure-sensitive layer and a second pressure-sensitive layer, and its operation principle is as described in its specification [0045 ]: the utility model adopts piezoelectric materials, the first pressure sensing unit 151 and the second pressure sensing unit 171 can generate capacitance change in response to the pressing action, and the pressure sensing unit is also used for detecting a force-sensitive capacitor essentially.

The three-dimensional input module disclosed in chinese patent CN201520772631.5 is a specific implementation of chinese patent CN201510639990.8, and in the implementation process, the touch electrode material is indium-tin oxide ITO, carbon nanotubes, graphene, silver nanowires, metal grids, and the like, which have high cost, and the structure thereof has a panel layer, a first touch electrode layer, a second touch electrode layer, a first pressure-sensitive layer, and a second pressure-sensitive layer, and all layers need to be bonded with glue, so that the production process is complex and the cost is high. Laminating need stay the clearance between first pressure layer and the second pressure layer and construct into force-sensitive electric capacity, and this clearance is hardly managed and controlled the uniformity in the production, and the volume production degree of difficulty is high.

In addition, the existing three-dimensional touch panel technology has no better corresponding method for deformation residue in the process of applying and removing panel external force.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned problems of small dynamic operating range, high difficulty in mass production, and difficulty in coping with deformation residue in the process of applying and removing an external force to a panel in response to a Z-direction input, the present invention has been made in order to provide a stereoscopic three-dimensional touch panel that overcomes or at least partially solves the above-mentioned problems.

According to an aspect of the present invention, there is provided a stereoscopic three-dimensional touch panel, including:

the touch sensing module can acquire a touch sensing signal, wherein the touch sensing signal is a capacitance signal variable quantity output by the touch sensing module;

the pressure sensing module can acquire a pressing sensing signal, and the pressing sensing signal is a voltage signal variable quantity output when the pressure sensing module is pressed;

the signal detection and processing module is connected with the pressure sensing module and the three-dimensional touch sensing module, can acquire a one-dimensional numerical value or a two-dimensional coordinate of a touch point according to the touch sensing signal, can calculate a pressure value applied to the touch point according to the press sensing signal, and integrates the one-dimensional numerical value or the two-dimensional coordinate of the touch point and the pressure value applied to the touch point into a three-dimensional touch signal for output;

the three-dimensional touch sensing module is arranged on the upper end face of the signal detection and processing module, and the pressure sensing module is arranged on the lower end face of the signal detection and processing module.

Preferably, the stereoscopic touch sensing module includes:

a three-dimensional base;

the touch sensing signal output layer is sleeved on the three-dimensional base;

and the three-dimensional mask is sleeved on the touch sensing signal output layer to protect the touch sensing signal output layer.

Preferably, the stereoscopic touch sensing module further includes:

the three-dimensional touch sensing module is arranged on the upper end face of the signal detection and processing module through the connecting layer;

the three-dimensional base is connected with the upper end face of the connecting layer, and the lower end face of the connecting layer is connected with the upper end face of the signal detection and processing module.

Preferably, the touch sensing signal output layer includes:

a substrate layer;

the touch sensing top layer circuit is arranged on the end face of the outer side of the base material layer;

the touch sensing bottom layer circuit is arranged on the inner side end face of the base material layer;

the touch sensing top layer circuit and/or the touch sensing bottom layer circuit are/is provided with a two-dimensional output module; and a connecting line perforation is arranged on the end surface of the inner side of the outer side of the base material layer, and the touch sensing top layer circuit penetrates through the connecting line perforation to be connected with the touch sensing bottom layer circuit.

Preferably, the number of the two-dimensional output modules is 5, and the 5 two-dimensional output modules are respectively arranged on the outer side end faces in the front direction, the rear direction, the left direction and the right direction of the touch sensing signal output layer and on the top end of the touch sensing signal output layer.

Preferably, the two-dimensional output module comprises a plurality of touch pads, the touch pads are connected with the signal detection and processing module, and the touch pads are mutual capacitance panels.

Preferably, the signal detecting and processing module includes:

a circuit board;

and the signal detection processing chip is mounted on the circuit board.

Preferably, the pressure sensing module includes:

the first strain resistor and the second strain resistor are connected;

the third strain resistor and the fourth strain resistor are connected;

the other ends of the first strain resistor and the third strain resistor can be connected with a power supply voltage, the second strain resistor and the fourth strain resistor are grounded, and the first strain resistor, the second strain resistor, the third strain resistor and the fourth strain resistor form a Wheatstone bridge.

Preferably, the number of the pressure sensing modules is 4, and the 4 pressure sensing modules are respectively arranged on the lower end face of the signal detection and processing module corresponding to the outer end faces of the front, rear, left and right directions of the touch sensing signal output layer.

Preferably, the three-dimensional touch panel further comprises a cantilever beam support, and the cantilever beam support is arranged on the lower end face of the signal detection and processing module.

The utility model has the beneficial effects that: the structure of the utility model is reasonable and ingenious in design, and through the modularized design, the part for acquiring the press induction signal is designed into the pressure induction module, and the part for acquiring the touch induction signal is designed into the three-dimensional touch induction module; during assembly, the pressure sensing module and the three-dimensional touch sensing module are only needed to be spliced and connected to the signal detection and processing module, so that the problems of high volume production difficulty, complex production process and high cost are solved; on the other hand, the problem of measurement errors caused by extrusion of the pressing induction module in the installation process is effectively solved; moreover, the use of force-sensitive capacitors, strain gauges and the like is eliminated, and the sensing detection of the pressure in the Z direction is realized by combining the deformation of the substrate layer with the detection of the pressure sensing module; because a Wheatstone bridge is formed, slight deformation of the substrate layer can act on the first strain resistor, the second strain resistor, the third strain resistor and the fourth strain resistor of the pressure sensing module, and compared with a force-sensitive capacitor, the pressure sensing module has the advantages of small detectable deformation displacement and large dynamic working range, can well solve errors caused by prepressing mechanical acting force, allows resistance errors of each strain resistor, and is suitable for large-scale mass production; meanwhile, the production process is simple and the cost is low; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved. The X direction and the Y direction can identify the effective action input based on human touch, so that the non-human misoperation can be avoided effectively, meanwhile, the Z direction can realize the detection of the micro-deformation pressure, and the micro-deformation pressure detection device has the technical leading advantage in the safety field and has wide market prospect in the fields of automobiles, mobile phones and electronic products in the future.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a perspective view a of a three-dimensional touch panel according to an embodiment of the utility model;

fig. 2 is an exploded view of a three-dimensional touch panel according to an embodiment of the utility model;

FIG. 3 is a schematic structural diagram of a touch sensing module according to an embodiment of the utility model;

FIG. 4 is a perspective view B of a three-dimensional touch panel according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a touch processing chip according to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating the ON/OFF recognition of a touch sensing signal according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of the ON/OFF recognition of the pressure-sensitive signal in the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Next, referring to fig. 1 to 7, an embodiment of the present invention will be explained.

According to an aspect of the present invention, an embodiment of the present invention provides a three-dimensional touch panel, also called a three-dimensional solid three-dimensional touch panel, including:

the three-dimensional touch sensing module 2 can acquire a touch sensing signal, wherein the touch sensing signal is a capacitance signal variation output by the touch sensing module 2;

the pressure sensing module 1 is capable of acquiring a pressing sensing signal, wherein the pressing sensing signal is a voltage signal variation output when the pressure sensing module 1 is pressed;

the signal detection and processing module 3 is connected with the pressure sensing module 1 and the three-dimensional touch sensing module 2, and the signal detection and processing module 3 can acquire a one-dimensional numerical value or a two-dimensional coordinate of a touch point according to the touch sensing signal, can calculate a pressure value applied to the touch point according to the press sensing signal, and integrates the one-dimensional numerical value or the two-dimensional coordinate of the touch point and the pressure value applied to the touch point into a three-dimensional touch signal for output;

the three-dimensional touch sensing module 2 is arranged on the upper end face of the signal detection and processing module 3, and the pressure sensing module 1 is arranged on the lower end face of the signal detection and processing module 3.

Specifically, the one-dimensional value is an induced value, and may be a value of a capacitance signal variation or a value having a corresponding relationship with the capacitance signal variation; the two-dimensional coordinates are x-axis coordinates and y-axis coordinates. The one-dimensional numerical value can be converted into a two-dimensional numerical value, namely, the one-dimensional numerical value is obtained on the basis of a preset x or y value and is converted into a two-dimensional coordinate with x and y axis coordinates.

The three-dimensional touch sensing module 2 is arranged on the upper end surface of the signal detection and processing module 3, and the pressure sensing module 1 is arranged on the lower end surface of the signal detection and processing module 3, so that when the three-dimensional touch sensing module 2 is touched, the pressure acting on the three-dimensional touch sensing module 2 can be identified by the pressure sensing module 1 through the force transmission of the three-dimensional touch sensing module 2 and the signal detection and processing module 3.

The three-dimensional touch signal is a three-dimensional coordinate.

Specifically, the three-dimensional coordinates may be (x, y, whether or not pressed), (x, y, pressure level), (x, y, pressure magnitude), and the like, or may be specific numerical values of the pressure magnitude and the touch position; the principle is that after the pressure value of the touch point is calculated, the touch point can adapt to three-dimensional coordinates of different scenes through subsequent processing.

Preferably, the stereoscopic touch sensing module 2 includes:

a solid base 26;

a touch sensing signal output layer 27, which is sleeved on the three-dimensional base 26;

and the three-dimensional face mask 28 is sleeved on the touch sensing signal output layer 27 to protect the touch sensing signal output layer 27.

Specifically, the three-dimensional base 26 is a plastic base, and functions to support the three-dimensional mask 28 and transmit the pressing force to the pressure sensing module 1.

Further, the pressure sensing module 1 is a wheatstone bridge module; the pressure sensing module 1 is connected with the signal detection and processing module 3 through a signal wire, and the touch sensing module 2 is connected with the signal detection and processing module 3 through a signal wire.

Further, the touch sensing signal output layer 27 and the three-dimensional base 26 are formed by injection molding through an IMD (in-mold decoration) or IML (in-mold decoration) process, or are formed by means of adhesive bonding or sandwich pressing.

According to the three-dimensional touch panel, through a modularized design, a part for acquiring a pressing induction signal is designed into a pressure induction module 1, and a part for acquiring a touch induction signal is designed into a touch induction module 2; during assembly, the pressure sensing module 1 and the touch sensing module 2 are only needed to be spliced, and the pressure sensing module 1 and the touch sensing module 2 are connected to the signal detection and processing module 3, so that the problems of high difficulty in volume production, complex production process and high cost are solved;

preferably, the stereoscopic touch sensing module 2 further includes:

the connecting layer 29 is used for installing the three-dimensional touch sensing module 2 on the upper end surface of the signal detection and processing module 3 through the connecting layer 29;

the three-dimensional base 26 is connected with the upper end face of the connecting layer 29, and the lower end face of the connecting layer 29 is connected with the upper end face of the signal detection and processing module 3.

Specifically, the connection layer 29 may be an insulating plate or an adhesive plate.

Preferably, the touch sensing signal output layer 27 includes:

a substrate layer;

a two-dimensional output module 222 is arranged on the touch sensing top layer circuit and/or the touch sensing bottom layer circuit; and a connecting line perforation is arranged on the end face of the inner side of the outer side of the substrate layer 1, and the touch sensing top layer circuit penetrates through the connecting line perforation to be connected with the touch sensing bottom layer circuit.

Specifically, through the structural design, the three-dimensional touch panel gets rid of the use of force-sensitive capacitors, strain gauges and the like, and realizes the sensing detection of the pressure in the Z direction by combining the deformation of the substrate layer with the detection of the pressure sensing module 1; because a Wheatstone bridge is formed, slight deformation of the substrate layer can act on the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 of the pressure sensing module 1, and compared with a force sensitive capacitor, the pressure sensing module has the advantages of small detectable deformation displacement, large dynamic working range, capability of well solving errors caused by pre-pressing mechanical acting force, permission of resistance value errors of each strain resistor and suitability for large-scale mass production; meanwhile, the production process is simple and the cost is low; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved.

Preferably, the number of the two-dimensional output modules 222 is 5, and 5 of the two-dimensional output modules 222 are respectively disposed on the outer side end faces of the touch sensing signal output layer 27 in the front, rear, left and right directions and the top end of the touch sensing signal output layer 27.

Preferably, the two-dimensional output module 222 includes a plurality of touch pads, the touch pads are connected to the signal detection and processing module 3, and the touch pads are mutual capacitance panels.

Specifically, the touch panel, i.e., the two-dimensional sensor, is composed of electrodes; the number of touch panels is not limited, and conventional materials thereof are copper, PEDOT (a transparent conductive ink), and ITO (indium-tin oxide), but also carbon nanotubes, graphene, nano silver wires, and Metal-Mesh (Metal Mesh).

The two-dimensional output module 222 is composed of a plurality of two-dimensional sensors, the two-dimensional sensors are arranged in a determinant, the shape of the two-dimensional sensors is a diamond shape or a star shape, and the shape of the two-dimensional sensors can be designed according to requirements without influencing the principle of the two-dimensional sensors. The principle of the self-capacitance operation mode is that a capacitance is formed between the sensor and the power ground, the signal detection and processing module 3 drives a current on a pin connected to the sensor and measures a voltage, and if a finger is placed on the sensor, the measured capacitance increases, thereby recognizing that the touch key 221a is operated.

Further, the touch sensing module 2 may be a single-layer circuit design, a double-layer circuit design, or a multi-layer circuit design.

When the touch sensing top layer circuit is designed as a single-layer circuit, the touch sensing top layer circuit is a traditional circuit layer;

when the touch sensing top circuit is designed as a double-layer circuit, the touch sensing top circuit is an element layer and is mainly used for placing components; the touch sensing bottom layer circuit 23 is a welding layer and is mainly used for wiring and welding.

The two-dimensional output module 222 includes:

a plurality of transmitting electrodes disposed on the touch sensing top layer line;

and a plurality of receiving electrodes arranged on the touch sensing underlying line.

The substrate layer is a carrier of the touch sensing top layer circuit and the touch sensing bottom layer circuit and plays a supporting role, and the substrate layer is generally an FR-4 epoxy glass fiber cloth substrate or a PET polyethylene terephthalate substrate; in a preferred embodiment, the substrate layer is a PET polyethylene terephthalate substrate, which is a flexible film substrate, and the thickness of the substrate layer is 0.125 mm.

Furthermore, the touch sensing top layer circuit and the touch sensing bottom layer circuit are made of conductive materials through processes of printing, spraying etching, coating, sputtering, laser radium carving and the like. The signal conductors and other connections of the circuit are interconnected, typically made of copper/aluminum metal and silver paste, which is produced by a printing and drying process and is resistant to bending.

Specifically, the touch pad is a mutual capacitance panel, the transmitting electrode and the receiving electrode are configured into the mutual capacitance panel, and the principle of the mutual capacitance sensing technology is that the signal detection and processing module 3 measures the mutual capacitance between the transmitting electrode and the receiving electrode, and when a finger is placed between the transmitting electrode and the receiving electrode, the mutual capacitance is reduced, so that the touch key action is recognized.

Further, the materials of the transmitting electrode and the receiving electrode are copper, PEDOT (a transparent conductive ink) and ITO (indium-tin oxide), and may also be carbon nanotube, graphene, nano silver wire and Metal-Mesh (Metal Mesh).

Preferably, the signal detecting and processing module 3 includes:

a wiring board 31;

and a signal detection processing chip mounted on the wiring board 31.

Specifically, the circuit board 31 is a pcb circuit board 31, which has signal wires and related electronic components in addition to the signal detection processing chip.

In some embodiments, the circuit board 31 has a plurality of hollow-out spaces.

Preferably, the pressure sensing module 1 includes:

the first strain resistor R1 and the second strain resistor R2 are connected;

the third strain resistor R3 and the fourth strain resistor R4 are connected;

the other ends of the first strain resistor R1 and the third strain resistor R3 can be connected with a power supply voltage, the second strain resistor R2 and the fourth strain resistor R4 are grounded, and the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 form a Wheatstone bridge.

Specifically, the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are fixed on the lower end face of the signal detection and processing module 3.

In some embodiments, the pressure sensing module 1 further includes:

the bearing board, first strain resistance R1, second strain resistance R2, third strain resistance R3, fourth strain resistance R4 set up on this bearing board 11, first strain resistance R1, second strain resistance R2, third strain resistance R3, fourth strain resistance R4 pass through this bearing board 11 and install on the fretwork vacancy of circuit board 31.

Specifically, the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are arranged on the lower end face of the signal detection and processing module 3 in an array manner, and in this embodiment, the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are arranged on the substrate layer 21 in a rectangular array manner.

Furthermore, the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are pressure-induced strain resistors and are made of micro-strain ink materials through a printing process, the size, the thickness and relevant forming parameter indexes of the resistors are strictly controlled, and the consistency of the assembly is ensured; in this embodiment, the resistances of the first strain resistor R1, the second strain resistor R2, the third strain resistor R3, and the fourth strain resistor R4 are equal, the standard resistances are all 5000 ohms, and the maximum error is ± 5%.

Furthermore, the connected first strain resistor R1 and second strain resistor R2 are connected in series to form a left half bridge of a Wheatstone bridge, and the connected third strain resistor R3 and fourth strain resistor R4 are connected in series to form a right half bridge of the Wheatstone bridge; the first strain resistor R1 and the second strain resistor R2 are connected with a Vm-end together, and the third strain resistor R3 and the fourth strain resistor R4 are connected with a Vm + end together; the first strain resistor R1 and the third strain resistor R3 are connected with a VCC end together, and the second strain resistor R2 and the fourth strain resistor R4 are connected with a GND end together.

Preferably, the number of the pressure sensing modules 1 is 4, and the 4 pressure sensing modules 1 are respectively arranged on the lower end face of the signal detection and processing module 3 corresponding to the outer end faces of the touch sensing signal output layer 27 in the front, rear, left and right directions.

Specifically, the area of the pressure-sensitive module 1 is 2.2 × 7.0 mm. Through judging the pressurized condition of 4 forced induction modules 1, judge whether front, back, left and right or the top pressurized. Examples are: one of the 4 pressure sensing modules 1 is pressed maximally, the direction corresponding to the pressure sensing module 1 is pressed, and if the 4 pressure sensing modules 1 are pressed almost the same, the top end is pressed.

Further, the first strain resistor R1 and the fourth strain resistor R4 are opposite to each other in the bridge arm a, and the second strain resistor R2 and the third strain resistor R3 are opposite to each other in the bridge arm B. When the substrate layer 21 is transversely pressed, bent and deformed, the deformation of the substrate is mainly transversely applied to the long sides of the first strain resistor R1 and the fourth strain resistor R4 to make them elongate and generate large deformation, and the deformation of the substrate layer 21 is applied to the short sides of the second strain resistor R2 and the third strain resistor R3 to make them generate small deformation or no deformation, so that the first strain resistor R1 and the fourth strain resistor R4, and the second strain resistor R2 and the third strain resistor R3 have different deformation quantities, and under the voltage action of the wheatstone bridge circuit, voltage difference output signals can be generated at the Vm + and Vm-two ends of the pressure sensing module 1.

Similarly, when the substrate layer 21 is longitudinally pressed, bent and deformed, the second strain resistor R2 and the third strain resistor R3 are deformed greatly, and the first strain resistor R1 and the fourth strain resistor R4 are deformed little, which also causes the wheatstone bridge to generate the voltage difference output signal.

When the single point of the PET substrate carrier plate is irregularly deformed under pressure, the induced strain resistors R1, R2, R3 and R4 are also deformed to different degrees respectively, so that the Wheatstone bridge generates voltage difference output signals.

In the embodiment, the standard resistance values of the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are 5000 ohms, the allowable maximum error is 5%, and the error of 5% in actual production is the standard for ensuring good precision and low production cost, namely the maximum error is +/-250 ohms. The pressure sensing module 1 can be obtained by the working principle of a Wheatstone full bridge under the condition of no pressure state:

according to the formula, when the maximum values of R1 and R4 are +250 ohms and the minimum values of R2 and R3 are-250 ohms, the output signal value of the UO is maximum, and when the resistance values of the four resistors R1, R2, R3 and R4 are completely consistent, the minimum value of the output signal value of the UO is zero.

When the voltage E applied to two ends of the Wheatstone bridges VCC and GND is 3VDC, the value range of the UO output signal is 0-150 mV, and the UO is called as a bridge signal Baseline in a natural state. Since the area of the pressure sensing module 1 is very small, 2.2 × 7.0mm, the pressures applied to the strain resistors R1 and R4 of the opposite bridge arm a and the pressures applied to the strain resistors R2 and R3 of the opposite bridge arm B are almost equal, please refer to the layout of fig. 3, since the direction of the applied force is in the transverse direction, the deformation of the strain resistors R1 and R4 of the opposite bridge arm a is relatively large and the same, the resistance after deformation is (R + Δ R), and the deformation of the strain resistors R2 and R3 of the opposite bridge arm B is relatively small and can be ignored, so that the output formula of the wheatstone bridge signal can be simplified as follows:

that is, the size of the wheatstone bridge signal is in direct proportion to the increment of the resistance value of the strain resistor of the bridge arm with obvious deformation, so that the size of the pressure can be obtained through calculation.

Preferably, the device further comprises a cantilever support 6, and the cantilever support 6 is arranged on the lower end surface of the signal detection and processing module 3.

Specifically, the cantilever beam support 6 is an optional component, and the function of the cantilever beam support is to make the deformation of the pressure-sensitive module more obvious. The three-dimensional touch sensing module 2 is combined with the pressure sensing module 1 and the signal detection and processing module 3 by means of screw fixation, adhesive bonding and the like, and then is installed on the cantilever beam support 6 to form a complete three-dimensional touch panel.

The three-dimensional touch panel can realize the three-dimensional touch operation function of pressing five directions at the left, right, front and back and the top of the panel, and has a wide application range.

On the other hand, referring to fig. 5 to 6, the signal detecting and processing module 3 includes a touch processing chip, the mutual capacitances Cx,1 to Cx, n between each set of the transmitting electrodes and the receiving electrodes of the touch sensing module 2 are connected to different pins of the touch processing chip, and the internal circuit of the chip converts the analog quantity of each Cx into a digital quantity and stores the digital quantity for post-processing. When a finger does not touch the touch sensing module 2, the chip pin has a parasitic capacitance Cp, Cp is generated by coupling between the Sensor board Sensor, the trace, the via and other conductors in the module and the ground grid, Cp usually ranges from 6pF to 15pF, and Cx ═ Cp at this time. When a finger touches the touch sensing module 2, the human finger capacitance Cf is superimposed to Cx, where Cx is Cp + Cf, and Cf is usually in the range of 0.1pF to 0.4pF, and in some embodiments, the state transition threshold is a digital quantity corresponding to 0.1 pF. In addition, different state transition thresholds can be set according to the touch sensitivity requirement, and the smaller the value is, the more sensitive the value is in the range of 0.1pF-0.4 pF.

Referring to fig. 6, assuming that Cp is 10pF and Cf is 0.4pF, when a finger does not touch the touch sensing module 2, Cx Cp is 10pF, and the capacitance is calculated by the signal detection and processing module 3 to obtain stable Raw Count data 5920, i.e., a "touch OFF" state Baseline is 5920. When the finger touches the sensing module 2, Cx ═ Cp + Cf ═ 10pF +0.4pF ═ 10.4pF, and the signal detection and processing module 3 calculates to obtain stable new Raw Count data 6060, which is the "touch ON" state, then if the state transition threshold is the digital quantity corresponding to 0.1pF, the state transition threshold is Cx ═ Cp + Cf ═ 10pF +0.1pF ═ 10.1pF corresponding Raw Count data. And judging the touch state by comparing the Raw Count data.

Further, the touch Signal (new Raw Count) -base ═ 6060-.

Since the Finger touching the touch sensing module 2 causes Cx to increase to Cp + Cf, the state is stable, the Finger leaves the touch sensor and stably restores Cx to Cp, and further, the state transition Threshold may be corresponding to the touch Signal, a state transition Threshold value Finger Threshold is set, for example, 100, the touch Signal 140 is greater than the Threshold value Finger Threshold 100, the Signal processor determines that the sensor is in an ON (touch) state, otherwise, if the touch Signal is less than the Threshold value Finger Threshold Signal processor, the sensor is in an OFF (no touch) state. If the signal detection and processing module 3 detects two Cx1 and Cx2 simultaneously, two-dimensional touch coordinate output of (X, Y) can be realized.

Preferably, when the pressure value applied to the touch point is calculated according to the pressing sensing signal, the method further includes:

judging whether the pressing induction signal is larger than a pressure threshold value, wherein the pressure threshold value is the minimum voltage signal variation quantity output by the pressure induction module 1 when the three-dimensional touch panel is confirmed to be pressed by a set target;

if not, the press sensing signal obtained by the pressure sensing module 1 is received again;

and if so, calculating the pressure value of the touch point according to the pressing sensing signal.

Specifically, the setting target is a finger.

It should be noted that, during the process of assembling the pressure sensing module 1 to the substrate layer or attaching the pressure sensing module to the user panel, the first, second, third and fourth strain resistors R4 may be subjected to a certain pre-deformation force, which is referred to as a pre-stressed state. Under the pre-compression state, the resistances of the four strain resistors R1, R2, R3 and R4 are superposed with a certain pre-compression resistance value under the natural state, and according to the wheatstone full-bridge working principle explained above, the signal value obtained under the pre-compression state is called Uo1, and Uo is the output signal of the pressure sensing module 1 under the non-pressure state, and the signal difference value of (Uo 1-Uo) is called the compensation number Offset or the compensation signal.

Moreover, the three-dimensional touch panel has a non-pressure state and a pressure state. The "no-pressure" state is the finished state of the touch panel with the pressure sensing module 1 attached, and includes the natural state and the pre-pressing state of the first, second, third and fourth strain resistors R4. The "pressed" state is the state when the touch panel is pressed by an external force.

Referring to fig. 3, when a transverse force is applied to make the touch panel in a "pressed" state, the stress on the long sides of the strain resistors R1 and R4 of the pressure sensing module 1 is further significantly elongated, and the deformation of the short sides of the strain resistors R2 and R4 due to stress on the short sides is negligible, so that the resistance values of the strain resistors R1 and R4 are usually increased to 20-50% of the standard resistance value R according to the material characteristics of the pressure sensing strain resistors and the magnitude of the force applied. Assuming that the resistance values of the strain resistors R1 and R4 are increased by 50%, i.e., Δ Rn is 2500 ohms in the "stressed" state of the embodiment, according to the wheatstone bridge signal output formula:

uo2 can be calculated to be 1.5V (1500mV) when the voltage E is 3VDC, which we call Signal.

The Signal, Offset compensation and Signal base line are input into the Signal detection and processing module 3, and through Signal amplification, analog/digital conversion and algorithm, two states of 'no pressure' and 'pressure' can be identified, and relevant control processing is performed.

That is, when determining whether the pressing sensing signal is greater than the pressure threshold, the method further includes:

if not, confirming that the three-dimensional touch panel is in a non-pressure state, and re-receiving the press induction signal acquired by the pressure induction module 1;

if yes, confirming that the three-dimensional touch panel is in a pressing state, and calculating a pressure value of the touch point according to the pressing induction signal.

Further, the pressure sensing module 1 outputs an analog signal to the AFE of the signal detection and processing module 3, the analog signal is converted into a digital signal by the ADC chip of the signal detection and processing module 3 after being amplified by the AFE, and the digital signal is sent to the ARM/DSP in the signal detection and processing module 3 for filtering, reconstruction algorithm and logic comparison processing.

Referring to fig. 7, in the present embodiment, when the touch panel is in the state of external force F being 0 and no pressure, the raw data read by the pressure sensing module 1 under natural conditions by the signal detection and processing module 3 is 500, and the initial Baseline of the pressure sensing module 1 is 500. The pressure sensing module 1 has Offset compensation under the pre-compression condition, at this time, the processor reads the RawData reading value 1050, (RawData-initial base) 1050-. That is, in the "no pressure" state a, Baseline is 1050, and Offset is 550.

Referring to fig. 7, when the three-dimensional touch panel is pressed by an external force F >0, the three-dimensional touch panel is in a "pressed" state, and since the deformation of the first, second, third, and fourth strain resistors R4 on the pressure sensing module 1 is significant, the RawData read by the processor is significantly increased to about 5100, and the reading increment, i.e., the pressing sensing Signal (RawData-base) (5100-1050) () 4050. When the external force is removed, F is equal to 0, the RawData read by the processor drops back to around Baseline 1050. Because the external force exists and can make the pressure-sensitive module 1 output the apparent Signal state steadily, and the external force removes the pressure-sensitive module 1 and can resume to the Baseline state steadily again, set up a Trigger Threshold such as 2500 ON the software logic of the processor, the pressure-sensitive Signal 4050 is greater than Trigger Threshold 2500, the Signal processor judges that the touch panel is in the ON (there is pressure) state, otherwise, if the pressure-sensitive Signal is less than Trigger Threshold, the processor judges that the touch panel is in the OFF (there is not pressure) state. Wherein the Trigger Threshold is the pressure Threshold.

Furthermore, the pressure signal processing system can judge the magnitude of the pressing force by detecting the coordinates of the touch points in advance and calibrating the pressure, and the use of Z-direction signals is further enriched. Three-dimensional touch panels are different in size, shape and pressing force point positions, and therefore two or more pressure sensing modules 1 are generally required to be used together to achieve the best effect.

Furthermore, the area of the pressure sensing module is 2.2 × 7.0mm, so that the first, second, third and fourth strain resistors R4 in the same wheatstone bridge can be located at close positions, and the change of environmental factors is also close at the close positions, so that the first, second, third and fourth strain resistors R4 in the wheatstone bridge can be simultaneously influenced by the environmental factors, and the resistance value is simultaneously increased or simultaneously decreased without influencing the change of voltage difference. Therefore, the design not only ensures that the strain sensing resistors of the bridge in the bridge have different deformation quantities, but also ensures that the change of environmental factors such as temperature, humidity, vibration, electromagnetic interference and the like has little influence on the strain sensing resistors, thereby solving the interference problem of the environmental factors.

In addition, in actual use, deformation of the base material layer 21 requires a certain time to recover, and in some cases, an operation gap of a user, for example, a contact point or the like, is shorter than a deformation recovery time; the existing method which does not deal with the deformation residue easily causes the problems of operation failure and the like which seriously affect the use experience.

Referring to fig. 7 again, when the problem of residual deformation is encountered, for example: after the first external force is removed, the new raw data read by the signal detection and processing module 3 is 950, which is not equal to 1050 before the external force is applied, because the deformation remains in the process of applying and removing the external force of the three-dimensional touch panel, which results in the pre-pressing state of the pressure sensing module 1 being changed, and at this time, the new Offset is 950-450. Then, the new "no-pressure" state B, base 950 and Offset 550, performs the next pressure-sensing recognition, and the recognition process is the same as the previous one, and is not described here again.

Here, since it is noted that the Offset signal Offset is Offset for the pre-compression, which is already determined when the assembly is completed, the Offset is constant in the subsequent calculation, and similarly, the initial Baseline of the pressure sensing module 1 is also constant.

Further, it is a continuously repeated step to receive the voltage signal obtained when the pressure sensing module 1 is not pressed, and when the external pressure is removed, the voltage signal obtained when the pressure sensing module 1 is not pressed is gradually increased, and the read RawData reading of the signal detection and processing module 3 is gradually increased; at this time, the next pressing occurs, the voltage signal obtained when the pressure sensing module 1 is not pressed is gradually reduced, and the read value of the RawData read by the corresponding signal detection and processing module 3 is also gradually reduced;

then, the deformation residue problem can be solved by only saving the maximum value in the gradually increasing RawData reading and taking the maximum value in the RawData reading as the new RawData.

When the three-dimensional touch panel is used, fingers are placed in any one or more directions of the left direction, the right direction, the front direction, the rear direction and the top of the three-dimensional touch panel, and pressure within a certain range can be applied at the same time;

the signal detection and processing module 3 continuously receives the touch sensing signal obtained by the touch sensing module 2;

the signal detection and processing module 3 continuously receives the press induction signal obtained by the pressure induction module 1;

judging whether the touch sensing signal is larger than a state transition threshold value, wherein the state transition threshold value is the minimum capacitance signal variation output by the touch sensing module 2 when the three-dimensional touch panel is confirmed to be touched by a set target;

and if so, acquiring the two-dimensional coordinates of the touch point according to the touch sensing signal.

And integrating the two-dimensional coordinates of the touch point and the pressure value received by the touch point to generate three-dimensional coordinates.

When the signal detection and processing module 3 continuously receives the pressing sensing signal obtained by the pressure sensing module 1, a non-pressure signal is obtained, wherein the non-pressure signal is the last measured value of the pressure sensing module 1 before the measured value is reduced, namely the last measured value of the pressure sensing module 1 before the pressure sensing module 1 is pressed; acquiring a pressure signal which is the minimum measured value of the pressure sensing module 1 after the measured value of the pressure sensing module 1 becomes smaller, namely, the minimum measured value of the pressure sensing module 1 when the pressure sensing module 1 is pressed; judging whether the non-pressure signal is larger than the non-pressure signal obtained last time; if yes, continuously acquiring a new non-pressure signal; and if not, storing the last non-pressure signal, and calculating the pressing induction signal according to the pressure signal and the last non-pressure signal.

The structure of the utility model is reasonable and ingenious in design, and through the modularized design, the part for acquiring the press sensing signal is designed into the pressure sensing module 1, and the part for acquiring the touch sensing signal is designed into the touch sensing module 2; during assembly, the pressure sensing module 1 and the touch sensing module 2 are only needed to be spliced, and the pressure sensing module 1 and the touch sensing module 2 are connected to the signal detection and processing module 3, so that the problems of high difficulty in volume production, complex production process and high cost are solved; on the other hand, the problem of measurement errors caused by extrusion of the pressing induction module in the installation process is effectively solved; moreover, the use of force-sensitive capacitors, strain gauges and the like is eliminated, and the sensing detection of the pressure in the Z direction is realized by combining the deformation of the substrate layer with the detection of the pressure sensing module 1; because a Wheatstone bridge is formed, slight deformation of the substrate layer can act on the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 of the pressure sensing module 1, and compared with a force sensitive capacitor, the pressure sensing module has the advantages of small detectable deformation displacement, large dynamic working range, capability of well solving errors caused by pre-pressing mechanical acting force, permission of resistance value errors of each strain resistor and suitability for large-scale mass production; meanwhile, the production process is simple and the cost is low; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved. The X direction and the Y direction can identify the effective action input based on human touch, so that the non-human misoperation can be avoided effectively, meanwhile, the Z direction can realize the detection of the micro-deformation pressure, and the micro-deformation pressure detection device has the technical leading advantage in the safety field and has wide market prospect in the fields of automobiles, mobile phones and electronic products in the future.

Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment of the present invention.

The principle and the implementation mode of the utility model are explained by applying specific embodiments in the utility model, and the description of the embodiments is only used for helping to understand the method and the core idea of the utility model; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. A three-dimensional touch panel, comprising:

2. The three-dimensional touch panel according to claim 1, wherein the three-dimensional touch sensing module comprises:

a three-dimensional base;

the touch sensing signal output layer is sleeved on the three-dimensional base;

3. The three-dimensional touch panel according to claim 2, wherein the three-dimensional touch sensing module further comprises:

4. The stereoscopic three-dimensional touch panel according to claim 2, wherein the touch sensing signal output layer comprises:

a substrate layer;

5. The stereoscopic three-dimensional touch panel according to claim 4, wherein the number of the two-dimensional output modules is 5, and 5 of the two-dimensional output modules are respectively disposed on the outer side end faces in the front, rear, left and right directions of the touch sensing signal output layer and the top end of the touch sensing signal output layer.

6. The stereoscopic three-dimensional touch panel according to claim 5, wherein the two-dimensional output module comprises a plurality of touch panels, the touch panels are connected with the signal detection and processing module, and the touch panels are mutual capacitance panels.

7. The stereoscopic three-dimensional touch panel according to claim 5, wherein the signal detection and processing module comprises:

a circuit board;

and the signal detection processing chip is mounted on the circuit board.

8. The three-dimensional touch panel according to claim 1, wherein the pressure sensing module comprises:

the first strain resistor and the second strain resistor are connected;

the third strain resistor and the fourth strain resistor are connected;

9. The three-dimensional touch panel according to claim 8, wherein the number of the pressure sensing modules is 4, and the 4 pressure sensing modules are respectively disposed on the lower end surface of the signal detection and processing module corresponding to the outer end surfaces of the touch sensing signal output layer in the front, rear, left, and right directions.

10. The three-dimensional touch panel according to claim 1, further comprising a cantilever bracket disposed on a lower end surface of the signal detection and processing module.