CN216083651U

CN216083651U - Three-dimensional touch signal induction module and three-dimensional touch panel

Info

Publication number: CN216083651U
Application number: CN202121950000.XU
Authority: CN
Inventors: 付嘉欣; 王发玉; 金秀芳; 罗富怀
Original assignee: Dongguan Mingxuan Technology Co ltd
Current assignee: Dongguan Mingxuan Technology Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-03-18
Anticipated expiration: 2031-08-19

Abstract

The utility model provides a three-dimensional touch signal induction module and a three-dimensional touch panel, wherein the three-dimensional touch signal induction module comprises: a pressure sensing module; a touch sensing module; and the signal detection and processing module is connected with the pressure sensing module and the touch sensing module. The utility model can synchronously realize the functions of three dimensions of human body touch identification and pressure sensing detection, and solves the problems of high difficulty in volume production, complex production process and high cost and the problem of measurement error caused by extrusion of a pressure sensing module in the installation process; moreover, the deformation of the substrate layer is combined with the detection of the pressure sensing module, so that the sensing detection of the pressure in the Z direction is realized, and compared with a force-sensitive capacitor, the deformation displacement can be detected to be small, the dynamic working range is large, and the method is suitable for large-scale mass production; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved.

Description

Three-dimensional touch signal induction module and three-dimensional touch panel

Technical Field

The utility model relates to the technical field of touch panels, in particular to a three-dimensional touch signal induction module and a three-dimensional touch panel.

Background

With the development of intelligent technology, the application of touch panels has become very wide, such as: smart phones, automotive interiors, tablet computers, household appliances, smart watches, electronic readers, virtual keyboards, industrial control panels, and the like.

The one-dimensional input touch panel can replace a mechanical key panel, the mechanical key panel is complex in structure and short in service life, fatigue, damage and key failure are prone to occurring, the mechanical key panel is rigid in appearance design and shape, difficult to bend, difficult to prevent water, afraid of oil stains and high in comprehensive cost. The two-dimensional input touch panel further enriches human-computer interaction modes, such as a touch screen, a touch pad, a touch slider, a touch roller and the like. A two-dimensional coordinate system (X, Y) can be virtually established on the surface where the two-dimensional input touch panel is located, coordinate positions of touch points in the X direction and the Y direction can be accurately calculated through the processing chip, and therefore display amplification/reduction/rotation/translation, single-press/double-click/hand-wave/multi-finger touch/proximity sensing and other gesture recognition operations are achieved, and the effect of various touch functions is achieved.

The touch panel with one-dimensional and two-dimensional input is the most mature and widely applied capacitive touch sensing technology at present, and the touch panel applying the technology has the remarkable advantages of simple structural design, flexible appearance and shape, long service life, high reliability, flexible panel, good dust and water resistance, low comprehensive cost and the like.

However, the capacitive touch sensing technology must rely on human body, and for some capacitive keys easily touched by human body, double confirmation such as automobile steering wheel key board, window keys, dome lamp control keys and the like is required, and hidden touch keys, touch plane coordinate keys such as vehicle-mounted mouse, 3D remote controller, keyless mobile phone and the like, three-dimensional touch input in X direction, Y direction and Z direction is required.

Regarding the technical scheme of touch panel Z direction input, the utility model discloses the people finds that above-mentioned technique has following technical problem at least at the in-process of realizing utility model technical scheme in the embodiment of this application:

chinese patent CN201810013731.8 discloses a "three-dimensional projection touch control method, a controller, and a household appliance", which adds a set of touch recognition functions to four directions, i.e., upper, lower, left, and right sides of a touch panel generating two-dimensional coordinate values (X, Y) to generate a depth coordinate value, thereby implementing input in the Z direction of a space, where the input in the Z direction is capacitive sensing operation such as movement of a finger in the space above the touch panel, and is not a touch action actually pressing on the touch panel, and thus is not a Z-direction touch function, and is prone to misoperation.

The other technical scheme is touch panel Z-direction pressure induction detection. The pressure sensing detection methods are various and comprise infrared rays, mechanical springs, force sensitive resistors, force sensitive capacitors, strain gauges and the like. The infrared pressure-sensitive detection structure is complex, the cost is high, the detection precision is not high, and the anti-interference capability is poor. Mechanical springs and strain gauges typically have large dimensions on the order of a few millimeters or more, require displacements of a few tens of microns to activate the force sensor and have low sensitivity. The force-sensitive resistor and the force-sensitive capacitor are very sensitive to pre-pressing mechanical acting force caused in the production and assembly processes of products, the sensor has large change and the dynamic working range is small. The touch panel is usually integrally assembled, the above detection methods are obviously not used, and a pressure sensing detection solution with simple structure, small detectable deformation displacement, high sensitivity, strong anti-interference capability and low production cost is needed in the industry.

At present, the three-dimensional input touch panel is in a demand rising period and is limited by a pressure sensing detection technology, and the three-dimensional input touch panel cannot be produced in a large scale. Chinese patent CN201510639990.8 discloses a detection method for capacitive three-dimensional detection module, which describes a capacitive three-dimensional detection method, wherein two-dimensional touch control uses an upper/lower layer structure to form mutual capacitance sensing control to determine the position coordinates of a touch point, and in fact, a touch pad can also determine the touch function in a self-capacitance manner. The pressure-sensitive detection of this patent uses a piezoelectric pressure sensor including a first pressure-sensitive layer and a second pressure-sensitive layer, and its operation principle is as described in its specification [0045 ]: the utility model adopts piezoelectric materials, the first pressure sensing unit 151 and the second pressure sensing unit 171 can generate capacitance change in response to the pressing action, and the pressure sensing unit is also used for detecting a force-sensitive capacitor essentially.

The three-dimensional input module disclosed in chinese patent CN201520772631.5 is a specific implementation of chinese patent CN201510639990.8, and in the implementation process, the touch electrode material is indium-tin oxide ITO, carbon nanotubes, graphene, silver nanowires, metal grids, and the like, which have high cost, and the structure thereof has a panel layer, a first touch electrode layer, a second touch electrode layer, a first pressure-sensitive layer, and a second pressure-sensitive layer, and all layers need to be bonded with glue, so that the production process is complex and the cost is high. Laminating need stay the clearance between first pressure layer and the second pressure layer and construct into force-sensitive electric capacity, and this clearance is hardly managed and controlled the uniformity in the production, and the volume production degree of difficulty is high.

In addition, the existing three-dimensional touch panel technology has no better corresponding method for deformation residue in the process of applying and removing panel external force.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned problems of small dynamic working range, high difficulty in mass production, and difficulty in dealing with the deformation residue during the application and removal process of the panel external force when dealing with the Z-direction input, the present invention is proposed to provide a three-dimensional touch signal sensing module and a three-dimensional touch panel which overcome the above-mentioned problems or at least partially solve the above-mentioned problems.

According to an aspect of the present invention, there is provided a three-dimensional touch signal sensing module, including:

the pressure sensing module can acquire a pressing sensing signal, and the pressing sensing signal is a voltage signal variable quantity output when the pressure sensing module is pressed;

the touch sensing module can acquire a touch sensing signal, wherein the touch sensing signal is a capacitance signal variable quantity output by the touch sensing module;

the signal detection and processing module is connected with the pressure sensing module and the touch sensing module, can acquire a one-dimensional numerical value or a two-dimensional coordinate of a touch point according to the touch sensing signal, can calculate a pressure value applied to the touch point according to the press sensing signal, and integrates the one-dimensional numerical value or the two-dimensional coordinate of the touch point and the pressure value applied to the touch point into a three-dimensional touch signal for output;

the touch sensing module is provided with a substrate layer, and the signal detection and processing module is arranged on the substrate layer.

Preferably, the pressure sensing module is arranged on the upper end face of the touch sensing module and/or on the lower end face of the touch sensing module and/or in the touch sensing module.

Preferably, the touch sensing module further includes:

the touch sensing top layer circuit is arranged on the upper end face of the base material layer;

the touch sensing bottom layer circuit is arranged on the lower end face of the base material layer;

the touch sensing top layer circuit and/or the touch sensing bottom layer circuit are/is provided with a plurality of one-dimensional output modules and/or two-dimensional output modules; and connecting wire through holes are formed in the upper end face and the lower end face of the substrate layer, and the touch sensing top layer circuit penetrates through the connecting wire through holes to be connected with the touch sensing bottom layer circuit.

Preferably, the one-dimensional output module comprises a plurality of touch keys and a plurality of touch slide bars, and the touch keys and the touch slide bars are connected with the signal detection and processing module;

and the two-dimensional output module comprises a plurality of touch pads and is connected with the signal detection and processing module.

Preferably, the touch pad is provided with a plurality of touch keys and a plurality of touch slide bars which are arranged on the touch sensing top layer circuit; the touch panel includes:

a plurality of transmitting electrodes disposed on the touch sensing underlying line;

a plurality of receive electrodes disposed on the touch sensing top layer circuitry.

Preferably, the pressure sensing module includes:

the first strain resistor and the second strain resistor are connected;

the third strain resistor and the fourth strain resistor are connected;

the first strain resistor and the third strain resistor can be connected with a power supply voltage, the second strain resistor and the fourth strain resistor are grounded, and the first strain resistor, the second strain resistor, the third strain resistor and the fourth strain resistor form a Wheatstone bridge.

Preferably, the three-dimensional touch signal sensing module further includes:

the first protective layer is arranged above the base material layer, connected with the base material layer and capable of covering the touch sensing top layer circuit;

and the second protective layer is arranged below the base material layer, is connected with the base material layer and can cover the touch sensing bottom layer circuit.

The first protective layer and/or the second protective layer can also cover the pressure sensing module.

According to another aspect of the present invention, there is provided a three-dimensional touch panel including:

the three-dimensional touch signal sensing module as described above;

the user panel module can cover the three-dimensional touch signal induction module and is provided with a plurality of entity touch positions for touch;

an adhesion module capable of adhering the user panel module and the three-dimensional touch signal sensing module.

Preferably, the entity touch position is a conductive entity touch position;

the user panel module further comprises a user panel, the entity touch position is arranged on the user panel, and the user panel is an insulating cover plate.

Preferably, the adhesion module is an OCA optical cement.

The utility model has the beneficial effects that: the structure of the utility model is reasonable and ingenious in design, and through the modularized design, the part for acquiring the press sensing signal is designed into the pressure sensing module, and the part for acquiring the touch sensing signal is designed into the touch sensing module; during assembly, the pressure sensing module and the touch sensing module are only needed to be spliced and connected to the signal detection and processing module, so that the problems of high difficulty in volume production, complex production process and high cost are solved; on the other hand, the problem of measurement errors caused by extrusion of the pressing induction module in the installation process is effectively solved; moreover, the force-sensitive capacitor is not used, and the sensing detection of the pressure in the Z direction is realized by combining the deformation of the substrate layer with the detection of the pressure sensing module; because a Wheatstone bridge is formed, slight deformation of the substrate layer can act on the first strain resistor, the second strain resistor, the third strain resistor and the fourth strain resistor of the pressure sensing module, and compared with a force-sensitive capacitor, the pressure sensing module has the advantages of small detectable deformation displacement and large dynamic working range, can well solve errors caused by prepressing mechanical acting force, allows resistance errors of each strain resistor, and is suitable for large-scale mass production; meanwhile, the production process is simple and the cost is low; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a three-dimensional touch signal sensing module according to an embodiment of the utility model;

FIG. 2 is a top view of a touch sensing top layer circuit in an embodiment of the utility model;

FIG. 3 is a schematic structural diagram of a pressure sensing module according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a three-dimensional touch panel according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a touch processing chip according to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating the ON/OFF recognition of a touch sensing signal according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of the ON/OFF recognition of the pressure-sensitive signal in the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Next, referring to fig. 1 to 7, an embodiment of the present invention will be explained.

Example 1

Next, example 1 of the present invention will be explained.

According to an aspect of the present invention, an embodiment of the present invention provides a three-dimensional touch signal sensing module, including:

the pressure sensing module 1 is capable of acquiring a pressing sensing signal, wherein the pressing sensing signal is a voltage signal variation output when the pressure sensing module 1 is pressed;

the touch sensing module 2 can acquire a touch sensing signal, wherein the touch sensing signal is a capacitance signal variation output by the touch sensing module 2;

the signal detection and processing module 3 is connected with the pressure sensing module 1 and the touch sensing module 2, and the signal detection and processing module 3 can acquire a one-dimensional numerical value or a two-dimensional coordinate of a touch point according to the touch sensing signal, can calculate a pressure value applied to the touch point according to the press sensing signal, and integrates the one-dimensional numerical value or the two-dimensional coordinate of the touch point and the pressure value applied to the touch point into a three-dimensional touch signal for output;

the pressure sensing module 1 is arranged on the upper end face of the touch sensing module 2 and/or on the lower end face of the touch sensing module 2 and/or in the touch sensing module 2.

The one-dimensional numerical value is an induced value, and can be a numerical value of capacitance signal variation or a numerical value which has a corresponding relation with the capacitance signal variation; the two-dimensional coordinates are x-axis coordinates and y-axis coordinates. The one-dimensional numerical value can be converted into a two-dimensional numerical value, namely, the one-dimensional numerical value is obtained on the basis of a preset x or y value and is converted into a two-dimensional coordinate with x and y axis coordinates.

The touch sensing module is provided with a substrate layer 21, and the signal detection and processing module 3 is arranged on the substrate layer 21. Further, the signal detection and processing module 3 may not be disposed on the substrate layer 21.

Specifically, the three-dimensional touch signal sensing module is designed in a modularized manner, wherein a part for acquiring a pressing sensing signal is designed into a pressure sensing module 1, and a part for acquiring a touch sensing signal is designed into a touch sensing module 2; during assembly, the pressure sensing module 1 and the touch sensing module 2 are only needed to be spliced, and the pressure sensing module 1 and the touch sensing module 2 are connected to the signal detection and processing module 3, so that the problems of high difficulty in volume production, complex production process and high cost are solved;

wherein, forced induction module 1 sets up the up end of touch-sensitive module 2 and/or the lower terminal surface of touch-sensitive module 2, its principle is: the pressure sensing module 1 may be a plurality of sub-modules, which are connected by adhesion or other conventional film connection means. The three-dimensional touch signal sensing module can be arranged in the touch sensing module 2, so that the thickness of the three-dimensional touch signal sensing module is further reduced, and the three-dimensional touch signal sensing module conforms to the great trend of thinning of the three-dimensional touch signal sensing module.

When the pressure sensing module 1 is arranged in the touch sensing module 2, a plurality of hollow positions are arranged on the touch sensing module 2, so that the pressure sensing module can be placed in the hollow positions.

Furthermore, the pressure sensing module 1 and the signal detection and processing module 3 are all thin films.

Further, the pressure sensing module 1 is substantially a wheatstone bridge module; the pressure sensing module 1 is connected with the signal detection and processing module 3 through a signal wire, and the touch sensing module 2 is connected with the signal detection and processing module 3 through a signal wire.

Preferably, the touch sensing module 2 includes:

a base material layer 21;

a touch sensing top layer circuit 22 mounted on the upper end face of the substrate layer 21;

a touch sensor substrate line 23 mounted on the lower end surface of the substrate layer 21;

a plurality of one-dimensional output modules 221 and/or two-dimensional output modules 222 are arranged on the touch sensing top layer lines 22 and/or the touch sensing bottom layer lines 23; connecting wire through holes are formed in the upper end face and the lower end face of the base material layer 21, and the touch sensing top layer circuit 22 penetrates through the connecting wire through holes to be connected with the touch sensing bottom layer circuit 23.

Specifically, the touch sensing top layer circuit 22 is an element layer and is mainly used for placing components; the touch sensing bottom layer circuit 23 is a welding layer and is mainly used for wiring and welding.

The substrate layer 21 is a carrier of the touch sensing top layer circuit 22 and the touch sensing bottom layer circuit 23, and plays a supporting role, and the substrate layer 21 is generally an FR-4 epoxy fiberglass cloth substrate or a PET polyethylene terephthalate substrate; in a preferred embodiment, the substrate layer 21 is a PET polyethylene terephthalate substrate, which is a flexible film substrate, and the thickness of the substrate layer 21 is 0.125 mm.

Further, the touch sensing top layer circuit 22 and the touch sensing bottom layer circuit 23 are made of conductive materials through processes of printing, spray etching, coating, sputtering, laser etching and the like. The signal conductors and other connections of the circuit are interconnected, typically made of copper/aluminum metal and silver paste, which is produced by a printing and drying process and is resistant to bending.

Preferably, the one-dimensional output module 221 includes a plurality of touch keys 221a and a plurality of touch sliders 221b, and the plurality of touch keys 221a and the plurality of touch sliders 221b are connected to the signal detection and processing module 3;

the two-dimensional output module 222 comprises a plurality of touch pads, and is connected with the signal detection and processing module 3;

the touch key 221a, the touch slider 221b, the touch pad, and the like can be set to be in a self-capacitance, mutual capacitance, or other capacitance design mode.

In this embodiment, the touch key 221a is a self-capacitance key, the touch slider 221b is a self-capacitance slider, and the touch pad is a mutual capacitance panel.

Specifically, the one-dimensional output module 221 is a one-dimensional sensor, and the two-dimensional output module 222 includes two-dimensional sensors, which are composed of electrodes; the number of the one-dimensional output modules 221 and the two-dimensional output modules 222 is not limited, and the conventional materials thereof are copper, PEDOT (a transparent conductive ink), and ITO (indium-tin oxide), and may also be carbon nanotubes, graphene, nano silver wires, and Metal-Mesh (Metal Mesh).

The self-capacitance key and the self-capacitance slide bar adopt a self-capacitance working mode. The shape of the one-dimensional sensor can be designed at will, such as a circle, a rectangle, an ellipse, a slide bar, a roller and the like. The touch pad is composed of a plurality of two-dimensional sensors, the two-dimensional sensors are arranged according to a determinant, the shape of the two-dimensional sensors is a diamond shape or a star shape, in addition, the shape of the two-dimensional sensors can be designed according to requirements, and the principle of the two-dimensional sensors cannot be influenced. The principle of the self-capacitance operation mode is that a capacitance is formed between the sensor and the power ground, the signal detection and processing module 3 drives a current on a pin connected to the sensor and measures a voltage, and if a finger is placed on the sensor, the measured capacitance increases, thereby recognizing the action of the touch key 221 a.

The signal detection and processing module 3 is a signal detection and processing chip.

Further, in some embodiments, the touch sensing module 2 may not include the one-dimensional output module 221, but only include the two-dimensional output modules 222.

Preferably, the touch keys 221a and the touch sliders 221b are arranged on the touch sensing top layer circuit 22; the touch panel includes:

a plurality of transmitting electrodes disposed on the touch sensing bottom layer line 23;

and a plurality of receiving electrodes disposed on the touch sensing top layer wire 22.

Specifically, the touch panel is a mutual capacitance panel, the transmitting electrode and the receiving electrode are configured as a mutual capacitance panel, and the principle of the mutual capacitance sensing technology is that the signal detection and processing module 3 measures the mutual capacitance between the transmitting electrode and the receiving electrode, and when a finger is placed between the transmitting electrode and the receiving electrode, the mutual capacitance is reduced, so that the action of the touch key 221a is recognized.

Further, the materials of the transmitting electrode and the receiving electrode are copper, PEDOT (a transparent conductive ink) and ITO (indium-tin oxide), and may also be carbon nanotube, graphene, nano silver wire and Metal-Mesh (Metal Mesh).

Preferably, the pressure sensing module 1 includes:

the first strain resistor R1 and the second strain resistor R2 are connected;

the third strain resistor R3 and the fourth strain resistor R4 are connected;

the first strain resistor R1 and the third strain resistor R3 can be connected with a power supply voltage, the second strain resistor R2 and the fourth strain resistor R4 are grounded, and the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 form a Wheatstone bridge.

Specifically, the other end of the first strain resistor R1 connected to the second strain resistor R2 can be connected to a supply voltage, and the other end of the third strain resistor R3 connected to the fourth strain resistor R4 can be connected to the supply voltage; the other end of the second strain resistor R2 connected with the first strain resistor R1 is grounded, and the other end of the fourth strain resistor R4 connected with the third strain resistor R3 is grounded. The first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are arranged on the substrate layer 21 in an array manner, and in this embodiment, the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are arranged on the substrate layer 21 in a rectangular array manner.

Furthermore, the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are pressure-induced strain resistors and are made of micro-strain ink materials through a printing process, the size, the thickness and relevant forming parameter indexes of the resistors are strictly controlled, and the consistency of the assembly is ensured; in this embodiment, the resistances of the first strain resistor R1, the second strain resistor R2, the third strain resistor R3, and the fourth strain resistor R4 are equal, the standard resistances are all 5000 ohms, and the maximum error is ± 5%.

Furthermore, the connected first strain resistor R1 and second strain resistor R2 are connected in series to form a left half bridge of a Wheatstone bridge, and the connected third strain resistor R3 and fourth strain resistor R4 are connected in series to form a right half bridge of the Wheatstone bridge; the first strain resistor R1 and the second strain resistor R2 are connected with a Vm-end together, and the third strain resistor R3 and the fourth strain resistor R4 are connected with a Vm + end together; the first strain resistor R1 and the third strain resistor R3 are connected with a VCC end together, and the second strain resistor R2 and the fourth strain resistor R4 are connected with a GND end together.

Further, in this embodiment, the number of the pressure sensing modules 1 is 4, and the 4 pressure sensing modules 1 are distributed in a rectangular array. The area of the pressure sensing module 1 is 2.2 × 7.0 mm.

The first strain resistor R1 and the fourth strain resistor R4 are opposite to each other, and the second strain resistor R2 and the third strain resistor R3 are opposite to each other, namely, a bridge arm A. When the substrate layer 21 is transversely pressed, bent and deformed, the deformation of the substrate is mainly transversely applied to the long sides of the first strain resistor R1 and the fourth strain resistor R4 to make them elongate and generate large deformation, and the deformation of the substrate layer 21 is applied to the short sides of the second strain resistor R2 and the third strain resistor R3 to make them generate small deformation or no deformation, so that the first strain resistor R1 and the fourth strain resistor R4, and the second strain resistor R2 and the third strain resistor R3 have different deformation quantities, and under the voltage action of the wheatstone bridge circuit, voltage difference output signals can be generated at the Vm + and Vm-two ends of the pressure sensing module 1.

Similarly, when the substrate layer 21 is longitudinally pressed, bent and deformed, the second strain resistor R2 and the third strain resistor R3 are deformed greatly, and the first strain resistor R1 and the fourth strain resistor R4 are deformed little, which also causes the wheatstone bridge to generate the voltage difference output signal.

When the single point of the PET substrate carrier plate is irregularly deformed under pressure, the induced strain resistors R1, R2, R3 and R4 are also deformed to different degrees respectively, so that the Wheatstone bridge generates voltage difference output signals.

In the embodiment, the standard resistance values of the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 are 5000 ohms, the allowable maximum error is 5%, and the error of 5% in actual production is the standard for ensuring good precision and low production cost, namely the maximum error is +/-250 ohms. The pressure sensing module 1 can be obtained by the working principle of a Wheatstone full bridge under the condition of no pressure state:

according to the formula, when the maximum values of R1 and R4 are +250 ohms and the minimum values of R2 and R3 are-250 ohms, the output signal value of the UO is maximum, and when the resistance values of the four resistors R1, R2, R3 and R4 are completely consistent, the minimum value of the output signal value of the UO is zero.

When the voltage E applied to two ends of the Wheatstone bridges VCC and GND is 3VDC, the value range of the UO output signal is 0-150 mV, and the UO is called as a bridge signal Baseline in a natural state. Since the area of the pressure sensing module 1 is very small, 2.2 × 7.0mm, the pressures applied to the strain resistors R1 and R4 of the opposite bridge arm a and the pressures applied to the strain resistors R2 and R3 of the opposite bridge arm B are almost equal, please refer to the layout of fig. 3, since the direction of the applied force is in the transverse direction, the deformation of the strain resistors R1 and R4 of the opposite bridge arm a is relatively large and the same, the resistance after deformation is (R + Δ R), and the deformation of the strain resistors R2 and R3 of the opposite bridge arm B is relatively small and can be ignored, so that the output formula of the wheatstone bridge signal can be simplified as follows:

that is, the size of the wheatstone bridge signal is in direct proportion to the increment of the resistance value of the strain resistor of the bridge arm with obvious deformation, so that the size of the pressure can be obtained through calculation.

Preferably, the signal detection and processing module 3 is disposed on the substrate layer 21.

In some embodiments, the signal detection and processing module 3 may not be disposed on the substrate layer 21, and only the connection relationship is required to be unchanged, and the signal detection and processing module 3 may be disposed at any position.

Preferably, the three-dimensional touch signal sensing module further includes:

a first protective layer 24 disposed above the substrate layer 21 and connected to the substrate layer 21, and capable of covering the touch sensing top layer wiring 22;

and a second protective layer 25 which is provided below the base material layer 21, is connected to the base material layer 21, and covers the touch sensor substrate line 23.

The first protective layer 24 and/or the second protective layer 25 can also cover the pressure sensing module 1.

Specifically, the first protective layer 24 and the second protective layer 25 are insulating materials, and function to cover the touch sensing top layer lines 22 and the touch sensing bottom layer lines 23, respectively, so as to prevent the touch sensing top layer lines 22 and the touch sensing bottom layer lines 23 from being oxidized or damaged by external force. In this embodiment, the first protective layer 24 and the second protective layer 25 are protective films and/or insulating UV inks.

Wherein the protective film can be polyethylene terephthalate film, polyimide film, polycarbonate film, polyvinyl chloride film, polyurethane film, polyvinyl chloride film; the touch sensing top layer lines 22 and the touch sensing bottom layer lines 23 are covered by a film covering process. The insulating UV printing ink is divided into two categories of transparent ink and non-transparent ink, and is used for a printing, UV and ultraviolet irradiation curing process.

In some embodiments, a first protective layer 24 is disposed over the substrate layer 21 and connected to the touch sensing top layer traces 22 and covers the touch sensing bottom layer traces 23; the second protection layer 25 is arranged below the substrate layer 21, connected with the touch sensing bottom layer and covering the touch sensing bottom layer circuit 23.

the three-dimensional touch signal sensing module of any of the above claims;

a user panel module 4 capable of covering the three-dimensional touch signal sensing module and having a plurality of physical touch positions for touching;

and an adhesion module 5 capable of adhering the user panel module 4 and the three-dimensional touch signal sensing module.

Specifically, the user panel module 4 is a cover plate of the three-dimensional touch signal sensing module, and the cover plate is used for providing physical materials for performing touch operations such as human fingers, touch pens or human hand-held metal bars, and also is used for forming a medium between the upper and lower electrodes of the sensing capacitor, so that the whole surface of the cover plate cannot be made of metal or conductive substances, a part of the area can contain metal or conductive substances, but the areas containing metal or conductive substances must be insulated, and further;

further, the entity touch bit is a conductive entity touch bit. The user panel module 4 further comprises a user panel, the entity touch position is arranged on the user panel, and the user panel is an insulating cover plate.

The conventional material of the insulating cover plate is glass, plastic, PET, PC, PMMA and the like, wood can be used, local metal can be used, and the insulating cover plate can also be a complex body formed by various materials, such as IMD plastic parts, double-color injection molding parts, metal inserts and the like. The insulating cover plate may be made into various shapes such as a plane, a convex, a curved or uneven thickness, etc., and various effect designs such as printing colors, 3D modeling, lighting effects, etc. may also be added to the insulating cover plate, without being limited thereto. The touch sensing function cannot be formed when a non-human body or a non-touch pen is contacted with the three-dimensional touch panel cover plate.

In addition, the adhesion module 5 is an adhesive material or a fixing screw, a hook structure, etc. and functions to adhere the user panel module 4 and the three-dimensional touch signal sensing module together. Conventional adhesive materials include solid/liquid double-sided tape, solid/liquid OCA optical tape, FFB heat transfer tape, and the like. The transparent lamination of OCA optical cement has no glue trace but higher cost, and the FFB heat transfer printing cement also has transparency and no trace but high lamination process. The actual application can be selected according to the characteristics of the adhesive material, cost and other factors, but is not limited to the characteristics.

Further, in this embodiment, the substrate layer 21 of the three-dimensional touch signal sensing module is a film substrate, that is, the three-dimensional touch signal sensing module is a flexible circuit of a film substrate, and is tightly attached to the user panel module 4 by using a solid OCA optical adhesive. If the three-dimensional touch signal sensing module is designed rigidly, such as a PCB, it can be adhered by fixing screws, hook structures, or by bonding materials.

Through the structural design, the three-dimensional touch panel gets rid of the use of the force-sensitive capacitor, and realizes the sensing detection of the pressure in the Z direction by combining the deformation of the substrate layer with the detection of the pressure sensing module 1; because a Wheatstone bridge is formed, slight deformation of the substrate layer can act on the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 of the pressure sensing module 1, and compared with a force sensitive capacitor, the pressure sensing module has the advantages of small detectable deformation displacement, large dynamic working range, capability of well solving errors caused by pre-pressing mechanical acting force, permission of resistance value errors of each strain resistor and suitability for large-scale mass production; meanwhile, the production process is simple and the cost is low; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved.

According to another aspect of the present invention, there is provided a three-dimensional touch method, including:

receiving a touch sensing signal acquired by a touch sensing module 2, wherein the touch sensing signal is a capacitance signal variation output by the touch sensing module 2;

receiving a pressing induction signal acquired by a pressure induction module 1, wherein the pressing induction signal is a voltage signal variable quantity output when the pressure induction module 1 is pressed;

acquiring two-dimensional coordinates of a touch point according to the touch sensing signal;

calculating a pressure value applied to the touch point according to the pressing sensing signal;

and integrating the two-dimensional coordinates of the touch point and the pressure value received by the touch point to generate a three-dimensional touch signal, wherein the three-dimensional touch signal is a three-dimensional coordinate.

Specifically, the three-dimensional coordinates may be (x, y, whether or not pressed), (x, y, pressure level), (x, y, pressure magnitude), or the like; the principle is that after the pressure value of the touch point is calculated, the touch point can adapt to three-dimensional coordinates of different scenes through subsequent processing.

In some embodiments, the pressure rating comprises: light press and heavy press.

Preferably, when acquiring the two-dimensional coordinates of the touch point according to the touch sensing signal, the method further includes:

judging whether the touch sensing signal is larger than a state transition threshold value, wherein the state transition threshold value is the minimum capacitance signal variation output by the touch sensing module 2 when the three-dimensional touch panel is confirmed to be touched by a set target;

if not, re-receiving the touch sensing signal acquired by the touch sensing module 2;

and if so, acquiring the two-dimensional coordinates of the touch point according to the touch sensing signal.

Specifically, the setting target in this embodiment is a finger.

Further, referring to fig. 5 to 6, the signal detection and processing module 3 includes a touch processing chip, mutual capacitances Cx,1 to Cx, n between each set of the transmitting electrodes and the receiving electrodes of the touch sensing module 2 are connected to different pins of the touch processing chip, and an internal circuit of the chip converts an analog quantity of each Cx into a digital quantity and stores the digital quantity for post-processing. When a finger does not touch the touch sensing module 2, the chip pin has a parasitic capacitance Cp, Cp is generated by coupling between the Sensor board Sensor, the trace, the via and other conductors in the module and the ground grid, Cp usually ranges from 6pF to 15pF, and Cx ═ Cp at this time. When a finger touches the touch sensing module 2, the human finger capacitance Cf is superimposed to Cx, where Cx is Cp + Cf, and Cf is usually in the range of 0.1pF to 0.4pF, and in some embodiments, the state transition threshold is a digital quantity corresponding to 0.1 pF. In addition, different state transition thresholds can be set according to the touch sensitivity requirement, and the smaller the value is, the more sensitive the value is in the range of 0.1pF-0.4 pF.

Referring to fig. 6, assuming that Cp is 10pF and Cf is 0.4pF, when a finger does not touch the touch sensing module 2, Cx Cp is 10pF, and the capacitance is calculated by the signal detection and processing module 3 to obtain stable Raw Count data 5920, i.e., a "touch OFF" state Baseline is 5920. When the finger touches the sensing module 2, Cx ═ Cp + Cf ═ 10pF +0.4pF ═ 10.4pF, and the signal detection and processing module 3 calculates to obtain stable new Raw Count data 6060, which is the "touch ON" state, then if the state transition threshold is the digital quantity corresponding to 0.1pF, the state transition threshold is Cx ═ Cp + Cf ═ 10pF +0.1pF ═ 10.1pF corresponding Raw Count data. And judging the touch state by comparing the Raw Count data.

Further, the touch Signal (new Raw Count) -base ═ 6060-.

Since the Finger touching the touch sensing module 2 causes Cx to increase to Cp + Cf, the state is stable, the Finger leaves the touch sensor and stably restores Cx to Cp, and further, the state transition Threshold may be corresponding to the touch Signal, a state transition Threshold value Finger Threshold is set, for example, 100, the touch Signal 140 is greater than the Threshold value Finger Threshold 100, the Signal processor determines that the sensor is in an ON (touch) state, otherwise, if the touch Signal is less than the Threshold value Finger Threshold Signal processor, the sensor is in an OFF (no touch) state. If the signal detection and processing module 3 detects two Cx1 and Cx2 simultaneously, two-dimensional touch coordinate output of (X, Y) can be realized.

Preferably, when the pressure value applied to the touch point is calculated according to the pressing sensing signal, the method further includes:

judging whether the pressing induction signal is larger than a pressure threshold value, wherein the pressure threshold value is the minimum voltage signal variation quantity output by the pressure induction module 1 when the three-dimensional touch panel is confirmed to be pressed by a set target;

if not, the press sensing signal obtained by the pressure sensing module 1 is received again;

and if so, calculating the pressure value of the touch point according to the pressing sensing signal.

Specifically, the setting target is a finger.

It should be noted that, during the process of assembling the pressure sensing module 1 to the substrate layer or attaching the pressure sensing module to the user panel, the first, second, third and fourth strain resistors R4 may be subjected to a certain pre-deformation force, which is referred to as a pre-stressed state. Under the pre-compression state, the resistances of the four strain resistors R1, R2, R3 and R4 are superposed with a certain pre-compression resistance value under the natural state, and according to the wheatstone full-bridge working principle explained above, the signal value obtained under the pre-compression state is called Uo1, and Uo is the output signal of the pressure sensing module 1 under the non-pressure state, and the signal difference value of (Uo 1-Uo) is called the compensation number Offset or the compensation signal.

That is, preferably, before receiving the pressing sensing signal obtained by the pressure sensing module 1, the method further includes:

receiving a voltage signal obtained when the pressure sensing module 1 is not pressed;

and calculating a compensation signal according to the voltage signal acquired when the pressing is not performed.

Further, when the pressure value applied to the touch point is calculated according to the press sensing signal, the method further includes:

and calculating the pressure value of the touch point according to the pressing induction signal and the compensation signal.

By the method, the problem of measurement errors caused by extrusion of the pressing induction module in the installation process is effectively solved.

The three-dimensional touch panel has a non-pressure state and a pressure state. The "no-pressure" state is the finished state of the touch panel with the pressure sensing module 1 attached, and includes the natural state and the pre-pressing state of the first, second, third and fourth strain resistors R4. The "pressed" state is the state when the touch panel is pressed by an external force.

Referring to fig. 7, when a transverse force is applied to make the touch panel in a "pressed" state, the stress on the long sides of the strain resistors R1 and R4 of the pressure sensing module 1 is further significantly elongated, and the deformation of the short sides of the strain resistors R2 and R4 due to stress on the short sides is negligible, so that the resistance values of the strain resistors R1 and R4 are usually increased to 20-50% of the standard resistance value R according to the material characteristics of the pressure sensing strain resistors and the magnitude of the force applied. Assuming that the resistance values of the strain resistors R1 and R4 are increased by 50%, i.e., Δ Rn is 2500 ohms in the "stressed" state of the embodiment, according to the wheatstone bridge signal output formula:

uo2 can be calculated to be 1.5V (1500mV) when the voltage E is 3VDC, which we call Signal.

The Signal, Offset compensation and Signal base line are input into the Signal detection and processing module 3, and through Signal amplification, analog/digital conversion and algorithm, two states of 'no pressure' and 'pressure' can be identified, and relevant control processing is performed.

That is, when determining whether the pressing sensing signal is greater than the pressure threshold, the method further includes:

if not, confirming that the three-dimensional touch panel is in a non-pressure state, and re-receiving the press induction signal acquired by the pressure induction module 1;

if yes, confirming that the three-dimensional touch panel is in a pressing state, and calculating a pressure value of the touch point according to the pressing induction signal.

Further, the pressure sensing module 1 outputs an analog signal to the AFE of the signal detection and processing module 3, the analog signal is converted into a digital signal by the ADC chip of the signal detection and processing module 3 after being amplified by the AFE, and the digital signal is sent to the ARM/DSP in the signal detection and processing module 3 for filtering, reconstruction algorithm and logic comparison processing.

Referring to fig. 7, in the present embodiment, when the touch panel is in the state of external force F being 0 and no pressure, the raw data read by the pressure sensing module 1 under natural conditions by the signal detection and processing module 3 is 500, and the initial Baseline of the pressure sensing module 1 is 500. The pressure sensing module 1 has Offset compensation under the pre-compression condition, at this time, the processor reads the RawData reading value 1050, (RawData-initial base) 1050-. That is, in the "no pressure" state a, Baseline is 1050, and Offset is 550.

Referring to fig. 7, when the three-dimensional touch panel is pressed by an external force F >0, the three-dimensional touch panel is in a "pressed" state, and since the deformation of the first, second, third, and fourth strain resistors R4 on the pressure sensing module 1 is significant, the RawData read by the processor is significantly increased to about 5100, and the reading increment, i.e., the pressing sensing Signal (RawData-base) (5100-1050) () 4050. When the external force is removed, F is equal to 0, the RawData read by the processor drops back to around Baseline 1050. Because the external force exists and can make the pressure-sensitive module 1 output the apparent Signal state steadily, and the external force removes the pressure-sensitive module 1 and can resume to the Baseline state steadily again, set up a Trigger Threshold such as 2500 ON the software logic of the processor, the pressure-sensitive Signal 4050 is greater than Trigger Threshold 2500, the Signal processor judges that the touch panel is in the ON (there is pressure) state, otherwise, if the pressure-sensitive Signal is less than Trigger Threshold, the processor judges that the touch panel is in the OFF (there is not pressure) state. Wherein the Trigger Threshold is the pressure Threshold.

Furthermore, the pressure signal processing system can judge the magnitude of the pressing force by detecting the coordinates of the touch points in advance and calibrating the pressure, and the use of Z-direction signals is further enriched. Three-dimensional touch panels are different in size, shape and pressing force point positions, and therefore two or more pressure sensing modules 1 are generally required to be used together to achieve the best effect.

Furthermore, the area of the pressure sensing module is 2.2 × 7.0mm, so that the first, second, third and fourth strain resistors R4 in the same wheatstone bridge can be located at close positions, and the change of environmental factors is also close at the close positions, so that the first, second, third and fourth strain resistors R4 in the wheatstone bridge can be simultaneously influenced by the environmental factors, and the resistance value is simultaneously increased or simultaneously decreased without influencing the change of voltage difference. Therefore, the design not only ensures that the strain sensing resistors of the bridge in the bridge have different deformation quantities, but also ensures that the change of environmental factors such as temperature, humidity, vibration, electromagnetic interference and the like has little influence on the strain sensing resistors, thereby solving the interference problem of the environmental factors.

In addition, in actual use, deformation of the base material layer 21 requires a certain time to recover, and in some cases, an operation gap of a user, for example, a contact point or the like, is shorter than a deformation recovery time; the existing method which does not deal with the deformation residue easily causes the problems of operation failure and the like which seriously affect the use experience.

Referring to fig. 7 again, when the problem of residual deformation is encountered, for example: after the first external force is removed, the new raw data read by the signal detection and processing module 3 is 950, which is not equal to 1050 before the external force is applied, because the deformation remains in the process of applying and removing the external force of the three-dimensional touch panel, which results in the pre-pressing state of the pressure sensing module 1 being changed, and at this time, the new Offset is 950-450. Then, the new "no-pressure" state B, base 950 and Offset 550, performs the next pressure-sensing recognition, and the recognition process is the same as the previous one, and is not described here again.

Here, since it is noted that the Offset signal Offset is Offset for the pre-compression, which is already determined when the assembly is completed, the Offset is constant in the subsequent calculation, and similarly, the initial Baseline of the pressure sensing module 1 is also constant.

Further, it is a continuously repeated step to receive the voltage signal obtained when the pressure sensing module 1 is not pressed, and when the external pressure is removed, the voltage signal obtained when the pressure sensing module 1 is not pressed is gradually increased, and the read RawData reading of the signal detection and processing module 3 is gradually increased; at this time, the next pressing occurs, the voltage signal obtained when the pressure sensing module 1 is not pressed is gradually reduced, and the read value of the RawData read by the corresponding signal detection and processing module 3 is also gradually reduced;

then, the deformation residue problem can be solved by only saving the maximum value in the gradually increasing RawData reading and taking the maximum value in the RawData reading as the new RawData.

That is to say, further, when receiving the pressing sensing signal obtained by the pressure sensing module 1, the method further includes:

acquiring a non-pressure signal, wherein the non-pressure signal is the last measured value of the pressure sensing module 1 before the measured value of the pressure sensing module 1 is reduced, namely the last measured value of the pressure sensing module 1 before the pressure sensing module 1 is pressed;

acquiring a pressure signal which is the minimum measured value of the pressure sensing module 1 after the measured value of the pressure sensing module 1 becomes smaller, namely, the minimum measured value of the pressure sensing module 1 when the pressure sensing module 1 is pressed;

judging whether the non-pressure signal is larger than the non-pressure signal obtained last time;

if yes, continuously acquiring a new non-pressure signal;

and if not, storing the last non-pressure signal, and calculating the pressing induction signal according to the pressure signal and the last non-pressure signal.

Wherein the pressing sensing signal is a difference value between the no-pressure signal and the pressure signal; it should be noted that the measured value becomes smaller with pressure and becomes larger without pressure.

Furthermore, the method solves the problem of identification errors caused by deformation residues in the processes of applying and removing the panel external force.

In addition, aiming at the condition that the resistance value of the resistor is influenced by the temperature, the three-dimensional touch panel also comprises a temperature identification meter, and the resistance value of the resistor contained in the three-dimensional touch panel at different temperatures is measured in advance; before use, the temperature recognizer collects the ambient temperature to obtain the resistance value of the resistor of the three-dimensional touch panel corresponding to the measured temperature, and various calculations are performed on the basis of the resistance value. The problem of touch identification errors caused by the fact that the resistance value of the resistor is affected by temperature can be solved.

When the three-dimensional touch panel is used, a finger is placed on the three-dimensional touch panel, and pressure within a certain range can be applied at the same time;

the signal detection and processing module 3 continuously receives the touch sensing signal obtained by the touch sensing module 2;

the signal detection and processing module 3 continuously receives the press induction signal obtained by the pressure induction module 1;

And integrating the two-dimensional coordinates of the touch point and the pressure value received by the touch point to generate three-dimensional coordinates.

When the signal detection and processing module 3 continuously receives the pressing sensing signal obtained by the pressure sensing module 1, a non-pressure signal is obtained, wherein the non-pressure signal is the last measured value of the pressure sensing module 1 before the measured value is reduced, namely the last measured value of the pressure sensing module 1 before the pressure sensing module 1 is pressed; acquiring a pressure signal which is the minimum measured value of the pressure sensing module 1 after the measured value of the pressure sensing module 1 becomes smaller, namely, the minimum measured value of the pressure sensing module 1 when the pressure sensing module 1 is pressed; judging whether the non-pressure signal is larger than the non-pressure signal obtained last time; if yes, continuously acquiring a new non-pressure signal; and if not, storing the last non-pressure signal, and calculating the pressing induction signal according to the pressure signal and the last non-pressure signal.

The structure of the utility model is reasonable and ingenious in design, and through the modularized design, the part for acquiring the press sensing signal is designed into the pressure sensing module 1, and the part for acquiring the touch sensing signal is designed into the touch sensing module 2; during assembly, the pressure sensing module 1 and the touch sensing module 2 are only needed to be spliced, and the pressure sensing module 1 and the touch sensing module 2 are connected to the signal detection and processing module 3, so that the problems of high difficulty in volume production, complex production process and high cost are solved; on the other hand, the problem of measurement errors caused by extrusion of the pressing induction module in the installation process is effectively solved; moreover, the force-sensitive capacitor is not used, and the deformation of the substrate layer is combined with the detection of the pressure sensing module 1, so that the sensing detection of the pressure in the Z direction is realized; because a Wheatstone bridge is formed, slight deformation of the substrate layer can act on the first strain resistor R1, the second strain resistor R2, the third strain resistor R3 and the fourth strain resistor R4 of the pressure sensing module 1, and compared with a force sensitive capacitor, the pressure sensing module has the advantages of small detectable deformation displacement, large dynamic working range, capability of well solving errors caused by pre-pressing mechanical acting force, permission of resistance value errors of each strain resistor and suitability for large-scale mass production; meanwhile, the production process is simple and the cost is low; the problems that the dynamic working range is small, the mass production difficulty is high, and the deformation residue in the process of applying and removing the panel external force is difficult to deal with the Z-direction input are solved.

Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment of the present invention.

The principle and the implementation mode of the utility model are explained by applying specific embodiments in the utility model, and the description of the embodiments is only used for helping to understand the method and the core idea of the utility model; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. A three-dimensional touch signal sensing module, comprising:

2. The three-dimensional touch signal sensing module according to claim 1, wherein the pressure sensing module is disposed on an upper end surface of the touch sensing module and/or a lower end surface of the touch sensing module and/or the touch sensing module.

3. The three-dimensional touch signal sensing module of claim 2, wherein the touch sensing module further comprises:

4. The three-dimensional touch signal sensing module according to claim 3, wherein the one-dimensional output module comprises a plurality of touch keys and a plurality of touch sliders, and the plurality of touch keys and the touch sliders are connected with the signal detection and processing module;

5. The three-dimensional touch signal sensing module according to claim 4, wherein the touch keys and the touch sliders are disposed on the touch sensing top layer circuit; the touch panel includes:

6. The three-dimensional touch signal sensing module of claim 3, wherein the pressure sensing module comprises:

the first strain resistor and the second strain resistor are connected;

the third strain resistor and the fourth strain resistor are connected;

7. The three-dimensional touch signal sensing module of claim 3, further comprising:

the second protective layer is arranged below the base material layer, connected with the base material layer and capable of covering the touch sensing bottom layer circuit;

8. A three-dimensional touch panel, comprising:

the three-dimensional touch signal sensing module of any of claims 1-7;

9. The three-dimensional touch panel according to claim 8, wherein the physical touch bits are conductive physical touch bits;

10. The three-dimensional touch panel according to claim 8, wherein the adhesive module is OCA optical adhesive.