CN216074080U - Electroplating cooling device with energy-saving and emission-reducing functions - Google Patents
Electroplating cooling device with energy-saving and emission-reducing functions Download PDFInfo
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- CN216074080U CN216074080U CN202122675779.5U CN202122675779U CN216074080U CN 216074080 U CN216074080 U CN 216074080U CN 202122675779 U CN202122675779 U CN 202122675779U CN 216074080 U CN216074080 U CN 216074080U
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Abstract
The utility model relates to an electroplating device field discloses an electroplating cooling device with energy saving and emission reduction function, it includes the support frame, the cooling casing of setting on the support frame, the setting is at the inside hot exchange pipe of cooling casing, the support frame sets up between electroplating pool and air pump, the inside coolant liquid that is full of cooling casing, hot exchange pipe one end and air pump exit end intercommunication, the other end and electroplating pool are inside, cooling casing below is provided with circulation coil, circulation coil's both ends and the inside intercommunication of cooling casing, be provided with circulating water pump in the middle of the circulating pipe. This application has the effect that reduces the electroplating solution temperature consumed the energy.
Description
Technical Field
The application relates to the field of electroplating equipment, in particular to an electroplating cooling device with energy-saving and emission-reducing functions.
Background
Electroplating is an indispensable process step in the production of many electronic components and devices. Electroplating is required in the production process of the PCB, and in order to make the plating solution uniform during the electroplating process, it is generally required to stir the plating solution. At present, the air pump is adopted to blow gas towards the electroplating solution, the gas is utilized to stir the electroplating solution, and the temperature of the gas generally blown out from the air pump can reach eighty ℃ to one hundred ℃.
In the process of implementing the application, the inventor finds that at least the following problems exist in the technology: utilize the gas that the air pump blew out to stir the plating solution, can make the temperature of plating solution rise along with gaseous conduction, because the temperature control of plating solution can guarantee the electroplating effect below thirty degrees centigrade, consequently need additionally to utilize cooling arrangement to cool off the plating solution, so need consume a large amount of energy.
SUMMERY OF THE UTILITY MODEL
In order to reduce the consumption of energy sources when reducing the temperature of electroplating solution, the application provides an electroplating cooling device with energy saving and emission reduction functions.
The application provides an electroplating cooling device with energy saving and emission reduction functions adopts the following technical scheme:
the utility model provides an electroplating cooling device with energy saving and emission reduction function, includes the support frame, sets up cooling shell on the support frame, sets up at the inside hot exchange pipe of cooling shell, the support frame sets up between electroplating pool and air pump, the inside coolant liquid that is full of cooling shell, hot exchange pipe's both ends are extended cooling shell, hot exchange pipe one end and air pump exit end intercommunication, the inside intercommunication of the other end and electroplating pool, cooling shell below is provided with circulation coil, circulation coil's both ends with the inside intercommunication of cooling shell, be provided with circulating water pump in the middle of the circulation coil.
Through adopting above-mentioned technical scheme, set up the cooling casing between electroplating pond and air pump, and be full of the coolant liquid inside cooling casing, utilize the heat of coolant liquid absorption heat exchange pipe, thereby reduce heat exchange pipe's temperature, when the high-temperature air that air pump exit end blew off is through heat exchange inside the pipe, can absorb the heat to the air through heat exchange pipe, finally reduce the air temperature who gets into electroplating pond, when coolant liquid temperature risees, utilize circulating water pump to make the coolant liquid constantly flow in circulating coil pipe inside, utilize the outside air to cool off circulating coil pipe, electroplating cooling device overall structure is simple, the energy consumption is low, compare and utilize cooling arrangement to cool off the plating solution, the consumption of reducible energy.
Optionally, a cooling fin is arranged inside the heat exchange tube, and the cooling fin includes a cooling tube core coaxially arranged with the heat exchange tube and a plurality of connecting pieces arranged between the cooling tube core and the heat exchange tube.
By adopting the technical scheme, the cooling fins are arranged in the heat exchange tubes, the contact area between the high-temperature air and the bottom-heating heat exchange tubes is increased by utilizing the cooling fins, and the cooling effect on the high-temperature air can be improved.
Optionally, the heat exchange tube is externally provided with a plurality of cooling fins arranged around the circumference of the heat exchange tube.
Through adopting above-mentioned technical scheme, set up a plurality of fin in hot exchange pipe outside, utilize the fin to increase the area of contact of hot exchange pipe and coolant liquid, make hot exchange pipe's heat transmit to the coolant liquid inside fast, promote hot exchange pipe's radiating effect.
Optionally, a plurality of heat dissipation holes are formed in the heat dissipation sheet.
By adopting the technical scheme, the contact area of the radiating fins and the cooling liquid is further increased by utilizing the radiating holes, so that the radiating effect of the radiating fins is better, and the radiating effect of the heat exchange tubes is improved.
Optionally, a plurality of heat exchange tubes are arranged in parallel, one end of each heat exchange tube close to the air pump is communicated with a manifold, and one end of each manifold close to the air pump is communicated with the outlet end of the air pump.
Through adopting above-mentioned technical scheme, utilize a plurality of hot exchange pipes to carry out the dispersed cooling with the high-temperature air of air pump output, can promote the cooling effect to high-temperature air.
Optionally, a cooling fan is disposed on one side of the circulating coil.
Through adopting above-mentioned technical scheme, utilize radiator fan to accelerate the peripheral air velocity of circulation coil for the inside thermal effluvium of circulation coil, thereby cool off the coolant liquid.
Optionally, a cover plate is arranged at the top of the cooling shell, one side of the cover plate is hinged to the cooling shell, and a connecting bolt is arranged on the other side of the cover plate and is in threaded connection with the cooling shell.
Through adopting above-mentioned technical scheme, utilize the apron that articulates on cooling housing, can open the apron as required, inspect cooling housing inside fast.
Optionally, an adding port is arranged on the cover plate, and an opening of the adding port is perpendicular to the cover plate.
Through adopting above-mentioned technical scheme, utilize to add mouthful to cooling casing inside adding the ice-cube, reduce the temperature of coolant liquid fast, the opening part that adds the mouth simultaneously is perpendicular with the apron, can reduce impurity and dust and fall into the inside possibility of cooling casing.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the cooling liquid is used for absorbing the heat of the heat exchange pipe, so that the temperature of the heat exchange pipe is reduced, when high-temperature air blown out from the outlet end of the air pump passes through the interior of the heat exchange pipe, the air passing through the heat exchange pipe can absorb heat, and finally the temperature of air entering the electroplating pool is reduced;
2. the cooling fins are arranged in the heat exchange tubes, and the contact area between the high-temperature air and the bottom-temperature heat exchange tubes is increased by utilizing the cooling fins, so that the cooling effect on the high-temperature air can be improved;
3. the heat exchange tubes are externally provided with the plurality of radiating fins, the contact area of the heat exchange tubes and the cooling liquid is increased by utilizing the radiating fins, so that the heat of the heat exchange tubes is quickly transferred to the inside of the cooling liquid, and the heat dissipation effect of the heat exchange tubes is improved.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.
Fig. 2 is a schematic diagram showing the installation position of the circulating water pump in the embodiment of the present application.
FIG. 3 is a front view of a heat exchange tube in the embodiment of the present application.
Fig. 4 is a sectional view taken along the line a-a in fig. 3.
Description of reference numerals:
01. an electroplating pool; 02. an air pump; 1. a support frame; 2. cooling the housing; 21. a cover plate; 211. a connecting bolt; 212. an addition port; 3. a heat exchange tube; 31. a manifold; 4. cooling the fins; 41. cooling the tube core; 42. connecting sheets; 5. a heat sink; 51. heat dissipation holes; 6. a circulating coil pipe; 7. a water circulating pump; 8. a heat dissipation fan.
Detailed Description
The present application is described in further detail below with reference to figures 1-4.
The embodiment of the application discloses an electroplating cooling device with energy-saving and emission-reducing functions. Referring to fig. 1, an electroplating cooling device with energy saving and emission reduction functions comprises a support frame 1, a cooling shell 2 and a heat exchange tube 3, wherein the support frame 1 is arranged between an electroplating pool 01 and an air pump 02, the support frame 1 is arranged on the ground, the cooling shell 2 is fixedly arranged on the support frame 1, and the cooling shell 2 is filled with cooling liquid. One end of the heat exchange tube 3 is communicated with the air outlet end of the air pump 02, the other end of the heat exchange tube is introduced into the electroplating pool 01, and the heat exchange tube 3 penetrates through the cooling shell 2.
Referring to fig. 1, heat exchange tube 3 is immersed in the coolant, the heat of heat exchange tube 3 is absorbed by the low-temperature coolant, and when the high-temperature air blown out from the outlet end of air pump 02 passes through the interior of heat exchange tube 3, the high-temperature air contacts with low-temperature heat exchange tube 3, so that the temperature of the air entering electroplating pool 01 is reduced, and the cooled air enters the interior of electroplating pool 01, so that the temperature inside electroplating pool 01 is kept in a proper range, and compared with the cooling of the electroplating solution by using professional cooling equipment, the consumption of energy can be reduced.
Referring to fig. 1 and 2, a plurality of heat exchange tubes 3 are arranged in parallel, three heat exchange tubes are taken as an example in the present embodiment, one end of each heat exchange tube 3 close to the air pump 02 is communicated with a manifold 31, and one side of the manifold 31 close to the air pump 02 is communicated with an outlet end of the air pump 02.
Referring to fig. 3 and 4, a cooling fin 4 is fixedly arranged inside each heat exchange tube 3, the cooling fin 4 comprises a cooling tube core 41 and a connecting sheet 42, the cooling tube core 41 and the heat exchange tubes 3 are coaxially arranged, and a plurality of connecting sheets 42 are fixedly arranged between the cooling tube core 41 and the heat exchange tubes 3.
Referring to fig. 2 and 3, a plurality of cooling fins 5 are fixedly arranged outside each heat exchange tube 3, the cooling fins 5 are located inside the cooling housing 2, the cooling fins 5 are arranged around the circumference of the heat exchange tubes 3, and each cooling fin 5 is further provided with a plurality of heat dissipation holes 51.
Referring to fig. 4, the contact area of the high-temperature air and the heat exchange tube 3 is increased by the cooling fins 4, so that the heat exchange tube 3 can absorb heat of the high-temperature air conveniently, the contact area of the cooling liquid and the heat exchange tube 3 is increased by the cooling fins 5, so that the cooling liquid can absorb heat of the heat exchange tube 3 conveniently, and the high-temperature air is further cooled.
Referring to fig. 1 and 2, in order to facilitate cooling of the coolant inside the cooling casing 2, a circulation coil 6 is disposed below the cooling casing 2, two ends of the circulation coil 6 are fixedly connected to the cooling casing 2, and two ends of the circulation coil 6 are communicated with the inside of the cooling casing 2. A circulating water pump 7 is arranged in the middle of the circulating coil 6, the circulating water pump 7 is arranged on the ground, a cooling fan 8 is arranged on one side of the circulating coil 6, and the cooling fan 8 is fixedly connected with the support frame 1.
Referring to fig. 1 and 2, when the temperature of the coolant rises, the circulation water pump 7 is operated, the coolant is continuously flowed inside the circulation coil 6 by the circulation water pump 7, and the cooling fan 8 is turned on to cool the circulation coil 6 by the external air.
Referring to fig. 1, a cover plate 21 is arranged at the top of the cooling housing 2, one side of the cover plate 21 is hinged to the cooling housing 2, the other side of the cover plate 21 is in threaded connection with a connecting bolt 211, and the connecting bolt 211 penetrates through the cover plate 21 to be in threaded connection with the cooling housing 2, so that the cover plate 21 can be conveniently opened, and the interior of the cooling housing 2 can be maintained.
Referring to fig. 1, an addition port 212 is further formed in the cover plate 21, and an opening of the addition port 212 is perpendicular to the cover plate 21, so that ice cubes can be added into the cooling housing 2 through the addition port 212, thereby rapidly reducing the temperature of the cooling liquid.
The implementation principle of the electroplating cooling device with the energy-saving and emission-reducing functions in the embodiment of the application is as follows: when high-temperature air blown out from the outlet end of the air pump 02 passes through the heat exchange tube 3, the heat exchange tube 3 immersed in the cooling liquid is used for absorbing heat in the air and transferring the heat to the cooling liquid, so that the high-temperature air is cooled.
When coolant temperature rose, utilize circulating water pump 7 to make the coolant liquid constantly flow in circulating coil 6 inside, radiator fan 8 work simultaneously cools off circulating coil 6, makes the temperature of coolant liquid be difficult for rising, still can add the ice-cube through adding mouth 212, the temperature of quick reduction coolant liquid.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. The utility model provides an electroplating cooling device with energy saving and emission reduction function which characterized in that: including support frame (1), cooling casing (2), the setting on support frame (1), set up at cooling casing (2) inside hot exchange pipe (3), support frame (1) sets up between electroplating pond (01) and air pump (02), cooling casing (2) inside is full of the coolant liquid, the both ends of hot exchange pipe (3) are extended cooling casing (2), hot exchange pipe (3) one end and air pump (02) exit end intercommunication, the other end and electroplating pond (01) inside intercommunication, cooling casing (2) below is provided with circulating coil (6), the both ends of circulating coil (6) with cooling casing (2) inside intercommunication, be provided with circulating water pump (7) in the middle of circulating coil (6).
2. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 1, wherein: the cooling fin (4) is arranged in the heat exchange tube (3), and the cooling fin (4) comprises a cooling tube core (41) which is coaxial with the heat exchange tube (3) and a plurality of connecting pieces (42) which are arranged between the cooling tube core (41) and the heat exchange tube (3).
3. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 1, wherein: the heat exchange tube (3) is externally provided with a plurality of radiating fins (5), and the radiating fins (5) are arranged around the heat exchange tube (3) in the circumferential direction.
4. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 3, wherein: the radiating fin (5) is provided with a plurality of radiating holes (51).
5. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 1, wherein: the heat exchange tubes (3) are arranged in parallel, one ends of the heat exchange tubes (3) close to the air pump (02) are communicated with a manifold (31), and one ends of the manifold (31) close to the air pump (02) are communicated with the outlet end of the air pump (02).
6. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 1, wherein: and a cooling fan (8) is arranged on one side of the circulating coil (6).
7. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 1, wherein: the top of cooling casing (2) is provided with apron (21), one side of apron (21) with cooling casing (2) are articulated, and the opposite side is provided with connecting bolt (211), connecting bolt (211) with cooling casing (2) threaded connection.
8. The electroplating cooling device with the energy-saving and emission-reducing functions as claimed in claim 7, wherein: an adding port (212) is formed in the cover plate (21), and an opening of the adding port (212) is perpendicular to the cover plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675779.5U CN216074080U (en) | 2021-11-03 | 2021-11-03 | Electroplating cooling device with energy-saving and emission-reducing functions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675779.5U CN216074080U (en) | 2021-11-03 | 2021-11-03 | Electroplating cooling device with energy-saving and emission-reducing functions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216074080U true CN216074080U (en) | 2022-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122675779.5U Active CN216074080U (en) | 2021-11-03 | 2021-11-03 | Electroplating cooling device with energy-saving and emission-reducing functions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216074080U (en) |
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2021
- 2021-11-03 CN CN202122675779.5U patent/CN216074080U/en active Active
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