CN216071947U

CN216071947U - Balance device for producing MCU and DSP high-end integrated circuit chips

Info

Publication number: CN216071947U
Application number: CN202122060066.8U
Authority: CN
Inventors: 李明正; 刘祝良
Original assignee: Anhui Xinchi Electronic Technology Co ltd
Current assignee: Anhui Xinchi Electronic Technology Co ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-03-18
Anticipated expiration: 2031-08-30

Abstract

The utility model discloses a wobble plate device for producing MCU (microprogrammed control Unit) and DSP (digital signal processor) high-end integrated circuit chips, which relates to the field of high-end integrated circuit chip production and comprises a wobble plate machine and a chip carrier plate, wherein the wobble plate machine comprises a base, a vibration platform is arranged above the base, the vibration platform is provided with a through hole, the base is provided with an upright post, the upright post penetrates through the through hole and is arranged in a gap with the through hole, the top end of the upright post is provided with a limiting block, the upright post is connected with a first spring in a winding manner, the vibration platform is provided with a vibration motor, the vibration platform is provided with a first surrounding frame, a limiting plate is arranged in the first surrounding frame, the limiting plate is connected with one side edge of the first surrounding frame through a plurality of second springs, the chip carrier plate comprises a bottom plate, the bottom plate is provided with a second surrounding frame, the center position is provided with chip carrier holes arranged in an array manner, the bottoms of the chip carrier holes are provided with air holes, and the upper surface of the second surrounding frame is provided with an air suction pump joint connected with the air holes. The utility model can solve the problems that the existing swinging plate device has low swinging plate efficiency and can not meet the requirement of modern production.

Description

Balance device for producing MCU and DSP high-end integrated circuit chips

Technical Field

The utility model relates to the field of high-end integrated circuit chip production, in particular to a wobble plate device for producing MCU and DSP high-end integrated circuit chips.

Background

When high-end integrated circuit chips such as MCU and DSP are produced, the chips are frequently required to be placed, and then the chips are grabbed one by a manipulator matched with a sucker to be detected or other procedures are carried out.

At present, there are two ways to balance the chip. One is to manually pick up the chips one by one and place the chips in the chip carrying holes of the chip carrying tray. This wobble plate approach is extremely inefficient. The other method is that a large number of chips are placed on the chip carrying tray, then the chip carrying tray body is shaken by an operator, so that the chips are slowly dispersed on the chip carrying tray and fall into the chip carrying holes of the chip carrying tray, then the chip carrying tray is inclined, the chips which do not fall into the chip carrying holes on the chip carrying tray slide off from the chip carrying tray, and only the chips in the chip carrying holes are reserved on the chip carrying tray. The defect of the wobble plate mode is that it takes several minutes for an operator to shake the carrier plate manually, the shaking efficiency is low, and when the operator tilts the chip carrier plate, because the depth of the chip carrying hole is 1.2-1.3 times of the thickness of the chip, a small number of chips can be separated from the chip carrying hole, the operator needs to use the first wobble plate mode to refill the chip carrying hole from which the chip is separated manually, and the wobble plate efficiency is higher than that of the first wobble plate mode, but the wobble plate efficiency still cannot meet the requirement of modern production.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem of providing a wobble plate device for producing MCU and DSP high-end integrated circuit chips, and solving the problems that the existing wobble plate device has low wobble plate efficiency and cannot meet the requirements of modern production.

The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides a set device is used in production of MCU and DSP high-end integrated circuit chip, carries the dish including set machine and chip, set machine includes the base, base top clearance sets up vibration platform, vibration platform's four apex angle departments set up the through-hole, the base upper surface sets up the stand in the position that corresponds with the through-hole, the stand passes corresponding through-hole and sets up with the through-hole clearance, and the top of stand sets up the stopper, the periphery of stand part between base and vibration platform is around connecing first spring, vibration platform's lower surface sets up vibrating motor, the vibration platform upper surface sets up the first frame that encloses of rectangle, set up the limiting plate in the first frame that encloses, the limiting plate with a side of first frame is through a plurality of second spring coupling, the chip carries the dish to include the bottom plate of rectangle, bottom plate upper surface periphery sets up the second and encloses the frame, Chip carrying holes arranged in an array mode are arranged in the center, the depth of each chip carrying hole is 1.2-1.3 times of the thickness of the corresponding chip, air holes are formed in the bottoms of the chip carrying holes, and air suction pump connectors connected with the air holes are arranged on the upper surface of the second enclosing frame.

Further, the number of the second springs is five.

Further, a limiting plate handle is arranged on the upper surface of the limiting plate.

Furthermore, the second encloses frame upper surface symmetry and sets up two second and encloses frame handles.

The utility model has the following beneficial effects:

when the chip tray placing device places the chips, an operator compresses the second spring through the limiting plate, puts the chip tray into the first enclosing frame, loosens the second spring, and limits the chip tray by the limiting plate, then the operator or a mechanical arm places a large number of chips on the chip tray, starts the vibration motor, the large number of chips are quickly dispersed and fall into the chip carrying holes of the chip tray under the vibration action of the vibration motor, at the moment, the operator closes the vibration motor, takes out the chip tray, connects the suction pump joint with the suction pump, and the suction pump sucks air to form negative pressure at the chip carrying holes, the chips in the chip carrying holes are fixed in the chip carrying holes by the negative pressure, and the operator inclines or inverts the chip tray to enable the chips which do not fall into the chip carrying holes on the chip tray to fall into the collecting basket. Because vibrating motor's shake efficiency compares and shakes greatly with the manpower and improves, this kind of balance mode balance efficiency improves greatly, simultaneously, because chip year hole department forms the negative pressure, operating personnel can not have the chip to deviate from the chip year hole when inclining or inverting chip year dish.

Drawings

FIG. 1 is a front view of a wobble plate machine;

FIG. 2 is a top view of the chip tray disposed within the first enclosure;

FIG. 3 is a top view of a chip carrier hole.

Detailed Description

Example 1:

as shown in fig. 1-3, a wobble plate device for producing MCU and DSP high-end integrated circuit chips comprises a wobble plate machine 1 and a chip carrier 2, wherein the wobble plate machine 1 comprises a base 11, a vibration platform 12 is disposed at a gap above the base 11, through holes 121 are disposed at four corners of the vibration platform 12, a stand column 13 is disposed on the upper surface of the base 11 at a position corresponding to the through holes 121, the stand column 13 passes through the corresponding through holes 121 and is disposed at a gap with the through holes 121, a limit block 131 is disposed at the top end of the stand column 13, a first spring 132 is disposed around the periphery of the part of the stand column 13 between the base 11 and the vibration platform 12, a vibration motor 14 is disposed on the lower surface of the vibration platform 12, a rectangular first surrounding frame 122 is disposed on the upper surface of the vibration platform 12, a limit plate 123 is disposed in the first surrounding frame 122, the limit plate 123 is connected with one side of the first surrounding frame 122 through a plurality of second springs 124, the chip carrying disc 2 comprises a rectangular bottom plate 21, a second enclosing frame 22 is arranged on the periphery of the upper surface of the bottom plate 21, chip carrying holes 24 which are arranged in an array mode are arranged in the center of the bottom plate, the depth of each chip carrying hole 24 is 1.2-1.3 times of the thickness of a corresponding chip, air holes 25 are formed in the bottoms of the chip carrying holes 24, and air suction pump connectors 26 connected with the air holes 25 are arranged on the upper surface of the second enclosing frame 22.

The vibration motor 14 is operated to vibrate the vibration platform 12.

The through hole 121 and the upright 13 are arranged at a gap for providing a limit in the horizontal direction when the vibration platform 12 vibrates.

The first springs 132 are used to support the vibration table 12 while providing a vertical lower limit for the vibration table 12.

The limiting block 131 provides an upper limit in the vertical direction for the vibration platform 12.

The limiting plate 123 is used in cooperation with the first surrounding frame 122 and the second spring 124 to limit and fix the chip tray 2.

The second enclosure 22 is used to prevent the chips on the chip tray 2 that do not fall into the chip loading holes 24 from sliding off the bottom plate 21 to the ground during the process of taking out the chip tray.

The depth of the chip carrier hole 24 is 1.2-1.3 times the thickness of the corresponding chip, so that the chip which has entered the chip carrier hole can be prevented from being released from the chip carrier hole during vibration.

When the chip tray placing device places the chips, an operator compresses the second spring through the limiting plate, puts the chip tray into the first enclosing frame, loosens the second spring, and limits the chip tray by the limiting plate, then the operator or a mechanical arm places a large number of chips on the chip tray, starts the vibration motor, the large number of chips are quickly dispersed and fall into the chip carrying holes of the chip tray under the vibration action of the vibration motor, at the moment, the operator closes the vibration motor, takes out the chip tray, connects the air suction pump joint with the air suction pump, and sucks air by the air suction pump to form negative pressure at the chip carrying holes, the chips in the chip carrying holes are fixed in the chip carrying holes by the negative pressure, and the operator inclines or inverts the chip tray to enable the chips which do not fall into the chip carrying holes on the chip tray to fall. Because vibrating motor's shake efficiency compares and shakes greatly with the manpower and improves, this kind of balance mode balance efficiency improves greatly, simultaneously, because chip year hole department forms the negative pressure, operating personnel can not have the chip to deviate from the chip year hole when inclining or inverting chip year dish.

The number of the second springs 124 is five.

And a limiting plate handle 1231 is arranged on the upper surface of the limiting plate 123.

Two second enclosing frame handles 23 are symmetrically arranged on the upper surface of the second enclosing frame 22.

The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in any way, and those skilled in the art can make various changes and modifications to the equivalent embodiments without departing from the scope of the present invention, and all such changes, modifications, equivalents and improvements that can be made to the above embodiments without departing from the technical spirit of the present invention are within the spirit and principle of the present invention.

Claims

1. The wobble plate device for producing the MCU and DSP high-end integrated circuit chip is characterized by comprising a wobble plate machine (1) and a chip carrying plate (2), wherein the wobble plate machine (1) comprises a base (11), a vibration platform (12) is arranged above the base (11) in a clearance mode, through holes (121) are formed in four top corners of the vibration platform (12), stand columns (13) are arranged on the upper surface of the base (11) in positions corresponding to the through holes (121), the stand columns (13) penetrate through the corresponding through holes (121) and are arranged in a clearance mode with the through holes (121), limit blocks (131) are arranged at the top ends of the stand columns (13), first springs (132) are wound on the peripheries of the parts, between the base (11) and the vibration platform (12), vibration motors (14) are arranged on the lower surface of the vibration platform (12), first rectangular surrounding frames (122) are arranged on the upper surface of the vibration platform (12), set up limiting plate (123) in first enclosing frame (122), limiting plate (123) with a side that first encloses frame (122) is connected through a plurality of second springs (124), chip year dish (2) are including bottom plate (21) of rectangle, bottom plate (21) upper surface periphery sets up the second and encloses frame (22), central point and puts chip year hole (24) that set up the array and arrange, the degree of depth of chip year hole (24) is 1.2-1.3 times of the thickness that corresponds the chip, and the bottom of chip year hole (24) sets up gas pocket (25), the second encloses frame (22) upper surface and sets up aspiration pump joint (26) of being connected with gas pocket (25).

2. The wobble plate apparatus for producing MCU and DSP high-end integrated circuit chips according to claim 1, characterized in that the number of the second springs (124) is five.

3. The wobble plate device for producing the MCU and DSP high-end integrated circuit chip as claimed in claim 1, wherein the upper surface of the limiting plate (123) is provided with a limiting plate handle (1231).

4. The wobble plate device for producing the MCU and DSP high-end integrated circuit chip according to claim 1, wherein two second surrounding frame handles (23) are symmetrically arranged on the upper surface of the second surrounding frame (22).