CN216057224U - Improved camera system and medical camera device with same - Google Patents
Improved camera system and medical camera device with same Download PDFInfo
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- CN216057224U CN216057224U CN202122705819.6U CN202122705819U CN216057224U CN 216057224 U CN216057224 U CN 216057224U CN 202122705819 U CN202122705819 U CN 202122705819U CN 216057224 U CN216057224 U CN 216057224U
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Abstract
The utility model belongs to the technical field of the video image processing technique and specifically relates to a medical camera device that modified camera system and have this system is related to, including image sensor, SDI signal generation mainboard, image signal processing mainboard and coaxial line, SDI signal generation mainboard includes first SDI signal processing module and second SDI signal processing module, and image signal processing mainboard includes SDI signal reception concatenation module, CPU signal processor and display driver module, this application beneficial effect: the camera system of this application divides into the image that image sensor sensed into the processing of many copies through improving SDI signal generation mainboard, and the image signal that will handle the acquisition transmits the display that the image signal processing mainboard transported the external world again, has improved the ability of handling the image, has promoted medical camera device's imaging effect.
Description
Technical Field
The present application relates to the field of video image processing technologies, and in particular, to an improved imaging system and a medical imaging apparatus having the same.
Background
The medical endoscope is a medical appliance which is frequently used in medicine, the endoscope camera is provided with a part which extends into a human body, the extended part enters the human body through a natural pore canal or an operation incision of the human body and is used for observing internal organs of the human body, and pictures shot by the extended part are processed by the camera system and are displayed on the display in real time and used for medical detection and operation observation.
In the existing medical endoscope used in the operation process, the generated image effect is poor due to poor image effect generated by the medical endoscope, the image quality is unclear, the judgment of an operator is possibly influenced, and the operation difficulty is increased due to misjudgment of the disease condition caused by the image, so that the image generation capability of the related technology needs to be improved.
SUMMERY OF THE UTILITY MODEL
In order to improve the image effect generated by the related art, the application provides an improved camera system.
The technical scheme is as follows:
in a first aspect, the present application provides an improved imaging system comprising:
an image sensor, an SDI signal generating main board, an image signal processing main board and a coaxial line,
the SDI signal generating main board comprises a first SDI signal processing module and a second SDI signal processing module,
the image sensor is respectively connected with the first SDI signal processing module and the second SDI signal processing module;
the image signal processing main board comprises an SDI signal receiving and splicing module, a CPU signal processor and a display driving module,
the first SDI signal processing module is connected with the SDI signal receiving and splicing module through a coaxial line, the second SDI signal processing module is connected with the SDI signal receiving and splicing module through a coaxial line,
the SDI signal receiving and splicing module is connected with the CPU signal processor, and the CPU signal processor is connected with the display driving module.
By adopting the scheme, after the image sensor is stretched into the designated area, the image sensor generates a light image by utilizing the sensitization effect and converts the light image into initial image information in a corresponding proportional relation with the light image, so that the function of acquiring the initial image is realized. The image sensor conveys initial image information to a first SDI signal processing module and a second SDI signal processing module, the first SDI signal processing module performs image processing on a half area of the initial image information to form first 4K resolution image quality half-screen SDI image information, the second SDI signal processing module performs image processing on the other half area of the initial image information to form second 4K resolution image quality half-screen SDI image information, and the function of improving image picture quality is achieved. After image processing accomplished, first SDI signal processing module carries first half screen SDI image information to SDI signal reception concatenation module through the coaxial line, and second SDI signal processing module carries second half screen SDI image information to SDI signal reception concatenation module through the coaxial line, utilizes the coaxial line to play the effect of simplifying cable quantity, reducing the attenuation on the line, reaches the effect of exempting from the compression to carry, helps preventing the effect of image information distortion. And the SDI signal receiving and splicing module splices the first half-screen SDI image information and the second half-screen SDI image information into 60-frame running high-definition image information with 4K resolution. The effect of enhancing the image quality is achieved.
The SDI signal receiving and splicing module sends 4K resolution image quality and 60-frame running high-definition image information to the CPU signal processor, and after the CPU signal processor is connected with an external display through the display driving module, the effect that 60-frame high-definition images of the 4K resolution image quality are sent to the external display to be displayed can be achieved, and the quality of generated images is integrally improved.
Optionally, the first SDI signal processing module includes a first parallel operation sub-module and a first SDI signal output sub-module, the first parallel operation sub-module includes at least 2 first ISP processing chips, and the image sensor is connected to the first SDI signal output sub-module through the at least 2 first ISP processing chips, respectively.
By adopting the scheme, after the first SDI signal processing module receives the initial image information, 2 first ISP processing chips respectively perform parallel operation processing on one-half area in the initial image information, and the effect of improving the image quality of 4K resolution is realized. And then, the image information processed by the 2 first ISP processing chips is subjected to synthesis processing by the first SDI signal output submodule to form first half-screen SDI image information.
Optionally, the second SDI signal processing module includes a second parallel operator module and a second SDI image conversion sub-module, the second parallel operator module includes at least 2 second ISP processing chips, and the image sensor is connected to the second SDI signal output sub-module through the second ISP processing chips.
By adopting the scheme, after the second SDI signal processing module receives the image information of the chef, 2 second ISP processing chips respectively perform parallel operation processing on one half area in the initial image information, and the effect of improving the image quality of 4K resolution is achieved. And then, the image information processed by the 2 second ISP processing chips is synthesized by the second SDI signal output sub-module to form second half-screen SDI image information.
Optionally, the image signal processing main board further comprises a communication module and an input component, and the input component is connected with the CPU signal processor through the communication module.
By adopting the scheme, the input component is connected with the communication module, after an operator uses the input component to send a control signal to the communication module, the CPU signal processor receives the control signal and executes corresponding action according to the control signal, and the control function is conveniently realized by the operator.
Optionally, the image signal processing main board further includes a storage module, and the storage module is connected with the CPU signal processor.
By adopting the scheme, the CPU signal processor processes the complete video signal from the SDI signal receiving and splicing module, and the final signal obtained by processing is transmitted to the storage module for storage, so that the data storage is realized.
Optionally, the camera system further includes a heat dissipation driving module and a heat sink, and the CPU signal processor is connected to the heat sink through the heat dissipation driving module.
By adopting the scheme, the CPU signal processor sends the starting signal to the heat dissipation driving module when working, and the heat dissipation driving module drives the radiator to act, so that the effect of cooling the image signal processing mainboard is achieved.
Optionally, the image signal processing motherboard further comprises a power supply voltage conversion module, and the SDI signal receiving and splicing module, the CPU signal processor, the display drive module, the storage module, the communication module, the heat dissipation drive module and the heat sink are all connected with the power supply voltage conversion module.
By adopting the scheme, the power supply voltage conversion module converts the voltage input from the outside into the voltage value suitable for each device module, and then supplies power to each device module, thereby realizing the effect of providing suitable voltage for each device module.
In a second aspect, the present application provides a medical imaging device with an improved imaging system of any of the above aspects, comprising an endoscope camera, an operating handle and a main machine housing,
the image sensor is installed in the endoscope camera, the SDI signal generation mainboard is installed in the operating handle, and the image signal processing mainboard is installed in the mainboard shell.
Through adopting above-mentioned scheme, operating personnel holds operating handle, stretch into the position of treating the observation with the endoscope camera, image sensor will catch initial picture information, it carries out the processing of information to transmit initial picture information to SDI signal generation mainboard, the SDI image information that obtains of processing transmits the image signal processing mainboard through the coaxial line and carries out the concatenation processing, the image signal processing mainboard is installed in the mainboard casing, play the effect of protection image signal processing mainboard, the image signal that the concatenation obtained shows through image signal processing mainboard transmission to outside display, whole reached treat the observation position and carried out the video collection of image and externally output and be used for the effect that shows.
Optionally, the host casing is provided with a heat dissipation through hole.
By adopting the scheme, when the radiator works, hot air generated by the image signal processing mainboard is discharged to the outside of the mainboard shell from the radiating through hole, and the radiating effect is achieved.
In summary, the present application includes at least one of the following beneficial technical effects: the image sensor converts a shot analog signal into digital initial image information, the initial image information is divided into two pieces of information according to a half-screen display area, one piece of information is transmitted to the first SDI signal processing module to be subjected to image processing to form first half-screen SDI graphic information of 4K resolution image quality, and the other piece of information is transmitted to the second SDI signal processing module to be subjected to image processing to form second half-screen SDI graphic information of 4K resolution image quality. The processed two half-screen SDI image information are transmitted to the SDI signal receiving and splicing module through the coaxial line to be subjected to image splicing processing, so that the transmission is ensured not to be distorted, the splicing processing of the images is ensured to be completed, and the image information with 4K resolution and 60-frame running high-definition image information is obtained. The SDI signal receiving and splicing module sends the high-definition image information with 4K resolution and 60 frames of operation to the CPU signal processor, and the CPU signal processor utilizes the display driving module to enable the image quality with 4K resolution and the high-definition image information with 60 frames of operation to be displayed on an external display, so that the capability of processing images is improved, and the imaging effect of the medical camera device is improved.
Drawings
Fig. 1 is a block diagram of an improved image capturing system according to embodiment 1 of the present application.
Fig. 2 is a block diagram of an internal component of the first SDI signal processing module according to embodiment 1 of the present application.
Fig. 3 is a block diagram of an internal component of the second SDI signal processing module according to embodiment 1 of the present application.
Fig. 4 is a block diagram of an improved imaging system according to embodiment 1 of the present application, including a communication module and an input device.
Fig. 5 is a block diagram of an improved image capturing system with the storage module according to embodiment 1 of the present application.
Fig. 6 is a block diagram of an improved image capturing system according to embodiment 1 of the present application, which includes the heat dissipation module and the heat sink.
Fig. 7 is a block diagram of an improved image capturing system according to embodiment 1 of the present application, including the power supply voltage conversion module.
Fig. 8 is a schematic structural diagram of a medical device with the system according to embodiment 2 of the present application.
Fig. 9 is a schematic structural diagram of the host housing according to embodiment 2 of the present application.
Fig. 10 is a schematic diagram of the CMOS sensor according to embodiment 1 of the present application.
Description of reference numerals:
1. an image sensor; 2. an SDI signal generating main board; 21. a first SDI signal processing module; 211. a first parallel operation sub-module; 2111. a first ISP processing chip; 2112. a second ISP processing chip; 212. a first SDI signal output submodule; 22. a second SDI signal processing module; 221. a second parallel operation submodule; 2211. a third ISP processing chip; 2212. a fourth ISP processing chip; 222. a second SDI signal output submodule; 3. an image signal processing main board; 31. an SDI signal receiving and splicing module; 32. a CPU signal processor; 33. a display driving module; 34. inputting a component; 35. a communication module; 36. a storage module; 37. a power supply voltage conversion module; 4. a coaxial line; 51. a heat dissipation driving module; 52. a heat sink; 6. a main housing; 7. an endoscope camera; 8. an operating handle; 9. and the heat dissipation through hole.
Detailed Description
The present application is described in further detail below with reference to figures 1-10.
Example 1:
the embodiment of the application discloses an improved camera system, refer to fig. 1, including: an image sensor 1, an SDI signal generation main board 2, an image signal processing main board 3, and a coaxial line 4, the SDI signal generation main board 2 including a first SDI signal processing module 21 and a second SDI signal processing module 22,
the image sensor 1 is respectively connected with a first SDI signal processing module 21 and a second SDI signal processing module 22;
the image signal processing main board 3 includes an SDI signal receiving mosaic module 31, a CPU signal processor 32 and a display drive module 33,
the first SDI signal processing module 21 is connected with the SDI signal receiving and splicing module 31 through the coaxial line 4, the second SDI signal processing module 22 is connected with the SDI signal receiving and splicing module 31 through the coaxial line 4,
the SDI signal receiving and splicing module 31 is connected with the CPU signal processor 32, and the CPU signal processor 32 is connected with the display driving module 33.
The image sensor 1 specifically adopts a CMOS image sensor, the model of the adopted CMOS image sensor may be an IMX334 model, a schematic diagram of the CMOS image sensor is shown in fig. 10, the image sensor 1 extends into an area to be observed, the image sensor 1 converts a shot picture into initial image information in a corresponding proportional relationship with a light image through an internal sensitization, the obtained image picture is divided into two parts, which are respectively transmitted to a first SDI signal processing module 21 and a second SDI signal processing module 22 for processing, wherein the SDI is fully called a Serial Digital Interface, the whole text is a Digital component Serial Interface, the first SDI signal processing module 21 processes and encodes and converts an image signal into an image signal of a Digital signal to form first half-screen SDI image information, the second SDI signal processing module 22 processes and encodes and converts an image signal into an image signal of a Digital signal, forming a second half screen SDI image information, respectively transmitting two image information to an SDI signal receiving and splicing module 31 by adopting a coaxial line 4 of 75 omega, wherein 75 omega means that the characteristic impedance of the cable is 75 omega, the transmission loss is minimum at this time, the coaxial line 4 is adopted for connection, the number of the cable can be simplified, the attenuation on the cable can be reduced, the effect of compression-free transmission is achieved, and the distortion of the image information is favorably prevented, the two image information are spliced after the image information is received by the SDI signal receiving and splicing module 31, the SDI signal receiving and splicing module 31 can adopt EN334S model, the SDI signal receiving and splicing module can also adopt LMH0376 model, the SDI signal receiving and splicing module 31 can be spliced to obtain image information with 4K resolution of 60 frames running, the 4K resolution is specifically 4096 x 2160 pixels, decoding operation is carried out on the image information, and the image information is transmitted to a CPU signal processor 32, the CPU signal processor 32 may adopt a HI3531 model, and the CPU signal processor 32 is communicated with an external display through the display driving module 33, and transmits processed image signals with a resolution of 4K and running for 60 frames to an external display for displaying images sensed by the image sensor 1 in real time.
Alternatively, the first SDI signal processing module 21 may encode and convert the processed image signal into an image signal of a digital signal, and then concatenate the image signal into a top half image signal.
The second SDI signal processing module 22 may further encode and convert the processed image signal into an image signal of a digital signal, and then splice the image signal into a lower half image signal.
Referring to fig. 2, the first SDI signal processing module 21 includes a first parallel operation submodule 211 and a first SDI signal output submodule 212, the first parallel operation submodule 211 includes at least 2 first ISP processing chips 2111, and the image sensor 1 is connected to the first SDI signal output submodule 212 through the at least 2 first ISP processing chips 2111, respectively.
Specifically, ISP is called Image Signal Processing, chinese is Image Signal Processing, the first ISP Processing chip may adopt an EN781 chip model, and the ISP Processing chip may also adopt FH 8510. In this embodiment, two ISP processing chips are disposed in the first parallel operation sub-module 211, the two ISP processing chips respectively receive image information from one half of the image area of the image sensor 1, process one image separately to improve processing efficiency, reduce the processing amount of a single instrument, and improve the imaging effect of 4K resolution, the ISP processing chips receive image signals from the image sensor 1 through a built-in CMOS sensor interface, perform encoding operation on the received information, perform analog-to-digital conversion after encoding the image signals, and output digital signals, the two image signals output by the two ISP chips are input to the first SDI signal output sub-module 212, and the first SDI signal output sub-module 212 splices the two image digital signals to obtain first half-screen SDI image information and transmits the first half-screen SDI image information to the image signal processing main board 3.
Referring to fig. 3, the second SDI signal processing module 22 includes a second parallel operator module 221 and a second SDI image conversion submodule, the second parallel operator module 221 includes at least 2 second ISP processing chips 2112, and the image sensor 1 is connected to the second SDI signal output submodule 222 through the 2 second ISP processing chips 2112, respectively.
In this embodiment, another two ISP processing chips are disposed in the second parallel operation submodule 221, and the second ISP processing chip may adopt an EN781 chip model. The two ISP processing chips respectively receive image information of the other half of the image from the image sensor 1, perform coding operation on the received information, perform analog-to-digital conversion after the coding of the image is completed, output digital signals, input two image signals of the two ISP chips to the second SDI signal output submodule 222, splice the two image digital signals through the second SDI signal output submodule 222 to obtain second half screen SDI image information, and transmit the second half screen SDI image information to the image signal processing main board 3.
Referring to fig. 4, the image signal processing main board 3 further includes a communication module 35 and an input device 34, and the input device 34 is connected to the CPU signal processor 32 through the communication module 35.
Specifically, the input device 34 is connected to the communication module 35 to implement external communication of the CPU signal processor 32, an operator can operate the input device 34 in a keyboard input manner, or can input a control instruction in a touch screen manner to send an instruction to the communication module 35, the communication module 35 sends the received operation instruction to the CPU signal processor 32, the CPU signal processor 32 receives the corresponding operation instruction, correspondingly adjusts an image parameter and performs a corresponding function action, thereby changing an imaging effect of an output image. The communication module 35 may be implemented by a wired connection module or a wireless connection module such as a bluetooth module. The input component 34 may be implemented as a keyboard or a joystick.
Referring to fig. 5, the image signal processing main board 3 further includes a storage module 36, and the storage module 36 is connected to the CPU signal processor 32.
Specifically, the storage module 36 is used for recording the shot pictures during the shooting process. Further, a storage interface such as an SD card socket is provided in the storage module 36, an external memory device is inserted into the storage interface of the storage module 36 to achieve an expansion effect, the SD card can be selectively accessed for storage, and an input device 34 sends a start and stop recording signal to the CPU signal processor 32 to switch on and off the operation of the storage module 36.
Referring to fig. 6, the image pickup system further includes a heat dissipation driving module 51 and a heat sink 52, and the CPU signal processor 32 is connected to the heat sink 52 through the heat dissipation driving module 51.
Specifically, when the image signal processing motherboard 3 operates, because the content of the processed video signal is large, the device for processing the image is prone to generate heat, the CPU signal processor 32 sends a heat dissipation signal to the heat dissipation driving module 51 during operation, and the heat dissipation driving module 51 drives the heat sink 52 to operate, so as to realize the function of cooling the image signal processing motherboard 3.
Referring to fig. 7, the image signal processing main board 3 further includes a power supply voltage conversion module 37, and the SDI signal receiving and splicing module 31, the CPU signal processor 32, the display driving module 33, the storage module 36, the communication module 35, the heat dissipation driving module 51, and the heat sink 52 are connected to the power supply voltage conversion module 37.
Specifically, the components of the camera system are not adapted to the 220V ac voltage, the power supply voltage conversion module 37 receives the 220V ac voltage input from the outside, and then converts the voltage into a voltage value adapted to the SDI signal receiving and splicing module 31, the CPU signal processor 32, the display driving module 33, the storage module 36, the communication module 35, the heat dissipation driving module 51 and the heat sink 52, and the power supply voltage conversion module 37 can convert the 220V ac voltage into a dc voltage of 1.2V, 1.5V, 3.3V, 5V and 12V. As one embodiment, the power voltage conversion module 37 may use a conventional linear regulator such as a PW6566 regulator to implement the voltage conversion function.
Example 2
Referring to fig. 8, the present application provides a medical imaging apparatus with an imaging system modified in any one of the above-described modes, including an endoscope camera 7, an operation handle 8, and a main chassis 6, wherein the image sensor 1 is mounted on the endoscope camera 7, the SDI signal generation main board 2 is mounted on the operation handle 8, and the image signal processing main board 3 is mounted in the main chassis.
Specifically, an operator holds the operating handle 8 to extend the endoscope camera 7 into a part to be detected or observed of a human body, and captures image information of the part to be observed, and the image sensor 1 built in the endoscope camera 7 converts a physical signal of the image information into an electrical signal and inputs the electrical signal into the SDI signal generation main board 2 in the operating handle 8. Image information is transmitted from the SDI signal generation main board 2 to the image signal processing main board 3 in the host shell 6 through the coaxial line 4, the host shell 6 protects the image signal processing main board 3 from being damaged, and the processed image is displayed in an external display mode.
Referring to fig. 9, the main chassis 6 is provided with a heat dissipation through-hole 9.
Specifically, the heat dissipation through hole 9 is used for heat dissipation of the image signal processing main board 3, and hot air generated in the host casing 6 is conveniently discharged from the heat dissipation through hole 9, so that the effect of reducing the temperature of the working environment is achieved.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. An improved camera system, comprising:
an image sensor (1), an SDI signal generating main board (2), an image signal processing main board (3) and a coaxial line (4),
the SDI signal generating main board (2) comprises a first SDI signal processing module (21) and a second SDI signal processing module (22),
the image sensor (1) is respectively connected with a first SDI signal processing module (21) and a second SDI signal processing module (22);
the image signal processing main board (3) comprises an SDI signal receiving and splicing module (31), a CPU signal processor (32) and a display driving module (33),
the first SDI signal processing module (21) is connected with an SDI signal receiving and splicing module (31) through a coaxial line (4), the second SDI signal processing module (22) is connected with the SDI signal receiving and splicing module (31) through the coaxial line (4),
the SDI signal receiving and splicing module (31) is connected with a CPU signal processor (32), and the CPU signal processor (32) is connected with a display driving module (33).
2. An improved camera system as in claim 1,
the first SDI signal processing module (21) comprises a first parallel operation submodule (211) and a first SDI signal output submodule (212), the first parallel operation submodule (211) comprises at least 2 first ISP processing chips (2111), and the image sensor (1) is connected with the first SDI signal output submodule (212) through the at least 2 first ISP processing chips (2111).
3. An improved camera system as in claim 1,
the second SDI signal processing module (22) comprises a second parallel operation sub-module (221) and a second SDI image conversion sub-module, the second parallel operation sub-module (221) comprises at least 2 second ISP processing chips (2112), and the image sensor (1) is connected with the second SDI signal output sub-module (222) through the at least 2 second ISP processing chips (2112) respectively.
4. The improved camera system according to claim 1, wherein the image signal processing main board (3) further comprises a communication module (35) and an input component (34), and the input component (34) is connected with the CPU signal processor (32) through the communication module (35).
5. An improved camera system according to claim 4, characterized in that the image signal processing main board (3) further comprises a memory module (36), the memory module (36) being connected to the CPU signal processor (32).
6. An improved camera system as claimed in claim 5, further comprising a heat dissipation driving module (51) and a heat sink (52), wherein the CPU signal processor (32) is connected to the heat sink (52) through the heat dissipation driving module (51).
7. The improved camera system of claim 6, wherein the image signal processing main board (3) further comprises a power supply voltage conversion module (37), and the SDI signal receiving and splicing module (31), the CPU signal processor (32), the display driving module (33), the storage module (36), the communication module (35), the heat dissipation driving module (51) and the heat sink (52) are all connected with the power supply voltage conversion module (37).
8. A medical imaging apparatus with an improved imaging system according to any of claims 1-7, characterized in that: comprises an endoscope camera (7), an operating handle (8) and a main machine shell (6),
the image sensor (1) is installed on an endoscope camera (7), the SDI signal generation main board (2) is installed on an operation handle (8), and the image signal processing main board (3) is installed in a main board shell.
9. The medical imaging apparatus according to claim 8, wherein: the host machine shell (6) is provided with a heat dissipation through hole (9).
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