CN216056970U

CN216056970U - Outdoor high-power communication emitter

Info

Publication number: CN216056970U
Application number: CN202122325726.0U
Authority: CN
Inventors: 杨进
Original assignee: Nanjing Guangyou Electronic Technology Co ltd
Current assignee: Nanjing Guangyou Electronic Technology Co ltd
Priority date: 2021-09-24
Filing date: 2021-09-24
Publication date: 2022-03-15
Anticipated expiration: 2031-09-24

Abstract

The utility model discloses an outdoor high-power communication transmitting device which comprises a main board, wherein the top of the main board is connected with a fixed frame through threads, the top of the fixed frame is provided with a dust cover, two sides of the top of the fixed frame are respectively provided with a movable groove, two sides of the fixed frame are respectively provided with a sliding groove, the front side and the back side of an inner cavity of each sliding groove are respectively provided with a limiting groove, two sides of the bottom of the dust cover are respectively and fixedly connected with a clamping strip, the bottom of each clamping strip extends to the inner cavity of each movable groove and is movably connected with the inner cavity of each movable groove, and one side of each clamping strip is fixedly connected with a clamping block. According to the utility model, the mainboard is used for placing and installing the chip main body, and the fixing frame is used for fixing and protecting the elements in the fixing frame, so that the elements are prevented from being damaged by collision and extrusion of foreign objects, the safety of the elements in the using process is improved, and the dustproof function is achieved by arranging the dustproof cover.

Description

Outdoor high-power communication emitter

Technical Field

The utility model relates to the technical field of millimeter wave radio frequency, in particular to an outdoor high-power communication transmitting device.

Background

The wireless communication refers to long-distance transmission communication among a plurality of nodes without being transmitted by conductors or cables, wireless communication can be carried out by utilizing a radio, a radio and the like, the wireless communication comprises various fixed, movable and portable applications, such as two-way radio, mobile phones, personal digital assistants and wireless networks, other examples of wireless communication include a GPS, a garage door remote controller, a wireless mouse and the like, most wireless communication technologies use radio, some wireless communication technologies do not use radio, other electromagnetic wave wireless technologies such as light, a magnetic field, an electric field and the like are used, most of communication transmitting devices at the present stage are not provided with a dustproof device in the using process, dust is easy to enter the device, the dust accumulation condition can occur in long-term use, the heat dissipation of the device is influenced, and the service life of the device is shortened, therefore, an outdoor high-power communication transmitting device is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an outdoor high-power communication transmitting device, which has the advantage of dust prevention and solves the problems that dust is easy to enter the device because most of the communication transmitting devices at the present stage are not provided with the dust prevention devices in the using process, the dust accumulation condition can occur after long-term use, the heat dissipation of the device is influenced, and the service life of the device is shortened.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an outdoor high-power communication emitter, includes the mainboard, there is the mount at the top of mainboard through threaded connection, the top of mount is provided with the dust cover, the activity groove has all been seted up to the both sides at mount top, the spout has all been seted up to the both sides of mount, the spacing groove has all been seted up at the front and the back of spout inner chamber, the equal fixedly connected with card strip in both sides of dust cover bottom, the bottom of card strip extend to the inner chamber of activity groove and with the inner chamber swing joint in activity groove, one side fixedly connected with fixture block of card strip, one side that the fixture block was kept away from the card strip extends to the inner chamber of spout.

Preferably, the inner cavity swing joint of spout has the ejector pad, the inner cavity swing joint of spacing groove has the stopper, and the stopper keeps away from one side and ejector pad fixed connection of spacing groove.

Preferably, the left side fixedly connected with spring of stopper, and the left end of spring and the inner wall fixed connection of spacing groove.

Preferably, the top of the main board and the inner cavity of the fixing frame are provided with a chip main body, and the top of the fixing frame is fixedly connected with a stabilizing frame.

Preferably, the upper end on chip main part surface is provided with the fender bracket, equal fixedly connected with support bar all around on fender bracket surface, and the support bar is kept away from the inner wall fixed connection of one side of fender bracket and steady rest.

Preferably, the surface of the chip main body is provided with heat conducting fins, the tops of the heat conducting fins are fixedly connected with two heat conducting copper pipes, and the number of the heat conducting copper pipes is two.

Preferably, the surface of the heat conduction copper pipe is fixedly connected with a radiating fin, and the surfaces of the heat conduction copper pipe and the radiating fin are both coated with graphene.

Preferably, both sides of the bottom of the radiating fin are provided with auxiliary frames, and the bottom of each auxiliary frame is in threaded connection with the fixing frame through a bolt.

Compared with the prior art, the utility model has the following beneficial effects:

1. the utility model has the advantages that the mainboard is arranged for placing and installing the chip main body, the fixing frame is arranged for fixing and protecting the elements in the fixing frame, the elements are prevented from being damaged by collision and extrusion of foreign objects, so the safety of the elements in the using process is improved, the dustproof function is realized by arranging the dustproof cover, the condition that the heat dissipation of the chip main body is influenced by the adhesion and accumulation of external dust in the using process of the chip main body is avoided, the service life of the chip main body is further prolonged, the dustproof cover can be clamped and fixed with the fixing frame through the matching of the movable groove, the sliding groove, the clamping strip and the clamping block, the condition that the electronic elements are extruded by position deviation in the using process of the dustproof cover is avoided, the stability of the device in use is improved, meanwhile, the replacement and installation of the dustproof cover are facilitated, and the practicability of the device is further improved, the problem of communication emitter at present stage at the in-process that uses mostly not set up dust keeper, lead to the dust to enter into the device easily inside, the accumulational condition of dust can appear in long-term the use, influence the heat dissipation of device, shortened the life of device is solved.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the connection structure of the dust cover, the clamping strip and the clamping block of the present invention;

FIG. 3 is an exploded view of the fixing frame and the pushing block of the present invention;

FIG. 4 is a schematic view of the connection structure of the fixing frame, the stabilizing frame and the protection frame of the present invention;

fig. 5 is a schematic view of a connection structure of the heat conducting copper pipe, the heat sink and the auxiliary frame according to the present invention.

In the figure: 1. a main board; 2. a fixed mount; 3. a dust cover; 4. a movable groove; 5. a chute; 6. a limiting groove; 7. clamping the strip; 8. a clamping block; 9. a push block; 10. a limiting block; 11. a spring; 12. a chip body; 13. a stabilizer frame; 14. a supporting strip; 15. a protection frame; 16. a heat conductive sheet; 17. a heat conducting copper pipe; 18. a heat sink; 19. an auxiliary frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, an outdoor high-power communication transmitter comprises a main board 1, the top of the main board 1 is connected with a fixed frame 2 through a screw thread, the top of the fixed frame 2 is provided with a dust cover 3, both sides of the top of the fixed frame 2 are provided with movable slots 4, both sides of the fixed frame 2 are provided with sliding slots 5, both the front and the back of the inner cavity of the sliding slot 5 are provided with limit slots 6, both sides of the bottom of the dust cover 3 are fixedly connected with clamping strips 7, the bottom of the clamping strips 7 extends to the inner cavity of the movable slots 4 and is movably connected with the inner cavity of the movable slots 4, one side of the clamping strips 7 is fixedly connected with clamping blocks 8, one side of the clamping blocks 8 away from the clamping strips 7 extends to the inner cavity of the sliding slots 5, through the arrangement of the main board 1, the main body 12 of a chip is placed and installed, through the arrangement of the fixed frame 2, the elements inside the fixed frame 2 are fixed and protected, and the elements are prevented from being damaged by the collision and extrusion of foreign objects, thereby improving the safety of the element in the using process, playing a role of dust prevention by arranging the dust cover 3, avoiding the situation that the heat dissipation of the chip main body 12 is influenced by the attachment and accumulation of external dust in the using process of the chip main body 12, further prolonging the service life of the chip main body 12, leading the dust cover 3 to be clamped and fixed with the fixed frame 2 by the matching of the movable groove 4, the sliding groove 5, the clamping strip 7 and the clamping block 8, avoiding the situation that the electronic element is extruded by the position deviation of the dust cover 3 in the using process, thereby improving the stability of the device in the using process, being convenient for replacing and installing the dust cover 3 at the same time, further improving the practicability of the device, solving the problem that most of the chips at the present stage are not provided with dust prevention devices in the using process, easily leading the dust to be attached to the surface of the chip and causing the dust accumulation in the long-term use, the heat dissipation of the chip is influenced, and the service life of the chip is shortened.

Specifically, the inner chamber swing joint of spout 5 has ejector pad 9, the inner chamber swing joint of spacing groove 6 has stopper 10, and stopper 10 keeps away from one side and ejector pad 9 fixed connection of spacing groove 6, through setting up ejector pad 9, cooperation spout 5 for extrude fixture block 8, so that take out the change to dust cover 3, through the cooperation of spacing groove 6 and stopper 10, be used for ejector pad 9 to carry on spacingly when removing it, the condition of ejector pad 9 at the in-process emergence offset that removes has been avoided.

Specifically, the left side fixedly connected with spring 11 of stopper 10, and the left end of spring 11 and the inner wall fixed connection of spacing groove 6, through setting up spring 11, make ejector pad 9 restore to the throne through spring 11's elasticity that resets after 8 extrusion fixture blocks, and then make things convenient for ejector pad 9 to reuse.

Specifically, the top of mainboard 1 and the inner chamber that is located mount 2 are provided with chip main part 12, and the top fixedly connected with steadying frame 13 of mount 2 through setting up steadying frame 13, has played the effect of fixed support bar 14, has avoided support bar 14 to receive the condition that the extrusion takes place the offset at the in-process that uses, and then has improved the stability of support bar 14 in the use.

Specifically, the upper end on chip main part 12 surface is provided with fender bracket 15, equal fixedly connected with support bar 14 all around on fender bracket 15 surface, and support bar 14 keeps away from one side of fender bracket 15 and the inner wall fixed connection of steady rest 13, through setting up fender bracket 15, a position for to chip main part 12 is fixed, the cracked condition of stitch skew has been avoided taking place for chip main part 12 at the in-process that uses, and then the life of chip main part 12 has been prolonged, through setting up support bar 14, fixed fender bracket 15's effect has been played, the condition that fender bracket 15 takes place the offset at the in-process that uses and leads to chip main part 12 to damage has been avoided.

Specifically, the surface of the chip main body 12 is provided with the heat conducting fins 16, the top of the heat conducting fins 16 is fixedly connected with the heat conducting copper pipes 17, the number of the heat conducting copper pipes 17 is two, and the effect of transferring the surface heat of the chip main body 12 is achieved by arranging the heat conducting fins 16 and the heat conducting copper pipes 17, so that the heat generated by the chip main body 12 in the using process is transferred to the radiating fins 18.

Specifically, the fixed surface of the heat conduction copper pipe 17 is connected with the heat radiating fins 18, the surfaces of the heat conduction copper pipe 17 and the heat radiating fins 18 are coated with graphene, and through the arrangement of the heat radiating fins 18, the effect of dispersing heat transferred to the heat radiating fins 18 into outside air is achieved, so that the chip main body 12 is cooled, the condition that the temperature of the chip main body 12 is overheated in the using process is avoided, and the service life of the chip main body 12 is prolonged.

Specifically, both sides of the bottom of the radiating fin 18 are provided with the auxiliary frames 19, and the bottom of the auxiliary frames 19 is in threaded connection with the fixing frame 2 through bolts, so that the effect of fixing the radiating fin 18 is achieved, the situation that the radiating fin 18 deviates in the using process is avoided, and the stability of the radiating fin 18 in use is further improved.

When the dustproof cover is used, when the chip main body 12 is used, heat is generated on the surface of the chip main body 12 and is transmitted to the heat conduction copper pipe 17 through the heat conduction sheet 16, the heat conduction copper pipe 17 guides the heat to the surface of the heat dissipation sheet 18, then the heat is dispersed into the surrounding air through the heat dissipation sheet 18, so that the chip main body 12 is cooled through heat dissipation, when the dustproof cover 3 needs to be replaced, the push block 9 is firstly inwards extruded, the push block 9 drives the limiting block 10 to move in the limiting groove 6, so that the push block 9 is limited, meanwhile, the push block 9 drives the spring 11 to move and deform the spring 11, when the push block 9 inwards moves and extrudes the clamping block 8, the clamping block 8 is extruded to be separated from the inner wall of the sliding groove 5, then the dustproof cover 3 is upwards taken up and the bottom of the clamping strip 7 is separated from the movable groove 4, so that the dustproof cover 3 is separated from the fixed frame 2, and then the push block 9 is loosened, spring 11 drives ejector pad 9 through the elasticity that resets and outwards removes and make ejector pad 9 reset to this reuse of ejector pad 9 of being convenient for, when needs are installed dust cover 3, otherwise above-mentioned operation can, the communication emitter who has solved present stage does not set up dust keeper at the in-process that uses mostly, lead to the dust to enter into the device easily inside, the condition that the dust is piled up can appear in the long-term use, influence the heat dissipation of device, the problem of the life of device has been shortened.

The standard parts used in the present application document can be purchased from the market, and can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts the conventional means of mature bolt, rivet, welding and the like in the prior art, the machines, parts and equipment adopt the conventional models in the prior art, the control mode is automatically controlled by a controller, the control circuit of the controller can be realized by simple programming of technicians in the field, the control circuit belongs to the common knowledge in the field, and the present application document is mainly used for protecting mechanical devices, so the control mode and the circuit connection are not explained in detail in the present application.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an outdoor high-power communication emitter, includes mainboard (1), its characterized in that: the top of mainboard (1) has mount (2) through threaded connection, the top of mount (2) is provided with dust cover (3), movable groove (4) have all been seted up to the both sides at mount (2) top, spout (5) have all been seted up to the both sides of mount (2), spacing groove (6) have all been seted up at the front and the back of spout (5) inner chamber, the equal fixedly connected with card strip (7) in both sides of dust cover (3) bottom, the bottom of card strip (7) extend to the inner chamber of movable groove (4) and with the inner chamber swing joint of movable groove (4), one side fixedly connected with fixture block (8) of card strip (7), one side that fixture block (8) kept away from card strip (7) extends to the inner chamber of spout (5).

2. An outdoor high-power communication transmitter as claimed in claim 1, wherein: the inner chamber swing joint of spout (5) has ejector pad (9), the inner chamber swing joint of spacing groove (6) has stopper (10), and stopper (10) keep away from one side and ejector pad (9) fixed connection of spacing groove (6).

3. An outdoor high-power communication transmitter as claimed in claim 2, wherein: the left side fixedly connected with spring (11) of stopper (10), and the inner wall fixed connection of the left end and spacing groove (6) of spring (11).

4. An outdoor high-power communication transmitter as claimed in claim 1, wherein: the chip fixing device is characterized in that a chip main body (12) is arranged at the top of the main board (1) and in an inner cavity of the fixing frame (2), and a stabilizing frame (13) is fixedly connected to the top of the fixing frame (2).

5. An outdoor high-power communication transmitter as claimed in claim 4, wherein: the upper end on chip main part (12) surface is provided with fender bracket (15), equal fixedly connected with support bar (14) all around on fender bracket (15) surface, and support bar (14) keep away from the inner wall fixed connection of one side and steady rest (13) of fender bracket (15).

6. An outdoor high-power communication transmitter as claimed in claim 4, wherein: the surface of the chip main body (12) is provided with heat conducting fins (16), the top of each heat conducting fin (16) is fixedly connected with two heat conducting copper pipes (17), and the number of the heat conducting copper pipes (17) is two.

7. An outdoor high-power communication transmitter as claimed in claim 6, wherein: the surface of the heat conduction copper pipe (17) is fixedly connected with a radiating fin (18), and the surfaces of the heat conduction copper pipe (17) and the radiating fin (18) are coated with graphene.

8. An outdoor high-power communication transmitter as claimed in claim 7, wherein: auxiliary frames (19) are arranged on two sides of the bottom of the radiating fin (18), and the bottom of each auxiliary frame (19) is in threaded connection with the fixed frame (2) through bolts.