CN216052769U

CN216052769U - Thermal balance structure of vehicle processor, temperature control system and vehicle

Info

Publication number: CN216052769U
Application number: CN202122419743.0U
Authority: CN
Inventors: 姚华
Original assignee: Huizhou BYD Electronic Co Ltd
Current assignee: Huizhou BYD Electronic Co Ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2022-03-15
Anticipated expiration: 2031-09-30

Abstract

The utility model discloses a thermal balance structure of a vehicle processor, a temperature control system and a vehicle, wherein the thermal balance structure comprises a heating sheet, the heating sheet is a flexible electric heating sheet, and the heating sheet is attached to one surface of the processor; a heat sink disposed on another surface of the processor. Adopt flexible electric heating plate as the heating plate, the heating plate can be according to the structural shape on treater surface bending at will, and the laminating sets up on the treater needs the surface of heating completely, improves the heat transfer efficiency between heating plate and the treater from this, and heating efficiency is higher.

Description

Thermal balance structure of vehicle processor, temperature control system and vehicle

Technical Field

The utility model relates to the technical field of automobiles, in particular to a thermal balance structure of a vehicle processor, a temperature control system and a vehicle.

Background

The electronic and intelligent control of the automobile is becoming obvious day by day, the intelligent central control of the automobile integrates the functions of GPS, 4G, WLAN, BT, backing images, driving records, large screens and power amplifiers, the real-time monitoring of the state of the automobile, remote control, driving assistance, navigation, game entertainment and the like, the intelligent central control becomes the standard configuration of a high-end automobile, the intelligent central control is popularized to middle and low-end automobiles at present, the cost of the central control for the automobile is high due to the fact that the cost of the intelligent central control on low-end automobiles is too high, the popularization speed is influenced, and users of the low-end automobiles also have practical requirements on the intelligent central control.

The intelligent central control core component of the vehicle is a central processor suite, the intelligent central control adopts a common consumption-level processor suite, the product iteration is fast, the performance is good, the price is low, but the working temperature of the common consumption-level processor suite is between-10 ℃ and 65 ℃. The automobile service temperature range is far larger than the processor working temperature range, the night environment temperature in northern cold regions in winter can reach-50 ℃, the temperature in the automobile is about-30 ℃, and the automobile service temperature range exceeds the consumer-grade processor suite working temperature range. In order to solve the use problem in the environment, a thermal balance structure of a TEC (thermoelectric Cooler) vehicle processor is added to the consumption-level processor suite central control, a TEC module is installed in close contact with the processor, and a TEC control system can rapidly adjust the temperature of the processor suite to be within a working temperature range.

The upper surface and the lower surface of the existing TEC are ceramic surfaces, and the middle part is a semiconductor element, but the structure of the TEC has certain defects, and the ceramic structure has high rigidity and poor plasticity and cannot be completely attached to the surface of a processor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a thermal balance structure of a vehicle processor, a temperature control system and a vehicle.

In a first aspect, the present invention provides a thermal balancing structure for a vehicle processor, comprising:

the heating sheet is a flexible electric heating sheet and is attached to one surface of the processor;

a heat sink disposed on another surface of the processor.

Optionally, the heating sheet is any one of a PET heating film, a PI heating film, a silica gel heating sheet, and a combination thereof.

Optionally, the heating plate is of an annular structure.

Optionally, the number of the heating sheets is at least two, and at least two heating sheets are arranged on the surface of the processor at intervals.

Optionally, a first heat-conducting film is connected between adjacent heating plates, and the first heat-conducting film is attached to the surface of the processor.

Optionally, a second heat conduction film is disposed on a bonding region of the heat sink on a surface bonded to the processor, and the second heat conduction film is an insulating film.

Optionally, the heat sink is provided with an isolation film in a non-bonding region on a surface bonded to the processor, and the isolation film is an insulating heat insulation film.

Optionally, a blank area is formed in the middle of the isolation film, and the second heat conduction film is disposed in the blank area.

In a second aspect, the present invention provides a temperature control system for a vehicle processor, comprising:

the heating module is a flexible electric heating sheet and is attached to the surface of the processor;

the heat dissipation module is attached to the surface of the processor;

the temperature detection module is arranged on the processor and used for detecting the temperature of the processor;

and the control module is connected with the heating module, the heat dissipation module and the temperature detection module and is used for receiving detection data of the temperature detection module and driving the heating module and the heat dissipation module.

In a third aspect, the present invention provides a vehicle provided with the vehicle processor thermal balancing structure or the vehicle processor temperature control system.

The heat balance structure adopts the flexible electric heating sheet as the heating sheet, the heating sheet can be bent at will according to the structural shape of the surface of the processor and is completely attached to the surface of the processor to be heated, so that the heat transfer efficiency between the heating sheet and the processor is improved, and the heating efficiency is higher; the product is more miniaturized, light and thin; meanwhile, the price is lower, and the cost is saved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 shows an exploded view of a processor and a thermal balance structure provided in an embodiment of the present application.

Fig. 2 shows a schematic structural diagram of a thermal balance structure provided in an embodiment of the present application after being connected to a processor.

Fig. 3 is a schematic structural diagram illustrating a structure provided by an embodiment of the present application after three heating sheets and the first thermal conductive film are disposed in fig. 2.

Fig. 4 shows a schematic block diagram of a temperature control system provided in an embodiment of the present application.

Fig. 5 shows a circuit diagram of a first switch circuit provided in an embodiment of the present application.

Fig. 6 shows a circuit diagram of a second switch circuit provided in an embodiment of the present application.

Fig. 7 is a schematic diagram showing a relationship among heating temperature, power and time of the temperature control system provided by the embodiment of the application.

Reference numerals:

the heat balance structure is a structure with the structure of-100,

a heater chip-10, a heat sink chip-11,

a first heat-conducting film-20, a second heat-conducting film-21, an isolating film-22, a blank area-2201,

a processor-30.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which are based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring now to FIG. 1, a thermal balance structure 100 for a vehicle processor is shown in accordance with an embodiment of the present application.

Referring to fig. 1 to 3, the thermal balance structure 100 includes:

the heating plate 10, the heating plate 10 is a flexible electric heating plate 10, the heating plate 10 is arranged on one surface of the processor in an attaching mode;

and a heat sink 11 disposed on the other surface of the processor.

It should be noted that, as mentioned in the background art, the upper and lower surfaces of the existing TEC (Thermo Electric Cooler) are ceramic surfaces, and the middle is a semiconductor element, but the ceramic structure of the TEC has high rigidity and poor plasticity, and the external shape of the automobile processor is irregular, so that a gap exists after the TEC is connected with the surface of the processor through an adhesive or a screw structure, and complete bonding cannot be achieved, which affects the heating effect.

Specifically, the heat balance structure 100 of the present application is not limited to the specific surface of the heat patch 10, and the area to be heated is adjusted according to the specific heating degree, i.e. the flexible heat patch 10 can be attached to one surface of the processor alone or extend from one surface to another surface of the processor.

The heat sink 11 and the heat fin 10 are generally provided on different surfaces of the processor, but the heat sink 11 and the heat fin 10 may be provided on the same surface of the processor.

The connection manner of the heater chip 10 and the surface of the processor for the close connection is not particularly limited in the present application, and includes, but is not limited to, an adhesive manner by an adhesive or a mechanical fixing manner by a screw or a hook.

The heat balance structure 100 of the application adopts the flexible electric heating plate 10 as the heating plate 10, the heating plate 10 can be bent at will according to the structural shape of the surface of the processor, and the heating plate is completely attached to the heating surface of the processor, so that the heat transfer efficiency between the heating plate 10 and the processor is improved, and the heating efficiency is higher.

In some embodiments of the present application, the heat patch 10 is any one of a PET (polyethylene terephthalate) heat film, a PI (polyimide film) heat film, a silicone heat patch 10, and a combination thereof.

Specifically, the silica gel heating sheet 10 is a flexible electric heating film element formed by combining high-temperature-resistant, high-heat-conductive, excellent-insulation, and high-strength silicone rubber, a high-temperature-resistant fiber reinforced material, and a metal heating film circuit, and is composed of two pieces of glass fiber cloth and silica gel glass fiber cloth formed by laminating two pieces of laminated silica gel.

The PI heating film is a flexible electric heating film element formed by integrating a polyimide film and a metal heating film circuit.

The PET heating film is a flexible electric heating film element formed by integrating polyethylene terephthalate and a metal heating film circuit.

The PET heating film, PI heating film and silicone heating sheet 10 have several identical characteristics:

all have good flexibility and can be completely and closely contacted with a heated object;

the shape can be selected, the device can be made into a flat shape or a specified shape, and the application range is wide;

the thickness of the product is 0.25mm-1.5 mm;

all have low cost.

It should be noted that the thickness of the conventional ceramic plate of the TEC is generally 5mm to 10mm, while the thickness of the heating plate 10 of the present application can reach 0.25mm, which is lighter and thinner than the TEC, and the product is smaller, lighter, and thinner.

Meanwhile, the prices of the PET heating film, the PI heating film and the silica gel heating sheet 10 are lower than those of the TEC, so that the cost is saved.

Conventional TEC is when using, when the object temperature is less than ambient temperature, probably the dewfall damages the object, can increase control by temperature change power demand simultaneously, and the PET that this application embodiment adopted adds hotting mask, PI adds hotting mask and silica gel heating plate 10, all has good insulating nature, anti chemical corrosion ability, can be used to the abominable place of environment such as humidity, corrosive gas, the laminating of heating plate 10 sets up the surface at the treater, can also play the effect of protection treater except that heating function.

The specific shape of the heating sheet 10 is not specifically limited, and referring to fig. 1 to 3, it is shown that the heating sheet 10 according to the embodiment of the present application is an annular structure, and besides the annular structure, the heating sheet 10 may be configured as any one of a polygonal structure, an arc structure, and a polyhedral structure.

As shown in fig. 2, the annular heating plate 10 can be sleeved around the processor, and the heating plate 10 is in contact with a plurality of surfaces of the processor at the same time to heat the processor in multiple directions, so that the processor is heated more quickly and uniformly.

The specific location of the heat patch 10 is not limited in this application, and the annular heat patch 10 may also be directly attached to one of the surfaces of the processor.

In some embodiments of the present application, the number of heat patches 10 is at least two, and at least two heat patches 10 are spaced apart on the surface of the processor. As shown in fig. 3, the heating sheets 10 are silica gel heating sheets 10, the number of the heating sheets 10 is three, and the heating sheets are all in an annular structure, and the three heating sheets 10 are sequentially sleeved around the processor from top to bottom.

The quantity of heating plate 10 sets up a plurality ofly, except that can improving heating efficiency, still is used for carrying out the even heating to the treater in this embodiment, and even interval sets up between a plurality of heating plates 10, carries out the subregion on the surface of treater in other words to all there is corresponding heating plate 10 to heat in every region, makes the treater be heated more evenly, compares in the mode that heating plate 10 fully wraps simultaneously, material saving more.

In some embodiments of the present application, on the basis of the above embodiments, as shown in fig. 3, three heating plates 10 are adopted as the heating plates 10, the number of the heating plates 10 is three, and all the heating plates are in an annular structure, the three heating plates 10 are sequentially sleeved around the processor from top to bottom, a first heat conduction film 20 is connected between adjacent heating plates 10, and the first heat conduction film 20 is attached to the surface of the processor.

Because interval setting between three heating plate 10, when a plurality of heating plate 10 heated the treater, the heat of the interval edge of adjacent heating plate 10 can give off the air in, the first heat conduction membrane 20 that sets up can be filled in the clearance of adjacent heating plate 10, and first heat conduction membrane 20 absorbs the marginal partly heat of heating plate 10 to interval with heat transfer to adjacent heating plate 10 is between, carries out more even heating to the treater.

The material of the first thermal conductive film 20 is not particularly limited, and includes, but is not limited to, thermal conductive silicone and thermal conductive silicone grease.

In some embodiments of the present application, as shown in fig. 1 and 3, the heat sink 11 is provided with a second heat conductive film 21 at a bonding area on a surface bonded to the processor, and the second heat conductive film 21 is an insulating film.

Specifically, the radiating fin 11 is used for radiating heat of the processor, the second heat conduction film 21 is arranged, the radiating fin 11 can be better connected with the surface of the processor, the attaching state is achieved, the processor and the radiating fin 11 can better perform heat exchange, and meanwhile, the second heat conduction film 21 is an insulating film, so that the situation of short circuit between the processor and the radiating fin 11 can be avoided.

The material of the second thermal conductive film 21 is not particularly limited, and includes, but is not limited to, thermal conductive silicone and thermal conductive silicone grease.

In some embodiments of the present application, as shown in fig. 1 and 3, the heat sink 11 is provided with a second heat conductive film 21 at a bonding area on a surface bonded to the processor, the second heat conductive film 21 being an insulating film; the heat sink 11 is provided with a separator 22 in a non-bonded region on a surface bonded to the processor, and the separator 22 is a heat insulating film having insulation properties.

Specifically, as shown in fig. 1 and 3, the surface area of the heat sink 11 connected to the processor is larger than the connecting surface area of the processor, the heat sink 10 is sleeved around the processor, and the heat sink 10 may contact or be in close proximity to the heat sink 11 when being set, and the isolation film 22 disposed on the non-attached surface of the heat sink 11 can prevent the heat of the heat sink 11 sucking away the heat sink 10 from reducing the heating efficiency, and can also prevent the heat sink 10 from contacting the heat sink 11 to cause a short circuit.

The material of the second thermal conductive film 21 is not particularly limited in this application, and includes, but is not limited to, heat insulating silicone and heat insulating silicone grease.

In some embodiments of the present application, the surface area of the heat sink 11 attached to the processor is larger than the attachment surface area of the processor, the attachment area of the heat sink 11 on the surface attached to the processor is provided with a second heat conductive film 21, and the second heat conductive film 21 is an insulating film; the heat sink 11 is provided with an isolation film 22 in a non-bonding region on a surface bonded to the processor, the isolation film 22 is a heat insulation film having insulation properties, a blank region 2201 is formed in the middle of the isolation film 22, and the second heat conduction film 21 is disposed in the blank region 2201.

Specifically, as shown in fig. 1, the blank area 2201 is a portion obtained by hollowing out the middle portion of the separator 22, the second thermally conductive film 21 can be pre-sized and shaped to conform to the size and shape of the surface of the processor for heat dissipation, and the size and shape of the blank area 2201 of the isolation film 22 are consistent with the size and shape of the second heat-conducting film 21, so that the second heat-conducting film 21 is just fit in the blank area 2201 of the isolation film 22, then the separator 22 and the second heat conductive film 21 are directly bonded to the surface of the heat sink for connection to the processor, the surface of the processor for heat dissipation is aligned with the second heat conductive film 21, the processor is bonded to the heat sink, the second heat-conducting film 21 is used for heat exchange between the heat sink and the processor, and the other part of the connecting surface of the heat sink 11 is isolated by the isolating film 22 to avoid heat exchange between the heat sink 11 and the heat plate 10.

In a second aspect, the present application further provides a temperature control system of a vehicle processor, referring to fig. 4, which shows a functional block diagram of the temperature control system of the present application, including:

the heating module is a flexible electric heating sheet 10 and is attached to the surface of the processor;

the heat dissipation module is attached to the surface of the processor;

and the control module is connected with the heating module, the heat dissipation module and the temperature detection module and used for receiving the detection data of the temperature detection module and driving the heating module and the heat dissipation module.

Specifically, the heating modules are any one of or a combination of a PET heating film, a PI heating film and a silica gel heating sheet 10, the number of the heating modules is at least two, and the heating modules are arranged on the surface of the processor at intervals.

In some embodiments of the present application, the working principle of the present temperature control system is:

the control module adjusts and controls the opening and closing of the heating module and the heat dissipation module according to the temperature of the processor detected by the temperature detection module, so that the temperature control system can heat the processor in a low-temperature environment, the temperature of the processor is increased to the working temperature, or the processor in a high-temperature environment is cooled, and the temperature of the processor is reduced to the working temperature.

In some embodiments of the present application, a temperature controlled switch circuit diagram of a temperature controlled system of the present application is also provided, as shown in fig. 5 and 6.

The temperature control switch circuit comprises an MCU, a temperature detection circuit, a first switch circuit Q4, a second switch circuit Q5 and a current monitoring circuit U9, wherein the MCU comprises an input port I-MON, a first output port HEAT-ON and a second output port HEAT-ON-SUP, the first switch circuit Q4 is connected with the first output port HEAT-ON through a resistor R16, and the second switch circuit Q5 is connected with the second output port HEAT-ON-SUP through a resistor R21.

Specifically, the temperature detection circuit is connected with the MCU and used for detecting the temperature of the processor and converting the temperature into a temperature signal to be transmitted to the MCU;

the MCU is prestored with a first threshold value and a second threshold value, and is used for comparing the temperature signal with the first threshold value and the second threshold value:

when the temperature signal is lower than a first threshold value, the MCU controls the first switch circuit Q4 and the second switch circuit Q5 to be conducted;

when the temperature signal is higher than a second threshold value, the MCU controls the second switching circuit Q5 to be switched off;

when the first switch circuit Q4 and the second switch circuit Q5 are turned on simultaneously, the heater module is turned on.

The input end of the current monitoring circuit is connected with an input power supply through a resistor R28, the output end of the current monitoring circuit is connected with an input port, a first output port is connected with a first switch circuit, a current threshold value is preset in the current control circuit, when the current value flowing through a resistor R28 is larger than the current threshold value, the current control circuit outputs an enabling signal to the MCU, and the MCU controls the first switch circuit to be disconnected.

Q3 is a control tube for controlling the ON/off of the first switch circuit Q4, the first output port HEAT _ ON of the MCU controls Q3 through R16,

when the heat _ ON is high, Q3 is turned ON, and the first switch Q4 is also turned ON;

conversely, the heat _ ON is low, Q3 is not conductive, and the first switch Q4 is also not conductive.

The G pole of the second switching circuit Q5 is connected to the second output port HEAT-ON-SUP of the MCU through a resistor R21. The temperature sensing circuit is placed in the vicinity of the processor and functions to sense the temperature at the processor. If the temperature exceeds the preset value, the temperature detection circuit acts to cause the level of the second output port HEARTER _ ON _ SUP to change, the MCU outputs an over-temperature protection signal, the second switch circuit Q5 is switched off to stop heating, and the danger caused by over-high temperature is avoided.

In some embodiments of the present application, the present temperature control system is described in conjunction with an actual scenario.

Assuming that the operating Temperature of the processor is-10 ℃ to 65 ℃, the Temperature corresponding to the first threshold may be preset in the MCU to be 0 ℃, the Temperature corresponding to the second threshold may be preset to be 55 ℃, the Temperature detection module may be an NTC resistor (Negative Temperature Coefficient thermistor), and the heating plate 10 may be a PI heating film.

After a user presses an automobile starting switch, the MCU detects the temperature of the processor through the NTC resistor, and if the temperature of the processor is within a normal working temperature range, the PI heating film does not work.

If the temperature of the processor is detected to be lower than 0 ℃ through the NTC resistor, the MCU controls the first switch circuit Q4 and the second switch circuit Q5 to be conducted, the PI heating film is opened to heat the processor, when the NTC resistor detects that the temperature of the processor rises to exceed the lowest temperature allowed by starting, the MCU outputs an enabling signal, and the processor runs a starting program to start.

If the NTC resistor detects that the temperature of the processor is higher than 50 ℃, the MCU controls the second switch circuit Q5 to be switched off, the PI heating film stops working, the radiating fin 11 starts working to reduce the temperature of the processor, the MCU outputs an enabling signal after the temperature is reduced to below 50 ℃, the processor runs a starting program to start at the moment, the PI heating module does not work, when the temperature of the processor is reduced to below 0 ℃, the MCU controls the first switch circuit Q4 and the second switch circuit Q5 to be switched on, and the controller controls the PI heating film to continue heating the processor.

And setting power adjustment parameters of the PI heating film, wherein the faster the system starting speed is, the better the user experience is.

However, if the environment temperature is too low and the preheating speed is too fast, the local continuous high-power heating may cause uneven heating of the device, which may cause damage, so that the heating time may not exceed 18 seconds at the temperature of-40 ℃ at the longest according to the user experience, the actual heating capacity and the heating safety condition, as shown in fig. 7, it is safe that the heating power is below the first line region in the actual project.

In a third aspect, the present application further provides a vehicle provided with the above thermal balance structure 100 or the above temperature control system.

In the description herein, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A thermal balancing structure for a vehicle processor, comprising:

a heat sink disposed on another surface of the processor.

2. The thermal balance structure of a vehicle processor of claim 1, wherein the heater chip is any one of a PET heater chip, a PI heater chip, a silicone heater chip, and a combination thereof.

3. The thermal balance structure of a vehicle processor of claim 1, wherein the heat patch is an annular structure.

4. The thermal balance structure of a vehicle processor of claim 1, wherein the number of the heat patches is at least two, and at least two of the heat patches are spaced apart on a surface of the processor.

5. The vehicle processor heat balance structure of claim 4, wherein a first heat conductive film is connected between adjacent heating plates, and the first heat conductive film is attached to a surface of the processor.

6. The heat balance structure of a vehicular processor according to claim 1, wherein the heat radiating fin is provided with a second heat conductive film at a bonding area on a surface bonded to the processor, the second heat conductive film being an insulating film.

7. The heat balance structure of a vehicle disposer according to claim 6, wherein the heat sink is provided with a separator at a non-attachment region on a surface to which the disposer is attached, the separator being a heat insulating film having an insulating property.

8. The heat balance structure of a vehicle processor of claim 7, wherein a blank area is opened in a middle portion of the isolation film, and the second heat conductive film is disposed in the blank area.

9. A vehicle processor temperature control system, comprising:

the heat dissipation module is attached to the surface of the processor;

10. A vehicle provided with a thermal balancing structure for a vehicle processor according to any one of claims 1 to 8 or a vehicle processor temperature control system according to claim 9.