CN216028841U

CN216028841U - Wafer cutting machine with adjustable vacuum chuck

Info

Publication number: CN216028841U
Application number: CN202122307795.9U
Authority: CN
Inventors: 赵康
Original assignee: Suzhou Cuizhu Semiconductor Co ltd
Current assignee: Suzhou Cuizhu Semiconductor Co ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-03-15
Anticipated expiration: 2031-09-23

Abstract

The utility model particularly relates to a wafer cutting machine with an adjustable vacuum chuck, which comprises a fixed seat, a lifting plate, a chuck base and a ceramic chuck, wherein the chuck base is fixedly arranged on a rotating shaft of a rotating motor, the end surface of the chuck base is provided with an electric adjusting rod, the top end of the electric adjusting rod is in supporting connection with the ceramic chuck, the bottom surface of a top plate is provided with a positioning chute, and the bottom surface of the top plate is provided with a cutting adjusting mechanism. Thereby ensuring the working stability of the rotating motor.

Description

Wafer cutting machine with adjustable vacuum chuck

Technical Field

The utility model belongs to the technical field of wafer cutting, and particularly relates to a wafer cutting machine with an adjustable vacuum chuck.

Background

Wafer cutting is an important ring in the manufacturing process of a wafer, the wafer is cut into small chips through a scribing process, the wafer cutting is the first step in the semiconductor subsequent packaging process, the area to be cut on the wafer is well distributed in advance, once the wafer cutting fails or the precision cannot be achieved, the loss cost is high, the requirements on the precision and the stability of equipment for wafer cutting are extremely high, the wafer needs to be positioned and fixed when being cut, a belt clamp needs to be utilized for positioning and clamping the wafer, the wafer is damaged and scrapped due to overlarge clamping force in the positioning and clamping process, the clamping and positioning are basically carried out manually, the wafer vibrates during cutting, so that the wafer can be cut and scrapped, in addition, a vacuum chuck can be utilized to clamp the wafer in the prior art, but the height adjustment cannot be carried out simultaneously after the wafer is fixed, therefore, the cutting efficiency of the wafer can be influenced, the body is required to be close to the cutting machine to take the wafer after the wafer is cut, and the body can touch the cutting machine in the taking process, so that the body can be scratched.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer cutting machine with an adjustable vacuum chuck, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: a wafer cutting machine with an adjustable vacuum chuck comprises a fixed seat, a lifting plate, a chuck base and a ceramic chuck, wherein sliding grooves are symmetrically formed in the end face of the fixed seat, an inverted U-shaped frame is arranged on the sliding grooves in a sliding mode, a driving block is arranged in the middle of the bottom side of the inverted U-shaped frame, a driving motor is arranged in the middle of the left end of the end face of the fixed seat, a threaded rod is connected to a rotating shaft of the driving motor in a transmission mode, electric lifting rods are symmetrically arranged on the end face of the inverted U-shaped frame, the lifting plate is fixed to the end face of the electric lifting rods, a rotating motor is fixed to the middle of the end face of the lifting plate, a circular sliding groove is formed in the outer side of the rotating motor and located on the surface of the lifting plate, the chuck base is fixedly installed on the rotating shaft of the rotating motor, an air suction pump is fixed to one side of the bottom face of the chuck base, a circular sliding block is arranged on the bottom face of the chuck base, and an electric adjusting rod is arranged on the end face of the chuck base, the utility model discloses a ceramic sucker, including fixing base, electrically operated control pole, ceramic sucker, top and the ceramic sucker that establishes of pole, the ceramic sucker bottom surface is equipped with the true chamber of taking out, the terminal surface of ceramic sucker is equipped with circular recess, the bottom surface of circular recess evenly is equipped with the ring recess, be equipped with the ceramic disc in the ring recess, the side symmetry of fixing base sets up the montant, be equipped with the roof between the montant, the location spout has been seted up to the bottom surface of roof, and the bottom surface of roof is equipped with cutting adjustment mechanism.

As a further optimization of the technical scheme, the cutting adjusting mechanism comprises a motor, a guide screw rod is connected to a rotating shaft of the motor in a transmission manner, a guide installation block is sleeved on the guide screw rod in a threaded manner, the top end of the guide installation block is connected with an arranged positioning sliding groove in a guiding and sliding manner, a telescopic cylinder is arranged on the bottom surface of the guide installation block, a positioning block is fixed on the right side of the bottom of a piston rod of the telescopic cylinder, and a laser cutting piece is installed on the positioning block, so that the stability of the laser cutting piece can be improved in the cutting process of a wafer.

As a further optimization of the technical scheme, the threaded rod is in threaded sliding connection with the driving block, the ceramic sucker is moved leftwards and rightwards, the telescopic protective cover is connected between the sucker base and the ceramic sucker in a sealing mode, and the function of protecting components in the device is achieved.

As a further optimization of the technical scheme, the sucker base is in sliding connection in the circular sliding groove through the circular sliding block, so that the sucker base can rotate to improve the stability.

As a further optimization of the technical scheme, the top end of the interior of the pumping cavity is uniformly provided with a communicating pipe, one end of the communicating pipe penetrates through the interior extending to the ceramic sucker and is communicated with the annular groove, and the function of clamping and adsorbing the wafer is achieved.

As a further optimization of the technical scheme, one end of the air pump is connected with a vacuum pumping hose, one end of the vacuum pumping hose penetrates through the upper end of the sucker base and is communicated with the bottom surface of the vacuum pumping cavity, the adsorption clamping efficiency of the wafer is improved, through holes are uniformly formed in the surface of the ceramic disc, and screen plates are arranged in the through holes.

The utility model has the technical effects and advantages that: this wafer cutting machine with adjustable vacuum chuck, at first place ceramic disc in circular recess, place the wafer that will cut on ceramic disc afterwards, then start driving motor and drive the threaded rod and rotate, and the rotation of threaded rod drives the drive block and removes, make the drive block drive the horizontal one side slip in the spout that the U-shaped frame set up on the fixing base simultaneously, make the wafer work piece moved the perpendicular department that cuts adjustment mechanism and stop at last, thereby can carry out automatic removal with the wafer, and then make things convenient for the staff to avoid cutting adjustment mechanism and carry out the blowing action, it needs limbs to be close to the cutting machine and take it after cutting to the wafer to have solved simultaneously, and can make limbs touch the cutting machine at the in-process of taking, can lead to the problem that limbs were by the fish tail, further improve the device's security.

When a wafer needs to be cut, firstly, an air suction pump is started to perform air suction action on a set vacuum cavity through a vacuum hose, negative pressure generated in the vacuum cavity is used by matching a communicating pipe with a ring groove arranged in a circular groove, a ceramic sucker generates suction through the communicating pipe, after the ceramic sucker generates suction, the ceramic disk is placed in the circular groove, so that the ceramic disk is adsorbed on the ceramic sucker, then the ceramic disk is adsorbed on the ceramic sucker, a wafer to be cut is placed on the ceramic disk for adsorption and fixation, further, automatic adsorption and fixation of the wafer are facilitated, the problem that the wafer is damaged when the wafer workpiece is fixed is reduced, the problem that the wafer is damaged and scraped due to overlarge clamping force in the process of positioning and clamping by utilizing a clamp is solved, then, a motor is started to drive a guide screw to rotate, and simultaneously a guide mounting block slides in a set positioning sliding groove, and the slip drive telescopic cylinder and the laser cutting piece of direction installation piece remove, make the laser cutting piece aim at wafer work piece cutting position, telescopic cylinder moves down the laser cutting piece afterwards to carry out the cutting work to the wafer work piece, and telescopic cylinder's setting can make the accurate cutting to the wafer work piece of laser cutting piece, thereby improves the cutting quality of wafer work piece.

Then the rotary motor drives the sucker base to rotate, the ceramic sucker is driven to rotate by the rotation of the sucker base, so that the wafer workpiece is driven to rotate, the laser cutting piece is enabled to realize the rotary cutting operation on the wafer workpiece, the cutting efficiency and the quality of the wafer workpiece are further improved, the wafer workpiece can be enabled to perform height adjustment action on the ceramic sucker according to the requirement of the cutting height distance through the arrangement of the electric adjusting rod, the telescopic action can be performed along with the height adjustment of the ceramic sucker through the arrangement of the telescopic protective cover which is arranged between the ceramic sucker and the sucker base, and a good dustproof effect can be achieved, the height of the ceramic sucker of the wafer cutting machine can be adjusted, so that the height of the ceramic disk on the ceramic sucker can be adjusted, the cutting precision and the quality of the wafer can be ensured, and the arranged electric lifting rod can ensure that the rotary motor can be kept in a horizontal state, thereby ensuring the working stability of the rotating motor.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of a circular groove of the present invention;

FIG. 3 is a top view of a ceramic disk of the present invention;

fig. 4 is a side view of the inverted U-shaped frame of the present invention.

In the figure: 1. a fixed seat; 2. a chute; 3. an inverted U-shaped frame; 4. a drive block; 5. a drive motor; 6. a threaded rod; 7. an electric lifting rod; 8. a lifting plate; 9. a circular chute; 10. a suction cup base; 11. a circular slider; 12. an electric adjusting rod; 13. a ceramic chuck; 14. a telescopic protective cover; 15. a fidelity cavity; 16. a circular groove; 17. a circular groove; 18. a communicating pipe; 19. a ceramic disc; 20. an air pump; 21. a vertical rod; 22. a telescopic cylinder; 23. cutting the workpiece by laser; 24. a top plate; 25. positioning the chute; 26. a cutting adjustment mechanism; 27. a lead screw; 28. a guide mounting block; 29. rotating the motor; 30. and a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a wafer cutting machine with an adjustable vacuum chuck comprises a fixed seat 1, a lifting plate 8, a chuck base 10 and a ceramic chuck 13, wherein the end face of the fixed seat 1 is symmetrically provided with a chute 2, the inverted U-shaped frame 3 can slide left and right conveniently through the arrangement of the chute 2, the inverted U-shaped frame 3 is arranged on the chute 2 in a sliding manner, the middle part of the bottom side of the inverted U-shaped frame 3 is provided with a driving block 4 which can drive the inverted U-shaped frame 3 to move, a driving motor 5 is arranged in the middle part of the left end of the end face of the fixed seat 1 and drives a threaded rod 6 to rotate through the arrangement of the driving motor 5, the threaded rod 6 is in transmission connection with a rotating shaft of the driving motor 5, the threaded rod 6 is in threaded sliding connection with the driving block 4, the solid inverted U-shaped frame 3 is adjusted left and right, the end face of the inverted U-shaped frame 3 is symmetrically provided with an electric lifting rod 7, and the height adjustment of the lifting plate 8 is realized through the arrangement of the electric lifting rod 7, the lifting plate 8 is fixed on the end face of the electric lifting rod 7, and the middle part of the end face of the lifting plate 8 is fixed with a rotating motor 29, so that the circumferential rotation of the sucker base 10 is realized.

The circular sliding groove 9 is arranged on the surface of the lifting plate 8, the circular sliding groove 9 is arranged to improve the stability of the circular sliding block 11 during rotation, the sucking disc base 10 is fixedly arranged on the rotating shaft of the rotating motor 29 to realize the circumferential rotation of the sucking disc base 10, the air suction pump 20 is fixed on one side of the bottom surface of the sucking disc base 10, the arrangement of the air suction pump 20 is convenient for vacuum extraction in the vacuum cavity 15, one end of the air pump 20 is connected with a vacuum pumping hose, one end of the vacuum pumping hose penetrates and extends to the upper end of the sucker base 10 and is communicated with the vacuum pumping cavity 15, so that the wafer is adsorbed and positioned, and the circular slide block 11 is arranged at the bottom side of the suction cup base 10, which can ensure the stability of the rotation of the suction cup base 10, the circular positioning sliding of the sucker base 10 is realized by the fact that the sucker base 10 is in sliding connection in the circular sliding groove 9 through the circular sliding block 11.

The end face of the sucker base 10 is provided with an electric adjusting rod 12, the electric adjusting rod 12 is arranged to facilitate height adjustment of the ceramic sucker 13, the top end of the electric adjusting rod 12 is connected with the ceramic sucker 13 in a supporting manner, a telescopic protective cover 14 is hermetically connected between the sucker base 10 and the ceramic sucker 13 to protect the electric adjusting rod 12 and the fidelity chamber 15 and prevent dust from entering power influencing the work of the electric adjusting rod, the bottom face of the ceramic sucker 13 is provided with the fidelity chamber 15, the end face of the ceramic sucker 13 is provided with a circular groove 16, the arrangement of the circular groove 16 is convenient for placing and positioning of a ceramic disc 19, the bottom face of the circular groove 16 is uniformly provided with a circular groove 17, the top end of the inside of the fidelity chamber 15 provided with the circular groove 17 is uniformly provided with a communicating pipe 18 for facilitating the fidelity adsorption and fixation of a wafer, one end of the communicating pipe 18 penetrates and extends to the inside of the ceramic sucker 13 to be communicated with the bottom face of the circular groove 17, the wafer workpiece is quickly positioned.

The ceramic disc 19 is arranged in the circular groove 17, the ceramic disc 19 is arranged to facilitate placement of wafer workpieces, through holes 30 are uniformly formed in the surface of the ceramic disc 19, screen plates are arranged in the through holes 30, vertical rods 21 are symmetrically arranged on the side surfaces of the fixing base 1, a top plate 24 is arranged between the vertical rods 21, a positioning chute 25 is formed in the bottom surface of the top plate 24, a cutting adjusting mechanism 26 is arranged on the bottom surface of the top plate 24 to realize left and right positioning sliding of the laser cutting piece 23, the cutting adjusting mechanism 26 comprises a motor, a guide screw 27 is connected to a rotating shaft of the motor in a transmission manner, a guide mounting block 28 is sleeved on the guide screw 27 in a threaded manner and is connected with the positioning chute 25 in a guide sliding manner, a telescopic cylinder 22 is arranged on the bottom surface of the guide mounting block 28, telescopic adjustment of the laser cutting piece 23 is realized through arrangement of the telescopic cylinder 22, a positioning block is fixed on the right side of the bottom of a piston rod of the telescopic cylinder 22, and a laser cutting piece 23 is installed on the positioning block to realize positioning cutting of the wafer.

Specifically, when the wafer needs to be cut, the air pump 20 is firstly started to pump the arranged vacuum pumping cavity 15 through the vacuum pumping hose, and the negative pressure generated in the pumping cavity 15 is matched with the circular groove 17 arranged in the circular groove 16 through the communicating pipe 18, so that the ceramic sucker 13 generates suction through the communicating pipe 18, after the ceramic suction cup 13 generates the suction force, the ceramic disc 19 is placed in the circular groove 16, so that the ceramic disc is adsorbed on the ceramic sucker 13, and then after the ceramic disc 19 is adsorbed on the ceramic sucker 13, the wafer to be cut is placed on the ceramic disc 19 for adsorption and fixation, thereby facilitating the automatic absorption and fixation of the wafer, reducing the damage problem when the wafer workpiece is fixed, therefore, the problem that the wafer is damaged and scrapped due to overlarge clamping force in the positioning and clamping process is solved.

Then drive sucking disc base 10 through rotating motor 29 and rotate, and the rotation of sucking disc base 10 drives ceramic chuck 13 and rotates, thereby drive the wafer work piece and rotate, and make laser cutting spare 23 realize rotating the cutting operation to the wafer work piece, and then improve the cutting efficiency and the quality of wafer work piece, and through the setting of electrical control pole 12, can make the wafer work piece carry out the regulation action of height to ceramic chuck 13 according to the requirement of the height distance of cutting, and establish the setting of sealed flexible protection casing 14 who sets up between ceramic chuck 13 and sucking disc base 10, can carry out flexible action along with the height regulation of ceramic chuck 13, and can play fine dirt-proof effect.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a wafer cutting machine with adjustable vacuum chuck, includes fixing base (1), lifter plate (8), sucking disc base (10), ceramic chuck (13), its characterized in that: the end face symmetry of fixing base (1) is equipped with spout (2), it is equipped with down U-shaped frame (3) to slide on spout (2), the bottom side middle part of down U-shaped frame (3) is equipped with drive block (4), fixing base (1) terminal surface left end middle part is equipped with driving motor (5), the transmission is connected with threaded rod (6) in the pivot of driving motor (5), the end face symmetry of down U-shaped frame (3) is equipped with electric lift pole (7), lifter plate (8) are fixed at the terminal surface of electric lift pole (7) that is established, lifter plate (8) terminal surface middle part is fixed with rotating motor (29), the outside of rotating motor (29) and the surface that is located lifter plate (8) are equipped with circular spout (9), sucking disc base (10) fixed mounting is in the pivot of rotating motor (29), bottom surface one side of sucking disc base (10) is fixed with aspiration pump (20), and the bottom side of sucking disc base (10) is equipped with circular slider (11), the terminal surface of sucking disc base (10) is equipped with electric regulating rod (12), the top of electric regulating rod (12) is connected with supporting between establishing ceramic chuck (13), ceramic chuck (13) bottom surface is equipped with true pumping chamber (15), the terminal surface of ceramic chuck (13) is equipped with circular recess (16), the bottom surface of circular recess (16) evenly is equipped with ring groove (17), be equipped with ceramic disc (19) in ring groove (17), the side symmetry of fixing base (1) is provided with montant (21), be equipped with roof (24) between montant (21), location spout (25) have been seted up to the bottom surface of roof (24), and the bottom surface of roof (24) is equipped with cutting adjustment mechanism (26).

2. The wafer cutter with adjustable vacuum chuck as set forth in claim 1, wherein: cutting adjustment mechanism (26) includes the motor, the transmission is connected with lead screw (27) in the pivot of motor, guide installation piece (28) have been cup jointed to lead screw (27) upper thread, the top of guide installation piece (28) and the location sliding connection that establishes between spout (25) lead, and the bottom surface of guide installation piece (28) is equipped with telescopic cylinder (22), the piston rod bottom right side of telescopic cylinder (22) is fixed with the locating piece, install laser cutting spare (23) on the locating piece.

3. The wafer cutter with adjustable vacuum chuck as set forth in claim 1, wherein: threaded sliding connection between threaded rod (6) and drive block (4), sealing connection has flexible protection casing (14) between sucking disc base (10) and ceramic sucking disc (13).

4. The wafer cutter with adjustable vacuum chuck as set forth in claim 1, wherein: the sucker base (10) is connected in a sliding manner in the circular sliding groove (9) through the circular sliding block (11).

5. The wafer cutter with adjustable vacuum chuck as set forth in claim 1, wherein: the inside top of the fidelity chamber (15) evenly is equipped with communicating pipe (18), communicating pipe (18) one end runs through and extends to the inside of ceramic sucking disc (13) and communicates between the ring recess (17) of establishing.

6. The wafer cutter with adjustable vacuum chuck as set forth in claim 1, wherein: one end of the air pump (20) is connected with a vacuum pumping hose, one end of the vacuum pumping hose penetrates through the upper end of the sucker base (10) and is communicated with the bottom surface of the vacuum pumping cavity (15), through holes (30) are uniformly formed in the surface of the ceramic disc (19), and screen plates are arranged in the through holes (30).