CN216017297U - Flexible circuit board mold processing - Google Patents
Flexible circuit board mold processing Download PDFInfo
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- CN216017297U CN216017297U CN202122641174.4U CN202122641174U CN216017297U CN 216017297 U CN216017297 U CN 216017297U CN 202122641174 U CN202122641174 U CN 202122641174U CN 216017297 U CN216017297 U CN 216017297U
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Abstract
The utility model discloses a flexible circuit board processing die, in particular to the field of processing of circuit boards, which comprises a soil platen and a top plate, wherein the bottom end of the soil platen is provided with a lower connecting plate, the top end of the lower connecting plate is detachably provided with a concave template, the bottom end of the top plate is detachably provided with an upper connecting plate, the bottom end of the upper connecting plate is detachably provided with a tooth punching plate, the bottom end of the tooth punching plate is provided with a stripper plate, the opposite sides of the soil platen and the top plate are provided with outer guide post and guide sleeve which are symmetrically distributed, the utility model discloses, when the top plate moves down to drive the stripper plate to move down and the concave template to contact, the bottom of the inner guide post movably passes through the corresponding upper guide sleeve and is movably clamped in the corresponding lower guide sleeve to guide and move the stripper plate and the concave template, thereby improving the stability of the relative movement of the stripper plate and the concave template and further improving the stability of the whole flexible circuit board processing die when in use, thereby the processing effect of flexible line way board has been promoted.
Description
Technical Field
The utility model relates to a circuit board processing technology field specifically is a flexible line way board mold processing.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible insulating substrates that provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability; the flexible circuit board is the only solution to meet the requirements of miniaturization and movement of electronic products; the flexible printed circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized;
the flexible line way board can use proprietary mould at the in-process of processing, however current mould for the processing of flexible line way board, the structure is fairly simple, lacks certain guide assembly and buffer unit, takes off the flitch in the mould and moves down to add man-hour, and stability is relatively weak, and is mostly direct rigid contact with the die board and causes the flexible line way board to damage very easily to influence the processing effect of flexible line way board, for this reason, we propose a flexible line way board mold processing and are used for solving above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flexible line way board mold processing to solve the problem of proposing among the above-mentioned background art.
In order to solve the technical problem, the utility model adopts the following technical scheme: a flexible circuit board processing die comprises a soil platen and a top plate, wherein a lower connecting plate is arranged at the bottom end of the soil platen, a concave die plate is detachably arranged at the top end of the lower connecting plate, an upper connecting plate is detachably arranged at the bottom end of the top plate, a tooth punching plate is detachably arranged at the bottom end of the upper connecting plate, a stripper plate is arranged at the bottom end of the tooth punching plate, symmetrically distributed outer guide pillar guide sleeves are arranged on the opposite sides of the soil platen and the top plate, inner guide mechanisms distributed in a rectangular array are arranged among the concave die plate, the upper connecting plate, the tooth punching plate and the stripper plate, and symmetrically distributed pad feet are fixedly arranged at the bottom end of the soil platen;
the top thread of the upper connecting plate is inserted with a first discharging screw distributed in a rectangular array, the bottom of the first discharging screw penetrates through the tooth punching plate and is movably sleeved with a silica gel spring, the silica gel spring is fixedly clamped in the tooth punching plate, the bottom end of the silica gel spring is contacted with the top end of the stripper plate, the middle position fixing clamps of the upper connecting plate and the tooth punching plate are provided with buffer springs distributed in a rectangular array, and the bottom ends of the buffer springs are contacted with the top end of the stripper plate.
Preferably, the inner guide mechanism comprises an inner guide pillar, an upper guide sleeve and a lower guide sleeve, the inner guide pillar is fixedly clamped on the upper connecting plate and the tooth punching plate, the upper guide sleeve is fixedly clamped on the stripper plate, the lower guide sleeve is fixedly clamped on the concave die plate, and the bottom of the inner guide pillar movably penetrates through the corresponding upper guide sleeve and can be movably clamped in the corresponding lower guide sleeve.
Preferably, threaded mounting has the first hex bolts that is the distribution of rectangle array between upper junction plate, the tooth punching plate, the card can be dismantled between upper junction plate, the tooth punching plate and be equipped with first locating pin.
Preferably, a second discharging screw is installed between the soil platen and the lower connecting plate in a threaded mode.
Preferably, the second hexagon screws distributed in a rectangular array are installed between the lower connecting plate and the concave template in a threaded mode, and the second positioning pins are detachably clamped between the lower connecting plate and the concave template.
Preferably, the top end screw thread of roof is inserted and is equipped with the third hex head cap screw that is the rectangular array and distributes, the bottom screw thread joint of third hex head cap screw is on the upper junction plate.
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. the utility model discloses, through setting up the interior guiding mechanism, when the roof moves down and drives the stripper plate to move down and contact with the die plate, the activity of inner guide pillar bottom passes corresponding upper guide pin bushing and activity joint is in corresponding lower guide pin bushing, carries out the guide removal of stripper plate and die plate, thereby has promoted the stability of relative movement of stripper plate and die plate, has further promoted the stability when whole flexible line way board mold processing uses, thereby has promoted the processing effect of flexible line way board;
2. through setting up silica gel spring and buffer spring, the roof moves down to drive takes off the flitch and moves down and carry out the contact with the die board, cushions the contact of taking off flitch and die board through silica gel spring and buffer spring to prevent to take off the direct rigid contact of flitch and die board and cause the flexible line way board to damage, thereby promoted the processing effect of flexible line way board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the structural connection of the inner guide mechanism of the present invention.
Fig. 3 is a connection diagram of a middle part structure of the present invention.
In the figure: 1. a soil platen; 2. a top plate; 3. a lower connecting plate; 4. a cavity plate; 5. an upper connecting plate; 6. a tooth punching plate is punched; 7. a material removing plate; 8. an inner guide mechanism; 81. an inner guide post; 82. an upper guide sleeve; 83. a lower guide sleeve; 9. An outer guide post and a guide sleeve; 10. a first discharge screw; 11. a silicone spring; 12. a buffer spring; 13. a first hexagonal screw; 14. a first positioning pin; 15. a second discharge screw; 16. a second hexagonal screw; 17. a second positioning pin; 18. a third hexagonal screw; 19. and (5) a foot pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b): as shown in fig. 1-3, the utility model provides a flexible printed circuit board processing mold, which comprises a soil platen 1 and a top plate 2, wherein the bottom end of the soil platen 1 is provided with a lower connecting plate 3, the top end of the lower connecting plate 3 is detachably provided with a concave template 4, the bottom end of the top plate 2 is detachably provided with an upper connecting plate 5, the bottom end of the upper connecting plate 5 is detachably provided with a tooth punching plate 6, the bottom end of the tooth punching plate 6 is provided with a stripper plate 7, a buffer space is reserved between the tooth punching plate 6 and the stripper plate 7, the opposite sides of the soil platen 1 and the top plate 2 are provided with symmetrically distributed outer guide pillar guide sleeves 9, and by arranging the outer guide pillar guide sleeves 9, when the whole flexible printed circuit board processing mold is used, the relative movement of the soil platen 1 and the top plate 2 is guided, so that the stability when the top plate 2 moves downwards is improved, and the stability when the whole flexible printed circuit board processing mold is used is improved, inner guide mechanisms 8 distributed in a rectangular array are arranged among the concave template 4, the upper connecting plate 5, the tooth punching plate 6 and the stripper plate 7, and pad feet 19 distributed symmetrically are fixedly arranged at the bottom end of the soil bedplate 1 to support the whole flexible circuit board processing mold;
the top thread of the upper connecting plate 5 is inserted with a first discharging screw 10 distributed in a rectangular array, the bottom of the first discharging screw 10 penetrates through the tooth punching plate 6 and is movably sleeved with a silica gel spring 11, the silica gel spring 11 is fixedly clamped in the tooth punching plate 6, the bottom end of the silica gel spring 11 is contacted with the top end of the stripper plate 7, the middle position of the upper connecting plate 5 and the tooth punching plate 6 is fixedly clamped with a buffer spring 12 distributed in a rectangular array, the bottom end of the buffer spring 12 is contacted with the top end of the stripper plate 7, when a processing die is used for processing a flexible circuit board, the top plate 2 moves down to drive the stripper plate 7 to move down to be contacted with the cavity plate 4, and during contact, the contact of the stripper plate 7 and the cavity plate 4 is buffered through the silica gel spring 11 and the buffer spring 12, so that the damage to the flexible circuit board caused by the direct rigid contact of the stripper plate 7 and the cavity plate 4 is prevented, thereby the processing effect of flexible line way board has been promoted.
The inner guide mechanism 8 comprises an inner guide post 81, an upper guide sleeve 82 and a lower guide sleeve 83, the inner guide post 81 is fixedly clamped on the upper connecting plate 5 and the tooth punching plate 6, the upper guide sleeve 82 is fixedly clamped on the stripper plate 7, the lower guide sleeve 83 is fixedly clamped on the concave template 4, the bottom of the inner guide post 81 movably passes through the corresponding upper guide sleeve 82 and can be movably clamped in the corresponding lower guide sleeve 83, when the top plate 2 moves downwards to drive the stripper plate 7 to move downwards to contact with the cavity plate 4, the bottom of the inner guide post 81 movably passes through the corresponding upper guide sleeve 82 and is movably clamped in the corresponding lower guide sleeve 83 to guide and move the stripper plate 7 and the cavity plate 4, thereby promoted the stability of taking off flitch 7 and 4 relative movements of die board, further promoted the stability when whole flexible line way board mold processing uses to the processing effect of flexible line way board has been promoted.
The utility model discloses a tooth punching machine, including upper junction plate 5, wash tooth plate 6, upper junction plate 5, wash tooth plate 6 between the screw thread install be the first hex head screw 13 that the rectangle array distributes, upper junction plate 5, wash tooth plate 6 between can dismantle the card and be equipped with first locating pin 14, conveniently carry out upper junction plate 5, wash the dismantlement maintenance between the tooth plate 6.
And a second discharging screw 15 is arranged between the soil platen 1 and the lower connecting plate 3 in a threaded manner, so that the soil platen 1 and the lower connecting plate 3 can be conveniently detached and overhauled.
The screw thread is installed between lower connecting plate 3, the die board 4 and is the second hex bolts 16 that the rectangle array distributes, can dismantle the card between lower connecting plate 3, the die board 4 and be equipped with second locating pin 17, conveniently carry out the dismantlement and the maintenance between lower connecting plate 3, the die board 4.
The top end screw thread of roof 2 is inserted and is equipped with third hex head cap screw 18 that is the rectangular array and distributes, the bottom screw thread joint of third hex head cap screw 18 is on upper junction plate 5, conveniently carries out the dismantlement and the maintenance between roof 2 and the upper junction plate 5.
The working principle is as follows: the utility model relates to a flexible circuit board mold processing, in use, roof 2 moves down, through the outer guide pillar guide pin bushing 9 that sets up, the relative movement to soil platen 1 and roof 2 is led, thereby the stability when roof 2 moves down has been promoted, and then the stability when whole flexible circuit board mold processing uses has been promoted, roof 2 moves down and drives stripper plate 7 to move down and cavity die plate 4 to contact, the activity of inner guide pillar 81 bottom passes corresponding upper guide pin bushing 82 and the activity joint is in corresponding lower guide pin bushing 83, the guide movement of stripper plate 7 and cavity die plate 4 is carried out, thereby the stability of the relative movement of stripper plate 7 and cavity die plate 4 has been promoted, the stability when whole flexible circuit board mold processing uses has further been promoted;
meanwhile, the contact between the stripper plate 7 and the cavity plate 4 is buffered through the silica gel spring 11 and the buffer spring 12, so that the damage of the flexible circuit board caused by the direct rigid contact between the stripper plate 7 and the cavity plate 4 is prevented, and the processing effect of the flexible circuit board is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The utility model provides a flexible line way board mold processing, includes soil platen (1) and roof (2), its characterized in that: the bottom end of the soil platen (1) is provided with a lower connecting plate (3), the top end of the lower connecting plate (3) is detachably provided with a concave template (4), the bottom end of the top plate (2) is detachably provided with an upper connecting plate (5), the bottom end of the upper connecting plate (5) is detachably provided with a tooth punching plate (6), the bottom end of the tooth punching plate (6) is provided with a stripper plate (7), the opposite sides of the soil platen (1) and the top plate (2) are provided with symmetrically distributed outer guide pillar guide sleeves (9), inner guide mechanisms (8) distributed in a rectangular array are arranged among the concave template (4), the upper connecting plate (5), the tooth punching plate (6) and the stripper plate (7), and the bottom end of the soil platen (1) is fixedly provided with symmetrically distributed pad feet (19);
the top thread of upper junction plate (5) is inserted and is equipped with first screw (10) of unloading that is the rectangular array and distributes, the bottom of first screw (10) of unloading is worn die block (6) and the activity cover is equipped with silica gel spring (11), silica gel spring (11) fixed joint is in die block (6), the bottom of silica gel spring (11) and the top contact of taking off flitch (7), upper junction plate (5), die block (6) middle part position fixing card are equipped with buffer spring (12) that are the rectangular array and distribute, the bottom of buffer spring (12) and the top contact of taking off flitch (7).
2. The flexible printed circuit board processing mold according to claim 1, wherein the inner guide mechanism (8) comprises an inner guide post (81), an upper guide sleeve (82) and a lower guide sleeve (83), the inner guide post (81) is fixedly clamped on the upper connecting plate (5) and the tooth punching plate (6), the upper guide sleeve (82) is fixedly clamped on the stripper plate (7), the lower guide sleeve (83) is fixedly clamped on the cavity plate (4), and the bottom of the inner guide post (81) movably penetrates through the corresponding upper guide sleeve (82) and can be movably clamped in the corresponding lower guide sleeve (83).
3. The flexible circuit board processing die of claim 1, wherein first hexagon screws (13) distributed in a rectangular array are installed between the upper connecting plate (5) and the tooth punching plate (6) in a threaded manner, and a first positioning pin (14) is detachably clamped between the upper connecting plate (5) and the tooth punching plate (6).
4. The flexible circuit board processing die of claim 1, wherein a second discharging screw (15) is threadedly mounted between the soil platen (1) and the lower connecting plate (3).
5. The flexible circuit board processing mold according to claim 1, wherein second hexagon screws (16) distributed in a rectangular array are installed between the lower connecting plate (3) and the cavity plate (4) in a threaded manner, and second positioning pins (17) are detachably clamped between the lower connecting plate (3) and the cavity plate (4).
6. The flexible circuit board processing mold according to claim 1, wherein third hexagonal screws (18) distributed in a rectangular array are inserted into the top threads of the top plate (2), and the bottom threads of the third hexagonal screws (18) are clamped on the upper connecting plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122641174.4U CN216017297U (en) | 2021-10-29 | 2021-10-29 | Flexible circuit board mold processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122641174.4U CN216017297U (en) | 2021-10-29 | 2021-10-29 | Flexible circuit board mold processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216017297U true CN216017297U (en) | 2022-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122641174.4U Active CN216017297U (en) | 2021-10-29 | 2021-10-29 | Flexible circuit board mold processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216017297U (en) |
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2021
- 2021-10-29 CN CN202122641174.4U patent/CN216017297U/en active Active
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