CN216017252U - Wearable equipment - Google Patents

Wearable equipment Download PDF

Info

Publication number
CN216017252U
CN216017252U CN202122034291.4U CN202122034291U CN216017252U CN 216017252 U CN216017252 U CN 216017252U CN 202122034291 U CN202122034291 U CN 202122034291U CN 216017252 U CN216017252 U CN 216017252U
Authority
CN
China
Prior art keywords
circuit board
shielding
top cover
wearable device
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122034291.4U
Other languages
Chinese (zh)
Inventor
牛杰爽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Techology Co Ltd
Original Assignee
Goertek Techology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Techology Co Ltd filed Critical Goertek Techology Co Ltd
Priority to CN202122034291.4U priority Critical patent/CN216017252U/en
Application granted granted Critical
Publication of CN216017252U publication Critical patent/CN216017252U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The application provides wearable equipment, which comprises a flexible injection molding piece, wherein a functional module is arranged in the flexible injection molding piece, the functional module comprises a circuit board, and one side of the circuit board is provided with an element; the shielding cover is arranged on the circuit board, the circuit board and the shielding cover are arranged in an enclosing mode to form a shielding cavity, and the component is located in the shielding cavity; wherein, the shielding cavity is internally provided with a flexible supporting part. This application is through setting up the shielding lid on the circuit board, and sets up flexible supporting part in the shielding intracavity that forms between shielding lid and circuit board, can increase the intensity of circuit board, avoids the circuit board to warp the damage easily under the exogenic action, has strengthened the anti mechanical destruction's of wearable equipment ability.

Description

Wearable equipment
Technical Field
The application belongs to the technical field of insert molding, and particularly relates to wearable equipment.
Background
In order to reduce the size of the wearable device, a flexible portion of the wearable device for wearing, such as a bending portion on a bracelet or a watch band of a watch, may be provided with an accommodating space for placing a circuit board. When wearing part at wearable equipment produces great bending or bears great external force, the circuit board can take place deformation and lead to damaging under the effect of external force, perhaps lead to the damage or the short circuit of the components and parts of installation on the circuit board, weaken wearable equipment resistance to mechanical damage's ability.
SUMMERY OF THE UTILITY MODEL
The application aims at providing a wearable device, and solves the problem that a circuit board arranged on a flexible part is easy to deform and damage in the existing wearable device.
The application provides a wearable equipment, including flexible injection molding, be provided with functional module in the flexible injection molding, functional module includes:
the circuit board is provided with a component on one side;
the shielding cover is arranged on the circuit board, the circuit board and the shielding cover are arranged in an enclosing mode to form a shielding cavity, and the component is located in the shielding cavity;
wherein, the shielding cavity is internally provided with a flexible supporting part.
Optionally, the shielding cover includes a top cover and a side wall extending to the same side of the top cover along the periphery of the top cover, and one end of the side wall, which is far away from the top cover, is seamlessly welded to the circuit board along the circumferential direction of the side wall.
Optionally, the top cover is provided with at least 1 filling hole, and the filling hole is located in a geometric center region of the top cover.
Optionally, the top cover is provided with at least two air release holes, the air release holes are distributed on the periphery of the top cover far away from the filling hole, and the diameter of the filling hole is larger than that of the air release hole.
Optionally, at least two strip-shaped reinforcing grooves are distributed on the top cover, and all the reinforcing grooves are arranged in parallel.
Optionally, the shielding cover further includes at least two supporting pillars, one end of each of the supporting pillars is fixedly disposed on the top cover and faces one side of the circuit board, the other end of each of the supporting pillars faces the circuit board, and all the supporting pillars are symmetrically distributed on the top cover.
Optionally, a reinforcing plate is fixedly disposed at a central portion of the other side of the circuit board, the reinforcing plate is of a wave-shaped structure, and a projection area of the reinforcing plate on the circuit board is at least larger than a half area of the circuit board.
Optionally, a first reinforcing rib and a second reinforcing rib are fixedly arranged on the other side of the circuit board, the first reinforcing rib and the second reinforcing rib are arranged in a crossed manner, and the projection of the first reinforcing rib and the projection of the second reinforcing rib on the circuit board do not exceed the circuit board.
Optionally, the flexible supporting part fills the shielding cavity; or the flexible supporting part does not fill the shielding cavity, but occupies more than eighty percent of the space of the shielding cavity.
Optionally, the flexible injection molding piece and the functional module are integrally injection molded.
Optionally, the wearable device comprises an electronic watch, and the flexible injection molded piece comprises a watchband.
The technical effect of application lies in, through set up the shielding lid on the circuit board, and sets up flexible supporting part in the shielding intracavity that forms between shielding lid and circuit board, can increase the intensity of circuit board, avoids the circuit board to warp the damage easily under the exogenic action, has strengthened the anti mechanical destruction's of wearable equipment ability.
Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a perspective view of a functional module provided herein;
FIG. 2 is a cross-sectional view of a first embodiment of a functional module;
FIG. 3 is a cross-sectional view of a second embodiment of a functional module;
FIG. 4 is a first angled perspective view of the first embodiment of the shield cover;
FIG. 5 is a second angular perspective view of the first embodiment of the shield cover;
FIG. 6 is a perspective view of a second embodiment of the shield cover;
FIG. 7 is a schematic view of the stiffener plate mounted on a circuit board;
fig. 8 is a schematic view of the first reinforcing rib and the second reinforcing rib mounted on the circuit board.
Reference numerals:
1. a flexible injection molded part; 2. a circuit board; 3. a shield cover; 31. a top cover; 32. a side wall; 4. a flexible support portion; 5. filling the hole; 6. an air release hole; 7. reinforcing the grooves; 8. a support pillar; 9. a reinforcing plate; 10. a first reinforcing rib; 11. and a second reinforcing rib.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The application provides a wearable device, including flexible injection molding 1, be provided with functional module in the flexible injection molding 1, as shown in fig. 1-8, functional module can embed components and parts such as chip, functional module can communicate with wearable device's circuit to realize the corresponding function of wearable device through the operation procedure in functional module, set components and parts such as chip in flexible injection molding 1, can make full use of whole wearable device's space, avoided the integrated setting of components and parts, reduced the shared space of components and parts integration.
Specifically, the functional module may include a circuit board 2 and a shielding cover 3, the circuit board 2 may be a PCB, the thickness of the circuit board 2 may be greater than 0.8 mm, components and parts are provided on one side of the circuit board 2, the components and parts are all electrically connected with the circuit board 2, and the components and parts may be components such as chips. The shielding cover 3 is of a cover-shaped structure, the shielding cover 3 is provided with an opening end, the opening end of the shielding cover 3 is fixedly arranged on the circuit board 2, the circuit board 2 and the shielding cover 3 are surrounded to form a shielding cavity at the moment, and the components are located in the shielding cavity. The shielding cover 3 fixedly arranged on the circuit board 2 can strengthen the strength of the circuit board 2, and when the circuit board 2 is subjected to external force, the shielding cover 3 can share part of the external force suffered by the circuit board 2, so that the stress of the circuit board 2 is reduced, and the problem that the circuit board 2 is deformed by the external force to cause damage is reduced; meanwhile, the shielding cover 3 can shield the influence of external electromagnetic waves on the components and circuits in the shielding cavity, and can prevent the electromagnetic waves emitted by the components and circuits in the shielding cavity from radiating outside the shielding cavity. The shielding cover 3 may be made of metal material, such as cupronickel, galvanized steel sheet or stainless steel sheet, and the shielding cover 3 may be connected to the reference ground on the circuit board 2, so as to enhance the shielding effect of the shielding cover 3. The shielding cover 3 is preferably made of tin-plated SUS304H with a thickness of 0.2mm or more.
The flexible supporting part 4 is arranged in the shielding cavity, and the flexible supporting part 4 can be filled in the shielding cavity, so that the flexible supporting part 4 can play a supporting role, further the flexible supporting part 4 can share part of external force borne by the circuit board 2, and the problem that the circuit board 2 is easy to deform due to the external force is further reduced; simultaneously under the condition that does not fill flexible support portion 4 in 3 intracavity of shield cover, the inside that shield cover 3 is at is hollow structure, when shield cover 3 received the effect of external force, shield cover 3 warp easily and cause the components and parts damage on circuit board 2 in the shielding space, short circuit scheduling problem, and when set up flexible support portion 4 in the shielding intracavity, flexible support portion 4 can provide the support for shield cover 3, prevent shield cover 3 pressurized deformation, and further prevent that shield cover 3 from warping and damaging the components and parts on circuit board 2.
Wherein, the shielding chamber can be filled up to flexible supporting part 4, also can not fill up the shielding chamber, but flexible supporting part 4 occupies the space more than eighty percent of shielding chamber at least to can realize flexible supporting part 4's supporting role. The flexible supporting part 4 can be filled into the shielding cavity before the shielding cover 3 is fixedly arranged on the circuit board 2, the shielding cover 3 is fixedly connected with the circuit board 2 after the flexible supporting part 4 is filled, and the flexible supporting part 4 can also be filled into the shielding cavity after the shielding cover 3 is fixed on the circuit board 2.
This application is through setting up shielding lid 3 on circuit board 2, and sets up flexible support portion 4 in the shielding intracavity that forms between shielding lid 3 and circuit board 2, can increase circuit board 2's intensity, avoids circuit board 2 to warp the damage easily under the exogenic action, has strengthened the ability of wearable equipment anti mechanical damage.
The flexibility of the flexible support portion 4 may be the same as the flexibility of the flexible injection molded part 1 on the electronic device, or the flexibility of the flexible support portion 4 may be smaller than the flexibility on the electronic injection molded part.
Optionally, the shielding cover 3 includes a top cover 31 and a side wall 32 extending to the same side of the top cover 31 along the periphery of the top cover 31, that is, the shielding cover 3 is a cover-shaped structure with an opening at one end, the end of the side wall 32 of the shielding cover 3 far from the top cover 31 is a continuous end surface in the circumferential direction, and along the circumferential direction of the side wall 32, the end of the side wall 32 far from the top cover 31 is welded to the circuit board 2 seamlessly, that is, the end of the side wall 32 of the shielding cover 3 far from the top cover 31 is welded to the circuit board 2, and the end surface of the side wall 32 of the shielding cover 3 is welded to the circuit board 2 continuously, so that no gap is left in the connection between the side wall 32 and the circuit board 2 in the circumferential direction, the sealing function can be achieved, the flexible supporting portion 4 is prevented from leaking out from the gap between the side wall 32 of the shielding cover 3 and the circuit board 2, the flexible supporting portion 4 is ensured to be reliably disposed in the shielding cavity, and the flexible supporting function of the shielding cover 4 can be achieved, the situation that the circuit board 2 is deformed and damaged by external force is reduced. The shielding cover 3 can be SMT welded on the circuit board 2 in a closed ring mode, the design width of a welding leg is larger than 0.4mm, and the welding design does not allow a breakpoint.
Optionally, the top cover 31 is provided with at least 1 filling hole 5, after the shielding cover 3 is fixed on the circuit board 2, the flexible supporting portion 4 can be filled into the shielding cavity through the filling hole 5, the filling hole 5 is located in a geometric center region of the top cover 31, for example, when the top cover 31 is rectangular, the filling hole 5 is located at an intersection point of diagonal lines of the top cover 31 and a region near the intersection point, when the number of the filling holes 5 is 1, the filling hole 5 may be disposed at the intersection point of the diagonal lines, and when the number of the filling holes 5 is plural, all the filling holes 5 may be disposed near the intersection point of the diagonal lines around the intersection point of the diagonal lines. With filling hole 5 setting in the geometric centre region of top cap 31, can make flexible supporting part 4 fill at the shielding intracavity uniformly when filling flexible supporting part 4, the one end that can not appear the shielding chamber has been filled up, and the other end in shielding chamber still is in the condition of hollow state, is favorable to flexible supporting part 4's evenly distributed. Wherein, flexible supporting part 4 can be the capillary bottom filling of silica gel or epoxy adhesive class makes agent glue, pours into the shielding chamber into with foretell glue from filling hole 5 in fluid state, and after the glue that is located the shielding intracavity solidifies completely, in the flexible injection molding 1 of setting up wearable equipment with whole functional module can. The diameter of the filling hole 5 is larger than 1 mm.
Optionally, two at least disappointing holes 6 have been seted up on top cap 31, disappointing hole 6 distributes and keeps away from the week side of filling hole 5 on top cap 31, the diameter of filling hole 5 is greater than the diameter of disappointing hole 6, can discharge the air current in the shielding through disappointing hole 6, for example when filling hole 5 to shielding chamber packing silica gel, under the state of silica gel from the middle part in shielding chamber to the both sides motion in shielding chamber, silica gel that flows to shielding chamber both sides can extrude the air to shielding chamber's lateral wall 32, the disappointing hole 6 discharge that is located top cap 31 week side just can be followed to the extruded air, guarantee that glue can fill completely in shielding space, make the glue after the solidification can play supporting role effectively. Meanwhile, the diameter of the filling hole 5 is larger than that of the air leakage hole 6, the flexible supporting part 4 can be smoothly filled through the filling hole 5, and the air leakage hole 6 can be guaranteed not to leak glue out of the shielding cavity while having the air leakage function. The air relief holes 6 may be evenly distributed on the top cover 31.
Optionally, at least two strip-shaped reinforcing grooves 7 are distributed on the top cover 31, and the reinforcing grooves 7 can form a support structure in space, so that the strength of the shielding cover 3 is ensured, and the shielding cover 3 is not prone to stress deformation. All strengthen recess 7 parallel arrangement, can strengthen the atress degree in the direction parallel with strengthening recess 7 pertinence, and then relatively weaker with strengthening the atress in the perpendicular orientation of recess 7, in this direction, can guarantee that shield cover 3 has certain deformability, the actual service environment of laminating product. The shielding cover 3 and the reinforcing groove 7 can be formed by stamping, stretching and forming through metal plates, and the manufacturing is simple and convenient. The reinforcing grooves 7 may be evenly distributed on the shield cover 3.
Optionally, the shielding cover 3 further includes at least two supporting pillars 8, one end of each of the supporting pillars 8 is fixedly disposed on the top cover 31 and faces one side of the circuit board 2, the other end of each of the supporting pillars 8 faces the circuit board 2, and the supporting pillars 8 are symmetrically distributed on the top cover 31, so that the deformation resistance of the shielding cover 3 can be improved by the supporting pillars 8. When the shielding cover 3 is fixedly arranged on the circuit board 2, the end part of the support column 8 facing one side of the circuit board 2 can be just in surface contact with the circuit board 2, and the pressure resistance of the shielding cover 3 is further ensured. It should be noted that the design of the support posts 8 is considered to avoid components in the shielding cavity.
Optionally, a reinforcing plate 9 is fixedly disposed at a central portion of the other side of the circuit board 2 (the other side is opposite to the side where the component is disposed, and the other side of the example circuit board in fig. 3 is the lower surface of the circuit board), the reinforcing plate 9 is of a wave-shaped structure, and has the same stress characteristics as the reinforcing groove 7, so that the stress degree in the direction parallel to the extending direction of a single wave can be reinforced in a targeted manner, the projection area of the reinforcing plate 9 on the circuit board 2 is at least larger than half of the area of the circuit board 2, more external force can be shared by the circuit board 2, and the problem that the circuit board 2 is deformed and damaged due to large stress is avoided. Further, the extension direction of a single wave on the wave-like structure may coincide with the extension direction of a single reinforcing groove 7.
Optionally, a first reinforcing rib 10 and a second reinforcing rib 11 are fixedly arranged on the other side of the circuit board 2, the first reinforcing rib 10 and the second reinforcing rib 11 are arranged in a crossed manner, for example, the first reinforcing rib 10 is arranged along the width direction of the circuit board 2, the second reinforcing rib 11 is arranged along the length of the circuit board 2, and the first reinforcing rib 10 and the second reinforcing rib 11 are crossed, so that part of external force borne by the circuit board 2 can be borne, and the circuit board 2 is ensured not to be deformed and damaged by the external force, wherein the first reinforcing rib 10 and the second reinforcing rib 11 are of an integral structure, and the manufacturing and the installation are convenient; the projection of the first reinforcing ribs 10 and the second reinforcing ribs 11 on the circuit board 2 does not exceed the circuit board 2, that is, the first reinforcing ribs 10 and the second reinforcing ribs 11 do not exceed the range of the circuit board 2, so that materials can be saved, and the cost is guaranteed. Further, the first reinforcing bead 10 and the second reinforcing bead 11 may have a rectangular shape with a width greater than 0.6mm and a height greater than 0.4 mm.
Optionally, the flexible injection molding part 1 and the functional module are integrally injection molded, specifically, when the flexible injection molding part is injection molded, the functional module is simultaneously injection molded in the flexible injection molding part 1, so that the manufacturing process is simplified, the flexible injection molding part 1 can be waterproof, and the functional module is prevented from being incapable of normally working due to water inflow.
Optionally, the wearable device comprises an electronic watch and the flexible injection molded part 1 comprises a watch strap.
Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.

Claims (10)

1. The wearable device is characterized by comprising a flexible injection molding piece, wherein a functional module is arranged in the flexible injection molding piece, and the functional module comprises:
the circuit board is provided with a component on one side;
the shielding cover is arranged on the circuit board, the circuit board and the shielding cover are arranged in an enclosing mode to form a shielding cavity, and the component is located in the shielding cavity;
wherein, the shielding cavity is internally provided with a flexible supporting part.
2. The wearable device according to claim 1, wherein the shielding cover comprises a top cover and a side wall extending along the periphery of the top cover to the same side of the top cover, and one end of the side wall away from the top cover is seamlessly welded with the circuit board along the circumference of the side wall.
3. The wearable device of claim 2, wherein the top cover defines at least 1 fill hole, the fill hole being located in a geometrically central region of the top cover.
4. The wearable device according to claim 3, wherein the top cover has at least two air release holes formed thereon, the air release holes are distributed on a peripheral side of the top cover away from the filling hole, and the diameter of the filling hole is larger than that of the air release holes.
5. The wearable device according to claim 2, wherein at least two strip-shaped reinforcing grooves are distributed on the top cover, and all the reinforcing grooves are arranged in parallel.
6. The wearable device of claim 2, wherein the shielding cover further comprises at least two support posts, one end of each support post is fixedly disposed on the top cover and faces one side of the circuit board, the other end of each support post faces the circuit board, and all the support posts are symmetrically distributed on the top cover.
7. The wearable device according to claim 1, wherein a reinforcing plate is fixedly arranged at the central part of the other side of the circuit board, the reinforcing plate is of a wave-shaped structure, and the projection area of the reinforcing plate on the circuit board is at least larger than half of the area of the circuit board; alternatively, the first and second electrodes may be,
the other side of the circuit board is fixedly provided with a first reinforcing rib and a second reinforcing rib, the first reinforcing rib and the second reinforcing rib are arranged in a crossed mode, and the projection of the first reinforcing rib and the projection of the second reinforcing rib on the circuit board are not more than that of the circuit board.
8. The wearable device of claim 1,
the flexible supporting part fills the shielding cavity; alternatively, the first and second electrodes may be,
the flexible support part does not fill the shielding cavity, but occupies more than eighty percent of the space of the shielding cavity.
9. The wearable device of claim 1, wherein the flexible injection molded piece is integrally injection molded with the functional module.
10. The wearable device of claim 1, wherein the wearable device comprises an electronic watch and the flexible injection molded piece comprises a watch band.
CN202122034291.4U 2021-08-26 2021-08-26 Wearable equipment Active CN216017252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122034291.4U CN216017252U (en) 2021-08-26 2021-08-26 Wearable equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122034291.4U CN216017252U (en) 2021-08-26 2021-08-26 Wearable equipment

Publications (1)

Publication Number Publication Date
CN216017252U true CN216017252U (en) 2022-03-11

Family

ID=80594904

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122034291.4U Active CN216017252U (en) 2021-08-26 2021-08-26 Wearable equipment

Country Status (1)

Country Link
CN (1) CN216017252U (en)

Similar Documents

Publication Publication Date Title
US11736856B2 (en) Earphone device
KR101216419B1 (en) Secondary Battery of Improved Sealability
JP6793175B2 (en) SiP module and its manufacturing method
CN109300859A (en) A kind of protectiveness chip package frame
CN207053578U (en) Microphone sealing structure and mobile phone
JP6065294B2 (en) Pouch-type battery
CN216017252U (en) Wearable equipment
US20040180475A1 (en) Mold die and method for manufacturing semiconductor device using the same
TWI382519B (en) Electronic element packaging module by using a cap
JP4155373B2 (en) Battery pack for small electrical equipment
CN112820990B (en) Battery with a battery cell
CN210325756U (en) Heat dissipation encapsulation triode
CN113451233B (en) TVS diode packaging structure
CN209016019U (en) Package assembling
CN108198804B (en) Stack packaging structure with pin side wall tin climbing function and manufacturing process thereof
CN213546311U (en) Waterproof shell for protecting integrated circuit chip
CN208190908U (en) A kind of electronic device
CN220569782U (en) Cover plate of hard shell cell and hard shell cell
CN220121837U (en) Lead frame with prevent collapsing limit structure
CN218160673U (en) Battery pack
CN217641680U (en) Modularized battery
CN213691997U (en) Metal packaging shell of ceramic packaging
CN213017143U (en) Mould and mould assembly
CN213026290U (en) Battery and electronic device
CN211715763U (en) A sealing strip and encapsulating structure for encapsulating

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant