CN216017231U

CN216017231U - PCB jointed board

Info

Publication number: CN216017231U
Application number: CN202122481602.1U
Authority: CN
Inventors: 秦天祥; 罗军; 苏瑞; 范欣; 杨韬
Original assignee: Sichuan Changhong Precision Electronic Technology Co ltd; Sichan Ai Chance Technology Co ltd
Current assignee: Sichuan Changhong Precision Electronic Technology Co ltd; Sichan Ai Chance Technology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-03-11
Anticipated expiration: 2031-10-14

Abstract

The utility model relates to a PCB makeup belongs to PCB board and makes the field. The PCB jointed board comprises a technical edge arranged at the edge of the PCB jointed board, the PCB jointed board is formed by splicing at least 2 PCB sub-boards, and each PCB sub-board is provided with a plurality of patch elements; two adjacent PCB daughter boards are connected through a first V-CUT, and the process edge is connected with the adjacent PCB daughter board through a second V-CUT; defining the board edge of a PCB daughter board with a patch element at the board edge as a first board edge, wherein a first groove is formed in the first board edge and/or the board edge of the PCB daughter board adjacent to the first board edge at a first position, a first groove is formed in the first board edge and/or the board edge of a process edge adjacent to the first board edge at a second position, and the arrangement position of the first groove corresponds to the arrangement position of the patch element; use the utility model discloses the device not only does not harm the corresponding side paster component at the minute board, still can make the space utilization height of the platoon board overall arrangement of PCB daughter board.

Description

PCB jointed board

Technical Field

The utility model relates to a PCB makeup belongs to PCB board and makes the field.

Background

The production of PCB board usually can carry out the makeup operation, the aim at of makeup: reduce the waste material, promote SMT production efficiency, promote and transport and efficiency of software testing etc.. When the jointed board is designed, in order to save the PCB plates, V-shaped groove technology is often adopted to divide the PCB single boards in the jointed board. Aiming at the V-shaped groove process, in order to avoid damaging components due to stress during board splitting operation, the distance between a chip component packaging pad and the edge of a PCB (printed circuit board) is generally recommended to be more than or equal to 3mm in the industry. In compact product development and application occasions, sometimes, the board distribution space of components of a PCB is insufficient, and the distance between a packaging pad of part of the patch elements and the edge of the PCB is less than 3mm, and at the moment, a V-shaped groove process is adopted, so that the stress of the sub-board can damage the patch parts close to the edge of the board during board splitting operation.

Patent document No. CN203661414U discloses a PCB jointed board, which is formed by splicing at least two PCB sub-boards, each PCB sub-board is provided with a plurality of patch parts, and at least one hollow groove is provided at a position close to the patch part and/or at a board edge of another PCB sub-board adjacent to each PCB sub-board and/or an adjacent process edge. Although the hollow-out grooves are arranged, the problem that the patch parts close to the board edges are damaged due to board separating stress can be solved, after the hollow-out grooves are arranged, components or wires cannot be placed or routed at the positions of the hollow-out grooves, and therefore the board arrangement layout space utilization rate of the PCB sub-boards is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the PCB jointed board has high space utilization rate of PCB daughter board and board layout.

The utility model provides a technical scheme that its technical problem adopted is: the PCB jointed board comprises a technical edge arranged at the edge of the PCB jointed board, the PCB jointed board is formed by splicing at least 2 PCB sub-boards, and each PCB sub-board is provided with a plurality of patch elements; two adjacent PCB daughter boards are connected through a first V-CUT, the process edge is connected with the adjacent PCB daughter board through a second V-CUT, and at least one board edge of the PCB daughter board is provided with a patch element;

the PCB sub-board comprises a PCB sub-board body and is characterized by further comprising a first groove, the edge of the PCB sub-board with the patch element arranged on the edge of the board is defined as a first board edge, the first groove is provided with two positions, when the first position is adopted, the first board edge and/or the edge of the PCB sub-board adjacent to the first board edge are/is provided with the first groove, when the second position is adopted, the first board edge and/or the edge of the board adjacent to the process edge of the first board edge are/is provided with the first groove, and the arrangement position of the first groove corresponds to the arrangement position of the patch element;

the groove depth of the first groove is a third groove depth c, the groove depth of the first V-CUT is a first groove depth a, the groove depth of the second V-CUT is a second groove depth, the sum of the third groove depth c and the first groove depth a is larger than or equal to the plate thickness of the PCB daughter board, and the sum of the third groove depth c and the second groove depth is larger than or equal to the plate thickness of the PCB daughter board; in the second position, the groove bottom of the first groove extends to the second V-CUT, and in the first position, the groove bottom of the first groove extends to the first V-CUT.

Furthermore, the outline of each PCB daughter board is consistent.

Further, in the second position, the side of the first groove in the length direction is parallel to the second V-CUT, and in the first position, the side of the first groove in the length direction is parallel to the first V-CUT.

Further, in the second position, the length of the first groove is larger than or equal to the length of the patch element in the second V-CUT direction, and in the first position, the length of the first groove is larger than or equal to the length of the patch element in the first V-CUT direction.

Further, the width of the first groove is 0.9 mm-1.1 mm.

Further, the first groove depth a and the second groove depth c are thicknesses of 1/3PCB sub-boards, and the third groove depth c is a thickness of 2/3PCB sub-boards.

Furthermore, the first groove is formed in the opposite surface of one surface of the PCB daughter board provided with the patch element.

The utility model has the advantages that:

the utility model discloses seted up first recess, when the second position, the tank bottom of first recess extends to second V-CUT, when the first position, the tank bottom of first recess extends to first V-CUT, so can guarantee that first recess just right surplus PCB daughter board has been CUT off by first V-CUT or second V-CUT, does not produce stress during the branch board, does not harm and corresponds the paster component that leans on the limit. In addition, on the one hand: because the first groove is not a hollow groove, the opposite surface of one surface of the PCB daughter board, which is provided with the first groove, is not damaged, so that components, wires and the like can be normally placed on the opposite surface of the PCB daughter board, which is opposite to the first groove; on the other hand: the hollowed-out groove can shorten creepage distance between components and parts, copper sheets and wiring on two sides of the PCB daughter board, the components and parts, the copper sheets and the wiring area can be increased due to prohibition of setting of insulation safety distance requirements, available space is correspondingly reduced when the PCB daughter board is arranged, and the problem can be avoided by arranging the first groove with depth. Therefore, the first groove with the depth is formed, and the space utilization rate of the layout of the PCB daughter boards is high.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the utility model at B;

FIG. 3 is a cross-sectional view of the groove of the present invention along line A-A in a first state;

FIG. 4 is a cross-sectional view of the groove of the present invention taken along line A-A in a second state;

fig. 5 is a cross-sectional view of the groove of the present invention along the line a-a in the third state.

Labeled as: 1 is a PCB jointed board, 12 is a PCB daughter board, 14 is a technical edge, 20 is a chip element, 30 is a first groove, 32 is a second groove, 40 is a first V-CUT, 42 is a second V-CUT, a is a first groove depth, and c is a third groove depth.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings.

As shown in fig. 1 to 5, the PCB jointed board of the present invention includes a technical edge 14 disposed at the edge of the PCB jointed board 1, the PCB jointed board 1 is formed by splicing at least 2 PCB sub-boards 12, and each PCB sub-board 12 is provided with a plurality of patch elements 20; two adjacent PCB daughter boards 12 are connected through a first V-CUT40, the technical edge 14 is connected with the adjacent PCB daughter board 12 through a second V-CUT42, and at least one board edge of the PCB daughter board is provided with a patch element 20;

the PCB sub-board comprises a PCB sub-board 12 and a first groove 30, wherein the PCB sub-board 12 is provided with a patch element 20 at one board edge, the first groove 30 is provided with two positions, the first groove 30 is arranged at the first board edge and/or the board edge of the PCB sub-board 12 adjacent to the first board edge at the first position, the first groove 30 is arranged at the first board edge and/or the board edge of a process edge 14 adjacent to the first board edge at the second position, and the arrangement position of the first groove 30 corresponds to the arrangement position of the patch element 20;

the groove depth of the first groove 30 is a third groove depth c, the groove depth of the first V-CUT40 is a first groove depth a, the groove depth of the second V-CUT42 is a second groove depth, the sum of the third groove depth c and the first groove depth a is larger than or equal to the plate thickness of the PCB sub-plate 12, and the sum of the third groove depth c and the second groove depth is larger than or equal to the plate thickness of the PCB sub-plate 12; in the second position, the groove bottom of the first groove 30 extends to the second V-CUT42, and in the first position, the groove bottom of the first groove 30 extends to the first V-CUT 40. Specifically, the first V-CUT40 and the second V-CUT42 are both V-shaped grooves formed in the front face and the back face of the PCB daughter board. The first V-CUT40 and the second V-CUT42 are beneficial for separating plates of operators. In the first position, the first groove 30 has three states, as shown in fig. 3, the first groove 30 is in the first state, and the first groove 30 is opened at the board edge of the PCB sub-board 12 adjacent to the PCB sub-board 12 having the patch element 20 at the board edge; as shown in fig. 4, the first groove 30 is in the second state, and the first groove 30 is opened at the board edge of the PCB sub-board 12 provided with the patch element 20 at the board edge; as shown in fig. 5, the first groove 30 is in a third state, and the first groove 30 is opened at the board edge of the PCB sub-board 12 having the patch element 20 at the board edge and the board edge of the PCB sub-board 12 adjacent to the board edge. The first recess 30 of the technical edge 14 is located in a manner consistent with that described above. In actual operation, the opening position of the first groove 30 can be selected according to the distance between the patch element 20 and the edge of the PCB sub-board 12 and the arrangement of other elements, wires, and the like.

In addition, in the second position, the groove bottom of the first groove 30 extends to the second V-CUT42, namely the first groove 30 is communicated with the second V-CUT42, and in the first position, the groove bottom of the first groove 30 extends to the first V-CUT40, namely the first groove 30 is communicated with the first V-CUT40, so that the residual PCB daughter board 12 opposite to the first groove 30 is CUT by the first V-CUT40 or the second V-CUT42, stress is not generated during board splitting, and the corresponding edge-adjacent chip element 20 is not damaged. In addition, on the one hand: because the first groove 30 is not a hollow groove, the opposite surface of one surface of the PCB daughter board, which is provided with the first groove 30, is not damaged, so that components, wires and the like can be normally placed on the opposite surface of the PCB daughter board, which is opposite to the first groove 30; on the other hand: the hollowed-out grooves can shorten creepage distances between components, copper sheets and wires on two sides of the PCB daughter board, the layout area of the components, the copper sheets and the wires is increased due to prohibition of setting of insulation safety distance requirements, available space is correspondingly reduced when the layout of 12 rows of PCB daughter boards is reduced, and the problem can be avoided by arranging the first groove 30 with depth. Therefore, the first groove 30 with a depth is formed, so that the space utilization rate of the row board layout of the PCB sub-board 12 is high.

Preferably, each of the PCB daughter boards 12 has a uniform outer contour. Specifically, each PCB sub-board 12 is provided with a first groove 30, the rest of the PCB sub-boards 12 are provided with second grooves 32 at corresponding positions, and the first grooves 30 and the second grooves 32 have the same groove depth and contour. If the contour of each PCB daughter board 12 is not consistent, on one hand, the user receives various contour products, which easily questions the difference in product specification and performance, or the product has defects, etc., and the corresponding user usually cannot accept the difference in appearance. On the other hand, since the national security certification generally requires to standardize the outline of the PCB daughter board 12, if there are a plurality of outlines that need to be specified, the operation is troublesome during the security certification, and it is not in accordance with the common practice.

Preferably, the lengthwise side of the first groove 30 is parallel to the second V-CUT42 in the second position, and the lengthwise side of the first groove 30 is parallel to the first V-CUT40 in the first position. Specifically, in the first position, if the side of the first groove 30 in the length direction is not parallel to the first V-CUT40, the width of the first groove 30 will be increased along the direction of the first V-CUT40, which will affect the routing space, and the same applies in the second position.

When the length of first recess 30 is less than the length of patch element 20 in the direction of first V-CUT40 in the first position, although some of the stress is relieved and the risk of damage to patch element 20 is reduced, this arrangement still allows for the possibility of damage to patch element 20 due to the board-splitting stress when the board is split, and the same applies in the second position. As a preferred embodiment of the present invention, in the second position, the length of the first groove 30 is greater than or equal to the length of the patch element 20 along the second V-CUT42 direction, and in the first position, the length of the first groove 30 is greater than or equal to the length of the patch element 20 along the first V-CUT40 direction. Therefore, the patch parts can be better protected during board splitting, and the PCB daughter board 12 is prevented from being damaged by stress.

Preferably, the width of the first groove 30 is 0.9mm to 1.1 mm. Specifically, when the width of the groove is less than 0.9mm, the PCB processing is not facilitated; when the width of the first groove 30 is greater than 1.1mm, the board layout space of the PCB sub-board 12 is wasted, and the structural strength of the remaining PCB sub-board after the first groove 30 is disposed is reduced.

Preferably, the first groove depth a and the second groove depth c are 1/3 thicknesses of the PCB sub-board 12, and the third groove depth c is 2/3 thicknesses of the PCB sub-board 12. Specifically, if the third groove depth c is smaller than the plate thickness of 2/3PCB daughter board 12, the first groove depth a and the second groove depth are larger than the plate thickness of 1/3PCB daughter board 12, the remaining thickness of the joint of two adjacent PCB daughter boards is smaller than the plate thickness of 1/3PCB daughter board 12, so that the PCB jointed board is easy to break when transporting the PCB jointed board 1, and the broken PCB daughter board cannot be normally used. If the third groove depth c is larger than the thickness of the 2/3PCB sub-board 12, the structural strength of the remaining PCB sub-boards is reduced.

When the patch elements 20 are mounted on both sides of the PCB sub-board 12, the first groove 30 may be opened on any one of the two sides of the PCB sub-board 12, and the opening position may be determined according to the distance from the patch element 20 to the edge of the PCB sub-board 12; when the chip component 20 is mounted on only one surface of the PCB sub-board 12, as a preferable technical solution, the first groove 30 is disposed on an opposite surface of the PCB sub-board 12 on which the chip component 20 is disposed. If the first groove 30 is formed in the side where the patch element 20 is disposed, the distance from the patch element 20 to the PCB daughter board edge needs to be considered, and the first groove is formed in the opposite side of the side where the patch element 20 is disposed, so that the selectable positions of the position where the first groove 30 is formed are more, the distance from the patch element 20 to the PCB daughter board edge does not need to be considered, and the first groove 30 can be prevented from interfering with other elements.

While the present invention has been described in detail with reference to the preferred embodiments thereof, it should be understood that the above description should not be taken as limiting the present invention. Numerous modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims. Furthermore, all technical schemes of the utility model can be combined. The word "comprising" does not exclude the presence of other devices or steps than those listed in a claim or the specification; the terms "first," "second," and the like are used merely to denote names, and do not denote any particular order. In this context, "parallel," "perpendicular," and the like are not strictly mathematical and/or geometric limitations, but also encompass tolerances as would be understood by one skilled in the art and permitted by fabrication or use.

Claims

The PCB jointed board comprises a technical edge (14) arranged at the edge of the PCB jointed board (1), wherein the PCB jointed board (1) is formed by splicing at least 2 PCB sub-boards (12), and each PCB sub-board (12) is provided with a plurality of patch elements (20); two adjacent PCB daughter boards (12) are connected through a first V-CUT (40), the process edge (14) is connected with the adjacent PCB daughter board (12) through a second V-CUT (42), and at least one board edge of the PCB daughter board is provided with a patch element (20);

the method is characterized in that: the PCB structure comprises a PCB daughter board (12) and a first groove (30), wherein a patch element (20) is arranged on the edge of the PCB daughter board (12), the first groove (30) is provided with two positions, the first groove (30) is arranged on the edge of the first board and/or the edge of the PCB daughter board (12) adjacent to the edge of the first board at the first position, the first groove (30) is arranged on the edge of the first board and/or the edge of the process edge (14) adjacent to the edge of the first board at the second position, and the arrangement position of the first groove (30) corresponds to the arrangement position of the patch element (20);

the groove depth of the first groove (30) is a third groove depth (c), the groove depth of the first V-CUT (40) is a first groove depth (a), the groove depth of the second V-CUT (42) is a second groove depth, the sum of the third groove depth (c) and the first groove depth (a) is larger than or equal to the plate thickness of the PCB sub-plate (12), and the sum of the third groove depth (c) and the second groove depth is larger than or equal to the plate thickness of the PCB sub-plate (12); in the second position, the groove bottom of the first groove (30) extends to the second V-CUT (42), and in the first position, the groove bottom of the first groove (30) extends to the first V-CUT (40).
2. The PCB panel of claim 1, wherein: the outline of each PCB sub-board (12) is consistent.
3. The PCB panel of claim 1, wherein: in the second position, the longitudinal sides of the first groove (30) are parallel to the second V-CUT (42), and in the first position, the longitudinal sides of the first groove (30) are parallel to the first V-CUT (40).
4. The PCB panel of claim 3, wherein: in the second position, the length of the first groove (30) is more than or equal to the length of the patch element (20) along the second V-CUT (42), and in the first position, the length of the first groove (30) is more than or equal to the length of the patch element (20) along the first V-CUT (40).
5. The PCB panel of claim 3, wherein: the width of the first groove (30) is 0.9-1.1 mm.
6. A PCB panel as defined in any one of claims 1 to 5 wherein: the first groove depth (a) and the second groove depth are 1/3PCB daughter board (12) plate thickness, and the third groove depth (c) is 2/3PCB daughter board (12) plate thickness.
7. A PCB panel as defined in any one of claims 1 to 5 wherein: the first groove (30) is arranged on the opposite surface of one surface of the PCB sub-board (12) provided with the patch element (20).