CN216015304U

CN216015304U - Die for processing diode core

Info

Publication number: CN216015304U
Application number: CN202121927168.9U
Authority: CN
Inventors: 吴海源
Original assignee: Jiangsu Gaoxin Electronics Co ltd
Current assignee: Jiangsu Gaoxin Electronics Co ltd
Priority date: 2021-08-17
Filing date: 2021-08-17
Publication date: 2022-03-11
Anticipated expiration: 2031-08-17

Abstract

The utility model relates to a die for processing a diode core, which comprises a template, a bottom plate and a cover plate, wherein a plurality of pores are designed on the bottom plate and the cover plate, a plurality of diode core holes are also designed in the middle of the template, the template is fixedly arranged on the bottom plate, the cover plate covers the template, an upper blocking net is designed at the lower end of the cover plate, and the upper blocking net and the cover plate are integrally processed and formed; the upper end of the bottom plate is provided with a lower blocking net. The advantage is that the design is simple, convenient to use, and the lower fender net design of apron lower extreme keeps off the net and laps through the integrated into one piece that moulds plastics for keeping off down, and both adopt same kind of material shaping, can not separate in the reuse process, life extension.

Description

Die for processing diode core

Technical Field

The utility model relates to the field of diode production, in particular to a die for diode core processing.

Background

The chemical treatment is an important process in the production process of high-voltage silicon stacks, and is characterized in that a tube core is arranged in a special treatment mould (BE mould) and is flushed by mixed strong acid, so that the tube core forms a table top. The BE mould comprises a template, a bottom plate and a cover plate, wherein the bottom plate and the cover plate are respectively provided with a pore, the size of each pore is required to ensure that mixed strong acid is fully treated and pure water is cleaned after treatment, and a tube core cannot leak from the pore.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a die for processing a diode core, which is simple in design, convenient to use and long in service life.

The technical scheme of the utility model is as follows:

a mould for processing diode cores comprises a template, a bottom plate and a cover plate, wherein a plurality of fine holes are formed in the bottom plate and the cover plate, a plurality of diode core holes are also formed in the middle of the template, the template is fixedly arranged on the bottom plate, the cover plate covers the template, an upper blocking net is arranged at the lower end of the cover plate, and the upper blocking net and the cover plate are integrally processed and formed; the upper end of the bottom plate is provided with a lower blocking net.

The lower blocking net is designed to be an acid-resistant silk net and is attached to the upper surface of the bottom plate through high temperature ironing, and the lower blocking net blocks the lower end opening parts of the tube core holes of the template.

The lower blocking net and the bottom plate are integrally processed and formed, and the lower blocking net blocks the lower end openings of the tube core holes of the template.

The bottoms of a plurality of pores of the cover plate are blocked surfaces, and an upper blocking net is formed after 7 or 9 pores are hollowed out on the blocked surfaces.

The upper parts of a plurality of pores of the bottom plate are blocked surfaces, and a lower blocking net is formed after 7 or 9 pores are hollowed out on the blocked surfaces.

The template is characterized in that a positioning column is respectively arranged in the middle of two side edges of the upper end of the template, positioning holes are respectively formed in the middle of two sides of the cover plate, strip-shaped grooves are formed in two sides of the cover plate and located on the outer sides of the positioning holes, the positioning columns are correspondingly inserted into the positioning holes, and the positioning columns are in interference fit with the positioning holes.

The upper end of the positioning column is designed into a tapered column, the upper end of the tapered column is thin, the lower end of the tapered column is thick, and the diameter of the thick position of the lower end of the tapered column is larger than that of the positioning hole.

The four corners of template and bottom plate connect through four bracing pieces simultaneously, four bracing piece lower extremes stretch out the bottom plate and form four stabilizer blades, four upper end of the support bar wear to link together the four corners of template and bottom plate fixedly.

The utility model has the advantages of simple design and convenient use, the lower baffle net at the lower end of the cover plate is designed to be integrally formed with the cover plate through injection molding, the lower baffle net and the cover plate are formed by adopting the same material, the lower baffle net and the cover plate can not be separated in the using process, and the service life is prolonged.

Drawings

FIG. 1 is a schematic of the present invention.

Fig. 2 is a cross-sectional view of the present invention.

Fig. 3 is a schematic view of the cover plate of the present invention.

Fig. 4 is a partially enlarged cross-sectional view of the fine hole of the cap plate of the present invention.

Fig. 5 is a top view of fig. 4.

Fig. 6 is a schematic illustration of a template of the present invention.

Fig. 7 is a schematic view of the base plate of the present invention.

Fig. 8 is a partially enlarged cross-sectional view of the bottom plate of the present invention at the fine hole.

Detailed Description

Referring to the attached drawings 1-8, the die for processing the diode core comprises a template 1, a bottom plate 2 and a cover plate 3, wherein a plurality of fine holes 4 are formed in the bottom plate 2 and the cover plate 3, a plurality of diode core holes 5 are also formed in the middle of the template 1, the template 1 is fixedly arranged on the bottom plate 2, the cover plate 3 covers the template 1, an upper blocking net 6 is designed at the lower end of the cover plate 3, and the upper blocking net 6 and the cover plate 3 are integrally processed and formed; the upper end of the bottom plate 2 is designed with a lower blocking net 7. The bottoms of the pores 4 of the cover plate 3 are blocked surfaces, and an upper blocking net 6 is formed after 7 or 9 small holes 11 are hollowed in the blocked surfaces. The cover plate and the upper baffle net are integrally formed by injection molding, and the cover plate and the upper baffle net are integrated.

In one embodiment, the lower screen 7 is designed as an acid-resistant silk screen and is attached to the bottom plate 2 by high-temperature ironing, and the lower screen 7 blocks the lower end openings of the plurality of die holes 5 of the template 1.

In another embodiment, the lower baffle net 7 is integrally formed with the bottom plate 2, and the lower baffle net 7 blocks the lower port parts of the plurality of die holes 5 of the template 1. The upper parts of a plurality of pores 4 of the bottom plate 2 are blocked surfaces, and a lower blocking net 7 is formed after 7 or 9 small holes 11 are hollowed in the blocked surfaces.

The middle positions of two side edges of the upper end of the template 1 are respectively provided with a positioning column 8, the middle of two sides of the cover plate 3 are respectively provided with a positioning hole 9, two sides of the cover plate 3 are respectively provided with a strip-shaped groove 10, the strip-shaped grooves 10 are positioned on the outer side of the positioning holes 9, the positioning columns 8 are correspondingly inserted into the positioning holes 9, and the positioning columns 8 are in interference fit with the positioning holes 9. The upper end of the positioning column 8 is designed into a tapered column, the upper end of the tapered column is thin, the lower end of the tapered column is thick, and the diameter of the thick position of the lower end of the tapered column is larger than that of the positioning hole 9. Reference column and locating hole structural design are in the same place for apron and the effective joint of template, and interference fit and the design of toper post can both guarantee that both tightly the joint is in the same place, prevent that chemical treatment process kind both are not hard up or the separation problem. The design of the strip-shaped groove is that when the strip-shaped groove is in interference connection, the positioning hole can be elastically opened, and then the positioning hole is elastically clamped with the positioning column. The four corners of the cover plate are also designed into L-shaped gaps.

The four corners of the template 1 and the bottom plate 2 are connected through four support rods 12, the lower ends of the four support rods 12 extend out of the bottom plate to form four support legs, and the four corners of the template 1 and the four corners of the bottom plate 2 are fixedly connected through the upper ends of the four support rods 12.

When the die is used, the bottom plate 2 and the template 1 are always fixedly connected together, the upper baffle net 6 between the bottom plate 2 and the template 1 blocks the lower end of the tube core hole 5 of the template 1 through the upper baffle net 6, but the small hole 11 of the upper baffle net 6 is smaller than the tube core hole 5, so that a chemical agent can be contacted with the tube core in subsequent treatment, and the upper baffle net 6 is designed into an independent net or is integrally designed with the bottom plate 2 without influencing the service life of the upper baffle net 6; however, the cover plate 3 needs to be opened and closed frequently when in use, so that it is necessary to design the cover plate 3 and the lower baffle net 7 as a whole, and thus the problem that the lower baffle net 7 is separated from the cover plate 3 can be prevented. During operation, the cover plate 3 is opened, a plurality of tube cores are placed in the tube core holes 5 of the template 1 through the sieve plate, so that one tube core is just placed in each tube core hole 5, the cover plate 3 is covered again, the positioning holes 9 at two ends of the cover plate 3 are respectively clamped on the positioning columns 8 at two ends of the template 1, the lower surface of the cover plate 3 is tightly attached to the upper surface of the template 1, the upper ends of the tube core holes 5 are blocked through the lower blocking net 7, the small holes 11 of the lower blocking net 7 are smaller than the tube core holes 5, the tube cores are prevented from falling from the upper side, and the chemical agent to be treated can be ensured to be in contact with the tube cores; finally, the mounted mould is sent to a chemical treatment device for subsequent treatment, after the treatment is finished, the cover plate 3 is opened, the tube core is taken out from the template 1, the device repeats the steps again, and the next filling and cleaning work is carried out.

Claims

1. A mould for processing diode cores is characterized by comprising a template, a bottom plate and a cover plate, wherein a plurality of fine holes are formed in the bottom plate and the cover plate, a plurality of diode core holes are formed in the middle of the template, the template is fixedly arranged on the bottom plate, the cover plate covers the template, an upper blocking net is arranged at the lower end of the cover plate, and the upper blocking net and the cover plate are integrally processed and formed; the upper end of the bottom plate is provided with a lower blocking net.

2. The mold for diode core processing as claimed in claim 1, wherein the lower barrier is designed as an acid-resistant wire mesh and attached on the bottom plate by high temperature ironing, and the lower barrier blocks the lower port parts of the plurality of the core holes of the template.

3. The mold of claim 1, wherein the lower baffle net is integrally formed with the bottom plate, and the lower baffle net is blocked at the lower port parts of the plurality of die holes of the template.

4. The mold of claim 1, wherein the bottom of the pores of the cover plate is a blocking surface, and the blocking surface is perforated with 7 or 9 pores to form an upper blocking net.

5. The mold for diode core processing as claimed in claim 3, wherein the upper part of the plurality of pores of the bottom plate is a blocking surface, and the blocking surface is hollowed with 7 or 9 pores to form a lower blocking net.

6. The mold of claim 1, wherein a positioning post is disposed at the middle of each of the two sides of the upper end of the mold plate, a positioning hole is disposed at the middle of each of the two sides of the cover plate, a strip-shaped groove is disposed at each of the two sides of the cover plate, the positioning post is inserted into the positioning hole, and the positioning post is in interference fit with the positioning hole.

7. The mold of claim 6, wherein the upper end of the positioning post is designed as a tapered post, the upper end of the tapered post is thinner and the lower end of the tapered post is thicker, and the diameter of the thicker position of the lower end of the tapered post is larger than that of the positioning hole.

8. The mold of claim 1, wherein the four corners of the mold plate and the bottom plate are connected by four support rods, the lower ends of the four support rods extend out of the bottom plate to form four support legs, and the upper ends of the four support rods connect the four corners of the mold plate and the bottom plate.