CN211125580U

CN211125580U - Semiconductor processing equipment

Info

Publication number: CN211125580U
Application number: CN201922172717.5U
Authority: CN
Inventors: 朱如泉
Original assignee: Shenzhen Stephen Optical Semiconductor Co ltd
Current assignee: Shenzhen Stephen Optical Semiconductor Co ltd
Priority date: 2019-12-06
Filing date: 2019-12-06
Publication date: 2020-07-28
Anticipated expiration: 2029-12-06

Abstract

The utility model provides a semiconductor processing equipment, includes the lower base, the lower extreme symmetry of base is provided with four supporting legs down, the upper end of base is provided with the base down, the internally mounted of base has the lower mould down, the bottom of base is provided with unloader down, the lower groove has been seted up to the upper end of base down, two cavitys have been seted up in the outside symmetry that is located the lower groove to the inside of base down, the internally mounted of cavity has the spring. A semiconductor processing equipment, through setting up three mouth and the water conservancy diversion hole of moulding plastics, can accelerate semiconductor chip's encapsulation, improve work efficiency, through six ejector pins that set up on unloader and the unloader, can make the chip can easily the unloading after the encapsulation finishes, through setting up mould, lower mould on the detachable, can be when the die cavity need wash simple light pull down the upper and lower mould wash, finally improved work efficiency.

Description

Semiconductor processing equipment

Technical Field

The utility model relates to a semiconductor field, in particular to semiconductor processing equipment.

Background

In the manufacturing process of the semiconductor chip, a bare chip is required to be installed on a substrate connected with pins, and the manufacturing of the chip is finished after the substrate is packaged, and through years of development, the current civil chip is basically packaged in a plastic packaging mode; the plastic package mold is a fixed charging cavity type thermosetting plastic die-casting mold, is specially used for plastic packaging of integrated circuits, semiconductors and chips, and is matched with a semiconductor device mould pressing and plastic packaging machine for use; the existing plastic package mold is slow in plastic package process due to only one injection port when a semiconductor chip is subjected to plastic package, and troublesome in blanking after the plastic package is finished, pollutants such as oil stains and carbon deposition are formed on the surface of a mold cavity of the mold in a long-term use process, and the existing mold cavity is mostly integrally formed and installed on the mold, so that the whole mold is required to be detached and then cleaned when the pollutants are cleaned, the operation is troublesome, and the mold is easy to damage when the whole mold is detached.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a semiconductor processing apparatus, which can effectively solve the problems occurring in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a semiconductor processing equipment, includes the base down, the lower extreme symmetry of base is provided with four supporting legs down, the upper end of base is provided with the base down, the internally mounted of base has the lower mould down, the bottom of base is provided with unloader down.

Preferably, the upper end of the lower base is provided with a lower groove, two cavities are symmetrically formed in the lower base outside the lower groove, a spring is mounted inside each cavity, a fixed push post is arranged inside each cavity and located inside the spring, an annular blocking piece is arranged at one end of each fixed push post, which is located at one end of the spring, a movable groove is formed in the lower base below the lower groove, six rod holes are symmetrically formed in the lower base between the lower groove and the movable groove, the lower groove and the movable groove are penetrated through the rod holes, and four fixed columns are symmetrically formed in the upper end of the lower base outside the lower groove.

Preferably, the upper end of the upper base is uniformly provided with three injection molding ports, the lower end of the upper base is provided with an upper groove, a flow guide hole is formed in the upper base between the injection molding ports and the upper groove, the injection molding ports penetrate through the flow guide hole and the upper groove, four first fixing grooves are symmetrically formed in the outer side of the lower end of the upper base, which is located in the upper groove, and the upper base is movably connected with the lower base through a first fixing groove embedded in a fixing column at the upper end of the lower base.

Preferably, a plurality of forming grooves are uniformly formed in the upper end of the lower die, two handles are symmetrically formed in the left side and the right side of the forming grooves in the upper end of the lower die, two second fixing grooves are symmetrically formed in the outer side of the lower die, the lower die is mounted in a lower groove in the upper end of the lower base, and the lower die is movably connected with the lower base through a fixing push column embedded into the second fixing grooves.

Preferably, the upper die is installed in an upper groove at the lower end of the upper base, and the upper die is fixedly connected with the upper base through a screw.

Preferably, an upper die is arranged in an upper groove formed in the lower end of the upper base, and the upper die is mounted in the upper groove through a screw.

Compared with the prior art, the utility model discloses following beneficial effect has:

through setting up three mouth and the water conservancy diversion hole of moulding plastics, can accelerate semiconductor chip's encapsulation, improve work efficiency, through six ejector pins that set up on unloader and the unloader, can make the chip can easily the unloading after the encapsulation finishes, through setting up mould, lower mould on the detachable, can be when the die cavity need wash simple light pull down the upper and lower mould and wash, finally improved work efficiency.

Drawings

FIG. 1 is a schematic view of the overall structure of a semiconductor processing apparatus according to the present invention;

FIG. 2 is a schematic structural view of a lower mold of a semiconductor processing apparatus according to the present invention;

FIG. 3 is a schematic structural view of a blanking device of a semiconductor processing apparatus according to the present invention;

FIG. 4 is a schematic structural view of a lower base of a semiconductor processing apparatus according to the present invention;

FIG. 5 is a schematic diagram of the internal structure of a semiconductor processing apparatus according to the present invention;

fig. 6 is a schematic structural view of an upper base of a semiconductor processing apparatus according to the present invention;

in the figure: 1. a lower base; 2. supporting legs; 3. an upper base; 4. a lower die; 5. an upper die; 6. a blanking device; 7. a lower groove; 8. a cavity; 9. fixing the push post; 10. an annular baffle plate; 11. a rod hole; 12. a movable groove; 13. fixing a column; 14. an injection molding port; 15. a flow guide hole; 16. an upper groove; 17. forming a groove; 18. A handle; 19. resetting the push rod; 20. a fixing plate; 21. a top rod; 22. a second fixing groove; 23. a first fixing groove.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-6, a semiconductor processing device comprises a lower base 1, four support legs 2 are symmetrically arranged at the lower end of the lower base 1, an upper base 3 is arranged at the upper end of the lower base 1, a lower die 4 is arranged in the lower base 1, and a blanking device 6 is arranged at the bottom end of the lower base 1;

the upper end of the lower base 1 is provided with a lower groove 7, the inside of the lower base 1 is symmetrically provided with two cavities 8 at the outer side of the lower groove 7, the inside of each cavity 8 is provided with a spring, the inside of each cavity 8 is provided with a fixed push column 9 at the inner side of the spring, one end of each fixed push column 9 at one end of the spring is provided with an annular baffle 10, the inside of the lower base 1 is provided with a movable groove 12 at the lower part of the lower groove 7, the inside of the lower base 1 is symmetrically provided with six rod holes 11 between the lower groove 7 and the movable groove 12, the lower groove 7 and the movable groove 12 are penetrated through by the rod holes 11, and the upper end of the lower base 1 is symmetrically provided with four fixed columns 13 at the outer side of the lower; the upper end of the upper base 3 is uniformly provided with three injection molding openings 14, the lower end of the upper base 3 is provided with an upper groove 16, a diversion hole 15 is formed in the upper base 3 between the injection molding openings 14 and the upper groove 16, the injection molding openings 14 are penetrated through the upper groove 16 by the diversion hole 15, the lower end of the upper base 3 is symmetrically provided with four first fixing grooves 23 on the outer sides of the upper groove 16, and the upper base 3 is embedded into the first fixing grooves 23 through fixing columns 13 at the upper end of the lower base 1 and is movably connected with the lower base 1; the upper end of the lower die 4 is uniformly provided with a plurality of forming grooves 17, the upper end of the lower die 4 is symmetrically provided with two handles 18 at the left side and the right side of the forming grooves 17, the outer side of the lower die 4 is symmetrically provided with two second fixing grooves 22, the lower die 4 is arranged in a lower groove 7 at the upper end of the lower base 1, and the lower die 4 is embedded into the second fixing grooves 22 through fixing push posts 9 and is movably connected with the lower base 1; an upper die 5 is arranged in an upper groove 16 formed in the lower end of the upper base 3, and the upper die 5 is installed in the upper groove 16 through a screw; the blanking device 6 is arranged in a movable groove 12 in the lower base 1, the blanking device 6 comprises a reset push rod 19, a spring is arranged at the outer end of the reset push rod 19, a fixing plate 20 is arranged at the upper end of the reset push rod 19, six ejector rods 21 are symmetrically arranged at the upper end of the fixing plate 20, and an embedding rod hole 11 of each ejector rod 21 is movably connected with the lower base 1.

It should be noted that the utility model relates to a semiconductor processing device, when in use, firstly, the prepared injection molding tool is aligned to the injection molding hole 14, and then injection molding is started after the injection molding tool is aligned to the injection molding hole 14, during the injection molding process, the injection molded material flows in through the injection molding hole 14, then flows through the diversion hole 15, and finally flows into the forming groove 17, after the material is cooled and formed, the upper base 3 is removed, then the reset push rod 19 on the blanking device 6 is pressed, the reset push rod 19 drives six push rods 21 at the upper end of the fixing plate 20, the push rods 21 push the finished product off the lower mold 4, then the reset push rod 19 on the blanking device 6 is reset by the spring, finally the upper base 3 is closed on the lower base 1, when the mold needs to be cleaned, only two fixed push posts 9 are pulled outwards, after the fixed push posts 9 are separated from the lower mold 4, two handles 18 at the upper end of the lower, and taking out the lower die 4 for cleaning.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A semiconductor processing apparatus, characterized by: including lower base (1), the lower extreme symmetry of lower base (1) is provided with four supporting legs (2), the upper end of lower base (1) is provided with base (3), the internally mounted of lower base (1) has lower mould (4), the bottom of lower base (1) is provided with unloader (6).

2. A semiconductor processing apparatus according to claim 1, wherein: the upper end of the lower base (1) is provided with a lower groove (7), the inner part of the lower base (1) is symmetrically provided with two cavities (8) at the outer side of the lower groove (7), a spring is arranged in the cavity (8), a fixed push column (9) is arranged in the cavity (8) and positioned on the inner side of the spring, one end of one side of the fixed push column (9) positioned at the spring is provided with an annular stop piece (10), a movable groove (12) is arranged in the lower base (1) and below the lower groove (7), six rod holes (11) are symmetrically arranged between the lower groove (7) and the movable groove (12) in the lower base (1), the lower groove (7) and the movable groove (12) are penetrated through by the rod hole (11), the upper end of the lower base (1) is symmetrically provided with four fixing columns (13) at the outer side of the lower groove (7).

3. A semiconductor processing apparatus according to claim 1, wherein: the injection molding machine is characterized in that three injection molding openings (14) are uniformly formed in the upper end of the upper base (3), an upper groove (16) is formed in the lower end of the upper base (3), a flow guide hole (15) is formed in the inner portion of the upper base (3) between the injection molding openings (14) and the upper groove (16), the injection molding openings (14) and the upper groove (16) are penetrated through by the flow guide hole (15), four fixing grooves (23) are symmetrically formed in the outer side of the upper groove (16) at the lower end of the upper base (3), and the upper base (3) is movably connected with the lower base (1) through fixing columns (13) arranged at the upper end of the lower base (1) and embedded into the fixing grooves (23).

4. A semiconductor processing apparatus according to claim 1, wherein: a plurality of forming grooves (17) are evenly seted up at the upper end of lower mould (4), two handles (18) have been seted up in the left and right sides symmetry that is located forming grooves (17) to the upper end of lower mould (4), two No. two fixed slots (22) have been seted up to the outside symmetry of lower mould (4), lower mould (4) are installed in lower groove (7) of base (1) upper end down, lower mould (4) are through fixed push pillar (9) embedding No. two fixed slots (22) and lower base (1) swing joint.

5. A semiconductor processing apparatus according to claim 3, wherein: an upper die (5) is arranged in an upper groove (16) formed in the lower end of the upper base (3), and the upper die (5) is installed in the upper groove (16) through screws.

6. The semiconductor processing apparatus of claim 5, wherein: unloader (6) are installed in base (1) inside activity groove (12) down, unloader (6) contain reset push rod (19), the outer end of reset push rod (19) is provided with the spring, the upper end of reset push rod (19) is provided with fixed plate (20), the upper end symmetry of fixed plate (20) is provided with six ejector pins (21), embedding pole hole (11) and lower base (1) swing joint of ejector pin (21).