CN216015300U - Spray device and spray array for cleaning semiconductor wafer - Google Patents
Spray device and spray array for cleaning semiconductor wafer Download PDFInfo
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- CN216015300U CN216015300U CN202121244759.6U CN202121244759U CN216015300U CN 216015300 U CN216015300 U CN 216015300U CN 202121244759 U CN202121244759 U CN 202121244759U CN 216015300 U CN216015300 U CN 216015300U
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Abstract
The utility model relates to a spray device for cleaning a semiconductor wafer, which is characterized by comprising: a left water spray member, a right water spray member, and a semiconductor wafer holder. When a semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the left water spraying piece and the right water spraying piece cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp. The spraying device for cleaning the semiconductor wafer has a good cleaning effect, and solves the technical problem of surface residue. The utility model also relates to a spray array for cleaning semiconductor wafers, which is a particular embodiment of the spray device, which enables a plurality of semiconductor wafers to be cleaned simultaneously with a reduced number of additional components.
Description
Technical Field
The present invention relates to a shower apparatus for cleaning semiconductor wafers, and to a shower array capable of cleaning a plurality of semiconductor wafers at the same time.
Background
Semiconductor wafer cleaning is one of the key steps in the process in the semiconductor wafer manufacturing industry. The common cleaning method in the prior art is manual single-wafer cleaning, i.e. an operator firstly places a semiconductor wafer on a semiconductor wafer clamp, then sequentially carries out chemical treatment according to the cleaning process requirement, and then uses deionized water to remove residual chemicals on the surface of the semiconductor wafer. In the whole cleaning process, an operator is required to manually control a water gun switch to control the water flow, so that the front surface, the back surface, corners of the clamp and other parts of the semiconductor wafer are washed, and any residual chemical and adhered particles are removed. However, the existing flushing water gun has the defects of small water spraying area and uneven water outlet. Furthermore, manual single-wafer cleaning using a flush gun means that the effectiveness of the rinse is highly correlated to the size of the switch that is toggled by the employee and the relative relationship between the water flow and the semiconductor wafer. In particular, it is often difficult to sufficiently clean the contact portion between the semiconductor wafer and the semiconductor wafer holder, surface residue occurs due to careless handling, and defects such as water marks and white spots are finally caused on the semiconductor surface. In addition, the manual single-chip cleaning using a water flushing gun also means that the operation method of an operator can have a significant influence on the cleaning effect, thereby causing instability of the cleaning quality.
SUMMERY OF THE UTILITY MODEL
It is an object of the present invention to provide a shower apparatus for cleaning semiconductor wafers that overcomes the problems of the prior art.
To this end, the present invention provides a shower apparatus for cleaning a semiconductor wafer (hereinafter also simply referred to as a shower apparatus), comprising:
a left water spraying piece is arranged on the left side of the water spraying device,
a right water jet member, and
a semiconductor wafer holder;
the semiconductor wafer clamp comprises a left water spraying piece, a right water spraying piece, a semiconductor wafer clamping piece and a water spraying device, wherein the left water spraying piece is located on the left side and can spray water towards the right, the right water spraying piece is located on the right side and can spray water towards the left, the left water spraying piece and the right water spraying piece are oppositely arranged, and the semiconductor wafer clamping piece is arranged between the left water spraying piece and the right water spraying piece; when a semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the left water spraying piece and the right water spraying piece cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp.
The spraying device can clean all surfaces of the semiconductor wafer at one time, thereby solving the technical problem of surface residue, improving the uniformity, consistency and repeatability of the surface cleaning of the semiconductor wafer, and reducing the defects of water marks, white spots and the like of the semiconductor wafer caused by the cleaning reason.
The present invention also provides a shower array for cleaning a semiconductor wafer (hereinafter also simply referred to as a shower array), comprising:
a left water spraying piece is arranged on the left side of the water spraying device,
the right water spraying piece is arranged on the right side,
at least one intermediate water jet, and
two or more semiconductor wafer clamps;
the left water spraying piece can spray water towards the right, the right water spraying piece can spray water towards the left, and the middle water spraying piece can spray water towards the left and the right simultaneously; the whole spraying array is arranged in a straight line shape, the left water spraying piece is arranged at the leftmost end of the spraying array, the right water spraying piece is arranged at the rightmost end of the spraying array, and the middle water spraying piece is arranged between the left water spraying piece and the right water spraying piece; in the spraying array, the distances between the adjacent water spraying pieces are equal, and a single semiconductor wafer clamp is arranged between the adjacent water spraying pieces, so that the number of the semiconductor wafer clamps is the number of the middle water spraying pieces plus one; when the semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the water spraying pieces positioned at the two sides of the semiconductor wafer cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp.
The spray array of the present invention is a specific embodiment of a spray device that can simultaneously clean multiple semiconductor wafers with a reduced number of additional components.
It will be understood that references herein to "right, left, opposite" are to be divided in the direction of the spray device shown in figure 1, i.e. oriented in the direction in which the device is used.
It should be understood that the "water spray area" as referred to herein refers to the cross-sectional area of the water spray stream of the water spray member as it reaches the surface of the semiconductor wafer.
It should be understood that the term "water jet" as used herein refers to all parts of the device that can spray water without the addition of modifiers such as "left, right, middle, side or adjacent".
Drawings
Advantages and features of the present invention will now be described in detail with reference to the accompanying drawings, wherein the various parts are not necessarily drawn to scale, and wherein:
fig. 1 shows a perspective view of a spray device 100.
Fig. 2 shows a front view of the left water jet 101, the water jet base 103, and the fixing screw 104 in the shower device 100 of fig. 1, wherein hidden lines are shown in dashed lines in order to show the internal structure of the left water jet 101.
Fig. 3 shows a right side view of the left sprinkler 101, sprinkler base 103 and set screw 104 of fig. 2.
Fig. 4 shows a perspective view of the spray device 100 in an operating state.
Fig. 5 shows a perspective view of the spray array 200.
Fig. 6 shows a front view of the intermediate waterjet 201, the waterjet base 103, and the set screw 104 in the spray array 200 of fig. 5, wherein hidden lines are shown in phantom to illustrate the internal structure of the intermediate waterjet 201.
Fig. 7 shows a right side view of the middle sprinkler 201, sprinkler base 103, and set screw 104 of fig. 6.
Fig. 8 shows a perspective view of the spray array 200 in an operational state.
It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the utility model.
Detailed Description
The shower apparatus for cleaning a semiconductor wafer of the present invention comprises:
a left water spraying piece is arranged on the left side of the water spraying device,
a right water jet member, and
a semiconductor wafer holder;
the semiconductor wafer clamp comprises a left water spraying piece, a right water spraying piece, a semiconductor wafer clamping piece and a water spraying device, wherein the left water spraying piece is arranged on the left side and can spray water towards the right, the right water spraying piece is arranged on the right side and can spray water towards the left, the left water spraying piece and the right water spraying piece are oppositely arranged, and the semiconductor wafer clamping piece is arranged between the left water spraying piece and the right water spraying piece; when a semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the left water spraying piece and the right water spraying piece cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp. Therefore, the surface of the whole semiconductor wafer can be thoroughly cleaned, the cleaning quality is improved, and the technical problem of surface residue is solved.
According to the spraying device for cleaning the semiconductor wafer, preferably, a water spraying piece base is respectively arranged below the left water spraying piece and the right water spraying piece, the water spraying piece base is detachably connected with the left water spraying piece or the right water spraying piece, and the geometric centers of the left water spraying piece and the right water spraying piece are concentric with the semiconductor wafer clamped on the semiconductor wafer clamp. Thus, the water spraying areas of the left water spraying piece and the right water spraying piece can be ensured to be overlapped with the surface area of the clamped semiconductor wafer to the maximum extent.
According to the spraying device for cleaning the semiconductor wafer, the left water spraying piece and the right water spraying piece are identical in geometric shape, each of the left water spraying piece and the right water spraying piece comprises a cylindrical body, a water spraying surface, a water supply interface and a water supply channel, the cylindrical body is fixed in a mode that the side surface of the cylindrical body is parallel to the ground, the water spraying surface is arranged on one circular surface of the cylindrical body, a water outlet hole is formed in the water spraying surface, the water supply interface is arranged on the other circular surface of the cylindrical body, the water supply channel is arranged inside the cylindrical body, and the water supply channel connects the water supply interface with the water outlet hole. And a fixing screw is arranged on the side surface of the cylinder body, and the cylinder body is in threaded connection with the water spraying piece base through the fixing screw. Since the geometry of the left and right water jet members is identical, the left and right water jet members can be manufactured by identical manufacturing processes, only requiring installation in opposite directions during installation. This significantly reduces the manufacturing difficulties of the spray device, thereby further optimizing the spray device.
According to the spraying device for cleaning the semiconductor wafer, the water outlet hole preferably comprises a plurality of water outlet hole groups, each water outlet hole group comprises a plurality of holes which are arranged in a circular shape, and the water outlet hole groups are uniformly arranged in the circumferential direction of the water spraying surface. The uniformly arranged water outlet hole groups effectively disperse the water spraying water flow, so that the water flow can be uniformly spread in the range covered by the water spraying area, and the cleaning effect is further improved.
The spray array of the present invention for cleaning a semiconductor wafer comprises:
a left water spraying piece is arranged on the left side of the water spraying device,
the right water spraying piece is arranged on the right side,
at least one intermediate water jet, and
two or more semiconductor wafer clamps;
the left water spraying piece can spray water towards the right, the right water spraying piece can spray water towards the left, and the middle water spraying piece can spray water towards the left and the right simultaneously; the whole spraying array is arranged in a straight line shape, the left water spraying piece is arranged at the leftmost end of the spraying array, the right water spraying piece is arranged at the rightmost end of the spraying array, and the middle water spraying piece is arranged between the left water spraying piece and the right water spraying piece; in the spraying array, the distances between the adjacent water spraying pieces are equal, and a single semiconductor wafer clamp is arranged between the adjacent water spraying pieces, so that the number of the semiconductor wafer clamps is the number of the middle water spraying pieces plus one; when the semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the water spraying pieces positioned at the two sides of the semiconductor wafer cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp. Compared with the spraying equipment, the spraying array not only can thoroughly clean the surface of the whole semiconductor wafer, but also can clean a plurality of semiconductor wafers simultaneously. Specifically, the number of semiconductor wafers that can be cleaned simultaneously is the same as the number of semiconductor wafer holders, plus one, the number of intermediate water spray members.
According to the spray array for cleaning the semiconductor wafer of the present invention, preferably, a water spray base is respectively disposed below the left water spray member, the right water spray member and the middle water spray member, the water spray base is detachably connected to the left water spray member, the right water spray member or the middle water spray member, and the geometric centers of the left water spray member, the right water spray member and the middle water spray member are concentric with the semiconductor wafer clamped on the semiconductor wafer clamp. This also ensures that the water spray areas of the left, right and middle water spray members overlap the surface area of the clamped semiconductor wafer to the maximum extent.
According to the spray array for cleaning the semiconductor wafer, the left water spraying piece and the right water spraying piece are preferably identical in geometric shape, each of the left water spraying piece and the right water spraying piece comprises a cylindrical body, a water spraying surface, a water supply interface and a water supply channel, the cylindrical body is fixed in a manner that the side surface of the cylindrical body is parallel to the ground, the water spraying surface is arranged on one circular surface of the cylindrical body, a water outlet hole is formed in the water spraying surface, the water supply interface is arranged on the other circular surface of the cylindrical body, the water supply channel is arranged in the cylindrical body, and the water supply channel connects the water supply interface with the water outlet hole; the middle water spraying piece comprises a middle cylinder body with the same outer diameter as the cylinder body, a middle left water spraying surface, a middle right water spraying surface, two water supply interfaces and two water supply channels, the middle cylinder body is fixed in a way that the side surface is parallel to the ground, the left and right circular surfaces of the middle cylinder body are respectively provided with a middle left water spraying surface and a middle right water spraying surface, the water outlet holes are arranged on the middle left water spraying surface and the middle right water spraying surface, the two water supply interfaces are arranged on the side surface of the middle cylinder body, the two water supply channels are arranged inside the middle cylinder body, one set of water supply channel connects the water outlet hole on the middle left water spray surface with one of the water supply interfaces, and the other set of water supply channel connects the water outlet hole on the middle right water spray surface with the other water supply interface. The sides of the cylinder body and the middle cylinder body are provided with fixing screws, and the fixing screws are used for connecting the cylinder body with the water spraying piece base in a threaded manner and connecting the middle cylinder body with the water spraying piece base in a threaded manner. Since the geometry of the left and right water jet members is identical, the left and right water jet members can be manufactured by identical manufacturing processes, only requiring installation in opposite directions during installation. Similarly, since the middle water-spraying member includes a middle cylindrical body having the same outer diameter as the cylindrical body, the manufacturing process of the middle water-spraying member can be largely unified with the manufacturing process of the left and right water-spraying members. These features all significantly reduce the manufacturing difficulty of the spray array, thereby further optimizing the spray array.
According to the spray array for cleaning the semiconductor wafer of the present invention, preferably, the water outlet hole includes a plurality of water outlet hole groups, each of the water outlet hole groups includes a plurality of holes arranged in a circular shape, and the water outlet hole groups are uniformly arranged in a circumferential direction of the water spray surface or the middle left water spray surface or the middle right water spray surface. The uniformly arranged water outlet hole groups effectively disperse the water spraying water flow, so that the water flow can be uniformly spread in the range covered by the water spraying area, and the cleaning effect is further improved.
In the simplest case, the spray device for cleaning semiconductor wafers according to the utility model can only clean one semiconductor wafer at a time. If it is desired to improve the cleaning efficiency for cleaning a plurality of semiconductor wafers at a time, the spray array for cleaning semiconductor wafers according to the present invention can be considered.
The spray array is a specific embodiment of a spray device, and compared with the spray device, the main differences are that: the semiconductor wafer clamp further comprises at least one middle water spraying piece, wherein the middle water spraying piece is arranged between the left water spraying piece and the right water spraying piece, the distance between the adjacent water spraying pieces is equal, and a single semiconductor wafer clamp is arranged between the adjacent water spraying pieces. Thus, the number of semiconductor wafers that can be cleaned by the spray array is one more than the number of intermediate water jets. That is, if there is one intermediate water jet, two semiconductor wafers can be cleaned, and if there are two intermediate water jets, three semiconductor wafers can be cleaned, and so on. Thus, the spray array enables the simultaneous cleaning of multiple semiconductor wafers with a reduced number of additional components.
Each water jet is generally a member capable of emitting a water stream. Generally, a sprinkler includes a water spray surface provided with a plurality of water outlet holes, a water supply port, and a water supply passage for connecting the water spray surface and the water supply port. The spray is similar in form to a shower head for daily showers and a shower head for irrigation. Preferably, the water jets of the water jet are spatially uniformly distributed.
The semiconductor wafer holder may be a known semiconductor wafer holder or any holding assembly that can hold and hold a semiconductor wafer for cleaning operations. For example, the semiconductor wafer holder may be a support with a circular notch that opens upward, and a groove for holding the semiconductor wafer in a vertical position is provided at the center in the thickness direction of the circular notch.
The spraying device and the spraying array can be made of plastic, metal and other materials and prepared by a common processing and forming method. Specifically, the plastic material may be ABS, nylon, polyurethane, etc., and the metal material may be steel, cast iron, aluminum, copper, etc. If a plastic material is used, the common processing methods are injection molding, extrusion molding, and the like. If a metal material is used, the common machining method is machining, casting, stamping, bending, or the like.
When the semiconductor wafer cleaning device works, the semiconductor wafer is clamped on the semiconductor wafer clamp, then water is supplied to the water supply interface, and the water spraying pieces spray water flow, so that the semiconductor wafer is thoroughly cleaned. Thereafter, the semiconductor wafer may be replaced and the cleaning operation repeated.
The utility model is described in detail below with reference to the accompanying drawings, in which the parts are made of plastic by injection molding, extrusion molding, etc.
Fig. 1 shows a perspective view of a spray device 100, which is generally designated by reference numeral 100. Wherein, spray set 100 includes: a left water spray 101, a right water spray 102, a water spray base 103, a fixing screw 104 and a semiconductor wafer holder 105. The left water jet 101 is on the left side, the right water jet 102 is on the right side, the left water jet 101 and the right water jet 102 are opposed to each other, and the semiconductor wafer holder 105 is disposed between the left water jet 101 and the right water jet 102. A water spray base 103 is respectively arranged below the left water spray part 101 and the right water spray part 102, and the water spray base 103 is detachably connected with the left water spray part 101 or the right water spray part 102 through a fixing screw 104 arranged on the side surface of the water spray part.
Fig. 2 shows a front view of the left water jet 101, the water jet base 103, and the fixing screw 104 in the shower device 100 of fig. 1, wherein hidden lines are shown in dashed lines in order to show the internal structure of the left water jet 101. It should be understood that in this embodiment, for ease of machining, the geometry of the left and right water jet members 101 and 102 are identical, the only difference being that they are installed in opposite directions during installation, and therefore, only the structure of the left water jet member 101 will be described in detail herein. As shown in fig. 2, the left water spraying member 101 includes a cylindrical body 101A, a water spraying surface 101B, a water supply port 101C, and a water supply passage 101D, wherein the cylindrical body 101A is fixed in a manner that a side surface is parallel to the ground, the water spraying surface 101B is disposed on one circular surface of the cylindrical body 101A, a water outlet hole is disposed on the water spraying surface 101B, the water supply port 101C is disposed on the other circular surface of the cylindrical body 101A, the water supply passage 101D is disposed inside the cylindrical body 101A, and the water supply port 101C is connected to the water outlet hole by the water supply passage 101D.
Fig. 3 shows a right side view of the left sprinkler 101, sprinkler base 103 and set screw 104 of fig. 2. The figure shows in detail the arrangement of said water outlet holes on the water spray surface 101B. As shown in fig. 3, the outlet holes include 4 outlet hole groups 101B-1, and each of the outlet hole groups 101B-1 includes 12 holes arranged in a circular shape, and the outlet hole groups are uniformly arranged in the circumferential direction of the water discharge surface 101B. It will be appreciated that the arrangement of the outlet holes of the right water jet 102 is the same as the left water jet 101, since the geometry of the left water jet 101 and the right water jet 102 is identical.
Fig. 4 shows a perspective view of the spray device 100 in an operating state. As shown in fig. 4, in operation, the semiconductor wafer 106 is mounted on the semiconductor wafer holder 105, and then water is supplied to the water supply port 101C, and water is sprayed from the water spray members, thereby completing thorough cleaning of the semiconductor wafer 106. The water spray base 103 is designed such that the geometric centers of the left and right water sprays 101 and 102 are concentric with the semiconductor wafer 106 when the semiconductor wafer 106 is clamped on the semiconductor wafer holder 105. The water spray areas of the left and right water spray members 101 and 102 will cover the entire front and back surfaces of the semiconductor wafer 106, as well as the contact portion of the semiconductor wafer 106 with the semiconductor wafer chuck 105.
Fig. 5 shows a perspective view of a spray array 200, generally designated by reference numeral 200. It should be understood that the spray array 200 shown in fig. 5 is a specific embodiment of the spray device 100, and therefore the same technical features are not described herein. Spray array 200 differs from spray device 100 in that: the middle water spraying part 201 is further arranged, the middle water spraying part 201 can spray water leftwards and rightwards at the same time, the spraying array 200 is arranged in a straight line shape, the left water spraying part 101 is arranged at the leftmost end of the spraying array 200, the right water spraying part 102 is arranged at the rightmost end of the spraying array 200, and the middle water spraying part 201 is arranged between the left water spraying part 101 and the right water spraying part 102. In spray array 200, the distance between adjacent spray jets is equal and a single semiconductor wafer holder 105 is disposed between adjacent spray jets. A water spray base 103 is arranged below the middle water spray member 201, and the water spray base 103 is detachably connected with the middle water spray member 201 through a fixing screw 104 arranged on the side surface of the middle water spray member 201.
Fig. 6 shows a front view of the intermediate water jet 201, the water jet base 103 and the set screw 104 in the spray array 200 of fig. 5, wherein hidden lines are shown in dashed lines in order to show the internal structure of the intermediate water jet 201. The middle water spraying part 201 comprises a middle cylinder body 201A with the same outer diameter as the cylinder body 101A, a middle left water spraying surface 201B, a middle right water spraying surface 201C, two water supply interfaces 201D and two sets of water supply channels 201E, the middle cylinder body 201A is fixed in a mode that the side surface is parallel to the ground surface, the middle left water spraying surface 201B and the middle right water spraying surface 201C are respectively arranged on the left circular surface and the right circular surface of the middle cylinder body 201A, water outlets are arranged on the middle left water spraying surface 201B and the middle right water spraying surface 201C, two water supply interfaces 201D are arranged on the side surface of the middle cylinder body 201A, the two sets of water supply channels 201E are arranged inside the middle cylinder body 201A, one set of the water supply channels 201E connects the water outlet on the middle left water spraying surface 201B with one of the water supply interfaces 201D, and the other set of the water supply channels 201E connects the water outlet on the middle right water spraying surface 201C with the other water supply The ports 201D are connected.
Fig. 7 shows a right side view of the middle sprinkler 201, sprinkler base 103, and set screw 104 of fig. 6. The figure shows in detail the arrangement of said outlet openings on the middle right water jet 201C. It should be understood that for ease of manufacture, the arrangement of the outlet holes on all of the water emitting surfaces of the individual water emitting elements of the spray array 200 is the same. As shown in fig. 7, the outlet hole includes 4 outlet hole groups 201C-1, each of the outlet hole groups 201C-1 includes 12 holes arranged in a circular shape, and the outlet hole groups 201C-1 are uniformly arranged in the circumferential direction of the middle right water ejection surface 201C.
Fig. 8 shows a perspective view of the spray array 200 in an operational state. As shown in fig. 8, in operation, two semiconductor wafers 106 are mounted on the semiconductor wafer chuck 105, and then water is supplied to the water supply ports 101C and the two water supply ports 201D, and water is discharged from each water spray member, thereby completing the thorough cleaning of the two semiconductor wafers 106. The water spray base 103 is designed such that the geometric centers of the left water spray 101, the right water spray 102, and the middle water spray 201 are concentric with the semiconductor wafer 106 when the semiconductor wafer 106 is mounted on the semiconductor wafer holder 105. The water spray areas of the left water spray 101, the right water spray 102 and the middle water spray 201 will cover the entire front surface and the entire back surface of the semiconductor wafer 106, and the contact portion of the semiconductor wafer 106 and the semiconductor wafer holder 105.
It should be understood that although fig. 4-8 illustrate the configuration with one intermediate waterjet 201, a corresponding spray array 200 may be configured with a greater number of intermediate waterjets 201. In this way, a greater number of semiconductor wafers 106 may be cleaned simultaneously. For example, three semiconductor wafers 106 may be cleaned simultaneously with two intermediate water jets 201, or four semiconductor wafers 106 may be cleaned simultaneously with three intermediate water jets 201, and so on.
Claims (10)
1. A shower apparatus for cleaning a semiconductor wafer, comprising:
a left water spraying piece is arranged on the left side of the water spraying device,
a right water jet member, and
a semiconductor wafer holder;
the semiconductor wafer clamp is arranged between the left water spraying piece and the right water spraying piece; when a semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the left water spraying piece and the right water spraying piece cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp.
2. The shower apparatus according to claim 1, wherein a water spray base is disposed below the left water spray and the right water spray, respectively, and the water spray base is detachably connected to the left water spray or the right water spray, and the geometric centers of the left water spray and the right water spray are concentric with the semiconductor wafer clamped on the semiconductor wafer clamp.
3. The shower apparatus according to claim 2, wherein the left and right water spraying members have identical geometric shapes, each of the left and right water spraying members comprises a cylindrical body, a water spraying surface, a water supply port, and a water supply channel, the cylindrical body is fixed in a manner that the side surface of the cylindrical body is parallel to the ground, the water spraying surface is provided with the water spraying surface, the water outlet hole is provided on the water spraying surface, the water supply port is provided on the other circular surface of the cylindrical body, the water supply channel is provided inside the cylindrical body, and the water supply channel connects the water supply port with the water outlet hole.
4. The shower apparatus for cleaning semiconductor wafers as recited in claim 3, wherein the side of the cylindrical body is provided with set screws that threadably connect the cylindrical body to the sprinkler base.
5. The shower apparatus for cleaning semiconductor wafers as claimed in claim 4, wherein the outlet hole includes a plurality of outlet hole groups, each of the outlet hole groups including a plurality of holes arranged in a circular shape, the outlet hole groups being arranged uniformly in a circumferential direction of the water ejection surface.
6. A spray array for cleaning a semiconductor wafer, comprising:
a left water spraying piece is arranged on the left side of the water spraying device,
the right water spraying piece is arranged on the right side,
at least one intermediate water jet, and
two or more semiconductor wafer clamps;
the left water spraying piece can spray water towards the right, the right water spraying piece can spray water towards the left, and the middle water spraying piece can spray water towards the left and the right simultaneously; the whole spraying array is arranged in a straight line shape, the left water spraying piece is arranged at the leftmost end of the spraying array, the right water spraying piece is arranged at the rightmost end of the spraying array, and the middle water spraying piece is arranged between the left water spraying piece and the right water spraying piece; in the spraying array, the distances between the adjacent water spraying pieces are equal, and a single semiconductor wafer clamp is arranged between the adjacent water spraying pieces, so that the number of the semiconductor wafer clamps is the number of the middle water spraying pieces plus one; when the semiconductor wafer is clamped on the semiconductor wafer clamp, the water spraying areas of the water spraying pieces positioned at the two sides of the semiconductor wafer cover the whole front surface and the whole back surface of the semiconductor wafer and the contact part of the semiconductor wafer and the semiconductor wafer clamp.
7. The spray array for cleaning semiconductor wafers as claimed in claim 6, wherein the left, right and middle water spray members are respectively provided with a water spray member base therebelow, the water spray member base is detachably connected with the left, right or middle water spray members, and the geometric centers of the water spray surfaces of the left, right and middle water spray members are concentric with the semiconductor wafer clamped on the semiconductor wafer clamp.
8. The spray array of claim 7, wherein the left and right water spray members have identical geometries, each of the left and right water spray members comprises a cylindrical body fixed with a side surface parallel to the ground, a water spray surface having a water outlet hole, a water supply port on the other side surface, and a water supply channel connecting the water supply port with the water outlet hole, the water supply port being provided inside the cylindrical body; the middle water spraying piece comprises a middle cylinder body with the same outer diameter as the cylinder body, a middle left water spraying surface, a middle right water spraying surface, two water supply interfaces and two water supply channels, the middle cylinder body is fixed in a way that the side surface is parallel to the ground, the left and right circular surfaces of the middle cylinder body are respectively provided with a middle left water spraying surface and a middle right water spraying surface, the water outlet holes are arranged on the middle left water spraying surface and the middle right water spraying surface, the two water supply interfaces are arranged on the side surface of the middle cylinder body, the two water supply channels are arranged inside the middle cylinder body, one set of water supply channel connects the water outlet hole on the middle left water spray surface with one of the water supply interfaces, and the other set of water supply channel connects the water outlet hole on the middle right water spray surface with the other water supply interface.
9. The spray array for cleaning semiconductor wafers of claim 8 wherein the sides of the cylindrical body and the middle cylindrical body are provided with set screws that threadably connect the cylindrical body to the waterjet base and threadably connect the middle cylindrical body to the waterjet base.
10. The spray array for cleaning semiconductor wafers of claim 9 wherein the outlet opening comprises a plurality of outlet opening sets, each outlet opening set comprising a plurality of openings arranged in a circle, the outlet opening sets being arranged evenly circumferentially of the water spray face or the middle left water spray face or the middle right water spray face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121244759.6U CN216015300U (en) | 2021-06-04 | 2021-06-04 | Spray device and spray array for cleaning semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121244759.6U CN216015300U (en) | 2021-06-04 | 2021-06-04 | Spray device and spray array for cleaning semiconductor wafer |
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| Publication Number | Publication Date |
|---|---|
| CN216015300U true CN216015300U (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121244759.6U Active CN216015300U (en) | 2021-06-04 | 2021-06-04 | Spray device and spray array for cleaning semiconductor wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN216015300U (en) |
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2021
- 2021-06-04 CN CN202121244759.6U patent/CN216015300U/en active Active
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