CN216015295U

CN216015295U - Semiconductor manufacturing oxidation device

Info

Publication number: CN216015295U
Application number: CN202122177205.5U
Authority: CN
Inventors: 胡晓刚; 何华军; 高峰
Original assignee: Mingjie Precision Machinery Taicang Co ltd
Current assignee: Mingjie Precision Machinery Taicang Co ltd
Priority date: 2021-09-09
Filing date: 2021-09-09
Publication date: 2022-03-11
Anticipated expiration: 2031-09-09

Abstract

The utility model relates to the technical field of semiconductor oxidation, in particular to a semiconductor manufacturing oxidation device, which comprises an oxidation box, wherein the inside of the oxidation box is provided with a shell through the rotation of a driving piece, the upper end of the oxidation box is provided with a covering piece, the front end of the oxidation box is provided with an oxygen delivery piece, the inside of the oxidation box is provided with a heating piece, the side wall of one end inside the shell is fixedly connected with a positioning plate, the side wall of the other end inside the shell is movably penetrated with a plurality of groups of connecting rods, the number of the connecting rods in each group is two, and one end of the two connecting rods is fixedly connected with a vertical plate together. And the semiconductor wafer can be taken out very simply and quickly.

Description

Semiconductor manufacturing oxidation device

Technical Field

The utility model relates to a semiconductor oxidation technology field especially relates to a semiconductor manufacturing oxidation unit.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most electronic products, such as a computer, a mobile phone or a digital recorder, have close relationship with the semiconductor, in the process of carrying out high-temperature oxidation on the semiconductor wafer, the contact effect between the surface of the wafer and oxygen is not good enough, and meanwhile, the semiconductor wafers with different specifications are not convenient to place, position and take together.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides an oxidation device for semiconductor manufacturing.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a semiconductor manufacturing oxidation unit, includes the oxidation case, the inside of oxidation case is provided with the casing through the driving piece rotation, and the upper end of oxidation case is equipped with hides the piece, and the front end of oxidation case is equipped with oxygen therapy spare, and the inside of oxidation case is equipped with the heating member, the inside one end lateral wall fixedly connected with locating plate of casing, and the activity of the inside other end lateral wall of casing runs through there are the multiunit connecting rod, every group the quantity of connecting rod is two, two the common fixedly connected with riser of one end of connecting rod, and the common fixedly connected with limiting plate of the other end of two connecting rods, the one end extension of keeping away from the connecting rod of riser has concave type board, and two springs of fixedly connected with between the inner wall of riser and casing, two the spring is located the outside of two connecting rods respectively, the locating plate lateral wall corresponds concave type board department and has seted up the constant head tank.

Preferably, the driving piece includes the L template, L template fixed connection is in the rear end of oxidation case, and fixed interlude has the motor on the inner wall of L template, the output shaft end fixedly connected with connecting axle of motor, the connecting axle activity runs through in the rear end outer wall of oxidation case, and the connecting axle keeps away from the one end of motor and the rear end fixed connection of casing.

Preferably, the covering part comprises a box cover, the box cover is slidably sleeved on the outer wall of the oxidation box, the top end of the inner side of the box cover is tightly attached to the top end of the oxidation box, and the center of the upper end of the box cover is communicated with an exhaust pipe.

Preferably, the oxygen therapy part comprises two symmetrical air inlet pipes, the two air inlet pipes are respectively communicated with two sides of the front end of the oxidation box, the front ends of the air inlet pipes are jointly communicated with a connecting pipe, and the outer wall of the connecting pipe is communicated with an oxygen therapy pipe.

Preferably, the heating element comprises two electric heating plates which are respectively and fixedly connected to the side walls of the two ends of the inner wall of the shell.

Preferably, one end of the limiting plate, which is far away from the connecting rod, is fixedly connected with a pull ring, and an integrally formed structure is arranged between the pull ring and the limiting plate.

Compared with the prior art, the utility model discloses an advantage lies in with positive effect: in the process of carrying out high-temperature oxidation on the semiconductor wafer, the surface of the wafer is heated uniformly, the contact effect between the surface of the wafer and oxygen is good, the oxidation quality of the surface of the wafer is improved, meanwhile, the semiconductor wafers of different specifications are placed and positioned together, the operation is very simple, convenient and fast, and the semiconductor wafers are also very simple, convenient and fast when taken out.

Drawings

FIG. 1 is a schematic view of the overall structure of an oxidation apparatus for semiconductor manufacturing according to the present invention;

FIG. 2 is a schematic view of the inside of an oxidation chamber of an oxidation apparatus for semiconductor manufacturing according to the present invention;

fig. 3 is an enlarged view of a portion a of fig. 2 of an oxidation apparatus for semiconductor manufacturing according to the present invention.

Illustration of the drawings: 1. an oxidation box; 2. a box cover; 3. a motor; 4. an exhaust pipe; 5. an oxygen delivery tube; 6. a connecting pipe; 7. an air inlet pipe; 8. an L-shaped plate; 9. an electrical heating plate; 10. a housing; 11. positioning a plate; 12. positioning a groove; 13. a connecting shaft; 14. a concave plate; 15. a vertical plate; 16. a spring; 17. a connecting rod; 18. a limiting plate; 19. and (4) a pull ring.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and the present invention is not limited to the specific embodiments disclosed below.

The semiconductor manufacturing oxidation apparatus as shown in fig. 1 to 3 comprises an oxidation box 1, a housing 10 is rotatably arranged inside the oxidation box 1 by a driving member, the upper end of the oxidation box 1 is provided with a covering part, the front end of the oxidation box 1 is provided with an oxygen delivery part, the interior of the oxidation box 1 is provided with a heating part, the side wall of one end of the interior of the shell 10 is fixedly connected with a positioning plate 11, and a plurality of groups of connecting rods 17 are movably penetrated through the side wall of the other end of the interior of the shell 10, the number of each group of connecting rods 17 is two, one end of each connecting rod 17 is fixedly connected with a vertical plate 15, and the other ends of the two connecting rods 17 are fixedly connected with a limit plate 18 together, one end of the vertical plate 15 far away from the connecting rods 17 extends to form a concave plate 14, and two springs 16 are fixedly connected between the vertical plate 15 and the inner wall of the shell 10, the two springs 16 are respectively positioned at the outer sides of the two connecting rods 17, and a positioning groove 12 is formed in the side wall of the positioning plate 11 corresponding to the concave plate 14.

The driving piece includes

L template

8, 8 fixed connection of L template are in the rear end of oxidation case 1, and fixed interlude has motor 3 on the inner wall of L template 8, motor 3's output shaft end fixedly connected with connecting axle 13, connecting axle 13 activity runs through in the rear end outer wall of oxidation case 1, and the one end that motor 3 was kept away from to connecting axle 13 and the rear end fixed connection of casing 10, be connected motor 3 and external power source, thereby motor 3 can order about connecting axle 13 and rotate, then connecting axle 13 can drive casing 10 and rotate, then it is rotatable to lay at the inside wafer of casing 10.

The cover part comprises a box cover 2, the box cover 2 is slidably sleeved on the outer wall of the oxidation box 1, the top end of the inner side of the box cover 2 is tightly attached to the top end of the oxidation box 1, the upper end center of the box cover 2 is communicated with an exhaust pipe 4, the oxidation box 1 can be sealed by arranging the box cover 2, air flow entering the interior of the oxidation box 1 can be discharged from the exhaust pipe 4, and the excessive air pressure in the oxidation box 1 is avoided.

The oxygen therapy part comprises two symmetrical air inlet pipes 7, the two air inlet pipes 7 are respectively communicated with two sides of the front end of the oxidation box 1, the front ends of the air inlet pipes 7 are jointly communicated with a connecting pipe 6, the outer wall of the connecting pipe 6 is communicated with an oxygen therapy pipe 5, a pipeline for delivering oxygen is communicated with the oxygen therapy pipe 5, and then the oxygen can be delivered to the inside of the oxidation box 1 along the connecting pipe 6 and the two air inlet pipes 7.

The heating member includes two electric heating plates 9, and two electric heating plates 9 are fixed connection respectively on the inner wall both ends lateral wall of casing 10, are connected two electric heating plates 9 with external power source to two electric heating plates 9 can produce the heat, make the inside of oxidation case 1 produce high temperature.

One end of the limiting plate 18, which is far away from the connecting rod 17, is fixedly connected with a pull ring 19, the pull ring 19 and the limiting plate 18 are of an integrally formed structure, and the limiting plate 18 is conveniently pulled outwards by the pull ring 19.

The working principle is as follows: opening the box cover 2, pulling a pull ring 19 at the side of the shell 10 outwards to drive the limit plate 18, the two connecting rods 17, the vertical plate 15 and the concave plate 14 to move outwards together, wherein the vertical plate 15 extrudes two springs 16 connected with the inner wall of the shell 10, the wafer is placed between the locating plate 11 and the vertical plate 15 and is positioned between the locating groove 12 on the locating plate 11 and the groove on the concave plate 14, at the moment, the pull ring 19 is loosened, the vertical plate 15 can be driven to drive the concave plate 14 to reset under the action force of the springs 16, the concave plate 14 can fix the wafer between the locating groove 12 and the concave plate 14 and is suitable for wafers with different specifications, at the moment, the box cover 2 is covered, oxygen can be provided for the inside of the oxidation box 1 through arranging an oxygen conveying piece, high temperature can be formed inside the oxidation box 1 through arranging a heating piece, the shell 10 can be driven to rotate through arranging a driving piece, and the wafer is uniformly heated, and the contact effect with oxygen is good, when the wafer needs to be taken out after the oxidation of the wafer is finished, the pull ring 19 is slightly pulled outwards to enable the concave plate 14 to be separated from the wafer, and the wafer can be directly taken out, so that the wafer is convenient to take.

In the present invention, the terms "mounting," "connecting," "fixing," and the like are to be understood in a broad sense, for example, "connecting" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description herein, the appearances of the phrases "one embodiment," "some embodiments," "a specific embodiment," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment or example, but rather to the same embodiment or example. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. An oxidation apparatus for semiconductor manufacturing, comprising an oxidation chamber (1), characterized in that: the oxidation box comprises an oxidation box (1), a shell (10) is arranged in the oxidation box (1) in a rotating mode through a driving piece, a covering piece is arranged at the upper end of the oxidation box (1), an oxygen delivery piece is arranged at the front end of the oxidation box (1), a heating piece is arranged in the oxidation box (1), a positioning plate (11) is fixedly connected to the side wall of one end of the interior of the shell (10), a plurality of groups of connecting rods (17) penetrate through the side wall of the other end of the interior of the shell (10), the number of the connecting rods (17) in each group is two, a vertical plate (15) is fixedly connected to one end of each connecting rod (17) together, a limiting plate (18) is fixedly connected to the other end of each connecting rod (17) together, a concave plate (14) extends from one end, far away from the connecting rods (17), two springs (16) are fixedly connected between the vertical plate (15) and the inner wall of the shell (10), and the springs (16) are respectively located on the outer sides of the two connecting rods (17), and a positioning groove (12) is formed in the side wall of the positioning plate (11) corresponding to the concave plate (14).

2. The semiconductor manufacturing oxidation apparatus according to claim 1, wherein: the driving piece comprises an L-shaped plate (8), the L-shaped plate (8) is fixedly connected to the rear end of the oxidation box (1), a motor (3) is fixedly inserted into the inner wall of the L-shaped plate (8), a connecting shaft (13) is fixedly connected to the output shaft of the motor (3), the connecting shaft (13) movably penetrates through the outer wall of the rear end of the oxidation box (1), and one end of the motor (3) and the rear end of the shell (10) are far away from the connecting shaft (13).

3. The semiconductor manufacturing oxidation apparatus according to claim 1, wherein: the cover comprises a box cover (2), the box cover (2) is slidably sleeved on the outer wall of the oxidation box (1), the top end of the inner side of the box cover (2) is tightly attached to the top end of the oxidation box (1), and the center of the upper end of the box cover (2) is communicated with an exhaust pipe (4).

4. The semiconductor manufacturing oxidation apparatus according to claim 1, wherein: the oxygen therapy part comprises two symmetrical air inlet pipes (7), the two air inlet pipes (7) are respectively communicated with two sides of the front end of the oxidation box (1), the front ends of the air inlet pipes (7) are jointly communicated with a connecting pipe (6), and the outer wall of the connecting pipe (6) is communicated with an oxygen therapy pipe (5).

5. The semiconductor manufacturing oxidation apparatus according to claim 1, wherein: the heating element comprises two electric heating plates (9), and the two electric heating plates (9) are respectively and fixedly connected to the side walls of the two ends of the inner wall of the shell (10).

6. The semiconductor manufacturing oxidation apparatus according to claim 1, wherein: one end of the limiting plate (18) far away from the connecting rod (17) is fixedly connected with a pull ring (19), and an integrally formed structure is arranged between the pull ring (19) and the limiting plate (18).