CN216015264U - Connecting structure of surge protector's disengagement mechanism and surge protector - Google Patents

Abstract

The utility model relates to a surge protector's disengagement mechanism's connection structure and surge protector, this connection structure includes: the first hot melting layer is connected with the separation mechanism and an electrode plate of the surge protector; the second hot melting layer is arranged on the separation mechanism and the first hot melting layer; the melting point of the first hot melt layer is smaller than that of the second hot melt layer. Through the technical scheme, the breaking-away mechanism of the surge protector gives consideration to the lightning stroke tolerance performance and the quick tripping performance of the surge protector during transient overvoltage, so that the surge protector obtains better protection effect and safety.

Description

Connecting structure of surge protector's disengagement mechanism and surge protector

Technical Field

The present disclosure relates to the field of surge protection devices, and in particular, to a connection structure of a release mechanism of a surge protection device and a surge protection device.

Background

The surge protector is applied to lightning surge protection of a power transmission and distribution system, an LED street lamp lighting system, a 4G/5G base station and the like. When the surge protector is installed in a system in the application field, the surge protector is often subjected to a fault voltage or transient overvoltage of a power supply system, so that the surge protector is subjected to overvoltage exceeding a rated value, abnormal current passes through the surge protector, and an overheating state is formed. At this time, the surge protector itself is required to be operated by a release mechanism to cut off abnormal voltage and current, thereby preventing the surge protector from being ignited and burnt due to overheating.

The release mechanism of the surge protector must be able to withstand the surge voltage of the natural lightning surge on one hand, and must be quickly actuated to release when the surge protector is overheated due to the fault voltage or transient overvoltage of the power supply system on the other hand, however, the release mechanism of the surge protector in the related art has difficulty in meeting the performance requirement.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem or at least partially solve the above technical problem, the present disclosure provides a connection structure of a detachment mechanism of a surge protector and the surge protector.

In a first aspect, the present disclosure provides a connection structure of a disconnection mechanism of a surge protector, including: the first hot melting layer is connected with the separation mechanism and an electrode plate of the surge protector; the second hot melting layer is arranged on the separation mechanism and the first hot melting layer; the melting point of the first hot melt layer is smaller than that of the second hot melt layer.

In some embodiments, the second thermal melting layer is further formed on the electrode sheet and covers a predetermined range of the electrode sheet.

In some embodiments, the first hot melt layer comprises: a first portion interposed between the detachment mechanism and the electrode pad, and a second portion located outside the detachment mechanism and covering the electrode pad.

In some embodiments, the difference between the melting point of the first hot melt layer and the melting point of the first hot melt layer is greater than or equal to 80 ℃.

In some embodiments, the melting point of the first hot melt layer is between 125 ℃ and 145 ℃, and the melting point of the second hot melt layer is between 215 ℃ and 235 ℃.

In some embodiments, the detachment mechanism is a metal dome.

In some embodiments, the melting point of the first hot melt layer is 138 ℃ and the melting point of the second hot melt layer is 227 ℃.

In a second aspect, the present disclosure provides a surge protector device comprising: the electrode plate is arranged on the body; a disengagement mechanism; the connecting structure is arranged to connect the electrode plate and the separating mechanism; wherein, connection structure includes: the first hot melting layer is connected with the separation mechanism and the electrode plate; the second hot melting layer is arranged on the separation mechanism and the first hot melting layer; the melting point of the first hot melt layer is smaller than that of the second hot melt layer.

In some embodiments, the second thermal melting layer is further formed on the electrode sheet and covers a predetermined range of the electrode sheet.

In some embodiments, the detachment mechanism is a metal dome.

Compared with the related art, the technical scheme provided by the embodiment of the disclosure has the following advantages: according to the technical scheme provided by the embodiment of the disclosure, the breaking-away mechanism of the surge protector gives consideration to the lightning stroke tolerance performance and the rapid tripping performance during transient overvoltage of the surge protector, so that the surge protector obtains better protection effect and safety.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a schematic structural diagram illustrating an embodiment of a connection structure of a detachment mechanism of a surge protector according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another embodiment of a connection structure of a detachment mechanism of a surge protector according to an embodiment of the present disclosure.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the disclosure and are not intended to limit the disclosure.

In the following description, suffixes such as "module", "component", or "unit" used to denote components are used only for facilitating the explanation of the present disclosure, and have no specific meaning by themselves. Thus, "module", "component" or "unit" may be used mixedly.

The surge protector provided in the embodiments of the present disclosure includes: the connecting structure is arranged to connect the separation mechanism and the electrode plate and is configured to enable the separation mechanism to separate from the electrode plate when the electrode plate is overheated due to fault voltage or transient overvoltage and the like of a power supply system. In some examples, the detachment mechanism is a metal spring, and the elastic force of the metal spring provides a force for detaching the detachment mechanism from the electrode plate. It should be understood that the present disclosure is not limited thereto and other disengagement mechanisms are possible, such as a spring or other resilient member that provides the disengagement force, and the present disclosure is not repeated herein.

The embodiment of the present disclosure provides a connection structure of a release mechanism of a surge protector, and as shown in fig. 1, a connection structure 10 of the embodiment of the present disclosure includes: a first hot melt layer 11 and a second hot melt layer 12. The first hot melt layer 11 connects the detachment mechanism 20 and the electrode sheet 30. The second thermofusible layer 12 is disposed on the detachment mechanism 20 and the first thermofusible layer 11. In the disclosed embodiment, the melting point of the first hot melt layer 11 is less than the melting point of the second hot melt layer 12.

In the disclosed embodiment, the first hot melt layer 11 connects the detachment mechanism 20 and the electrode sheet 30, and includes a portion interposed between the detachment mechanism 20 and the electrode sheet 30, and a portion outside the detachment mechanism 20 and covering the electrode sheet 30. The second thermal fusing layer 12 covers at least a portion of the release mechanism 20 and the first thermal fusing layer 11. The first thermal fusing layer 11 has a low melting point, and when it is overheated due to a fault voltage or a transient overvoltage of the power supply system, the first thermal fusing layer 11 is rapidly fused, so that the detachment mechanism 20 is separated from the electrode tab 30. The second hot melt layer 12 has a high melting point, and can keep the separation mechanism 20 and the electrode sheet 30 from being separated when overheated due to an impact voltage or the like caused by a natural lightning surge.

In order to improve the toughness of the connection structure 10, the second hot melt layer 12 is prevented from conducting heat to the first hot melt layer 11 to melt the first hot melt layer 11, so that the separation mechanism 20 is separated from the electrode plate 30, and in some embodiments, as shown in fig. 2, the second hot melt layer 12 also covers the electrode plate 30, so that the connection between the separation mechanism 20 and the electrode plate 30 is relatively stable. However, in order to avoid the second thermal melting layer 12 being connected too tightly with the electrode pad 30, the second thermal melting layer 12 covers a predetermined range of the electrode pad 30, and in a specific implementation, an area where the second thermal melting layer 12 is connected with the electrode pad 30 is set as needed.

In the embodiment of the present disclosure, the area of the second hot melt layer 12 connected to the electrode sheet 30 is related to the melting point of the second hot melt layer 12, generally, the higher the melting point of the second hot melt layer 12 is, the smaller the connection area is, so as to avoid that the separation cannot be realized due to the too large connection area; the lower the melting point of the second hot melt layer 12 is, the larger the connection area can be. A person skilled in the art can obtain a reasonable connection area through experimental tests based on the present disclosure.

In some embodiments, the difference between the melting point of the first hotmelt layer 11 and the melting point of the first hotmelt layer 12 is greater than or equal to 80 ℃. The larger melting point difference can prevent one hot melt layer (the first hot melt layer 11 or the first hot melt layer 12) from affecting the other hot melt layer (the first hot melt layer 12 or the first hot melt layer 11) when being heated.

In some embodiments, the melting point of the first hot melt layer is between 125 ℃ and 145 ℃, and the melting point of the second hot melt layer is between 215 ℃ and 235 ℃. In a specific implementation, according to the magnitude of the fault voltage or the transient overvoltage of the power supply system, the corresponding thermal melting component may be selected to form the first thermal melting layer, for example, a thermal melting component with a lower melting point may be used when the fault voltage or the transient overvoltage of the power supply system is small, and a thermal melting component with a higher melting point may be used when the fault voltage or the transient overvoltage of the power supply system is large.

In some embodiments, the first hot melt layer 11 is formed of a solder paste including: 42% of tin (Sn) by mass; 58 percent of bismuth (Bi) by mass. It should be understood that the embodiments of the present disclosure are not limited to the solder paste formulation, and in particular, other thermal fuse components may be selected to form the first thermal fuse layer according to the magnitude of the fault voltage or the transient overvoltage of the power supply system, for example, a thermal fuse component with a lower melting point may be used when the fault voltage or the transient overvoltage of the power supply system is small, and a thermal fuse component with a higher melting point may be used when the fault voltage or the transient overvoltage of the power supply system is large.

In some embodiments, the second hotmelt layer 12 is formed from tin filaments including: 99.3% of tin (Sn) by mass; copper Cu) in an amount of 0.7% by mass. In the disclosed embodiment, the tin wire formula is not limited, and other known formulas are possible.

In some embodiments, the first hot melt layer 11 is formed of a solder paste including: 42% of tin (Sn) by mass; 58 percent of bismuth (Bi) by mass; the second thermo-fuse layer 12 is formed of a tin filament including: 99.3% of tin (Sn) by mass; copper Cu) in an amount of 0.7% by mass. The melting point of the first hot melt layer 11 was 138 deg.c and the melting point of the second hot melt layer 12 was 227 deg.c. The surge voltage endurance of the connection structure is 1.2/50us, 6kV and 1.2/50us, 10kV through tests, and the tripping time at transient overvoltage is between 360 and 480 milliseconds.

And (4) evaluating and testing the lightning surge impact voltage tolerance and transient overvoltage tripping time of the surge protector which is welded by the separation mechanism. The samples were evaluated at 6kV and 10kV in this example, respectively. The surge voltage endurance of the connection structure is 1.2/50us, 6kV, and 1.2/50us, 10kV, and the trip time at transient overvoltage is between 360 and 480 milliseconds. The breaking-away mechanism of the surge protector can give consideration to the lightning stroke tolerance performance and the rapid tripping performance during transient overvoltage of the surge protector, so that the surge protector obtains better protection effect and safety.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above-mentioned serial numbers of the embodiments of the present disclosure are merely for description and do not represent the merits of the embodiments.

While the embodiments of the present disclosure have been described in connection with the drawings, the present disclosure is not limited to the specific embodiments described above, which are intended to be illustrative rather than limiting, and it will be apparent to those of ordinary skill in the art in light of the present disclosure that many more modifications can be made without departing from the spirit of the disclosure and the scope of the appended claims.

Claims (10)

1. A connecting structure of a disengaging mechanism of a surge protector, comprising:

the first hot melting layer is connected with the separation mechanism and an electrode plate of the surge protector;

the second hot melting layer is arranged on the separation mechanism and the first hot melting layer;

the melting point of the first hot melt layer is smaller than that of the second hot melt layer.

2. The connection structure of claim 1, wherein the second thermally fusible layer is further formed on the electrode tab and covers a predetermined range of the electrode tab.

3. The connection structure according to claim 1 or 2, wherein the first hot melt layer comprises: a first portion interposed between the detachment mechanism and the electrode pad, and a second portion located outside the detachment mechanism and covering the electrode pad.

4. The connection structure according to claim 1 or 2, wherein a difference between the melting point of the first hot melt layer and the melting point of the first hot melt layer is greater than or equal to 80 ℃.

5. The connection structure according to claim 1, wherein the first hot melt layer has a melting point of 125 ℃ to 145 ℃ and the second hot melt layer has a melting point of 215 ℃ to 235 ℃.

6. The connecting structure according to claim 1 or 2, wherein the detachment mechanism is a metal dome.

7. The connection structure according to any one of claims 1, 2 or 5, wherein the melting point of the first hot-melt layer is 138 ℃ and the melting point of the second hot-melt layer is 227 ℃.

8. A surge protector device, comprising:

the electrode plate comprises a body, wherein an electrode plate is arranged on the body;

a disengagement mechanism;

a connecting structure configured to connect the electrode sheet and the release mechanism;

wherein, the connection structure includes:

the first hot melting layer is connected with the separation mechanism and the electrode plate;

the second hot melting layer is arranged on the separation mechanism and the first hot melting layer;

the melting point of the first hot melt layer is smaller than that of the second hot melt layer.

9. A surge protector according to claim 8, wherein the second heat-fusible layer is further formed on the electrode sheet so as to cover a predetermined range of the electrode sheet.

10. A surge protector as claimed in claim 8 or 9, wherein the release mechanism is a metal spring.

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