CN216012498U - Non-contact temperature measuring device, temperature measuring module therein and electronic equipment - Google Patents

Abstract

The utility model provides a device, temperature measurement module and electronic equipment wherein of non-contact temperature measurement, the temperature measurement module includes: a substrate; the heating resistor is arranged on the substrate and is electrically connected with the first bonding pad; the temperature-sensitive resistor is arranged on the substrate and is in contact with the heating resistor, and the temperature-sensitive resistor is electrically connected with the second bonding pad; the temperature-sensitive resistor is used for receiving an optical signal radiated by a target to be measured and generating a first electrical signal according to the optical signal, the first electrical signal is used for generating a first control signal, the heating resistor is used for heating under the control of the first control signal so as to enable the temperature measurement module to be in a constant temperature state, and the first control signal is used for determining the temperature of the target to be measured. The utility model provides a non-contact temperature measuring device utilizes the heating resistor and the temperature sensitive resistor of contact, is in the constant temperature state through closed-loop control temperature measurement module and carries out the temperature measurement, when guaranteeing that the temperature measurement is accurate for this far infrared temperature measuring device's volume is less, the heat capacity is less, is convenient for encapsulate and can effectively reduce the consumption of device.

Description

Non-contact temperature measuring device, temperature measuring module therein and electronic equipment

Technical Field

The present application relates to the field of temperature measurement technologies, and more particularly, to a non-contact temperature measuring device, a temperature measuring module and an electronic device thereof.

Background

Radiation thermometry is a typical non-contact thermometry method, and the principle is to measure the temperature by using the fact that the thermal radiation of an object can change along with the change of the temperature. The temperature of the target to be measured is received by the sensor in a radiation mode, an electric signal corresponding to the radiation intensity is generated and output, and the temperature value of the target to be measured is measured after being processed by the processor and corresponding to the corresponding temperature value. The non-contact temperature measuring sensor has wide application in the fields of industry, health and medical treatment. The non-contact temperature measuring sensor usually adopts a thermopile, but the thermopile has the problems of larger packaging volume, larger heat capacity, higher power consumption and higher price, and limits the application of the non-contact temperature measuring sensor.

Therefore, how to reduce the cost while meeting the non-contact temperature measurement accuracy is an urgent technical problem to be solved in order to manufacture smaller and more portable non-contact temperature measurement equipment.

Disclosure of Invention

The embodiment of the application provides a temperature measurement module, non-contact temperature measuring device and electronic equipment among non-contact temperature measuring device, can reduce the cost and the volume of device when guaranteeing that measurement accuracy is high.

In a first aspect, a temperature measurement module in a non-contact temperature measurement device is provided, the temperature measurement module includes: a substrate; the heating resistor is arranged on the substrate and is electrically connected with the first bonding pad; the temperature-sensitive resistor is arranged on the substrate and is in contact with the heating resistor, and the temperature-sensitive resistor is electrically connected with the second bonding pad; the temperature-sensitive resistor is used for receiving an optical signal radiated by a target to be detected and generating a first electrical signal according to the optical signal, the first electrical signal is used for generating a first control signal, the heating resistor is used for heating under the control of the first control signal so as to enable the temperature measurement module to be in a constant temperature state, and the first control signal is used for determining the temperature of the target to be detected.

In this application embodiment, the temperature measurement module passes through temperature sensitive resistor and receives the photosignal that the target that awaits measuring radiated, and temperature sensitive resistor is sensitive to the temperature, and its resistance can change along with temperature variation, through temperature sensitive resistor's electric current also changes thereupon to produce first signal of telecommunication, first signal of telecommunication are used for confirming the first control signal that can control heating resistor and generate heat, thereby first control signal control heating resistor generates heat and forms closed-loop control, makes the temperature measurement module be in constant temperature state. The optical signal radiated by the target to be measured can be directly reflected according to the change of the first control signal so as to determine the temperature of the target to be measured.

In the embodiment of the application, heating resistor and temperature sensitive resistor contact, heating resistor and temperature sensitive resistor zonulae occludens together promptly, and on the one hand, heating resistor generates heat under first control signal's control, can heat self and through heat-conduction heating temperature sensitive resistor, eliminates temperature change that temperature sensitive resistor takes place because of receiving the optical signal fast, and on the other hand, temperature sensitive resistor also can be through the zonulae occludens with heating resistor more fast, accurately sense the current temperature of temperature measurement module, improves the work efficiency of temperature measurement module.

The temperature measuring device comprises a heating resistor, a temperature sensing resistor, a temperature measuring module, a thermoelectric pile and a thermoelectric resistor, wherein the heating resistor is arranged on the temperature sensing module and is used for heating the temperature sensing resistor; in addition, the small volume enables the thermal capacity of the temperature measuring module to be small, and the power consumption waste caused by the large volume and the large thermal capacity can be reduced, so that the power consumption of the temperature measuring device is reduced.

In one possible implementation, the substrate includes: and the heat insulation groove surrounds the heating resistor and the temperature-sensitive resistor.

In the embodiment of the application, the heat insulation grooves are formed in the periphery of the heating resistor and the temperature-sensitive resistor, so that the influence of the heat effect of the substrate on the heating resistor and the temperature-sensitive resistor can be effectively isolated, the common-mode interference of the working environment of the device on the device is reduced, the measurement accuracy of the non-contact temperature measuring device module is improved, and the power consumption of the temperature measuring module is further reduced.

In one possible implementation, the substrate includes: the heating resistor and the temperature-sensitive resistor are arranged on the first substrate; the second substrate comprises a through hole, and the first substrate is arranged on the second substrate so that the through hole is positioned below the heating resistor and the temperature-sensitive resistor to form a heat insulation area.

In the embodiment of the application, set up the through-hole on the second substrate of heating resistor and temperature sensitive resistor below, can form the air insulation layer below heating resistor and temperature sensitive resistor, further reduce the influence of the heat effect of substrate to heating resistor and temperature sensitive resistor, weaken the environment to the influence of this non-contact temperature measurement module, further promote the accuracy that non-contact temperature measurement module measured and reduce the consumption of this temperature measurement module.

In one possible implementation, the heating resistor surrounds the temperature-sensitive resistor or the temperature-sensitive resistor surrounds the heating resistor.

In the embodiment of the application, make the heating resistor encircle the heating resistor through structural design or temperature sensitive resistor encircles the heating resistor, the area of contact of the heating resistor and the temperature sensitive resistor of contact further increases, and the heat-conduction effect further promotes to improved the consumption that further reduced the temperature measurement module, improved the temperature measurement efficiency of temperature measurement module.

For example, the heating resistor is in an annular structure and surrounds the temperature-sensitive resistor, or the temperature-sensitive resistor is in an annular structure and surrounds the heating resistor, and the physical connection between the heating resistor and the temperature-sensitive resistor can be increased through the mutual surrounding structural design, so that the heat conduction between the heating resistor and the temperature-sensitive resistor is enhanced, the power consumption of the temperature measurement module is reduced, and the temperature measurement efficiency of the temperature measurement module is improved.

In one possible implementation, the heating resistor includes: the first heating resistor is in contact with the temperature-sensitive resistor; a second heating resistor in contact with the first heating resistor and in contact with the temperature sensitive resistor; the first heating resistor and the second heating resistor generate heat under the control of the control signal, so that the temperature measurement module is in a constant temperature state.

In the embodiment of the application, the temperature measurement is carried out through the combination of two heating resistors that contact each other and a temperature sensitive resistor, can maintain the temperature measurement module more fast, high-efficiently and be in the constant temperature state, avoids after detecting a target that awaits measuring, because the temperature measurement error that the temperature measurement module does not in time resume the constant temperature state and lead to improves the accuracy and the temperature measurement efficiency of temperature measurement module temperature measurement.

In one possible implementation, the temperature-sensitive resistor includes: the first temperature-sensitive resistor is in contact with the heating resistor; a second temperature sensitive resistor in contact with the first temperature sensitive resistor and in contact with the heating resistor; the first temperature-sensitive resistor and the second temperature-sensitive resistor are used for receiving the optical signal and respectively generating a first electric signal according to the optical signal, and the first electric signal is used for generating a first control signal for controlling the heating resistor to generate heat.

In the embodiment of the application, the temperature is measured through the combination of two temperature sensitive resistors in contact with each other and a heating resistor, and the temperature of the temperature measuring module can be fed back through the first electric signal more quickly, so that the temperature measuring module can recover the constant temperature state under closed-loop control, the temperature measuring error caused by the fact that the temperature measuring module does not recover the constant temperature state in time is avoided, and the accuracy and the temperature measuring efficiency of the temperature measuring module are improved.

In one possible implementation, the first heating resistor and the second heating resistor are resistors of the same material.

In one possible implementation, the first temperature-sensitive resistor and the second temperature-sensitive resistor are resistors of the same material.

In the embodiment of the application, the heating resistors or the temperature-sensitive resistors more than two are made of the same material, so that the production is convenient, and the production efficiency of the temperature measurement module can be improved.

In a possible implementation manner, the far infrared absorption coefficients of the heating resistor and the temperature-sensitive resistor are both greater than or equal to 80%.

Specifically, the heating resistor and the temperature sensitive resistor can be prepared from far infrared absorption materials.

In a possible implementation manner, the optical signal is far infrared light, and the temperature measurement module further includes: and the far infrared filter is arranged above the heating resistor and the temperature-sensitive resistor and is used for transmitting the far infrared light and blocking non-far infrared light.

In the embodiment of the application, the far infrared light radiated by the target to be measured is utilized to measure the temperature, and the far infrared filter is arranged above the heating resistor and the temperature sensitive resistor which are prepared from the far infrared absorbing material, so that the heating resistor and the temperature sensitive resistor only receive the far infrared light, the influence of non-far infrared light on the temperature of the temperature measuring module is avoided, and the accuracy of temperature measurement of the temperature measuring module is improved.

In a possible implementation manner, the temperature measurement module further includes: and the far infrared filter is arranged above the heating resistor and the temperature-sensitive resistor through the support.

In a possible implementation manner, the temperature measurement module further includes: and the far infrared micro lens is arranged above the far infrared optical filter and is used for adjusting the field angle of the far infrared light received by the heating resistor and the temperature sensitive resistor.

In this application embodiment, further set up far infrared microlens in the top of far infrared light filter, can control far infrared temperature measuring device's angle of vision, enlarge the detection range of temperature measurement module, promote the wholeness ability of temperature measurement module.

In one possible implementation, the heating resistor includes at least one of a graphene ink layer, a carbon nanotube ink layer, a carbon black ink layer, or a metallic resistive layer.

In one possible implementation, the absolute value of the temperature sensitive coefficient of the material of the temperature sensitive resistor is greater than or equal to 1.5%.

In one possible implementation, the temperature-sensitive resistor includes at least one of a graphene ink layer or a vanadium oxide layer.

In one possible implementation, the substrate is a flexible polyimide layer.

In the embodiment of the application, through adopting flexible polyimide material as the substrate, flexible polyimide material is with low costs and light in weight, sets up heating resistor and temperature sensitive resistor on it, in reduce cost, makes the volume of this temperature measurement module littleer, more frivolous.

In one possible implementation manner, the heating resistor and the temperature-sensitive resistor are both coated on the substrate.

In the embodiment of the application, the heating resistor and the temperature sensitive resistor are both arranged on the substrate through a brushing process, the temperature measuring module of the non-contact temperature measuring device can be prepared through a simple brushing process, the heating resistor is physically connected with the temperature sensitive resistor to realize accurate temperature measurement, the temperature measuring module prepared through the brushing process can be lighter and thinner, the size is smaller, the power consumption of the temperature measuring module is reduced while the temperature measuring module is lighter and thinner, the production cost of the temperature measuring module is reduced, and the production efficiency is improved.

In one possible implementation, the first substrate is bonded to the second substrate.

In the embodiment of the application, the first substrate is arranged on the second substrate through a pressure welding process, so that the first substrate provided with the heating resistor and the temperature-sensitive resistor and the second substrate provided with the through hole can be processed separately and simultaneously, and the processing efficiency is improved.

In a second aspect, a non-contact temperature measuring device is provided, comprising:

at least one temperature measurement module as in any one of the possible implementations of the first aspect, configured to receive an optical signal radiated by a target to be measured, and generate a first electrical signal according to the optical signal; and the control circuit is electrically connected with the temperature measuring module and used for generating a first control signal according to the first electric signal, and the first control signal is used for determining the temperature of the target to be measured.

In the embodiment of the application, the small and light and thin temperature measurement module in the first aspect is adopted, the temperature measurement module is subjected to constant-temperature closed-loop control through the control circuit, a first control signal is generated according to a first electric signal, the temperature of a target to be measured is determined according to the first control signal, and efficient and accurate temperature measurement is achieved. The non-contact temperature measuring device can achieve small size and low power consumption under the condition of ensuring the measuring accuracy.

In a possible implementation manner, the temperature measurement module in any one possible implementation manner of the at least one first aspect includes: the reference temperature measurement module is provided with a baffle above and used for blocking the optical signal from being transmitted to the reference temperature measurement module; the reference temperature measurement module is used for shielding the optical signal so as to keep the reference temperature measurement module in a constant temperature state and generate a second electric signal in the constant temperature state; the control circuit is used for generating a second control signal according to the second electric signal, and the first control signal and the second control signal are used for determining the temperature of the target to be measured.

In the embodiment of the application, the reference temperature measurement module is arranged in the non-contact temperature measurement device, the temperature measurement module and the reference temperature measurement module are used simultaneously during temperature measurement, wherein the reference temperature measurement module receives an optical signal radiated by a target to be measured, the reference temperature measurement module does not receive the optical signal radiated by the target to be measured, the reference temperature measurement module is always in a constant temperature state and is not influenced by the optical signal, a second control signal can be provided as a reference, the reference temperature measurement module does not receive the second control signal generated by the optical signal radiated by the target to be measured and the first control signal obtained by the temperature measurement module after receiving the optical signal radiated by the target to be measured, difference calculation is carried out, common-mode temperature interference caused by a sensor substrate can be further reduced, influence of temperature drift on temperature measurement is reduced, and accuracy of the non-contact temperature measurement device is improved.

In a possible implementation manner, the temperature measuring device further includes: the temperature measurement module in any one of the possible implementation manners of the at least one first aspect is arranged on the reinforcing plate.

In the embodiment of the application, the reinforcing plate is arranged below the temperature measurement module, so that the problem of insufficient mechanical strength possibly caused by the flexible substrate can be solved, the temperature measurement device can adapt to wider application scenes, and the application of the non-contact temperature measurement device is expanded.

In one possible implementation, the reinforcing plate includes: a first part, to which the at least one temperature measurement module according to any one of the possible implementations of the first aspect is disposed; a second portion adjacent to the first portion, the control circuit being disposed in the second portion.

In one possible implementation, the stiffener is a printed circuit board.

In the embodiment of the application, the printed circuit board is directly adopted as the reinforcing plate, and the circuit connection structure of the far infrared temperature measuring device is simplified, so that the far infrared temperature measuring device is more convenient to produce, the production cost is reduced, and the production efficiency is improved.

In a possible implementation manner, the substrates of the at least one temperature measurement module according to any one of the possible implementation manners of the first aspect are the same substrate, and the at least one temperature measurement module according to any one of the possible implementation manners of the first aspect are adjacently arranged on the substrate.

In one possible implementation, the substrate includes: a third part, where the at least one temperature measurement module as in any one of the possible implementations of the first aspect is disposed; and the fourth part is adjacent to the third part, and the control circuit is arranged on the fourth part.

In a third aspect, an electronic device is provided, including: such as the non-contact temperature measuring device in any one of the possible implementations of the second aspect.

Drawings

Fig. 1 is a schematic structural diagram of a temperature measurement module according to the present application.

Fig. 2a and 2b are top views of two temperature measurement modules according to the present application.

Fig. 3a, fig. 3b and fig. 3c are schematic diagrams illustrating the arrangement and routing of the heating resistor and the temperature sensitive resistor in the centralized temperature measurement module.

FIG. 4 is a schematic view of another temperature measurement module according to the present application.

Fig. 5a and 5b are schematic structural diagrams of two non-contact temperature measuring devices according to the present application.

Fig. 6a and fig. 6b are top views of two temperature measurement modules in the non-contact temperature measurement device of the present application.

FIG. 7 is a schematic block diagram of another non-contact thermometry apparatus of the present application.

Fig. 8a and 8b are schematic structural diagrams of an electronic device of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a temperature measurement module 100 in a non-contact temperature measurement device according to an embodiment of the present application, and as shown in the drawing, the temperature measurement module 100 includes: a heating resistor 102, a temperature sensitive resistor 103, a first pad and a second pad (not shown) electrically connected to the heating resistor 102 and the temperature sensitive resistor 103, respectively, and a substrate 104.

The heating resistor 102 and the temperature-sensitive resistor 103 are both arranged on the substrate 104, the heating resistor 102 and the temperature-sensitive resistor 103 are in close contact, the temperature-sensitive resistor 103 can receive an optical signal radiated by a target to be detected, the heating resistor 102 can generate heat under the control of a control signal, and the temperature-sensitive resistor is heated through heat conduction, so that the whole temperature measurement module is in a constant temperature state.

The temperature measurement process of the temperature measurement module is as follows:

the heating resistor 102 generates heat under the control of a first control signal generated by the temperature measuring device, and conducts heat through contact with the temperature sensitive resistor 103, so that the heating resistor 102 and the temperature sensitive resistor 103 reach a consistent constant temperature state, after the temperature measuring module receives a light signal radiated by a target to be measured, the temperature sensitive resistor 103 is sensitive to temperature, and the resistance value changes, so that a first electric signal related to the temperature of the target to be measured is generated and fed back to the temperature measuring device, and the temperature measuring device generates the first control signal again according to the first electric signal to control heating of the heating resistor 102 in order to maintain the constant temperature state of the temperature measuring module, illustratively, if the temperature of the temperature sensitive resistor 103 is reduced after receiving the light signal, the heating resistor 102 is controlled to prolong heating time, and if the temperature of the temperature sensitive resistor 103 is increased after receiving the light signal, the heating resistor 102 is controlled to shorten heating time. The closed-loop constant temperature control process enables the temperature of the target to be measured to have correlation with the first control signal, so that the temperature of the target to be measured can be measured according to the first control signal.

In the embodiment, on one hand, the heating resistor is in contact with the temperature-sensitive resistor, so that the heat conduction between the heating resistor and the temperature-sensitive resistor is facilitated, and the temperature of the temperature-sensitive resistor can be accurately controlled, so that the temperature measuring module is in a constant-temperature installation state, and the temperature of the target to be measured is accurately detected; on the other hand, compared with the traditional thermopile temperature measuring device which needs large-volume packaging and large power consumption, the temperature measuring device of the embodiment of the application uses the temperature measuring module instead of the thermopile, utilizes the combination of the heating resistor and the temperature sensitive resistor to measure the temperature, the heating resistor is in close contact with the temperature sensitive resistor, and the temperature measuring module has small volume and low cost while ensuring accurate and efficient temperature measurement, thereby reducing the volume of the temperature measuring device and reducing the cost of the temperature measuring device; in addition, the temperature measurement module is convenient to package due to small volume, heat capacity of the temperature measurement module is small, power consumption waste caused by large volume and large heat capacity can be reduced, and power consumption of the temperature measurement device is reduced.

Fig. 2a and 2b are top views of the temperature measuring module 100 according to the embodiment of the present disclosure.

Optionally, an insulating groove 105 is disposed on the substrate 104, and the insulating groove 105 is disposed around the heating resistor 102 and the temperature-sensitive resistor 103.

Specifically, as shown in fig. 2a, the substrate 104 is provided with an insulating groove 105, the insulating groove 105 has an integrated structure, and the heating resistor 102 and the temperature sensitive resistor 103 are located inside the integrated groove structure. It should be understood that the unitary slot structure is shown as circular, but is not limited thereto and may be other shapes such as rectangular.

As shown in fig. 2b, a plurality of heat insulating grooves 105 may be provided in the substrate 104, the heat insulating grooves 105 may have a split structure, and the heating resistor 102 and the temperature sensitive resistor 103 may be surrounded by the plurality of heat insulating grooves 105.

This embodiment is through setting up the heat-insulating groove around heating resistor and temperature sensitive resistor for heating resistor and temperature sensitive resistor are surrounded by the heat-insulating groove, can effectively completely cut off because the influence of the heat effect of substrate to the temperature of heating resistor and temperature sensitive resistor, reduce the common mode interference that the operational environment of device caused the device, help improves the measurement accuracy of this temperature measurement module and reduces the consumption of temperature measurement module.

Optionally, as shown in fig. 1, in one embodiment, the substrate 104 comprises: the substrate structure comprises a first substrate 1041 and a second substrate 1042, wherein the first substrate 1041 is provided with a heating resistor 102 and a temperature-sensitive resistor 103, the second substrate 1042 is provided with a through hole 106, and the through hole 106 is simultaneously located below the heating resistor 102 and the temperature-sensitive resistor 103 to form a heat insulation region between the heating resistor 102 and the temperature-sensitive resistor 103 and the second substrate 1042. In this embodiment, the first substrate 1041 and the second substrate 1042 are two split substrates, the first substrate 1041 has a first surface and a second surface opposite to each other along the thickness thereof, the second substrate 1042 has a third surface and a fourth surface opposite to each other along the thickness thereof, wherein the heating resistor 102 and the temperature sensitive resistor 103 are disposed on the first surface, the through hole 106 is disposed on the fourth surface, and the second surface and the third surface are connected by a process such as pressure welding.

It should be understood that, in addition to the above-mentioned split design, the first substrate 1041 and the second substrate 1042 may also be a single integrated substrate, that is, the substrate 104 has a fifth surface and a sixth surface opposite to each other along the thickness thereof, wherein the fifth surface is provided with the heating resistor 102 and the temperature-sensitive resistor 103, and the sixth surface is provided with the through hole 106.

It is to be understood that the first substrate 1041 and the second substrate 1042 may use a substrate of the same material, or may use substrates of different materials; preferably, substrates of the same material are used.

This embodiment is through setting up the heat insulation area on the second substrate for this region is full of the lower air of heat transfer coefficient, and this heat insulation area is located the two below of heating resistor and temperature sensitive resistor, can further completely cut off the influence of factors such as substrate, environment to the temperature of heating resistor and temperature sensitive resistor, makes the heating resistor and temperature sensitive resistor regional being in the constant temperature state, avoids the interference of substrate, environment to the constant temperature state, thereby makes the temperature measurement of temperature measurement module more accurate.

Optionally, the heating resistor 102 and the temperature sensitive resistor 103 are painted on the substrate 104.

In this embodiment, heating resistor and temperature sensitive resistor set up on the substrate through the technology of brushing, can prepare non-contact temperature measuring device's temperature measurement module through simple technology of brushing, and heating resistor and temperature sensitive resistor physical connection realize accurate temperature measurement, and this temperature measurement module through the technology of brushing preparation can be more frivolous, and the volume is littleer for the temperature measurement module reduces the consumption when more frivolous, reduces temperature measurement module's manufacturing cost, improves production efficiency.

Optionally, the first substrate 1041 is press-bonded to the second substrate 1042.

In the embodiment of the application, the first substrate is arranged on the second substrate through a pressure welding process, so that the first substrate provided with the heating resistor and the temperature-sensitive resistor and the second substrate provided with the through hole can be processed separately and simultaneously, and the processing efficiency is improved.

Optionally, the heating resistor 102 and the temperature sensitive resistor 103 are both far infrared absorbing materials, and the far infrared absorption coefficient of the far infrared absorbing materials is greater than or equal to 80%.

In the embodiment, the heating resistor and the temperature-sensitive resistor are prepared by the far infrared absorption material, only the far infrared light of the target to be detected is absorbed, the far infrared light with the strongest radiation when the object generates heat radiation is used for measuring the temperature, and the accuracy of radiation temperature measurement can be ensured.

The embodiment adopts the material with the larger far infrared absorption coefficient, namely, the material with the far infrared absorption coefficient larger than or equal to 80% is used as the material of the heating resistor and the temperature sensitive resistor, the sensitivity to far infrared light is higher, the temperature change after the heating resistor and the temperature sensitive resistor absorb the far infrared light is more obvious, so that the resistance change of the temperature sensitive resistor is more obvious, the situation that the temperature of the target to be measured cannot be responded due to the fact that the temperature measuring module is insensitive to the far infrared light and the resistance change of the temperature sensitive resistor is smaller is avoided, and the sensitivity of the temperature measuring device is improved.

Optionally, the material of the heating resistor 102 is at least one of graphene heating silica gel, graphene ink, carbon nanotube ink, carbon black ink, or metal resistor.

It is to be understood that the heating resistor is made of a material having a low temperature-sensitive coefficient, and illustratively, a graphene heating paste is used.

In this embodiment, the heating resistor is prepared from a material with a low temperature-sensitive coefficient, so that the resistance of the heating resistor is insensitive to temperature and does not change along with temperature change, that is, after the temperature of the optical signal received by the heating resistor changes, the resistance of the heating resistor does not change, so that the first control signal can stably control the heating resistor to generate heat, and the normal temperature measurement of the temperature measurement module is ensured.

Optionally, the absolute value of the temperature sensitive coefficient of the material of the temperature sensitive resistor 103 is greater than or equal to 1.5%.

Optionally, the material of the temperature-sensitive resistor 103 is at least one of graphene nano-powder silica gel, graphene ink or vanadium oxide compound.

It should be understood that the temperature sensitive coefficient of the temperature sensitive resistor can be a positive temperature sensitive coefficient or a negative temperature sensitive coefficient, and the temperature sensitive resistor is exemplarily prepared by using a graphene nano powder adhesive material.

In this application embodiment, adopt the material preparation temperature sensitive resistance of high temperature sensitive coefficient for temperature sensitive resistance is more sensitive to the response of temperature, can produce the first signal of telecommunication that the signal is stronger after receiving the light signal of the target that awaits measuring, avoids because of the temperature measurement inaccuracy that first signal strength is less caused, promotes the sensitivity and the degree of accuracy of temperature measurement module temperature measurement.

Optionally, the substrate 104 is a flexible polyimide material.

It should be understood that in the case of the substrate 104 having the first substrate 1041 and the second substrate 1042, the first substrate 1041 is made of a flexible polyimide material, and the second substrate 1042 may be made of a flexible polyimide material, or other hard materials, so as to form the thermal insulation region 106 and further strengthen the mechanical strength of the far infrared device 300.

This embodiment is through adopting flexible polyimide material as substrate brush coating heating resistor and temperature sensitive resistance, when reduce cost for this far infrared temperature measuring device's volume is littleer, and is more frivolous.

Fig. 3a, 3b and 3c show top views of possible arrangements and routing ways of the heating resistor and the temperature sensitive resistor in the temperature measuring module 100.

Alternatively, the heating resistor 102 and the temperature-sensitive resistor 103 are brushed into a rectangular structure and contacted with each other as shown in fig. 3a, and the pad 301 and the pad 302 are both located inside the rectangular structure and connected with an external circuit through a wire.

Alternatively, as shown in fig. 3b, the heating resistor 102 and the temperature sensitive resistor 103 are brushed to form a circular and annular structure, the annular heating resistor 102 or temperature sensitive resistor 103 surrounds the circular temperature sensitive resistor 103 or heating resistor 102, the pad 303 is located at the center of the circular region, and the pad 304 is located at the boundary of the circular region and the annular region and is connected with an external circuit through a wire. In fig. 3b, only the case where the annular region is the heating resistor 102 and the circular region is the temperature sensitive resistor 103 is shown, but actually, the annular region may be the temperature sensitive resistor 103 and the circular region may be the heating resistor 102. In other words, the pad 301 may be a first pad or a second pad, and the pad 302 may be the same.

The heating resistor is in an annular structure and surrounds the temperature-sensitive resistor, or the temperature-sensitive resistor is in an annular structure and surrounds the heating resistor, the contact area between the heating resistor and the temperature-sensitive resistor is increased through the mutual surrounding structural design, the heat conduction between the heating resistor and the temperature-sensitive resistor is enhanced, the power consumption of the far infrared temperature measuring device is reduced, and the performance of the device is improved.

Optionally, as shown in fig. 3c, the thermometric module 100 may further include a plurality of heating resistors 102 and/or a plurality of temperature sensitive resistors 103. The figure only shows the case that the temperature measuring module comprises two heating resistors and one temperature sensitive resistor.

Specifically, the heating resistor 102 includes a first heating resistor 1021 and a second heating resistor 1022, the first heating resistor 1021 and the second heating resistor 1022 are in contact and are both in contact with the temperature-sensitive resistor 103, the first heating resistor 1021 and the second heating resistor 1022 are respectively electrically connected to the first pads 305 and 306, and the temperature-sensitive resistor 103 is electrically connected to the second pad 307. Or the temperature-sensitive resistor 103 includes a first temperature-sensitive resistor 1031 and a second temperature-sensitive resistor 1032, the first temperature-sensitive resistor 1031 and the second temperature-sensitive resistor 1032 are both in contact with the heating resistor 102, the first temperature-sensitive resistor 1031 and the second temperature-sensitive resistor 1032 are respectively electrically connected with the second pads 305 and 306, and the heating resistor 102 is electrically connected with the first pad 307. Illustratively, in fig. 3c, the heating resistor and the temperature-sensitive resistor are brushed into a circle, and the pads 305, 306 and 307 are respectively located at the center of the circle and connected with an external circuit through a wire. At this time, the first control signal is used for controlling the first heating resistor 1021 and the second heating resistor 1022 to simultaneously generate heat, the temperature sensitive resistor 103 is heated, and the temperature measuring module is in a constant temperature state, or the first temperature sensitive resistor 1031 and the second temperature sensitive resistor 1032 simultaneously receive optical signals and respectively generate first electric signals according to the optical signals, and the first electric signals are used for generating first control signals for controlling the heating resistor 102 to generate heat, so that the temperature of the target to be detected is detected through constant temperature closed-loop control.

It should be understood that the present embodiment shows a case where the temperature measurement module includes two heating resistors or two temperature-sensitive resistors, but the present application is not limited thereto, and the temperature measurement module 100 may also include a plurality of heating resistors and/or temperature-sensitive resistors, such as two heating resistors and two temperature-sensitive resistors. The shape of the heating resistor and the temperature-sensitive resistor is not limited to a circle, and the heating resistor and the temperature-sensitive resistor can be brushed into other shapes such as a rectangle and a triangle.

Alternatively, the first heating resistor 1021 and the second heating resistor 1022 are made of the same material.

Alternatively, the first temperature-sensitive resistor 1031 and the second temperature-sensitive resistor 1032 are made of the same material.

In this embodiment, two or more heating resistors or temperature sensitive resistors are made of the same material, which is convenient for production, for example, when the temperature measurement module is prepared by using a brush coating process, a plurality of heating resistors or a plurality of temperature sensitive resistors can be formed by one-time brush coating at the same time, thereby improving the production efficiency of the temperature measurement module.

Fig. 4 is a schematic diagram of another temperature measuring module 400 according to an embodiment of the present disclosure.

Optionally, the optical signal is far infrared light, and the temperature measurement module 400 further includes: a far infrared filter 401.

Specifically, the far infrared filter 401 is disposed above the heating resistor 102 and the temperature sensitive resistor 103, and covers the area where the heating resistor 102 and the temperature sensitive resistor 103 are located, so as to transmit the far infrared light and block the non-far infrared light.

In the embodiment, the far infrared filter is arranged above the heating resistor and the temperature-sensitive resistor which are made of far infrared absorption materials, so that the heating resistor and the temperature-sensitive resistor only receive far infrared light, the influence of non-far infrared light on the temperature of the temperature measurement module is avoided, and the temperature measurement accuracy of the temperature measurement module can be further improved.

Optionally, the temperature measurement module 400 further includes: the support 402 and the far infrared filter 401 are disposed above the heating resistor 102 and the temperature sensitive resistor 103 through the support 402.

It should be understood that the far infrared filter 401 may be directly disposed above the heating resistor 102 and the temperature sensitive resistor 103 by means of pasting, pressure welding, or the like.

Optionally, the temperature measurement module 400 further includes: and a far infrared micro lens 403 disposed above the far infrared filter 402, for controlling the viewing angle at which the heating resistor 102 and the temperature sensitive resistor 103 receive the far infrared light. The far infrared micro lens 403 can enlarge the field angle of the temperature measurement module 400, thereby enlarging the detection range of the temperature measurement module 400. It is to be understood that the far infrared micro-lens 403 may be a general optical lens, or may be a lens capable of blocking non-far infrared light.

In the embodiment of the application, the far infrared micro lens is further arranged above the far infrared optical filter, so that the field angle of the far infrared temperature measuring device can be controlled, the detection range of the far infrared temperature measuring device is enlarged, and the overall performance of the device is improved.

Optionally, as shown in fig. 4, an interconnection structure 107 enabling the heating resistor 102 and the temperature-sensitive resistor 103 to be electrically connected to an external circuit is further provided in the substrate 104.

Fig. 5a and 5b are schematic diagrams of two non-contact temperature measuring devices according to the present application.

The non-contact temperature measuring device 500a includes:

the temperature measurement module 100 is used for receiving an optical signal radiated by a target to be measured and generating a first electrical signal according to the optical signal;

the control circuit 501 (in the figure, the control circuit 501 is disposed in the temperature measuring device in a form of a chip), and the temperature measuring module 100 or 400 is electrically connected to the chip 501 through the interconnection structure 107, or is electrically connected to the chip 501 through the interconnection structure 107 and an external wire. The chip 501 is configured to generate a first control signal according to the first electrical signal, where the first control signal is used to determine the temperature of the target to be measured.

The non-contact temperature measuring device 500b includes:

the temperature measurement module 400 is used for receiving an optical signal radiated by a target to be measured and generating a first electrical signal according to the optical signal;

the chip 501 and the temperature measurement module 100 or 400 are electrically connected with the chip 501 through the interconnection structure 107, or are electrically connected with the chip 501 through the interconnection structure 107 and an external lead. The chip 501 is configured to generate a first control signal according to the first electrical signal, where the first control signal is used to determine the temperature of the target to be measured.

In this embodiment, adopt small and frivolous temperature measurement module in this application embodiment, carry out constant temperature closed-loop control to the temperature measurement module through the chip, temperature measuring device produces first control signal and the temperature of the target that awaits measuring is confirmed according to first control signal according to first signal of telecommunication, realizes high-efficient, accurate temperature measurement. The non-contact temperature measuring device can achieve small size and low power consumption under the condition of ensuring the measuring accuracy.

Optionally, as shown in fig. 5, the temperature measuring device 500 further includes: the reinforcing plate 502 and at least one temperature measuring module 100 or 400 are arranged on the reinforcing plate 502.

In this embodiment, set up the stiffening plate in temperature measurement module below, can improve the problem that the mechanical strength is more weak because of using flexible substrate to cause, increase temperature measuring device's whole mechanical strength for the device can adapt to more extensive application scene, extension non-contact temperature measuring device's application.

Optionally, the stiffener 502 is a printed circuit board.

It should be understood that the reinforcing plate is provided to change the mechanical strength of the far infrared temperature measuring device, the embodiment of the present application exemplarily uses the printed circuit board, and all other hard substrates can be applied to the far infrared temperature measuring device 300 as the reinforcing plate.

This embodiment directly adopts printed circuit board as the stiffening plate, and the temperature measurement module all can directly set up on the stiffening plate with the chip to realize the electricity through printed circuit board and connect, simplified far infrared temperature measuring device's circuit connection structure, make this far infrared temperature measuring device be convenient for more produce, reduced manufacturing cost and promoted production efficiency.

The positional relationship between the chip 501 and the thermometric module 100 or 400 is described below.

Fig. 6a and 6b show the arrangement top view of at least one temperature measuring module in the non-contact far infrared temperature measuring device. The substrate 104 of at least one temperature measurement module 100 is the same substrate, and at least one temperature measurement module 100 is adjacently arranged on the substrate 104.

Alternatively, as shown in fig. 6a, the stiffener 502 includes a first portion and a second portion adjacent to each other, the at least one temperature measurement module 100 is disposed on the first portion, and the chip 501 is disposed on the second portion.

Optionally, as shown in fig. 6b, the substrate 104 includes a third portion and a fourth portion adjacent to each other, the at least one temperature measurement module 100 is disposed in the third portion, and the chip 501 is disposed in the fourth portion.

It should be noted that fig. 6a and 6b are only for showing one possible arrangement manner of the temperature measurement modules in the temperature measurement device, the temperature measurement module 100 in fig. 6a and 6b may also be replaced by the temperature measurement module 400, the temperature measurement module in fig. 6a and 6b may be all the temperature measurement module 100 or the temperature measurement module 400, or part of the temperature measurement module 100 and part of the temperature measurement module 400, which is not limited in this embodiment of the present application.

FIG. 7 is a schematic diagram of another non-contact temperature measuring device 700 according to an embodiment of the present disclosure. (only the case where the temperature measuring device 700 includes at least one temperature measuring module 400 is shown in the figure)

In the temperature measuring device 700, at least one temperature measuring module 100 or 400 further includes:

the reference temperature measurement module 701 is used for shielding the optical signal so as to enable the reference temperature measurement module 701 to keep a constant temperature state and generate a second electrical signal in the constant temperature state;

the chip 501 is configured to generate a second driving signal according to a second electrical signal, and the first control signal and the second control signal are configured to determine a temperature of the target to be measured.

Specifically, the reference temperature measurement module 701 has the same structure as the temperature measurement module 100 or 400, and also includes a heating resistor 702, a temperature sensitive resistor 703, and a substrate 704. It should be understood that the substrate 104 and the substrate 704 may be the same substrate or different substrates, and the embodiments of the present application are not limited thereto. A baffle 705 is disposed above the reference temperature measurement module 701 for blocking the far infrared light from being transmitted to the reference temperature measurement module 701.

In the embodiment of the application, the reference temperature measurement module is arranged in the non-contact temperature measurement device, the temperature measurement module and the reference temperature measurement module are used simultaneously during temperature measurement, wherein the reference temperature measurement module does not receive an optical signal radiated by a target to be measured, so that the reference temperature measurement module is always in a constant temperature state and is not influenced by the optical signal, a second control signal can be provided as a reference, the reference temperature measurement module does not receive the second control signal generated by the optical signal radiated by the target to be measured and the first control signal obtained by the temperature measurement module after receiving far infrared light radiated by the target to be measured to perform differential calculation, common mode interference caused by a working environment (such as a heat transfer effect of a substrate) to a device can be further reduced, influence of temperature drift on temperature measurement is reduced, and accuracy of the non-contact temperature measurement device is improved.

Optionally, the baffle 705 is a metal material capable of blocking far infrared light.

Optionally, the non-contact temperature measuring device 300 further includes: the far infrared filter 706 and the far infrared micro lens 707 are both arranged above the reference temperature measurement module 701.

It should be understood that the far infrared filter 706 may also be the far infrared filter 402, that is, the temperature measurement module 100 or 400 and the reference temperature measurement module 701 may share the far infrared filter (not shown in the figure), and similarly, the temperature measurement module 100 or 400 and the reference temperature measurement module 701 may also share the far infrared microlens.

In the embodiment, the reference temperature measurement module is only added with one baffle structure compared with the temperature measurement module, and the temperature measurement module and the reference temperature measurement module can be produced simultaneously in the production process, so that the production flow is simplified and the production efficiency is improved; on the other hand, for reference the temperature measurement module provides the environment and the condition that are completely the same with the temperature measurement module, improved the accuracy that the temperature detected.

Optionally, the chip 501 comprises: the constant temperature control circuit is electrically connected with the heating resistor 102 and the temperature sensitive resistor 103 and is used for collecting a first electric signal or a first electric signal and a second electric signal from the temperature sensitive resistor and generating a first control signal according to the first electric signal or generating a first control signal and a second control signal according to the first electric signal and the second electric signal so as to control the temperature measurement module to keep a constant temperature state.

Optionally, the chip 501 determines the temperature of the target to be measured according to the first control signal or the first control signal and the second control signal. In the embodiment of the present application, the temperature of the target to be measured is determined by the chip 501, or may be determined by a master control in an external device of the temperature measuring device, which is not limited in the embodiment of the present application.

Specifically, when detecting the temperature of the target to be measured, the heating resistor 102 first adjusts the temperature measurement module 100 or 400 and the reference temperature measurement module 701 to a target temperature, which is exemplarily in a range of 50-80 ℃ under the control of the first control signal. After the temperature measurement module 100 or 400 receives an optical signal (for example, far infrared light) radiated by a target to be measured, the temperature changes, the temperature sensitive resistor 103 generates a first electric signal accordingly, the constant temperature control circuit collects the first electric signal and determines a first control signal for controlling the heating resistor to generate heat according to the first electric signal, and the constant temperature control circuit sends the first control signal to the heating resistor 102 to control the heating resistor 102 to adjust the temperature of the temperature measurement module 100 or 400 back to the target temperature, so that the temperature of the temperature measurement module 100 or 400 is maintained in a constant temperature state; meanwhile, the reference temperature measurement module 701 does not receive the optical signal, the temperature is consistent and constant, and the reference temperature measurement module is still at the target temperature, the temperature sensitive resistor 103 generates a second electric signal at the temperature, the constant temperature control circuit generates a second control signal according to the second electric signal, and the temperature measurement device finally performs differential calculation according to the first control signal and the second control signal to determine the temperature of the target to be measured.

The temperature measuring device in this embodiment realizes the thermostatic control to temperature measurement module and reference temperature measurement module through the thermostatic control circuit in the chip, forms the thermal radiation transmission model through the relation of the control signal that the fitting control heating resistor generates heat and the temperature that detects the target that awaits measuring to realize accurate non-contact temperature and measure.

Optionally, the temperature of the target to be measured is determined by the first control signal or the pulse width of the first control signal and the second control signal.

An embodiment of the present application further provides an electronic device 800a and an electronic device 800b, as shown in fig. 8a and 8b, including: the non-contact temperature measuring device 500 or 700 according to any embodiment of the present application.

This application is through the heating resistor with low temperature sensitive coefficient and the temperature sensitive resistor of high temperature sensitive coefficient with the mode combination of in close contact, can adopt simple brush coating technology to brush resistive material on the substrate and can prepare the temperature measurement module that is used for far infrared temperature detection, and this technology becomes simple process and cost lower, can effectively save far infrared temperature measuring device's cost, improves non-contact temperature measuring device's production efficiency. According to the technical scheme, the heating resistor and the temperature-sensitive resistor are coated with the flexible polyimide substrate with low cost, the size of the device can be reduced, the small and thin far infrared temperature measuring device is prepared, the heat capacity of the device is reduced due to the reduction of the size of the device, and the power consumption can be saved. This application generates heat through control heating resistor, and the temperature of temperature sensing resistor feedback temperature measurement module to make the temperature measurement module be in the constant temperature state, and carry out the temperature measurement through the thermostatic control to the temperature measurement module. This application still carries out the temperature that difference processing detected the target that awaits measuring through the reference temperature measurement module that sets up not receiving far infrared light with the temperature measurement module, can further reduce the influence that the temperature drifts and detect the temperature, hoisting device's measuring accuracy.

By way of example and not limitation, the electronic device in the embodiments of the present application may include a device capable of implementing a complete or partial function, such as a smart phone, a smart watch, or smart glasses; the device can also comprise devices which are only concentrated on a certain type of application function and need to be matched with other devices such as a smart phone and the like for use, such as various smart bracelets for physical sign monitoring, smart jewelry and the like. The depth detection device may be configured to measure depth information of a detection target, and the control unit may receive the depth information to perform operation control on at least one function of the electronic device, for example, distance-based photographing auxiliary focusing may be performed according to the measured depth information of a human face, or unlocking the electronic device according to the depth information, and so on.

Through the description of the above embodiments, those skilled in the art will understand that, for convenience and simplicity of description, only the division of the above functional modules is used as an example, and in practical applications, the above function distribution may be completed by different functional modules as needed, that is, the internal structure of the device may be divided into different functional modules to complete all or part of the above described functions. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.

It should be noted that, without conflict, the embodiments and/or technical features in the embodiments described in the present application may be arbitrarily combined with each other, and the technical solutions obtained after the combination also fall within the protection scope of the present application.

It is also to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (25)

1. The utility model provides a temperature measurement module among non-contact temperature measuring device which characterized in that, the temperature measurement module includes:

a substrate;

the heating resistor is arranged on the substrate and is electrically connected with the first bonding pad;

the temperature-sensitive resistor is arranged on the substrate and is in contact with the heating resistor, and the temperature-sensitive resistor is electrically connected with the second bonding pad;

the temperature-sensitive resistor is used for receiving an optical signal radiated by a target to be detected and generating a first electrical signal according to the optical signal, the first electrical signal is used for generating a first control signal, the heating resistor is used for heating under the control of the first control signal so as to enable the temperature measurement module to be in a constant temperature state, and the first control signal is used for determining the temperature of the target to be detected.

2. The thermometric module of claim 1, wherein said substrate comprises: and the heat insulation groove surrounds the heating resistor and the temperature-sensitive resistor.

3. The thermometric module of claim 1, wherein said substrate comprises:

the heating resistor and the temperature-sensitive resistor are arranged on the first substrate;

the second substrate comprises a through hole, and the first substrate is arranged on the second substrate so that the through hole is positioned below the temperature-sensitive resistor and the heating resistor to form a heat insulation area.

4. The temperature measurement module of claim 1, wherein the heating resistor surrounds the temperature sensitive resistor or the temperature sensitive resistor surrounds the heating resistor.

5. The thermometric module according to any of claims 1-4, wherein the heating resistor comprises:

the first heating resistor is in contact with the temperature-sensitive resistor;

a second heating resistor in contact with the first heating resistor and in contact with the temperature sensitive resistor;

the first heating resistor and the second heating resistor generate heat under the control of the control signal, so that the temperature measurement module is in a constant temperature state.

6. The temperature measurement module according to any one of claims 1-4, wherein the temperature sensitive resistor comprises:

the first temperature-sensitive resistor is in contact with the heating resistor;

a second temperature sensitive resistor in contact with the first temperature sensitive resistor and in contact with the heating resistor;

the first temperature-sensitive resistor and the second temperature-sensitive resistor are used for receiving the optical signal and respectively generating a first electric signal according to the optical signal, and the first electric signal is used for generating a first control signal for controlling the heating resistor to generate heat.

7. The temperature measurement module according to any one of claims 1-4, wherein the far infrared absorption coefficients of the heating resistor and the temperature sensitive resistor are both greater than or equal to 80%.

8. The temperature measurement module of any one of claims 1-4, wherein the optical signal is far infrared light, the temperature measurement module further comprising:

and the far infrared filter is arranged above the heating resistor and the temperature-sensitive resistor and is used for transmitting the far infrared light and blocking non-far infrared light.

9. The thermometry module of claim 8, wherein the thermometry module further comprises:

and the far infrared filter is arranged above the heating resistor and the temperature-sensitive resistor through the support.

10. The thermometry module of claim 9, wherein the thermometry module further comprises:

and the far infrared micro lens is arranged above the far infrared optical filter and is used for adjusting the field angle of the far infrared light received by the heating resistor and the temperature sensitive resistor.

11. The thermometric module of any of claims 1-4, wherein the heating resistor comprises at least one of a graphene ink layer, a carbon nanotube ink layer, a carbon black ink layer, or a metallic resistive layer.

12. The temperature measurement module according to any one of claims 1-4, wherein the absolute value of the temperature sensitive coefficient of the temperature sensitive resistor is greater than or equal to 1.5%.

13. The thermometric module according to any one of claims 1-4, wherein the temperature sensitive resistor is at least one of a graphene ink layer or a vanadium oxide layer.

14. The thermometric module of any of claims 1-4, wherein the substrate is a flexible polyimide layer.

15. The temperature measurement module according to any one of claims 1-4, wherein the heating resistor and the temperature sensitive resistor are coated on the substrate.

16. The temperature measurement module of claim 3, wherein the first substrate is bonded to the second substrate.

17. A non-contact temperature measuring device, characterized in that, the temperature measuring device includes:

at least one temperature measuring module according to any one of claims 1 to 16, for receiving an optical signal radiated by an object to be measured and generating a first electrical signal according to the optical signal;

and the control circuit is electrically connected with the temperature measurement module and used for generating a first control signal according to the first electric signal, and the first control signal is used for determining the temperature of the target to be measured.

18. The thermometric apparatus of claim 17, wherein at least one of the thermometric modules comprises:

the reference temperature measurement module is provided with a baffle above and used for blocking the optical signal from being transmitted to the reference temperature measurement module;

the reference temperature measurement module is used for shielding the optical signal so as to keep the reference temperature measurement module in a constant temperature state and generate a second electric signal in the constant temperature state;

the control circuit is used for generating a second control signal according to the second electric signal, and the first control signal and the second control signal are used for determining the temperature of the target to be measured.

19. The thermometric apparatus of claim 17, further comprising:

the temperature measurement module is arranged on the reinforcing plate.

20. The thermometric apparatus of claim 19, wherein said stiffening plate comprises:

the temperature measuring module is arranged on the first part;

a second portion adjacent to the first portion, the control circuit being disposed in the second portion.

21. The temperature measuring device of claim 19, wherein the temperature measuring module is press-welded to the stiffener.

22. The thermometric apparatus of any one of claims 19-21, wherein the stiffening sheet is a printed circuit board.

23. The temperature measuring device according to any one of claims 17 to 21, wherein the substrates of the temperature measuring modules are the same substrate, and the temperature measuring modules are arranged adjacently on the substrate.

24. The thermometric apparatus of claim 23, wherein said substrate comprises:

the temperature measuring module is arranged on the third part;

and the fourth part is adjacent to the third part, and the control circuit is arranged on the fourth part.

25. An electronic device, comprising:

the non-contact temperature measuring device of any one of claims 17-24.

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