CN216011092U

CN216011092U - Temperature control system in space

Info

Publication number: CN216011092U
Application number: CN202120652797.9U
Authority: CN
Inventors: 栾世壹
Original assignee: Shenzhen Panoramic Space Industry Co ltd
Current assignee: Shenzhen Panoramic Space Industry Co ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2022-03-11
Anticipated expiration: 2031-03-29

Abstract

The utility model relates to a temperature regulating system in a space, comprising: one or more temperature regulated plates configured to comprise a non-expanded graphite sheet; one or more heat exchange devices configured to provide heat to or absorb heat from the one or more temperature regulated plates; and a control device configured to control the one or more heat exchange devices to adjust the temperature of the one or more temperature regulated plates; wherein the one or more heat exchange devices provide/absorb heat in a manner that is thermal conduction.

Description

Temperature control system in space

Technical Field

The utility model relates to a temperature adjusting system, in particular to a temperature adjusting system in a space.

Background

For living spaces, the regulation of the indoor temperature is often carried out by air conditioning or heating. The air conditioner is used in summer, although people can feel cool, the air conditioner realizes heat transfer in a forced air convection mode, and the cooling speed is relatively slow. No matter the floor heating or the externally hung heating used in winter, a large amount of hot water is needed to be circulated repeatedly in the floor heating or the externally hung heating, and the purpose of heating is achieved. This method has a low heat utilization rate, and not only needs to burn a large amount of coal or natural gas, but also needs a long time to realize indoor temperature control. Likewise, for some work spaces, such as warehouses, there is also a problem with cooling or heating speed. Firstly, the working space is often very large and the cooling/heating costs are very high; and also cannot rapidly adjust the temperature in the space to the target temperature in a short time. Such an approach greatly increases the daily operating and maintenance costs.

SUMMERY OF THE UTILITY MODEL

Aiming at the technical problems in the prior art, the utility model provides a temperature adjusting system in a space, which comprises: one or more temperature regulated plates configured to comprise a non-expanded graphite sheet; one or more heat exchange devices configured to provide heat to or absorb heat from the one or more temperature regulated plates; and a control device configured to control the one or more heat exchange devices to adjust the temperature of the one or more temperature regulated plates; wherein the one or more heat exchange devices provide/absorb heat in a manner that is thermal conduction.

In particular, the temperature adjusting plate is a plurality of temperature adjusting plates which are detachably arranged at the top, the bottom and/or the side wall of the space.

Particularly, wherein the temperature regulation plate is a sandwich graphite plate, and the sandwich graphite plate sequentially comprises from bottom to top: the graphite plate comprises an upper non-expanded graphite plate, a metal plate and a lower non-expanded graphite plate.

In particular, wherein the temperature-regulating plate is a unitary graphite plate comprising: the slab comprises a cement board and a non-expanded graphite back plate which is of an integral structure with the cement board.

In particular, the graphite back plate is attached to one side of the cement board before the cement board is solidified.

In particular, the temperature-regulating plate further comprises a decorative layer disposed on an outer side of the non-expanded graphite sheet configured to protect the non-expanded graphite sheet.

In particular, the temperature-regulating plate further comprises an insulating layer which is arranged on the inner side of the non-expanded graphite plate.

In particular, wherein the heat exchange device comprises a semiconductor heat exchange device.

In particular, the heat exchanging device further comprises a heat sink connected with the semiconductor heat exchanging device.

Particularly, the heat exchange device comprises the refrigerant circulation heat exchange device.

In particular, the heat exchanger including the refrigerant cycle heat exchanger includes: a refrigerant line; and a plurality of contact points disposed on the refrigerant line; wherein at least one of the contact points is in contact with the temperature-regulating plate.

In particular, wherein the control device is configured to independently control the temperature of one or more temperature conditioning devices.

In particular, wherein the control means comprises: a tempering control panel connected to the control device configured to control a temperature of at least one tempering device.

In particular, wherein the control means comprises: a valve disposed on the heat exchange device configured to control a temperature of at least one temperature regulating device.

Drawings

Preferred embodiments of the present invention will now be described in further detail with reference to the accompanying drawings, in which:

FIG. 1 is a schematic view of a system for regulating temperature in a space according to an embodiment of the present invention;

figure 2A is a schematic structural view of a sandwiched graphite sheet and a semiconductor heat exchange device according to one embodiment of the present invention;

FIG. 2B is a schematic diagram of a semiconductor heat exchange device and heat sink configuration according to one embodiment of the present invention;

FIG. 3 is a schematic structural view of an integrated graphite plate and semiconductor heat exchange device according to one embodiment of the present invention;

FIG. 4A is a schematic view of a system for regulating temperature in a space according to another embodiment of the present invention; and

fig. 4B is a schematic diagram of a contact point configuration according to an embodiment of the utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the following detailed description, reference is made to the accompanying drawings that form a part hereof and in which is shown by way of illustration specific embodiments of the application. In the drawings, like numerals describe substantially similar components throughout the different views. Various specific embodiments of the present application are described in sufficient detail below to enable those skilled in the art to practice the teachings of the present application. It is to be understood that other embodiments may be utilized and structural, logical or electrical changes may be made to the embodiments of the present application.

The present application includes an in-space temperature conditioning system, as shown in fig. 1. The in-space temperature adjusting system 100 includes:

the temperature-adjusting plate 11, the temperature-adjusting plate 11 may be disposed on the top, side wall and/or bottom of a space. The temperature-adjusting plate 11 is configured to include a non-expanded graphite plate, and since graphite itself has a good heat-conducting property, heat of one side of the graphite plate can be rapidly transferred to the other side. By arranging the temperature-regulating plates 11 of similar construction at the top, side walls and/or bottom of a space, a rapid temperature balance between the interior and exterior of the space can be achieved. Meanwhile, the temperature control plate 11 includes a non-expanded graphite structure, and its own heat conduction speed (point and surface) is very fast. Therefore, if a device for rapidly increasing and decreasing the temperature is added to one side of the temperature adjustment plate 11, the heat can be rapidly transferred through the temperature adjustment plate 11, and the temperature in the space can be rapidly adjusted through a heat conduction manner.

In some embodiments, the thermal plate 11 is a modular structure. As shown in fig. 1, four modules are respectively provided on the ceiling and the wall surface, and each module is an independent temperature-adjusting plate 11. As known to those skilled in the art, the number of modules is not limited herein, and may be increased or decreased according to the actual situation.

A heat exchanging device 12 fixedly disposed on the temperature-adjusting plate 11, configured to provide heat to the temperature-adjusting plate 11 or absorb heat from the temperature-adjusting plate. Wherein the heat conduction means may be heat transfer. The heat exchanging means 12 may be a means for rapidly adjusting its temperature, which not only can achieve rapid conversion of cold-hot temperature, but also can directly transfer the temperature to the temperature-adjusting plate 11.

In some embodiments, there is one heat exchanging device 12 for each temperature adjustment plate 11. In some embodiments, heat exchange device 12 is a semiconductor heat exchange device. In some embodiments, the heat exchanging device 12 is a refrigerant cycle heat exchanging device.

A control device 13 configured to control one or more heat exchange devices 12 to adjust the temperature of the one or more temperature-regulating plates 11.

In actual use, the user can set the target temperature of the current space on the control device 13. The control device 13 sends a signal to the heat exchanging device 12 of the space, and the heat exchanging device 12 can be quickly adjusted to the target temperature in a short time and then acts on the temperature adjusting plate 11 by means of heat conduction. The temperature control plate 11 includes a non-expanded graphite structure, and can rapidly transfer the heat of the heat exchanging device 12 to the whole temperature control plate 11 from points and surfaces. The temperature adjusting plate 11 further acts on the whole space, and the temperature in the space is quickly adjusted.

In some embodiments, the control device 13 may regulate the temperature of part or all of the heat exchanging device 12 in the current space. In some embodiments, as shown in fig. 1, when the semiconductor heat exchanging device is used, the temperature adjusting system 100 in the space is used to adjust and control part of the temperature adjusting plates 11 (similar to the case of being applied to a plurality of spaces), a temperature adjusting control plate 15 may be provided for each or a plurality of temperature adjusting plates 11, the temperature adjusting control plate 15 is connected to the control device 13, and the temperature adjusting plates 11 are divided into different groups to achieve targeted adjustment and control. In some embodiments, when the temperature adjustment is performed by the refrigerant circulation heat exchanging device, the temperature adjustment plate 11 can be partially adjusted by setting valves for different pipelines, which will be further described later. In some embodiments, the control device 13 controls the plurality of temperature control panels 15 via a control line 14, wherein the plurality of temperature control panels 15 are accessible via a wired connection (not shown). In some embodiments, the connection may be by way of wireless communication, such as wifi, bluetooth, or the like. In some embodiments, the thermal control plate 15 may be disposed on a certain thermal control plate 11, which facilitates installation and later maintenance.

In some embodiments, the temperature-regulating plate 11 may be a sandwiched graphite plate, as shown in fig. 2A. The sandwich graphite sheet comprises: a metal plate 202, an upper non-expanded graphite sheet 201 and a lower non-expanded graphite sheet 203. In some embodiments, the metal plate 202, the upper non-expanded graphite sheet 201, and the lower non-expanded graphite sheet 203 are fixedly connected by punching teeth or bonding. In some embodiments, the upper non-expanded graphite sheet 201 and the lower non-expanded graphite sheet 203 may be flexible graphite coils. In some embodiments, the metal plate 202 may be made of iron, aluminum alloy, or other metal with good mechanical and thermal conductivity. In some embodiments, the heat exchange device 22 may in turn be disposed on a sandwiched graphite sheet. In the present embodiment, the heat exchanging device 22 is a semiconductor heat exchanging device, and includes a semiconductor temperature adjusting device 222 and a semiconductor contact plate 221. Since the semiconductor temperature adjusting device can reach the target temperature in a short time, it can quickly adjust the temperature of the temperature adjusting plate to the target temperature. The sandwich graphite plate structure in this embodiment can be used as a ceiling of a space.

In some embodiments, since the semiconductor temperature conditioning device 222 generates heat during cooling, the cooling efficiency is affected if the heat is not dissipated in time. Therefore, as shown in fig. 2B, a heat sink 24 is provided on the semiconductor temperature control device 222, and includes: a heat radiating contact plate 243, a heat pipe 242, and a heat radiating fin 241. In some embodiments, semiconductor temperature conditioning device 222 is a semiconductor temperature conditioning chip that may be 10 × 10 to 50 × 50mm in size²The heat sink fins of the heat sink 24 are aluminum sheets with undulating surfaces, and the dimensions of the aluminum sheets can be long, wide and high, and the height of the aluminum sheets is 120 multiplied by 25mm³。

In some embodiments, the temperature-adjusting plate 11 further includes: and the decoration layer 204 is arranged on the sandwich graphite plate. Decorative layer 204 may include: one or more of a cloth, paint, sheet or sticker. In some embodiments, decorative layer 204 is not necessary. The decoration layer 204 not only can play a role in decoration, but also can protect the lower non-expanded graphite plate 203 and improve the wear resistance.

In some embodiments, the temperature-adjusting plate 11 further includes: insulation (not shown in fig. 2A). The heat preservation covers on the sandwich graphite board, can prevent that unnecessary heat is excessive, promotes the effect that adjusts the temperature.

Compared with the traditional expanded graphite structure, the sandwich graphite plate has better mechanical strength and wear resistance. Meanwhile, the whole sandwich graphite plate is used as a ceiling, and the material is lighter.

In some embodiments, the temperature-regulating plate 11 may be a unitary graphite plate, as shown in fig. 3. The integrated graphite sheet includes: cement board 302 and graphite backplate 301, cement board 302 sets up on graphite backplate 301 left side. In fig. 3, the left side of the integrated graphite plate is inside the space where the integrated graphite plate is located, and the right side of the integrated graphite plate is outside the space where the integrated graphite plate is located. In some embodiments, a heat exchanging device 32 is further disposed on the right side of the graphite back plate 301.

The integrated graphite plate structure shown in fig. 3 is an integrally formed structure formed by mixing 1% -30% of graphite powder into cement in advance, and attaching a second graphite plate to the unset cement plate before the cement plate is set until the cement plate is set.

In some embodiments, the temperature-adjusting plate 11 further includes: and a decorative layer 304 disposed on the unitary graphite sheet. Decorative layer 304 may include: one or more of a cloth, paint, sheet or sticker. In some embodiments, decorative layer 304 is not necessary. The decorative layer 304 not only can play a decorative role, but also can protect the lower cement board 302 and improve the wear resistance.

In some embodiments, the unitary graphite sheet structure may serve as a space interior wall panel and/or floor panel. In some embodiments, the integrated graphite plate structure can be disposed on an original wall (e.g., a cement wall), so that the original wall is utilized to assist in heat dissipation, and the heat dissipation structure shown in fig. 2B is not required.

In some embodiments, the thermal plates of fig. 2A or 2B and the thermal plate of fig. 3 may be used in combination. For example, the structure shown in fig. 2A or 2B is provided as a ceiling of a space, and the structure shown in fig. 3 is provided as a wall and/or a floor. The two are used in a matched mode, not only can the temperature adjusting function be achieved, but also the two are of modular structures, and installation and future maintenance are convenient.

In some embodiments, in the system for adjusting temperature in a space described herein, the heat exchanging device is a refrigerant circulation heat exchanging device. Fig. 4A is another system for regulating temperature in a space, according to an embodiment of the present invention, as shown in fig. 4A. Fig. 4A is different from fig. 1 in that the refrigerant cycle heat exchanging apparatus in fig. 4A includes a refrigerant line 42, a control device 43, and a temperature control cycle machine 45. After the user sets the indoor temperature on the control device 43, the control device 43 controls the temperature adjustment circulator 45 to increase/decrease the temperature through the control line 44, and starts the water circulation. The refrigerant in the refrigerant pipeline 42 is heated/cooled by the temperature adjustment circulator 45 and then enters the refrigerant pipeline 42 for circulation, and further, the heat is transferred to the temperature adjustment plate 41. The temperature adjustment plate 41 has a similar function to the structure described above, and will not be described again. After short-time water circulation, the temperature in the space can be quickly adjusted, and the same temperature adjusting effect is achieved.

In some embodiments, as shown in fig. 4B, the temperature-adjusting plate further includes at least one contact point 46 disposed on the refrigerant line 42, wherein the at least one contact point 46 is in contact with the temperature-adjusting plate 11. In some embodiments, the contact points 46 are constructed of a highly thermally conductive material, such as graphite, copper, or the like.

In comparison with the conventional water circulation structure, the structure shown in fig. 4A can not only heat but also cool. More importantly, since the temperature-adjusting plate 41 can rapidly transfer heat, the refrigerant pipeline 42 does not need to be laid in a large area as in the conventional water circulation structure, but can be laid in a small area as shown in fig. 4A. Therefore, not only is the material saved, but also the water quantity required to be circulated is reduced as the pipeline is shortened, the temperature-adjusting circulator 45 can realize the temperature rise/reduction of the water in a shorter time, the water temperature can reach the target temperature more quickly, and the whole temperature-adjusting time is obviously shortened.

In some embodiments, the temperature regulating system in the space of the present application may not include an insulating layer, nor open the heat exchanging device and the control device when in use. Thus, due to the high thermal conductivity of the temperature adjusting plate, the rapid balance of the temperature inside and outside the space can be realized. Taking a specific test as an example, the room area is 19 square meters, the indoor and outdoor temperature is 32 ℃, the sealing is good, the outdoor wind power is less than or equal to 3 grades, and 1.5 pieces of air conditioners are adopted to reduce the indoor temperature of 32 ℃ to 28 ℃. Under normal operation of the air conditioner, the target temperature is reached for about 30 minutes. Under the same condition, the temperature regulating system in the space provided by the scheme of the application has the advantage that the cooling time is about 7 minutes.

This application temperature governing system in space, traditional mode of adjusting temperature has a great deal of advantage relatively. Firstly, the temperature regulation speed of the scheme of the application is higher. For example, the semiconductor heat exchanger can quickly respond to temperature adjustment, reach a target temperature in a short time, and act on the temperature adjustment plate. And, can all set up the board of adjusting temperature on ceiling, wallboard and floor, adjust the interior temperature of space from a plurality of different angular position, the efficiency of adjusting temperature is higher, and heat utilization rate is also higher. Secondly, the mode that adjusts the temperature of this application is more natural, compares traditional air conditioner and adjusts the temperature, need not carry out the air convection through the mode of blowing, does not have the influence to the human body. Even if the utility model is used for a long time, the user will not feel uncomfortable. Simultaneously, the temperature regulation board of this application can be the modular combination, can set up the size and the quantity of module like this according to actual demand. And the modules are independently spliced and installed, so that the operation is simple, and if a certain module is damaged, the module can be directly replaced, and the maintenance is convenient.

The application can also be applied to large-scale operation sites, such as storehouses. The temperature in the storehouse can be rapidly adjusted, and compared with the traditional structure, the temperature control device is lower in cost and more convenient to maintain.

The above embodiments are provided only for illustrating the present invention and not for limiting the present invention, and those skilled in the art can make various changes and modifications without departing from the scope of the present invention, and therefore, all equivalent technical solutions should fall within the scope of the present invention.

Claims

1. An in-space temperature adjustment system, comprising:

one or more temperature regulated plates configured to comprise a non-expanded graphite sheet;

one or more heat exchange devices configured to provide heat to or absorb heat from the one or more temperature regulated plates; and

a control device configured to control the one or more heat exchange devices to adjust a temperature of the one or more temperature regulated plates;

wherein the one or more heat exchanging devices provide/absorb heat in a heat conducting manner.

2. An interior temperature conditioning system according to claim 1, wherein the temperature adjustment plate is provided in plurality, and the plurality of temperature adjustment plates are detachably provided on the top, bottom and/or side wall of the space.

3. The system for regulating the temperature in a space according to claim 1, wherein the temperature regulating plate is a sandwich graphite plate, and the sandwich graphite plate sequentially comprises from bottom to top: the graphite plate comprises an upper non-expanded graphite plate, a metal plate and a lower non-expanded graphite plate.

4. An in-space temperature adjustment system according to claim 1, wherein the temperature adjustment plate is a unitary graphite plate comprising: the slab comprises a cement board and a non-expanded graphite back plate which is of an integral structure with the cement board.

5. An indoor temperature adjusting system according to claim 4, wherein the graphite backing plate is attached to one side of the cement board before the cement board is solidified.

6. An in-space temperature adjustment system according to claim 1, wherein the temperature adjustment sheet further comprises a decorative layer provided outside the non-expanded graphite sheet, configured to protect the non-expanded graphite sheet.

7. An in-space temperature adjustment system according to claim 1, wherein the temperature adjustment plate further comprises an insulating layer provided inside the non-expanded graphite sheet.

8. An in-space temperature regulating system according to claim 1, wherein the heat exchanging means comprises a semiconductor heat exchanging means.

9. A system for regulating temperature in a space according to claim 8, wherein said heat exchanging means further comprises a heat sink attached to said semiconductor heat exchanging means.

10. The system for adjusting temperature in a space according to claim 1, wherein the heat exchanging device comprises the refrigerant circulation heat exchanging device.

11. The system as claimed in claim 10, wherein the heat exchanging device comprises the refrigerant cycle heat exchanging device comprising:

a refrigerant line; and

a plurality of contact points provided on the refrigerant line;

wherein at least one of the contact points is in contact with the temperature-regulating plate.

12. An in-space temperature conditioning system according to claim 1, wherein the control means is configured to independently control the temperature of the one or more temperature conditioning means.

13. An indoor temperature adjusting system according to claim 12, wherein the control means includes:

a tempering control panel connected to the control device configured to control a temperature of at least one tempering device.

14. An in-space temperature adjusting system according to claim 11, wherein the heat exchanging means includes:

a valve disposed on the refrigerant line configured to control a temperature of at least one temperature regulating device.