CN215997369U - Inductance flows backward mucilage binding and puts - Google Patents
Inductance flows backward mucilage binding and puts Download PDFInfo
- Publication number
- CN215997369U CN215997369U CN202122262182.8U CN202122262182U CN215997369U CN 215997369 U CN215997369 U CN 215997369U CN 202122262182 U CN202122262182 U CN 202122262182U CN 215997369 U CN215997369 U CN 215997369U
- Authority
- CN
- China
- Prior art keywords
- table module
- slip table
- glue
- inductance
- direction sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Coating Apparatus (AREA)
Abstract
The utility model discloses an inductance glue reversing device, the on-line screen storage device comprises a base, be equipped with X on the base to slip table module, Y to slip table module and Z to the slip table module, X is connected with the support grillage on to the slip table module, Y is connected with sizing applicator to slip table module and Z to the slip table module, furtherly, sizing applicator includes at least one rubber storage tube, the intracavity is glued out to the rubber storage tube is arranged in, it is equipped with out the gluey needle tubing to go out gluey chamber bottom. Through the arrangement of the X-direction sliding table module, the positioning die 16 matched with the magnetic core cover to be glued can move back and forth, so that gluing is facilitated; through the matching of the Y-direction sliding table module and the Z-direction sliding table module, the position of the glue applying mechanism can be adjusted according to requirements, so that glue can be accurately applied to the magnetic core cover; and exert pressure through the pneumatic pump and add gluey for add gluey volume and can obtain controlling, avoid adding the volume and too much destruction to magnetic core cover wall when drying, promoted the product percent of pass.
Description
Technical Field
The utility model relates to a paster inductance processing technology field, in particular to inductance is glue device of flowing backward.
Background
The inductor is one of three passive devices in an electronic circuit, various chip inductors are produced along with the development of a surface mounting technology, the chip inductors are made of novel magnetic materials, a precision thin film process and automatic winding equipment, so the chip inductors not only have extremely small size, but also have good performance to meet the requirements of different working frequencies and working currents, and the wound inductance coil is not fixed and can deform, so the inductance coil is stuck by using adhesive after the inductance coil is wound, and the coil is prevented from being loose and deforming.
The winding chip inductor has a link in the production process that the inductance coil and the magnetic core cover are glued together in a point gluing mode, the existing point gluing operation is to glue the inductance coil and the magnetic core cover from four corners of the magnetic core cover after the inductance coil and the magnetic core cover are matched, and the existing point gluing modes are two, namely manual point gluing, so that the manual point gluing efficiency is low, and the high-quality batch production of the inductor is not facilitated; secondly, some supplementary gluey equipment has appeared in the existing market, but this type of gluey equipment is placed the glue solution on the rubber plate, then brush glue in the rubber plate through gluing the brush and permeate the magnetic core cover with the glue solution through the through-hole in, this gluey in-process, the glue solution volume is uncontrollable, if permeate the inside glue volume of magnetic core cover too much, at the in-process of stoving, if the magnetic core cover wall is thinner, the glue solution is heated the inflation and is easily made the magnetic core cover fracture, lead to the defective rate to rise, be unfavorable for enterprise sustainable development. Therefore, an inductance glue pouring device is provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides an inductance flows backward mucilage binding and puts, and the control that can be fine is glued the volume and is added, adds simultaneously and glues efficiently, can effectively solve the problem among the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides an inductance glue reversing device, includes the base, be equipped with X on the base to slip table module, Y to slip table module and Z to the slip table module, X is connected with the support grillage to the slip table module, Y is connected with glue applicator to slip table module and Z to slip table module, furtherly, glue applicator constructs including at least one rubber storage tube, the rubber storage tube is arranged out and is glued the intracavity in, it is equipped with out and glues the needle tubing to go out to glue the chamber bottom, rubber storage tube top and pneumatic pump intercommunication, go out to glue chamber and heat pipe intercommunication, the heat pipe is connected with heating mechanism.
Furthermore, go out gluey chamber one side and fix on the support frame, support frame and connecting plate bottom fixed connection, Z is to the slider and the connecting plate fixed connection of slip table module.
Further, Z is equipped with the spring that is connected to the connecting plate bottom to slip table module top bilateral symmetry.
Furthermore, limiting clamping rods are symmetrically arranged on two sides of the supporting plate frame.
Furthermore, the bottom of the supporting plate frame is concave-convex, and one end of the supporting plate frame is provided with a baffle.
Compared with the prior art, the utility model discloses following beneficial effect has:
through the arrangement of the X-direction sliding table module, the back-and-forth movement of a positioning die matched with the magnetic core cover to be glued is realized, and the gluing is facilitated; through the matching of the Y-direction sliding table module and the Z-direction sliding table module, the position of the glue applying mechanism can be adjusted according to requirements, so that glue can be accurately applied to the magnetic core cover; the pneumatic pump is used for applying pressure and adding the glue, so that the glue adding amount can be controlled, the damage to the wall of the magnetic core cover when the glue adding amount is too large and the product percent of pass is improved;
the glue outlet cavity is communicated with a heat conduction pipe, and the heat conduction pipe is connected with a heating mechanism, so that the glue solution is continuously in a molten state, and the accuracy of the application amount of the glue solution is ensured;
thirdly, one side of the glue outlet cavity is fixed on a support frame, the support frame is fixedly connected with the bottom of the connecting plate, a sliding block of the Z-direction sliding table module is fixedly connected with the connecting plate, springs connected to the bottom of the connecting plate are symmetrically arranged on two sides of the top of the Z-direction sliding table module, the accuracy of the operation of a glue applying mechanism driven downwards by the connecting plate is guaranteed by the resilience force of the springs, and the accuracy of the upward and downward displacement of the Z direction is guaranteed;
to sum up, whole device structure cooperation is reasonable, can realize giving a plurality of magnetic core covers glueing simultaneously, and guarantees the accuracy of glueing volume, has promoted work efficiency, guarantees final product quality.
Drawings
FIG. 1 is a schematic view of the overall structure of the inductance back-flow glue device of the present invention;
FIG. 2 is a side view of the structure of the inductor reverse flow glue device of the present invention;
fig. 3 is the schematic view of the structure of the positioning mold used in the inductance back-flow glue device of the present invention.
In the figure: 1. a base; 2. an X-direction sliding table module; 3. a Y-direction sliding table module; 4. a Z-direction sliding table module; 5. a support plate frame; 6. a rubber storage tube; 7. a glue outlet cavity; 8. discharging the glue needle tube; 9. a pneumatic pump; 10. a heat conducting pipe; 11. a connecting plate; 12. a support frame; 13. a spring; 14. a limiting clamping rod; 15. a baffle plate; 16. positioning a mold; 121. a transverse plate; 122. model Contraband block; 123. and a clamping block.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
A plurality of magnetic core covers to be glued related to the following embodiment are equidistantly distributed on the positioning die 16, and the bottom of the positioning die 16 is provided with a high-strength magnet, so that the magnetic core covers are prevented from scattering in the transfer process;
as shown in figures 1-3, an inductance glue pouring device comprises a base 1, wherein an X-direction sliding table module 2, a Y-direction sliding table module 3 and a Z-direction sliding table module 4 are arranged on the base 1, the sliding table modules adopt the existing structures and mainly drive a glue applying mechanism to move, a supporting plate frame 5 is connected on the X-direction sliding table module 2, the supporting plate frame 5 is fixedly connected with a sliding block on the X-direction sliding table module 2, the supporting plate frame 5 can move back and forth on the upper surface, limiting clamping rods 14 are symmetrically arranged on two sides of the supporting plate frame 5 and used for inserting a positioning die 16 from the side edge and limiting the position of the positioning die 16, the accurate position placement is ensured, the bottom of the supporting plate frame 5 is concave-convex, the positioning die 16 is placed on the upper surface to avoid sliding, a baffle 15 is arranged at one end of the supporting plate frame 5 and also used for limiting the position of the positioning die 16, the Y-direction sliding table module 3 and the Z-direction sliding table module 4 are connected with the glue applying mechanism, the glue applying mechanism comprises four glue storage tubes 6, the glue storage tubes 6 are arranged in a glue outlet cavity 7, a glue outlet needle tube 8 is arranged at the bottom of the glue outlet cavity 7, one side of the glue outlet cavity 7 is fixed on a support frame 12, the support frame 12 specifically comprises a transverse plate 121, one side of the transverse plate 121 is provided with Contraband-type blocks 122, one side of the glue outlet cavity 7 is provided with clamping blocks 123 corresponding to Contraband-type blocks 122, Contraband-type blocks 122 are fixedly locked with the clamping blocks 123 through screws, the glue storage tubes 6 are convenient to clean and replace, the support frame 12 (specifically, the transverse plate 121) is fixedly connected with the bottom of a connecting plate 11, a sliding block of a Z-direction sliding table module 4 is fixedly connected with the connecting plate 11, springs 13 connected to the bottom of the connecting plate 11 are symmetrically arranged on two sides of the top of the Z-direction sliding table module 4, the top of the glue storage tubes 6 is communicated with a pneumatic pump 9, the glue outlet cavity 7 is communicated with a heat conducting tube 10, the heat conducting tube 10 is connected with a heating mechanism, and the heating mechanism can be an electric heating tube.
It should be noted that, the utility model relates to an inductance is glue device of flowing backward's theory of operation is in advance with glue solution (G500 glue) add in glue storage tube 6, then cover glue storage tube 6 top lid, will treat that location mould 16 of gluey magnetic core cover moves to supporting plate frame 5 on, spacing clamping bar 14 and baffle 15 play limiting displacement, position with location mould 16 is fixed well, then open pneumatic pump 9 switch and heating mechanism switch, it makes the glue solution flow downwards to press to glue storage tube 6, heating mechanism adds heat transfer to going out in the rubber tube 7, melt the glue solution, let the glue solution can flow downwards smoothly until falling into the magnetic core cover of waiting to encapsulating from going out the rubber tube 8, the needle tubing volume of applying the glue solution realizes through the pressure of control pneumatic pump 9, the glue solution volume of adding in the magnetic core cover like this, and X is to slip table module 2, Y is to slip table module 3 and Z to slip table module 4 through the cooperation realization with the glue solution even from going out glue 8 add the magnetic core cover in to the glue solution .
The control modes of the X-direction sliding table module 2, the Y-direction sliding table module 3 and the Z-direction sliding table module 4 are not within the protection range of the technical scheme, and the existing wire connection control mode is adopted in this part, and this part is not the point to be protected by the technical scheme, and is not described herein again.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides an inductance flows mucilage binding backward and is put which characterized in that: including base (1), be equipped with X on base (1) to slip table module (2), Y to slip table module (3) and Z to slip table module (4), X is connected with supporting plate frame (5) on to slip table module (2), Y is connected with sizing mechanism to slip table module (3) and Z to slip table module (4), sizing mechanism includes at least one rubber storage tube (6), rubber storage tube (6) are arranged in and are glued chamber (7), it is equipped with out and glues needle tubing (8) to glue chamber (7) bottom, rubber storage tube (6) top and pneumatic pump (9) intercommunication, go out to glue chamber (7) and heat pipe (10) intercommunication, heat pipe (10) are connected with heating mechanism.
2. The inductance glue pouring device according to claim 1, characterized in that: go out gluey chamber (7) one side and fix on support frame (12), support frame (12) and connecting plate (11) bottom fixed connection, Z is to the slider and connecting plate (11) fixed connection of slip table module (4).
3. The inductance glue pouring device according to claim 2, characterized in that: and springs (13) connected to the bottom of the connecting plate (11) are symmetrically arranged on two sides of the top of the Z-direction sliding table module (4).
4. The inductance glue pouring device according to claim 1, characterized in that: limiting clamping rods (14) are symmetrically arranged on two sides of the supporting plate frame (5).
5. The inductance glue pouring device according to claim 1, characterized in that: the bottom of the supporting plate frame (5) is concave-convex, and a baffle (15) is arranged at one end of the supporting plate frame (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122262182.8U CN215997369U (en) | 2021-09-17 | 2021-09-17 | Inductance flows backward mucilage binding and puts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122262182.8U CN215997369U (en) | 2021-09-17 | 2021-09-17 | Inductance flows backward mucilage binding and puts |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215997369U true CN215997369U (en) | 2022-03-11 |
Family
ID=80591261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202122262182.8U Active CN215997369U (en) | 2021-09-17 | 2021-09-17 | Inductance flows backward mucilage binding and puts |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN215997369U (en) |
-
2021
- 2021-09-17 CN CN202122262182.8U patent/CN215997369U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207680922U (en) | A kind of mobile phone camera module group fitting dispenser | |
CN215997369U (en) | Inductance flows backward mucilage binding and puts | |
CN109119367B (en) | Semi-automatic film sticking machine for IC packaging | |
CN203792581U (en) | Novel plastic package mold with micro matrix lead frame attached to surface | |
CN214289129U (en) | A point gum machine constructs for producing quartz crystal syntonizer | |
CN210527819U (en) | High accuracy point gum machine feed mechanism | |
CN210817305U (en) | Lost foam hot glue bonding machine | |
CN218197236U (en) | Adhesive device for carton packaging | |
CN210411369U (en) | Electronic components adhesive deposite device | |
CN206524251U (en) | A kind of tap lead cold press device | |
WO2018000776A1 (en) | Full-automatic horizontal i-shaped inductor assembler | |
CN209061489U (en) | A kind of efficient switching diode glue pouring machine | |
CN207836071U (en) | A kind of SMT chip mounters patch feed device | |
CN114496550A (en) | Electric heating coil winding machine | |
CN219855694U (en) | Assembled cylinder cover sealing washer forming mechanism | |
CN214600095U (en) | Inductor production and processing is with automatic adhesive deposite device | |
CN211436829U (en) | Adhesive deposite device of amorphous magnetic ring | |
CN214717996U (en) | Shell adhesive deposite device is used in SSD processing | |
CN216288333U (en) | Semiconductor chip mounting and positioning device | |
CN218691022U (en) | SMT paster dispensing equipment convenient to change and extrude head | |
CN221668793U (en) | Bonded silver wire production extracting device convenient to use | |
CN217485284U (en) | Inductor bonding device | |
CN217940740U (en) | Earphone is processingequipment for manufacturing | |
CN218859210U (en) | 3D prints product frame of keeping in | |
CN210668084U (en) | Transformer winding lead-out wire rubberizing device and transformer rubberizing machine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |