CN215990587U - Shell assembly and power adapter - Google Patents

Abstract

The application provides a shell assembly and a power adapter. The shell assembly comprises a shell and a heat conduction shielding piece, the shell is provided with a closed accommodating space, and the heat conduction shielding piece is arranged in the accommodating space. The application provides a housing assembly, through add the heat conduction shielding part in the casing, make the heat conduction shielding part parcel in the casing. First, the heat conductive shield itself has a shielding function for electromagnetic wave signals, so the addition of the heat conductive shield can improve the shielding effect of the housing assembly for electromagnetic wave signals, and improve the shielding performance of the housing assembly, i.e., the EMI prevention performance. And the heat conduction shielding piece also has a heat conduction function, so that the heat of the power adapter can be transmitted to the outside more quickly through the heat conduction shielding piece, and the heat radiation performance of the shell assembly is improved. In addition, the heat conduction shielding piece is arranged in the closed accommodating space, the heat conduction shielding piece can be protected by the shell, a user cannot see the heat conduction shielding piece from the appearance, and the appearance performance of the shell assembly is improved.

Description

Shell assembly and power adapter

Technical Field

The application belongs to the technical field of power adapters, and particularly relates to a shell assembly and a power adapter.

Background

With the progress of technology, electronic devices such as mobile phones and the like become necessities of life of people. Power adapters are commonly used to charge electronic devices such as cell phones. Along with the continuous increase of power adapter power, power adapter's heat dispersion is relatively poor, and is relatively poor to the shielding effect of signal.

SUMMERY OF THE UTILITY MODEL

In view of this, the first aspect of the present application provides a housing assembly, which includes a housing and a heat-conducting shielding member, where the housing has a closed accommodating space, and the heat-conducting shielding member is disposed in the accommodating space.

The shell assembly that this application first aspect provided through add heat conduction shielding part in the casing, also can understand as additionally increased a heat conduction shielding part on the basis of casing among the correlation technique to inlay heat conduction shielding part in the shell assembly, made heat conduction shielding part parcel in the casing. The heat conductive shield has both heat conductive and shielding effects as the name implies. First, the heat conductive shield itself has a shielding function for electromagnetic wave signals, so the addition of the heat conductive shield can improve the shielding effect of the housing assembly for electromagnetic wave signals, and improve the shielding performance of the housing assembly, i.e., the EMI prevention performance. And the heat conduction shielding piece also has a heat conduction function, so that the heat of the power adapter can be transmitted to the outside more quickly through the heat conduction shielding piece, and the heat radiation performance of the shell assembly is improved.

In addition, locate the heat conduction shielding part in inclosed accommodation space, usable casing protects the heat conduction shielding part, prevents that the heat conduction shielding part from droing, makes the user can't follow the existence of heat conduction shielding part in the outward appearance, has improved casing assembly's outward appearance performance.

The second aspect of the present application provides a power adapter, including participating in subassembly, circuit board and like the housing assembly that the first aspect of the present application provided, housing assembly has accommodating space, the circuit board is located in accommodating space, at least part it locates to participate in the subassembly in accommodating space, just it connects to participate in the subassembly the housing assembly, it connects the circuit board to participate in the subassembly electricity.

The power adapter that this application second aspect provided, through adopting the casing subassembly that this application first aspect provided, can improve power adapter's shielding performance and heat dispersion.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic perspective view of a housing assembly according to an embodiment of the present disclosure.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is a schematic sectional view taken along a-a direction in fig. 1.

Fig. 4 is a partially enlarged schematic view at a of fig. 3.

Fig. 5 is a schematic perspective view of a heat-conducting shield according to an embodiment of the present application.

FIG. 6 is a side view of a thermally conductive shield in accordance with an embodiment of the present application.

Fig. 7 is a schematic perspective view illustrating a heat-conducting shield and a first sub-housing according to an embodiment of the present disclosure.

Fig. 8 is a perspective view of a thermally conductive shield according to another embodiment of the present application.

Fig. 9 is a partially enlarged schematic view at B of fig. 3.

Fig. 10 is a partial enlarged view of fig. 3 at a in another embodiment of the present application.

Fig. 11 is a partially exploded view of a housing assembly according to an embodiment of the present application.

Fig. 12 is a partially enlarged view of fig. 11.

Fig. 13 is a schematic perspective view illustrating a power adapter in a closed state according to an embodiment of the present application.

Fig. 14 is a partial cross-sectional view taken along the direction B-B in fig. 13.

Fig. 15 is a schematic perspective view illustrating a power adapter in an open state according to an embodiment of the present application.

Fig. 16 is a schematic partial cross-sectional view taken along the direction C-C in fig. 15.

Fig. 17 is a partially enlarged view of fig. 16.

Description of reference numerals:

a shell assembly-1, a shell 2, a heat conduction shielding piece-3, a containing space-4, a power adapter-5, a pin assembly-6, a circuit board-7, a cover body-8, a first sub-shell-10, a first area-11, a second area-12, a filling part-13, a convex part-14, an output hole-15, a second sub-shell-20, a first part-21, a second part-22, a first side-31, a second side-32, a gap-33, a flat part-34, an inner surface-341, an outer surface-342, a first side-343, a second side-344, a bent part-35, a through hole-36, a containing space-40, an opening-41, an adhesive piece-50 and a bone position structure-60, pin-61, bracket-62, socket-80, first end surface 81, second end surface 82.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Before the technical solutions of the present application are introduced, the technical problems in the related art will be described in detail.

With the progress of technology, electronic devices such as mobile phones and the like gradually become necessities of life of people. Since power adapters are generally used to charge electronic devices such as mobile phones, research on power adapters is increasing. At present, in order to improve the charging efficiency and reduce the charging time, a high-power adapter is generally adopted, for example, a super fast charger with a charging power of 66w is provided at present. With the continuous increase of power, the size of the power adapter is also continuously decreasing, and the trend towards miniaturization and thinning is developed, for example, the overall thickness of the current power adapter is only 12mm, which results in the thickness of the adapter body also decreasing. However, the increase in power and the decrease in size can result in poor shielding effect of the power adapter, i.e., the electromagnetic wave signals emitted by the power adapter during operation can affect and interfere with other electronic products around the power adapter (the EMI protection performance is poor). And the radiating effect of the whole power adapter is also poor, the internal temperature of the power adapter is not easy to spread to the outside, and the service life of the power adapter is shortened.

In view of the above, in order to solve the above problems, the present application provides a housing assembly. Referring to fig. 1 to 4 together, fig. 1 is a schematic perspective view of a housing assembly according to an embodiment of the present disclosure. Fig. 2 is an exploded view of fig. 1. Fig. 3 is a schematic sectional view taken along a-a direction in fig. 1. Fig. 4 is a partially enlarged schematic view at a of fig. 3. This embodiment provides a housing assembly 1, specifically including: including casing 2 and heat conduction shielding piece 3, casing 2 has inclosed accommodation space 4, heat conduction shielding piece 3 is located in accommodation space 4.

The housing assembly 1 provided in this embodiment can be used as a housing of an electronic device, and is used to provide a mounting base for a structural member inside the electronic device and protect the structural member. Alternatively, the present embodiment is illustrated with the case assembly 1 as an adapter body of the power adapter 5. Of course, in other embodiments, the housing assembly 1 may also be used as a housing of an electronic device such as a mobile phone, a tablet, a computer, etc. Also, the housing assembly 1 may be the entire housing 2 of the electronic device, or only a portion of the housing 2 of the power adapter 5. Alternatively, the present embodiment is illustrated with the case assembly 1 as a partial adapter body of the power adapter 5. For example, the housing assembly 1 may serve as a lower cover sleeve for the power adapter 5, and the power adapter 5 may further include an upper cover to cover the pins.

In the related art, the housing assembly 1 is generally a one-piece structure, i.e., the housing assembly 1 is a complete structural member integrally made of one material. For example, the housing assembly 1 is usually made of plastic, which has good insulating property, low mass and low cost. However, as mentioned above, as the power of the power adapter 5 increases and the thickness of the whole device decreases, the number and strength of the electrical signals increase, the shielding performance of the housing assembly 1 is poor, so that the electrical signals generated by the power adapter 5 during operation affect the surrounding electronic products. And the increase of power also can make the heat that power adapter 5 gived off increase, but because the reason of casing assembly 1 material, lead to casing assembly 1's heat dispersion relatively poor, the heat can't in time be transmitted to the external world, leads to the heat at the inside gathering of power adapter 5, has reduced power adapter 5's life.

Therefore, in the present embodiment, by additionally providing the heat conducting shield 3 in the housing 2, it can also be understood that an additional heat conducting shield 3 is added on the basis of the housing 2 in the related art, and the heat conducting shield 3 is embedded in the housing assembly 1, so that the heat conducting shield 3 is wrapped in the housing 2. The heat-conducting shield 3 has, as the name implies, a heat-conducting and shielding effect. The material of the heat-conducting shield 3 includes, but is not limited to, various metal materials, and therefore, the heat-conducting shield 3 may also be referred to as a metal member. Alternatively, the material of the heat conductive shield 3 may be an aluminum alloy, a copper alloy, or the like. First, the heat conductive shield 3 itself has a shielding function for electromagnetic wave signals, so the addition of the heat conductive shield 3 can improve the shielding effect of the housing assembly 1 for electromagnetic wave signals, and improve the shielding performance of the housing assembly 1, i.e. the EMI prevention performance. And heat conduction shielding piece 3 still has the function of heat conduction, can transmit the heat of power adapter 5 to the external world through heat conduction shielding piece 3 more fast, improves housing assembly 1's heat dispersion.

In addition, locate heat conduction shielding piece 3 in inclosed accommodation space 4, usable casing 2 protects heat conduction shielding piece 3, prevents that heat conduction shielding piece 3 from droing, makes the user can't follow the existence of heat conduction shielding piece 3 in the outward appearance, has improved the outward appearance performance of casing subassembly 1.

Referring to fig. 2 and fig. 3 again, in this embodiment, the housing 2 includes a first sub-housing 10 and a second sub-housing 20, the first sub-housing 10 and the second sub-housing 20 are enclosed to form the accommodating space 4, the heat-conducting shielding element 3 is sandwiched between at least a portion of the first sub-housing 10 and at least a portion of the second sub-housing 20, and one end of the heat-conducting shielding element 3 is in contact with the first sub-housing 10, and the other end is in contact with the second sub-housing 20.

The present embodiment provides a specific structure of the housing 2 and the heat conductive shield 3. For example, the housing 2 may be a split structure, i.e. the housing 2 is not a complete component, but is assembled from 2 sub-housings 2. The heat conduction shielding element 3 is clamped between at least part of the first sub-housing 10 and at least part of the second sub-housing 20, and the first sub-housing 10 and the second sub-housing 20 are enclosed to form the accommodating space 4, so that the heat conduction shielding element 3 can be arranged in the accommodating space 4 in the housing 2, and the difficulty in preparing the housing assembly 1 is reduced by matching the two sub-housings 2.

Regarding the positional relationship between the heat conductive shield 3 and the first sub-housing 10 and the second sub-housing 20, in one embodiment, the heat conductive shield 3 may be completely disposed between the first sub-housing 10 and the second sub-housing 20. In another embodiment, the heat conductive shield 3 may also be disposed between a portion of the first sub-housing 10 and a portion of the second sub-housing 20, and the rest of the first sub-housing 10 or the second sub-housing 20 is disposed in the heat conductive shield 3, or other positions.

Regarding the connection relationship between the heat-conducting shield 3 and the first sub-housing 10 and the second sub-housing 20, the present embodiment brings one end of the heat-conducting shield 3 into contact with the first sub-housing 10 and the other end into contact with the second sub-housing 20. It should be understood that the opposite ends of the heat conductive shield 3 contact the first sub-housing 10 and the second sub-housing 20, respectively, but the embodiment is not limited herein, specifically, what connection relationship the heat conductive shield 3 is connected to the first sub-housing 10 and the second sub-housing 20. For example, the heat conductive shield 3 and the first and second sub-housings 10 and 20 may be connected, may be abutted, may be bonded, or the like.

In addition, as shown in fig. 1, the housing assembly 1 generally has a receiving space 40, and the receiving space 40 is generally used for mounting a pin, a circuit board 7 and other structural members. Therefore, for the first sub-housing 10 and the second sub-housing 20, one sub-housing may be used as an external appearance member, and the other sub-housing is disposed in the external appearance member, which is not limited herein. In one embodiment, the first sub-housing 10 may be closer to the accommodating space 40, and the second sub-housing 20 may be an external appearance of the housing assembly 1, and the first sub-housing 10 is disposed in the second sub-housing 20. In another embodiment, the second sub-housing 20 may be closer to the accommodating space 40, in which case the first sub-housing 10 is an external appearance of the housing assembly 1, and the second sub-housing 20 is disposed in the first sub-housing 10. Further, a heat conductive shield 3 is interposed between the first sub-housing 10 and the second sub-housing 20. The first sub-housing 10, the heat-conducting shield 3 and the second sub-housing 20 thus form a three-layer "sandwich" structure, thereby forming the housing assembly 1.

Referring to fig. 5-6 together, fig. 5 is a schematic perspective view of a heat conductive shielding element according to an embodiment of the present application. FIG. 6 is a side view of a thermally conductive shield in accordance with an embodiment of the present application. In this embodiment, the heat conductive shielding element 3 has an inner surface 341 and an outer surface 342 opposite to each other, the inner surface 341 contacts the first sub-housing 10, and the outer surface 342 contacts the second sub-housing 20; the heat conductive shield 3 has a gap 33 extending through the inner surface 341 and the outer surface 342, and a portion of the housing 2 is disposed in the gap 33.

The thermally conductive shield 3 sandwiched between the first sub-housing 10 and the second sub-housing 20 generally has an inner surface 341 and an outer surface 342, wherein the inner surface 341 is configured to contact the first sub-housing 10 and the outer surface 342 is configured to contact the second sub-housing 20. The contact here may be a connection, may be an abutment, or may be an adhesion, etc., as the contact mentioned above.

In this embodiment, the gap 33 penetrating the inner surface 341 and the outer surface 342 may be disposed on the heat-conducting shielding member 3, and the disposition of the gap 33 may reduce the difficulty in manufacturing the heat-conducting shielding member 3. This is because the housing assembly 1 is a three-dimensional structure and has a certain shape, and the housing assembly 1 generally has the receiving space 40, so that neither the first sub-housing 10, the heat conductive shield 3, nor the second sub-housing 20 is a planar structure, but a three-dimensional structure. Therefore, the present embodiment requires the preparation of the heat conductive shield 3 having a three-dimensional structure. Specifically, the present embodiment can form the structure required for the present embodiment by bending one heat conductive shield 3 of a planar structure. For example, as shown in fig. 6, the planar heat conduction shield 3 has a first side 31 and a second side 32 opposite to each other, and the first side 31 and the second side 32 only need to be bent toward the same side to form the heat conduction shield 3 with a three-dimensional structure as required by the present embodiment. Since the heat conductive shield 3 with a three-dimensional structure is formed by bending, the first side 31 and the second side 32 are close to each other after bending, and a gap 33 is formed between the first side 31 and the second side 32. In summary, the present embodiment reduces the difficulty in manufacturing the heat conductive shield 3 by bending the heat conductive shield 3 with the gap 33.

In addition, in the present embodiment, a part of the housing 2 may be disposed in the gap 33, and the gap 33 may be filled with the housing 2, thereby improving structural stability of the housing assembly 1. Alternatively, a portion of the first sub-housing 10 may be provided in the gap 33. Alternatively, a portion of the second sub-housing 20 may be provided in the gap 33. Alternatively, portions of the first sub-housing 10 and the second sub-housing 20 may be disposed in the gap 33. Further alternatively, injection molding may be performed on the basis of the heat conductive shield 3, thereby forming the housing 2, and disposing a portion of the housing 2 in the gap 33

Referring to fig. 6 again, in the present embodiment, the heat conducting shield 3 includes two flat portions 34 disposed opposite to each other, and a bent portion 35 connected to a periphery of the flat portions 34 in a bent manner, and the gap 33 is located on one of the flat portions 34.

As is apparent from the above description, the heat conductive shield 3 is formed by bending, and therefore the heat conductive shield 3 includes the flat portion 34 and the bent portion 35. The flat portion 34 can be understood as the portion of the heat conductive shield 3 that is not bent, and the bent portion 35 is the portion of the heat conductive shield 3 that is bent. In the present embodiment, the heat conducting shield 3 includes two opposite flat portions 34 and two opposite bent portions 35, and the gap 33 can be located on one of the flat portions 34, so as to firstly reduce the difficulty of forming the heat conducting shield 3, and make it easier to prepare the heat conducting shield by bending. Secondly, the gap 33 is located at the flat portion 34 instead of the bent portion 35, so that the stability of the heat-conducting shield 3 is improved, and the heat-conducting shield 3 is not easy to deform after being bent.

Optionally, the flat portion 34 and the bent portion 35 are of a unitary structure, and in order to make the structure thereof clearer, the applicant has given different names to different portions of the heat-conducting shield 3.

Referring to fig. 7-8, fig. 7 is a schematic perspective view illustrating a heat conductive shielding element and a first sub-housing according to an embodiment of the present disclosure. Fig. 8 is a perspective view of a heat-conductive shield 3 according to another embodiment of the present application. In this embodiment, the flat portion 34 has the inner surface 341, the outer surface 342, a first side surface 343, and a second side surface 344, the first side surface 343 and the second side surface 344 are connected to the inner surface 341 and the outer surface 342 by bending, and the first side surface 343 is connected to the second side surface 344 by bending; the bending portion 35 is connected to at least a portion of the first side 343 in a bending manner.

As can be seen from the above, the heat conductive shield 3 is formed by bending, and the heat conductive shield 3 includes the flat portion 34 and the bent portion 35, but the bent portion 35 is not connected to all the side surfaces of the flat portion 34 by bending, and the bent portion 35 is connected to only a part of the side surfaces of the flat portion 34 by bending. Specifically, the first side surface 343 and the second side surface 344 are bent to connect the inner surface 341 and the outer surface 342, the first side surface 343 and the second side surface 344 are partial peripheral surfaces of the flat portion 34, and the first side surface 343 and the second side surface 344 are bent to connect, that is, the first side surface 343 and the second side surface 344 are adjacent sides. In this embodiment, the bending portion 35 may be bent and connected to at least a portion of the first side surface 343, and it can also be understood that not all the side surfaces are connected to the bending portion 35, and some of the side surfaces have no bending portion 35, so that the shape of the accommodating space 40 defined by the heat conductive shielding member 3 is similar to the structure of the through hole 36, rather than a groove structure, which has no bottom wall and only has side walls. This further reduces the bending difficulty of the heat conductive shield 3, making it easier to form the heat conductive shield 3 by bending.

The structure of the heat conductive shield 3 itself is described above, and the structure of the heat conductive shield 3 when it is mated with the first sub-housing 10 and the second sub-housing 20 is described below.

Referring to fig. 3, fig. 7 and fig. 8 again, in the present embodiment, the housing assembly 1 has a receiving space 40, and the first side surface 343 is far away from the bottom wall of the receiving space 40 than the second side surface 344; the first sub-housing 10 and the second sub-housing 20 are provided with an output hole 15 communicating with the accommodating space 40.

The adapter body generally has a receiving space 40 and an opening 41, and various structural components within the adapter body enter into the receiving space 40 through the opening 41. In the present embodiment, the first side surface 343 is farther from the bottom wall of the accommodating space 40 than the second side surface 344. For example, the first side surface 343 may be a surface of the flat portion 34 corresponding to a sidewall of the receiving space 40, and the second side surface 344 may be a surface of the flat portion 34 corresponding to a bottom wall of the receiving space 40. In this case, the position of the bent portion 35 of the present embodiment may be set corresponding to the sidewall of the accommodating space 40, but not set opposite to the bottom wall of the accommodating space 40. Because the output hole 15 needs to be opened on the side of the housing assembly 1 away from the accommodating space 40, so that the charging interface is installed in the subsequent process to connect the charging line, the bending part 35 can avoid the position to omit the opening on the heat-conducting shielding member 3, and only the output hole 15 needs to be opened on the first sub-housing 10 and the second sub-housing 20, thereby further reducing the difficulty in preparing the housing assembly 1.

Referring to fig. 9, fig. 9 is a partially enlarged view of fig. 3 at B. In this embodiment, the first sub-housing 10 has a first region 11 and a second region 12 connected to each other, and an orthographic projection of the heat-conducting shield 3 on the first sub-housing 10 is located in the first region 11; the first sub-housing 10 located in the second region 12 is provided with a filling portion 13 at a side close to the heat conductive shield 3, and the filling portion 13 contacts the second sub-housing 20 to form the accommodating space 4.

In the present embodiment, the size of the heat conducting shield 3 may not completely cover the first sub-housing 10, i.e. the heat conducting shield 3 is only arranged corresponding to a partial area of the first sub-housing 10. For example, as is clear from the above description, the bent portion 35 is not bent over all the side surfaces connected to the flat portion 34, but is bent over only a part of the side surfaces connected to the flat portion 34. This may result in that the heat-conducting shield 3 may not cover the entire area of the first sub-housing 10, but only a partial area of the first sub-housing 10, i.e. the orthographic projection of the heat-conducting shield 3 on the first sub-housing 10 is located in the first area 11. The thermally conductive shield 3 is not present in the second region 12. Therefore, the present embodiment may provide the first sub-housing 10 located in the second region 12 with a filling portion 13 on a side close to the heat conductive shield 3, and the filling portion 13 contacts the second sub-housing 20. That is, the region without the heat conductive shield 3 is filled with the filling portion 13 to improve the structural stability of the housing assembly 1. And the filling part 13 contacts the second sub-housing 20 to seal the accommodating space 4 formed by the first sub-housing 10 and the second sub-housing 20, so as to form the closed accommodating space 4.

Alternatively, the first sub-housing 10 and the filling portion 13 are of a one-piece structure, and may be integrally formed by insert molding, for example. The applicant has given different names to different parts of its structure in order to make its structure clearer. In the present exemplary embodiment, the heat-conducting shield 3 is therefore arranged only between the second partial housing 20 and a part of the first partial housing 10. Of course, in other embodiments, the first sub-housing 10 and the filling part 13 may be of a split structure.

Referring to fig. 10 again, fig. 10 is a partial enlarged view of fig. 3 at a in another embodiment of the present application. In this embodiment, the heat-conducting shield 3 is provided with at least one through hole 36, the through hole 36 penetrates through the surface of the heat-conducting shield 3 close to the first sub-housing 10, and the surface of the heat-conducting shield 3 close to the second sub-housing 20; at least one protrusion 14 is disposed on one side of the first sub-housing 10 close to the heat-conducting shielding member 3, and each protrusion 14 is correspondingly disposed in one of the through holes 36.

In this embodiment, at least one through hole 36 may be formed in the heat conductive shield 3, and the through hole 36 penetrates through the surfaces close to the first sub-housing 10 and the second sub-housing 20, that is, the through hole 36 penetrates through the inner surface 341 and the outer surface 342. Optionally, the thermally conductive shield 3 is provided with a plurality of through holes 36 arranged in an array. The arrangement of the through holes 36 can increase the surface area of the heat-conducting shield 3, and further improve the heat dissipation performance of the heat-conducting shield 3 and the housing assembly 1. In addition, in this embodiment, at least one protrusion 14 may be disposed on a side of the first sub-housing 10 close to the heat conductive shield 3, and each protrusion 14 is correspondingly disposed in one through hole 36. The protruding portion 14 is disposed in the through hole 36 and connected to the sidewall of the through hole 36, so as to further improve the connection performance between the first sub-housing 10 and the heat conductive shield 3.

Optionally, the first sub-housing 10 and the protruding portion 14 are of an integral structure, and further optionally, the first sub-housing 10, the filling portion 13, and the protruding portion 14 are of an integral structure. For example, the material can be integrally formed by insert molding. The applicant has given different names to different parts of its structure in order to make its structure clearer. Specifically, the planar heat conductive shield 3 may be provided, and then the heat conductive shield 3 with the through hole 36 may be formed by punching and bending. Then, the first sub-housing 10 is placed in a mold and integrally molded by means of in-mold injection, so that the first sub-housing has the filling portion 13 and the protruding portion 14. In the present exemplary embodiment, the heat-conducting shield 3 is therefore arranged only between the second partial housing 20 and a part of the first partial housing 10. Of course, in other embodiments, the first sub-housing 10 and the protruding portion 14 may be a split structure.

Referring to fig. 10 again, in this embodiment, a side surface of the heat-conducting shield 3 facing away from the first sub-housing 10 is flush with a side surface of the protrusion 14 facing away from the first sub-housing 10.

In this embodiment, the heat-conducting shielding element 3 and the surface of the protruding portion 14 away from the first sub-housing 10 can be flush, so that the entire surface is flat, which is beneficial to the subsequent connection with the second sub-housing 20, and improves the connection performance between the heat-conducting shielding element 3 and the second sub-housing 20.

Referring to fig. 3 again, in the present embodiment, the heat conducting shield 3 and the first sub-housing 10 are both disposed in the second sub-housing 20, the heat conducting shield 3 is closer to the second sub-housing 20 than at least a portion of the first sub-housing 10, and the first sub-housing 10 and the heat conducting shield 3 are in an integrated structure.

As can be seen from the above, in the present embodiment, the second sub-housing 20 can be used as an external appearance of the housing assembly 1, and the first sub-housing 10 and the heat-conducting shield 3 are both disposed in the second sub-housing 20, and the heat-conducting shield 3 is closer to the second sub-housing 20 than at least a part of the first sub-housing 10, so as to form a three-layer "sandwich" structure of the first sub-housing 10, the heat-conducting shield 3, and the second sub-housing 20. In other words, the first sub-housing 10 or the second sub-housing 20 may be the housing 2 close to the accommodating space 40, and in this embodiment, it is defined that the first sub-housing 10 is the housing 2 close to the accommodating space 40, and the second sub-housing 20 is the housing 2 far from the accommodating space 40, so that a side surface of the second sub-housing 20 far from the accommodating space 40 is an appearance surface of the housing assembly 1. In addition, the first sub-housing 10 and the heat-conducting shielding member 3 may be an integrated structure, so as to reduce the difficulty in manufacturing the first sub-housing 10 and the heat-conducting shielding member 3. As for the specific preparation method of the first sub-housing 10 and the heat conductive shielding member 3, the above mentioned is mentioned in the present application, and the detailed description is omitted here.

Referring to fig. 11, fig. 11 is a partially exploded view of a housing assembly according to an embodiment of the present disclosure. In this embodiment, the second sub-housing 20 and the heat-conducting shield 3 are of a split structure.

This embodiment can make the second sub-housing 20 and the heat conduction shielding member 3 be the split type structure, namely prepare the second sub-housing 20 earlier, make the second sub-housing 20 and the heat conduction shielding member 3 assemble afterwards to further reduce the preparation degree of difficulty of casing assembly 1. Because one side of the heat conduction shielding member 3 is provided with the first sub-housing 10, the other side is provided with the second sub-housing 20, and the first sub-housing 10 and the heat conduction shielding member 3 are of an integrated structure. Therefore, if the first sub-housing 10, the heat conductive shield 3, and the second sub-housing 20 are designed as an integrated structure, the molded heat conductive shield 3 is placed in a mold and the first sub-housing 10 and the second sub-housing 20 are formed on two sides. Since the heat conductive shielding element 3 cannot be completely suspended in the mold, the heat conductive shielding element 3 must be supported in the mold, and thus the first sub-housing 10 and the second sub-housing 20 cannot be formed at the same time.

In addition, if the first sub-housing 10 and the heat-conducting shield 3 are designed as an integral structure first. Then, the first sub-housing 10 and the heat conducting shielding member 3 are integrated into a whole and then placed into another mold to form the second sub-housing 20, that is, the heat conducting shielding member 3 and the first sub-housing 10 are integrated, and the heat conducting shielding member 3 and the second sub-housing 20 are integrated. In other words, a bijective method is used. Due to the nature of the injection molding and the presence of the first sub-housing 10 and the heat-conducting shield 3, for example, the material of the housing 2 has a certain viscosity, so that if the second sub-housing 20 is formed and the second sub-housing 20 is made uniform, the reserved space is larger than 0.9mm, the material of the housing 2 can flow well in the reserved space in the mold, that is, the thickness of the second sub-housing 20 is 0.9 mm. In the embodiment, a split structure is adopted, the second sub-housing 20 meeting the thickness requirement of a user can be manufactured firstly, and then the second sub-housing is assembled with the heat-conducting shielding member 3, so that the thickness of the second sub-housing 20 can be reduced. Optionally, the thickness of the second sub-housing 20 is 0.5-0.9 mm. Further alternatively, the thickness of the second sub-housing 20 may be 0.6-0.8 mm. For example the thickness of the second sub-housing 20 may be 0.6 mm.

Optionally, the thickness of the first sub-housing 10 is 0.6-1 mm. For example, the thickness of the first sub-housing 10 may be 0.8 mm.

Optionally, the thickness of the thermally conductive shield 3 is 0.1-0.3 mm. The thickness of the thermally conductive shield 3 may be 0.15mm, for example.

Referring to fig. 11 again, in the present embodiment, the second sub-housing 20 includes a first portion 21 and a second portion 22 of a split structure, the first portion 21 and the second portion 22 are disposed on two opposite sides of the heat conductive shielding element 3, and both the first portion 21 and the second portion 22 are in contact with the heat conductive shielding element 3.

In the present embodiment, the second sub-housing 20 may thus be of a split structure with the heat-conducting shield 3, and the second sub-housing 20 itself may also be of a split structure, i.e. the second sub-housing 20 is made up of multiple parts. For example, the second sub-housing 20 includes a first portion 21 and a second portion 22, the first portion 21 and the second portion 22 are disposed on two opposite sides of the heat conductive shield 3, and the first portion 21 and the second portion 22 are in contact with the heat conductive shield 3. By making the second sub-housing 20 a split structure, the assembling performance of the housing assembly 1 can be further reduced. For example, the first portion 21 and the second portion 22 may be prepared, the first portion 21 and the second portion 22 are disposed on opposite sides of the heat conductive shield 3, and then the first portion 21 and the second portion 22 are brought into contact with the heat conductive shield 3 by various methods, thereby completing the assembly. The application is not limited as to whether the first portion 21 is in contact with the second portion 22. For example, in one embodiment the first portion 21 is spaced from the second portion 22. In another embodiment the first part 21 is connected to the second part 22.

In addition, the first portion 21 and the second portion 22 are separately prepared and then contacted with the heat conductive shielding member 3, so that no matter whether the first portion 21 is connected with the second portion 22 or not, the connection position has a larger or smaller gap, and thus the current on the pins enters the second sub-housing 20 through the gap, and is further transmitted into the accommodating space 40. However, since the first sub-housing 10 and the heat conductive shield 3 are of an integral structure, that is, the first sub-housing 10 is integrally formed, no gap exists. Therefore, current can only flow from the surface of the first sub-housing 10 to the circuit board 7 and other parts in the accommodating space 40, so that the creepage distance is increased, and the parts in the accommodating space 40 are effectively protected. However, if the first sub-housing 10, the heat conductive shield 3, and the second sub-housing 20 are designed as two parts like the second sub-housing 20, there will be a gap at the joint of each structural member, and the current on the pins can be directly transmitted into the accommodating space 40 through the gap, which will result in too short creepage distance and affect the performance and service life of each component in the accommodating space 40.

Referring to fig. 11 again, in the present embodiment, the housing assembly 1 further includes an adhesive member 50, and the adhesive member 50 is disposed between the first portion 21 and the heat conductive shielding member 3, and between the second portion 22 and the heat conductive shielding member 3.

The above describes that both the first portion 21 and the second portion 22 are in contact with the thermally conductive shield 3. This application introduces two specific implementations. In the first implementation manner, the first portion 21 and the second portion 22 can be bonded to the heat-conducting shield 3 by using the adhesive 50 through a dispensing method, so as to improve the connection performance between the second sub-housing 20 and the heat-conducting shield 3.

Referring to fig. 12, fig. 12 is a partial enlarged view of fig. 11. In this embodiment, a bone structure 60 is disposed on a side of the heat conducting shield 3 and the first sub-housing 10 away from the receiving space 40, the first portion 21 and the second portion 22 are both connected to the bone structure 60, and the first portion 21 and the second portion 22 are both abutted against the heat conducting shield 3.

In a second implementation manner, a bone structure 60 is disposed on the heat-conducting shield 3 and one side of the first sub-housing 10 close to the second sub-housing 20, the bone structure 60 is connected to the first portion 21 and the second portion 22, and the first portion 21 and the second portion 22 are both abutted to the heat-conducting shield 3, so that the first portion 21, the second portion 22 and the heat-conducting shield 3 are in contact, and the second sub-housing 20 is assembled. For example, after the heat conductive shielding element 3 is manufactured as a single body, the bone structure 60 can be formed on the heat conductive shielding element 3 and the first sub-housing 10 on the side close to the second sub-housing 20, then the first portion 21 and the second portion 22 are manufactured and abutted against the heat conductive shielding element 3 and the bone structure 60, and finally the bone structure 60 can be connected to the first portion 21 and the second portion 22 by ultrasonic welding.

Please refer to fig. 13-14 together, fig. 13 is a schematic perspective view illustrating a power adapter in a closed state according to an embodiment of the present application. Fig. 14 is a partial cross-sectional view taken along the direction B-B in fig. 13. The embodiment further provides a power adapter 5, which includes a pin assembly 6, a circuit board 7, and the housing assembly 1 provided in the above embodiments of the present application, where the housing assembly 1 has an accommodating space 40, the circuit board 7 is disposed in the accommodating space 40, at least a portion of the pin assembly 6 is disposed in the accommodating space 40, the pin assembly 6 is connected to the housing assembly 1, and the pin assembly 6 is electrically connected to the circuit board 7.

The power adapter 5 according to the present embodiment can improve the shielding performance and the heat radiation performance of the power adapter 5 by using the case assembly 1 according to the above embodiment.

Referring to fig. 13-17, fig. 15 is a schematic perspective view illustrating a power adapter in an open state according to an embodiment of the present application. Fig. 16 is a schematic partial cross-sectional view taken along the direction C-C in fig. 15. Fig. 17 is a partially enlarged view of fig. 16. In this embodiment, the pin assembly 6 includes a pin 61 and a bracket 62 connected to each other, the bracket 62 is disposed in the accommodating space 40, at least a portion of the pin 61 is disposed outside the accommodating space 40, and the power adapter 5 further includes a cover 8 rotatably connected to the bracket 62;

when the power adapter 5 is in the closed state, the pins 61 are disposed in the cover 8, and the cover 8 has a first end surface 81 close to the bracket 62; the housing assembly 1 and the bracket 62 have a second end face 82 adjacent to the cover 8; when the power adapter 5 is in the open state, the cover 8 abuts against the housing assembly 1, and the first end surface 81 and the second end surface 82 together form an insertion surface 80.

The pin assembly 6 of the power adapter 5 according to this embodiment includes the pins 62 and the bracket 62 connected to each other. Wherein the pin assembly 6 is composed of a bracket 62 and a pin 61. The plug 61 is made of conductive metal, and the plug 61 is inserted into the socket 3 and used for receiving alternating voltage provided by the socket. The number of the pins 61 may be, but not limited to, two, and in the present embodiment, the number of the pins 61 is two. The two pins 61 are arranged oppositely and at intervals. The pins 61 may be, but are not limited to, elongated. The end of the pin 61 facing away from the bracket 62 is curved to facilitate insertion of the pin 61 into the socket. When the pin 61 is inserted into the socket 3 to receive a first voltage, the circuit board is electrically connected to the pin 61 to receive the first voltage transmitted from the pin 61, and the circuit board 7 is used for converting the first voltage into a second voltage, and the second voltage is used for charging a battery of an electronic device. As for the bracket 62, the pin 61 is disposed on the bracket 62, and other structural members may be disposed in the bracket 62, which is not described in detail herein.

In addition, the power adapter 5 may further include a cover 8 besides the above structure, wherein the cover 8 is used to be in a closed state to enclose the pins 61 when the power adapter 5 is not in operation, so as to improve the service life and appearance performance of the pins 61. When the power adapter 5 is operated, the cover body 8 is opened to expose the pins 61, thereby plugging the receptacle. In this embodiment, when the power adapter 5 is in the closed state, the pin 61 is covered, which includes but is not limited to the following cases: the pins 61 are covered by the cover 30; alternatively, the pins 61 are covered by the housing assembly 1; alternatively, the pins 61 are covered by both the housing assembly 1 and the cover 30. The case where the pins 61 are covered by the cover 30 is exemplified by the case where the cover 30 has receiving cavities in which the pins 61 are received when the cover 30 is closed, so as to cover the pins 61. The case where the pins 61 are covered by the housing assembly 1 is exemplified by the case where the housing assembly 1 has the accommodating space 40, and when the cover 30 is closed, the pins 61 are accommodated back in the accommodating space 40, and in this case, the pins 61 are covered by the housing assembly 1. The case where the pins 61 are covered by both the case assembly 1 and the cover 30 is exemplified by the case assembly 1 and the cover 30 together forming the receiving cavities 13, and when the cover 30 is closed, the pins 61 are received in the receiving cavities formed by both the case assembly 1 and the cover 30 together. The present application is illustrated with the pins 61 covered by the cover 30.

When the power adapter 5 is in the open state, at least a part of the pins 61 are disposed outside the accommodating space 11. When the power adapter 5 is in the closed state, there may be any situation, but when the power adapter 5 is in the open state, at least a part of the pins 61 need to be ensured to be arranged outside the accommodating space 11 for the pins 61 to be plugged into the socket.

The cover 30 of the present embodiment is rotatably connected to the bracket 62, so that the cover 30 can rotate relative to the housing assembly 1 or the bracket 62, thereby achieving the open state and the closed state. The number of covers 30 may be, but is not limited to, two. In the present embodiment, the number of the lid bodies 30 is two. When the two covers 30 rotate relatively and the two covers 30 abut against each other, the power adapter 5 is in a closed state (as shown in fig. 13-14). When the two covers 30 rotate back to back and both covers 30 abut against the housing assembly 1, the power adapter 5 is in an open state (as shown in fig. 15-16).

In addition, when the power adapter 5 is in the closed state, the cover 8 has a first end surface 81 close to the bracket 62; the housing assembly 1 and the bracket 62 have a second end face 82 adjacent to the cover 8; when the power adapter 5 is in the open state, the first end surface 81 and the second end surface 82 together form a plug surface 80. The first end face 81 is disposed flush with the second end face 82.

Since the distance between the pins and the outermost surface of the power adapter (i.e., the distance of the contact surface 80) when the pins 61 are inserted into the socket is required to satisfy the national safety regulations, for example, the size of the contact surface is required to be not less than 6.5mm, or not less than 7.9mm, so as to satisfy the creepage distance and prevent current from hurting users. This application is through making lid 8 upset to utilize the terminal surface of lid 8 to serve as partial bayonet surface 80, can reduce housing assembly 1's thickness like this under the condition that satisfies the ann rule, the numerical value of the thickness that reduces is the thickness size of lid 8 terminal surfaces promptly, thereby reduces the thickness of the whole machine of power adapter 5, realizes the purpose of ultra-thin adapter.

Optionally, the range of D1 of the first end face 81 is: d1 is not less than 4.825mm and not more than 7 mm. The thickness D2 of the second end face 82 ranges from: d2 is not less than 6.3mm and not more than 14 mm.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (14)

1. The shell assembly is characterized by comprising a shell and a heat conduction shielding piece, wherein the shell is provided with a closed accommodating space, and the heat conduction shielding piece is arranged in the accommodating space.

2. The housing assembly of claim 1, wherein the housing includes a first sub-housing and a second sub-housing, the first sub-housing and the second sub-housing are enclosed to form the accommodating space, and the heat-conducting shielding element is sandwiched between at least a portion of the first sub-housing and at least a portion of the second sub-housing.

3. The housing assembly of claim 2, wherein the thermally conductive shield has an inner surface and an outer surface disposed opposite, the inner surface contacting the first sub-housing and the outer surface contacting the second sub-housing; the thermally conductive shield has a gap extending through the inner surface and the outer surface, a portion of the housing being disposed within the gap.

4. The housing assembly of claim 3, wherein the heat conductive shield comprises two flat portions disposed opposite to each other and a bent portion connected to a peripheral edge of the flat portions, and the gap is located on one of the flat portions.

5. The housing assembly of claim 2, wherein the first sub-housing has a first region and a second region joined, an orthographic projection of the thermally conductive shield on the first sub-housing being located within the first region; and a filling part is arranged on one side, close to the heat conduction shielding part, of the first sub-shell positioned in the second area, and the filling part is in contact with the second sub-shell to form the accommodating space.

6. The housing assembly of claim 2, wherein the thermally conductive shield is provided with at least one through hole extending through a surface of the thermally conductive shield proximate to the first sub-housing and a surface of the thermally conductive shield proximate to the second sub-housing; at least one protruding part is arranged on one side, close to the heat conduction shielding part, of the first sub-shell, and each protruding part is correspondingly arranged in one through hole.

7. The housing assembly of claim 6, wherein a side surface of the thermally conductive shield facing away from the first sub-housing is flush with a side surface of the boss facing away from the first sub-housing.

8. The housing assembly of any of claims 2-7, wherein the thermally conductive shield and the first sub-housing are both disposed within the second sub-housing, the thermally conductive shield is closer to the second sub-housing than at least a portion of the first sub-housing, and the first sub-housing and the thermally conductive shield are a unitary structure.

9. The housing assembly of claim 8, wherein the thickness of the second sub-housing is 0.5-0.9 mm.

10. The housing assembly of claim 8, wherein the second sub-housing comprises a first portion and a second portion of a split-type structure, the first portion and the second portion being disposed on opposite sides of the thermally conductive shield, and both the first portion and the second portion being in contact with the thermally conductive shield.

11. The housing assembly of claim 10, further comprising an adhesive disposed between the first portion and the thermally conductive shield and between the second portion and the thermally conductive shield.

12. The housing assembly of claim 10, wherein the thermally conductive shield and a side of the first sub-housing proximate the second sub-housing are provided with a bone structure, the first portion and the second portion are both connected to the bone structure, and the first portion and the second portion are both abutted to the thermally conductive shield.

13. A power adapter comprising a pin assembly, a circuit board, and a housing assembly as claimed in any one of claims 1-12, wherein the housing assembly has a receiving space, the circuit board is disposed in the receiving space, at least a portion of the pin assembly is disposed in the receiving space, and the pin assembly is connected to the housing assembly, and the pin assembly is electrically connected to the circuit board.

14. The power adapter as claimed in claim 13, wherein the pin assembly comprises a pin and a bracket connected with each other, the bracket is disposed in the receiving space, at least a portion of the pin is disposed outside the receiving space, and the power adapter further comprises a cover body rotatably connected with the bracket;

when the power adapter is in a closed state, the plug pins are arranged in the cover body, and the cover body is provided with a first end surface close to the bracket; the shell assembly and the bracket are provided with second end faces close to the cover body; when the power adapter is in an open state, the cover body is abutted to the shell assembly, and the first end face and the second end face jointly form a plug-in face.

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