CN215988798U

CN215988798U - PC composite board and solar module

Info

Publication number: CN215988798U
Application number: CN202120941629.1U
Authority: CN
Inventors: 刘宝信; 袁志林; 刘亚锋; 钱俊岑
Original assignee: Risen Energy Co Ltd
Current assignee: Risen Energy Co Ltd
Priority date: 2021-04-30
Filing date: 2021-04-30
Publication date: 2022-03-08
Anticipated expiration: 2031-04-30

Abstract

The embodiment of the application provides a PC composite board and a solar module, and relates to the field of solar module preparation. The PC composite board comprises an organic silicon glass resin layer, a PC base material layer and a bonding layer which are sequentially stacked from top to bottom and are connected into a whole. The solar module comprises a front plate, a front packaging adhesive film, a battery string, a back packaging adhesive film and a back plate which are sequentially stacked, wherein the back plate is made of the PC composite board or the front plate and the back plate are made of the PC composite board, and the organic silicon glass resin layers of the front plate and the back plate are located on the outermost layer. The PC composite board is used as a packaging board of the solar module, and has high mechanical strength, light weight and low cost.

Description

PC composite board and solar module

Technical Field

The application relates to the field of solar module preparation, in particular to a PC composite board and a solar module.

Background

The existing solar module comprises a dual-glass module or a single-glass module, in order to ensure the overall strength of the module, the thickness of the glass is usually 2.0mm-4.0mm, and the weight of the glass accounts for more than 70%, so that the overall weight of the module is larger.

The existing light solar module mostly achieves the purpose of reducing the whole weight of the module by reducing the thickness of glass on the basis of the original module structure, for example, toughened glass with relatively thinner thickness is adopted. Although the purpose of reducing the overall weight of the assembly can be achieved by the mode, the manufacturing cost of the toughened glass is high, and in addition, after the thickness of the packaging layer is reduced, the load-resisting capacity of the assembly is inevitably reduced.

In order not to increase the cost, and to ensure the load-bearing capacity of the assembly and reduce the overall weight, people turn to exploring some composite photovoltaic panels to expect to replace glass as a packaging panel. For example, a composite photovoltaic back panel disclosed in chinese patent publication No. CN111634074A includes a weather-resistant layer, a transparent support substrate layer, an adhesive layer, and a functional layer in sequence, where the transparent support substrate layer is made of PET (Polyethylene terephthalate) or PEN (Polyethylene naphthalate), and such polyester is a flexible resin, so that the formed composite photovoltaic panel does not have good support strength. When the composite photovoltaic panel is used as a packaging plate, glass or other supporting layers with higher supporting strength must be matched for use, so that the formed photovoltaic module can meet certain mechanical strength requirements.

SUMMERY OF THE UTILITY MODEL

An object of the embodiments of the present application is to provide a PC (Polycarbonate) composite board and a solar module, where the PC composite board is used as an encapsulation board of the solar module, and has high mechanical strength, light weight, and low cost.

In a first aspect, an embodiment of the present application provides a PC composite board, which includes an organosilicone glass resin layer, a PC substrate layer, and an adhesive layer, which are sequentially stacked from top to bottom, and are connected into a whole.

In the implementation process, the strength of the PC substrate layer is high, and the weight is light; the PC substrate layer is matched with the organic silicon glass resin layer, so that the weather resistance of the PC substrate layer can be improved, and the PC substrate layer is protected; the PC substrate layer is matched with the bonding layer, so that the PC substrate layer is conveniently bonded with other layers, and the packaging of the battery string is realized; and all the laminated layers of the PC composite board are connected into a whole, so that the PC composite board can be directly used as a front board and a back board of a packaging board.

In one possible implementation, the thickness of the silicone glass resin layer is 0.01mm to 1mm, and the light transmittance of the silicone glass resin layer is greater than 70%.

In the implementation process, the organic silicon glass resin layer is high in transmittance and strength, resistant to ultraviolet irradiation and good in protection effect on the PC substrate layer.

In one possible implementation, the thickness of the PC substrate layer is 1mm-10mm, and the light transmittance of the PC substrate layer is greater than 70%.

In the implementation process, the substrate layer with a certain thickness has high strength and high light transmittance.

In one possible implementation, the material of the adhesive layer is EVA (ethylene-vinyl acetate copolymer), POE (Polyolefin elastomer), PVB (polyvinyl butyral), epoxy resin or polyurethane; the thickness of the bonding layer is 0.1mm-2 mm.

In a second aspect, the embodiment of the application provides a solar module, it is including front bezel, front side encapsulation glued membrane, battery cluster, back side encapsulation glued membrane and the backplate that superposes in proper order and sets up, and the backplate adopts or front bezel and backplate all adopt the PC composite sheet that the first aspect provided, and the organic silicon glass resin layer of front bezel and backplate all is located outmost.

In the implementation process, the PC composite board is used as a packaging board of the solar module, and the module is high in overall mechanical strength, light in weight and low in cost.

In one possible implementation, the adhesive layer of the front plate is a light-transmitting adhesive layer, and the light transmittance of the light-transmitting adhesive layer is greater than 70%.

In the implementation process, the bonding layer of the front plate is a light-transmitting bonding layer, the light transmittance is greater than 70%, and the light transmittance of the PC composite plate serving as the front plate is higher, so that power generation is realized.

In one possible implementation, the adhesive layer of the back plate is a light-transmitting adhesive layer, and the light transmittance of the light-transmitting adhesive layer is greater than 70%.

In the implementation process, the bonding layer of the back plate is a light-transmitting bonding layer, the light transmittance is greater than 70%, and the light transmittance of the PC composite plate serving as the back plate is higher, so that double-sided power generation is realized.

In one possible implementation, the adhesive layer of the backplate is a light-tight adhesive layer having a reflectivity of greater than 70%.

In the implementation process, the back plate is light-tight and has high reflectivity, so that sunlight directly irradiating the front surface of the assembly is reflected, and the sunlight absorption rate is improved.

In a possible implementation manner, the material of the front side packaging adhesive film is one of EVA, POE, PVB and transparent silica gel, and the thickness of the front side packaging adhesive film is 0.2mm-1.5 mm; and/or the back packaging adhesive film is made of one of EVA, POE, PVB and transparent silica gel, and the thickness of the back packaging adhesive film is 0.2mm-1.5 mm.

In the implementation process, the front side packaging adhesive film and the back side packaging adhesive film are good in transparency, double-side power generation is easy to achieve, and bonding and packaging of the assembly can be achieved.

In a possible implementation manner, the laminated glass further comprises a frame surrounding all the laminated edges, and the frame is made of aluminum, steel, glass fiber reinforced polyurethane or glass fiber reinforced polycarbonate.

In the implementation process, the frames fix the laminated layers together, the overall strength can be increased, and the edge collision damage is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a PC composite board according to a first embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a PC composite board according to a second embodiment of the present application;

fig. 3 is a schematic structural diagram of a solar module according to a third embodiment of the present application;

fig. 4 is a schematic structural diagram of a solar module according to a fourth embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a solar module according to a fifth embodiment of the present application.

Icon: 100-PC composite board; 110-a silicone glass resin layer; 120-PC substrate layer; 130-light-transmitting adhesive layer; 200-PC composite board; 210-a light-transmissive adhesive layer; 300-a solar module; 310-front side packaging adhesive film; 320-a battery string; 321-solder strip; 330-back packaging adhesive film; 400-a solar module; 500-a solar module; 510-frame.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

First embodiment

Referring to fig. 1, the PC composite board 100 provided in this embodiment includes an organic silicon glass resin layer 110, a PC substrate layer 120, and an adhesive layer, which are sequentially stacked and connected together from top to bottom. As a whole, the PC composite board 100 is composed of three layers, the first layer is the organic silicon glass resin layer 110, the second PC substrate layer 120, and the third layer is an adhesive layer, and the three layers are integrated, for example, manufactured by co-extrusion process and extrusion production.

In the embodiment of the present application, the thickness of the silicone glass resin layer 110 is generally 0.01mm to 1mm, and the light transmittance of the silicone glass resin layer 110 is greater than 70%, and usually the light transmittance is greater than 90%. In this embodiment, the silicone glass resin layer 110 is a silicone glass resin layer with a thickness of 0.2mm, and the light transmittance is greater than 91%.

In the embodiment of the present application, the PC substrate layer 120 refers to a plate material, the main component of the plate material is PC, the thickness of the PC substrate layer 120 is generally 1mm-10mm, and the light transmittance of the PC substrate layer 120 is greater than 70%. In this embodiment, the thickness of the PC substrate layer 120 is 2mm, and the light transmittance is greater than 91.5%.

In the embodiment of the application, the bonding layer is a hot-melt bonding layer, that is, the hot-melt bonding layer is melted after hot pressing and bonds with other adjacent laminates, or the bonding layer is a thermosetting bonding layer, that is, the bonding layer is cross-linked and cured to bond with other adjacent laminates, and in general, the bonding layer is made of EVA, POE, PVB, epoxy resin or polyurethane; the thickness of the bonding layer is 0.1mm-2 mm. In this embodiment, the adhesive layer is made of EVA and has a thickness of 0.2mm, the adhesive layer is the light-transmitting adhesive layer 130, and the light transmittance of the light-transmitting adhesive layer 130 is greater than 70%.

In the embodiment of the present application, UV stabilizers may be added to both the PC substrate layer 120 on the second layer and the bonding layer on the third layer of the PC composite board 100, and the UV stabilizers are one or more of benzophenones, hindered amines, benzotriazoles, substituted acrylonitriles, and triazines. In this embodiment, a UV stabilizer of a benzophenone and hindered amine composite system is added to the PC substrate layer 120 of the PC composite board 100.

In the embodiment of the present disclosure, a silane coupling agent may be added into the adhesive layer of the third layer of the PC composite board 100 to bond with other adhesive layers (e.g., an encapsulant film), where the silane coupling agent is one or two of vinyltriethoxysilane, methyltrimethoxysilane, and dodecyltrimethoxysilane. In this embodiment, vinyltriethoxysilane is added to the adhesive layer of the PC composite board 100.

In this embodiment, a cross-linking agent may be further added into the third adhesive layer of the PC composite board 100 to bond with other adhesive layers (e.g., a packaging adhesive film), where the cross-linking agent is one or two of dicumyl peroxide, benzoyl peroxide, dicumyl peroxide, and di-tert-butyl peroxide. In this embodiment, di-tert-butyl peroxide is added to the adhesive layer of the PC composite board 100.

Second embodiment

Referring to fig. 2, the present embodiment provides a PC composite board 200, which has a structure substantially the same as that of the first embodiment, except that: the adhesive layer is an opaque adhesive layer 210, and the opaque adhesive layer 210 may be configured to be white, black, other colors, or a mixture of colors, and the reflectivity of the opaque adhesive layer 210 is greater than 70% (in the case of an incident angle of approximately 90 °). Specifically, the opaque adhesive layer 210 is a white layer having a reflectivity greater than 80%.

Third embodiment

Referring to fig. 3, the present embodiment provides a solar module 300, which includes a front board, a front side encapsulant film 310, a battery string 320, a back side encapsulant film 330, and a back board, which are sequentially stacked, wherein the front board and the back board are both made of the PC composite board 100 of the first embodiment, and the organic silicon glass resin layers 110 of the front board and the back board are both located at the outermost layer. In other embodiments, the PC composite board 100 of the first embodiment may also be employed with only the backplane.

In the embodiment of the present application, the front board and the rear board may be the same or different, and the material and the thickness of each same functional layer may be the same or different: the silicone glass resin layer 110 of the front plate may be the same as or different from the silicone glass resin layer 110 of the back plate in material and thickness; the PC substrate board of the front plate can be the same as or different from the PC substrate board of the back plate; the adhesive layer of the front plate may be the same as or different from the adhesive layer of the back plate. In this embodiment, the PC composite board 100 of the front board and the back board is the same, that is, the front board and the back board are transparent layers, that is, the organic silicon glass resin layer 110, the PC substrate layer 120 and the bonding layer all have higher light transmittance, and the formed solar module 300 can realize double-sided power generation. Specifically, the solar module 300 includes a silicone glass resin layer 110, a PC substrate layer 120, a light-transmitting adhesive layer 130 (front panel), a packaging adhesive film, a battery string 320, a packaging adhesive film, a light-transmitting adhesive layer 130, a PC substrate layer 120, and a silicone glass resin layer 110 (back panel) which are sequentially stacked.

In the embodiment of the present application, the battery string 320 is formed by a plurality of battery pieces which are arranged at intervals and electrically connected, and the battery pieces may be 1/2 slices, 1/3 slices or 1/4 slices, in this embodiment, 1/2 slices. In this embodiment, the surface of the battery string 320 is further provided with solder strips 321, specifically, the solder strips 321 are respectively disposed on the front and the back of the battery dies, so as to realize the electrical connection between the battery dies.

In the embodiment of the present application, the packaging adhesive film is a hot-melt adhesive film, which is melted after hot pressing and flows to wrap the battery string 320 and bond the adjacent other stacked layers, or the adhesive layer is a thermosetting adhesive layer, which is cross-linked and cured to bond the adjacent other stacked layers. Generally, the front side encapsulant film 310 is made of one of EVA, POE, PVB, and transparent silica gel, and the thickness of the front side encapsulant film 310 is 0.2mm to 1.5 mm. The back side packaging adhesive film 330 is made of one of EVA, POE, PVB and transparent silica gel, and the thickness of the back side packaging adhesive film 330 is 0.2mm-1.5 mm. In this embodiment, the front side packaging adhesive film 310 is an EVA adhesive film with a thickness of 0.5 mm; the backside packaging film 330 is a POE film with a thickness of 0.5 mm. In other embodiments, the front-side encapsulant film 310 and the back-side encapsulant film 330 are the same material as the adjacent adhesive layer, so as to facilitate direct bonding therebetween.

Fourth embodiment

Referring to fig. 4, the embodiment provides a solar module 400, which includes a front board, a front side encapsulant film 310, a battery string 320, a back side encapsulant film 330, and a back board, which are sequentially stacked, wherein the front board is the PC composite board 100 of the first embodiment, the back board is the PC composite board 200 of the second embodiment, the organic silicon glass resin layers 110 of the front board and the back board are both located at the outermost layers, and the solar module 400 realizes front side single-side power generation. Specifically, the solar module 400 includes the organic silicon glass resin layer 110, the PC substrate layer 120, the transparent adhesive layer 130 (front panel), the front-side packaging adhesive film 310, the battery string 320, the back-side packaging adhesive film 330, the opaque adhesive layer 210, the PC substrate layer 120, and the organic silicon glass resin layer 110 (back panel) which are sequentially stacked.

Fifth embodiment

Referring to fig. 5, the present embodiment provides a solar module 500, which has substantially the same structure as the third embodiment, and includes a front board, a front-side packaging adhesive film 310, a battery string 320, a back-side packaging adhesive film 330 and a back board, which are sequentially stacked, except that: in the embodiment of the present application, the solar module 300 further includes a frame 510 surrounding all the edges of the stacked layers, which does not cover the upper surface and the lower surface of the stacked layers, so as to reduce the shielding of the cell strings. The frame 510 is made of aluminum, steel, glass fiber reinforced polyurethane, or glass fiber reinforced polycarbonate, and specifically, the frame 510 is an aluminum frame.

In summary, the PC composite board of the embodiment of the present application is used as a packaging board of a solar module, and has high mechanical strength, light weight, and low cost.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. The utility model provides a PC composite sheet which characterized in that, it includes from top to bottom superposes in proper order and sets up and link into an integrated organic silicon glass resin layer, PC substrate layer and adhesive linkage, the luminousness of organic silicon glass resin layer is greater than 70%.

2. The PC composite board of claim 1, wherein the thickness of the organosilicone glass resin layer is 0.01mm to 1 mm.

3. The PC composite board according to claim 1, wherein the thickness of the PC substrate layer is 1mm-10mm, and the light transmittance of the PC substrate layer is greater than 70%.

4. The PC composite board according to claim 1, wherein the adhesive layer is made of EVA, POE, PVB, epoxy resin or polyurethane; the thickness of the bonding layer is 0.1mm-2 mm.

5. A solar module is characterized by comprising a front plate, a front packaging adhesive film, a battery string, a back packaging adhesive film and a back plate which are sequentially stacked, wherein the back plate is made of the PC composite board as claimed in any one of claims 1 to 4 or the front plate and the back plate are made of the PC composite board, and the organic silicon glass resin layers of the front plate and the back plate are positioned on the outermost layer.

6. The solar module of claim 5 wherein the adhesive layer of the front sheet is a light-transmissive adhesive layer having a light transmittance of greater than 70%.

7. The solar module of claim 5 wherein the adhesive layer of the backsheet is a light transmissive adhesive layer having a light transmittance of greater than 70%.

8. The solar module of claim 5 wherein the adhesive layer of the backsheet is an opaque adhesive layer having a reflectivity of greater than 70%.

9. The solar module according to claim 5, wherein the front side encapsulant film is made of one of EVA, POE, PVB and transparent silica gel, and the thickness of the front side encapsulant film is 0.2mm to 1.5 mm; and/or the back packaging adhesive film is made of one of EVA (ethylene vinyl acetate), POE (polyolefin elastomer), PVB (polyvinyl butyral) and transparent silica gel, and the thickness of the back packaging adhesive film is 0.2mm-1.5 mm.

10. The solar module of claim 5, further comprising a frame surrounding all edges of the laminate, wherein the frame is made of aluminum, steel, fiberglass-reinforced polyurethane, or fiberglass-reinforced polycarbonate.