CN215969954U - Circulating cooling device for injection molding of mold - Google Patents
Circulating cooling device for injection molding of mold Download PDFInfo
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- CN215969954U CN215969954U CN202121925269.2U CN202121925269U CN215969954U CN 215969954 U CN215969954 U CN 215969954U CN 202121925269 U CN202121925269 U CN 202121925269U CN 215969954 U CN215969954 U CN 215969954U
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- heat exchange
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- exchange box
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Abstract
本实用新型公开了一种用于模具注塑的循环冷却装置，包括底座和模具定模，所述底座的上方分别设有储水箱、热交换箱和冷却箱，所述冷却箱的左右两侧面分别与储水箱和热交换箱相互靠近的一侧面固定连接，所述储水箱的上表面固定安装有循环泵，所述循环泵的输入端固定连通有供水管，所述供水管远离循环泵的一端与储水箱的右侧面固定连通。本实用新型设计结构合理，它通过热交换箱的右侧设置冷却箱，利用冷却箱顶部设置的半导体制冷片为冷却箱进行供冷，便于进行热交换后的循环水进行冷却，经过冷却箱冷却后的循环水通过储水箱内的喷头喷出，从而再次起到降温的效果，解决了冷却液在不断循环使用的时候，将会使冷却液的水温不断升高的问题。
The utility model discloses a circulating cooling device for mold injection molding, which comprises a base and a fixed mold of a mold. A water storage tank, a heat exchange box and a cooling box are respectively arranged above the base, and the left and right sides of the cooling box are respectively provided with It is fixedly connected with the side of the water storage tank and the heat exchange box that are close to each other. A circulating pump is fixedly installed on the upper surface of the water storage tank. It is fixedly connected to the right side of the water storage tank. The utility model has a reasonable design and structure. A cooling box is arranged on the right side of the heat exchange box, and the semiconductor refrigerating sheet arranged on the top of the cooling box is used for cooling the cooling box, so that the circulating water after heat exchange is convenient to be cooled, and the cooling box is cooled. The circulating water is sprayed out through the nozzles in the water storage tank, so as to play a cooling effect again, which solves the problem that the water temperature of the cooling liquid will continue to rise when the cooling liquid is continuously circulated.
Description
Technical Field
The utility model relates to the technical field of injection molds, in particular to a circulating cooling device for mold injection.
Background
The injection mold is a tool for producing plastic products and also a tool for endowing the plastic products with complete structures and accurate dimensions, and the injection molding is a processing method used for batch production of parts with complex shapes, in particular to a method for injecting heated and melted plastics into a mold cavity from an injection molding machine at high pressure and obtaining a formed product after cooling and solidification.
At present when utilizing the mould to mould plastics the production part, generally all can utilize circulative cooling device to come the cooling of the casting liquid of die cavity inside with higher speed and take shape to improve the production efficiency of enterprise, current circulative cooling device is at the in-process that uses, generally all sets up the cooling tube in the inside of cover half, then utilize the water pump to let in the cooling tube with the coolant liquid, and then form cooling cycle, but when the coolant liquid gets into inside the cover half, will absorb a large amount of heats, consequently when the coolant liquid is in continuous used cyclically, will make the temperature of coolant liquid constantly rise, influence the cooling effect, for this reason, we propose a circulative cooling device for mould moulds plastics.
SUMMERY OF THE UTILITY MODEL
One) technical problem to be solved
The utility model aims to make up the defects of the prior art and provides a circulating cooling device for injection molding of a mold.
II) technical scheme
In order to achieve the purpose, the utility model provides the following technical scheme: a circulating cooling device for injection molding of a mold comprises a base and a fixed mold of the mold, wherein a water storage tank, a heat exchange tank and a cooling tank are respectively arranged above the base, the left and right side surfaces of the cooling box are respectively fixedly connected with one side surface of the water storage box and one side surface of the heat exchange box which are close to each other, the upper surface of the water storage tank is fixedly provided with a circulating pump, the input end of the circulating pump is fixedly communicated with a water supply pipe, one end of the water supply pipe, which is far away from the circulating pump, is fixedly communicated with the right side surface of the water storage tank, a spiral pipe is arranged inside the heat exchange tank, the top end of the spiral pipe penetrates through the heat exchange box and extends to the outside of the heat exchange box, the right end of the spiral pipe sequentially penetrates through the heat exchange box and the cooling box and extends to the inside of the water storage box, the right end of the spiral pipe is fixedly communicated with a spray head, and the upper surface of the cooling box is fixedly provided with a semiconductor refrigeration piece.
Further, the inside of mould cover half is fixed to be inlayed and is had cooling coil, cooling coil's input and the fixed intercommunication of the output of circulating pump, cooling coil's output and the fixed intercommunication in top of spiral pipe.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould is moulded plastics can utilize the circulating pump to carry out circulative cooling to the circulating water.
Furthermore, the cold junction of semiconductor refrigeration piece runs through the cooler bin and extends to the inside of cooler bin, the hot junction fixed mounting of semiconductor refrigeration piece has the heat dissipation fan.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould injection moulding can play the effect of cooling down to the semiconductor refrigeration piece cold junction.
Further, the front fixed mounting of cooler bin has control panel, the front fixed mounting of heat exchange box has the controller, control panel passes through the wire and is connected with the controller electricity, the controller passes through the wire respectively with circulating pump, semiconductor refrigeration piece and heat dissipation fan electricity be connected.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould is moulded plastics can conveniently control circulative cooling device.
Furthermore, the left side surface of the heat exchange box is fixedly communicated with a water inlet valve through a pipeline, the left side surface of the heat exchange box is fixedly communicated with a faucet through a pipeline, a liquid level sensor is fixedly mounted inside the heat exchange box, and a liquid level window is arranged on the front surface of the water storage tank.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould is moulded plastics can the inside water level of real-time supervision heat exchange box, be convenient for in time supply heat exchange water.
Furthermore, the bottom surface of the heat exchange box and the bottom surface of the water storage tank are fixedly connected with the upper surface of the base, and two groups of symmetrical supporting legs are fixedly connected with the bottom surface of the base.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould injection moulding can play the effect of support.
III) beneficial effects
Compared with the prior art, this kind of a circulative cooling device for mould is moulded plastics possesses following beneficial effect:
firstly, the method comprises the following steps: according to the utility model, circulating water of the cooling coil in the fixed die of the die is introduced into the heat exchange box, the spiral pipe is arranged in the heat exchange box for heat exchange, so that the effect of primarily cooling water is achieved, on the other hand, water in the heat exchange box can be heated by using waste heat, and the water can be used for domestic warm water through the faucet.
Secondly, the method comprises the following steps: according to the utility model, the cooling box is arranged on the right side of the heat exchange box, the semiconductor refrigeration sheet arranged on the top of the cooling box is used for cooling the cooling box, so that circulating water subjected to heat exchange can be cooled conveniently, the circulating water cooled by the cooling box is sprayed out through the spray head in the water storage tank, the cooling effect is achieved again, and the problem that when the cooling liquid is continuously recycled, the temperature of the cooling liquid is continuously increased, and the cooling effect is influenced is solved.
Drawings
FIG. 1 is a schematic perspective view of a hydronic apparatus according to the present invention;
FIG. 2 is a front cross-sectional view of the cooling box of the present invention;
fig. 3 is a schematic view of the installation structure of the cooling coil of the present invention.
In the figure: 1. a base; 2. a water storage tank; 3. a liquid level window; 4. a water supply pipe; 5. a circulation pump; 6. a cooling coil; 7. a semiconductor refrigeration sheet; 8. a control panel; 9. a cooling tank; 10. supporting legs; 11. a faucet; 12. a controller; 13. a water inlet valve; 14. a heat exchange box; 15. a heat dissipation fan; 16. a spray head; 17. a spiral tube; 18. a liquid level sensor; 19. and (5) fixing the die.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, the present invention provides a technical solution: a circulating cooling device for injection molding of a mold comprises a base 1 and a fixed mold 19 of the mold, a water storage tank 2 is respectively arranged above the base 1, heat exchange box 14 and cooler bin 9, cooler bin 9's the left and right sides face respectively with storage water tank 2 and the mutual side fixed connection who is close to of heat exchange box 14, storage water tank 2's last fixed surface installs circulating pump 5, the fixed intercommunication of input of circulating pump 5 has delivery pipe 4, the one end that circulating pump 5 was kept away from to delivery pipe 4 and storage water tank 2's the fixed intercommunication of right flank, heat exchange box 14's inside is equipped with spiral pipe 17, spiral pipe 17's top is run through heat exchange box 14 and is extended to heat exchange box 14's outside, spiral pipe 17's right-hand member runs through heat exchange box 14 and cooler bin 9 in proper order and extends to storage water tank 2's inside, the fixed intercommunication of spiral pipe 17's right-hand member has shower nozzle 16, cooler bin 9's last fixed surface installs refrigeration piece 7.
Further, the inside of mould cover half 19 is fixed to be inlayed and is had cooling coil 6, and cooling coil 6's input and circulating pump 5's output are fixed to be linked together, and cooling coil 6's output and the fixed intercommunication in top of spiral pipe 17.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould injection molding can utilize circulating pump 5 to carry out circulative cooling to the circulating water.
Further, the cold end of the semiconductor refrigeration piece 7 penetrates through the cooling box 9 and extends to the inside of the cooling box 9, and the hot end of the semiconductor refrigeration piece 7 is fixedly provided with a heat dissipation fan 15.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould injection moulding can play and carry out the effect of cooling to 7 cold junctions of semiconductor refrigeration piece.
Further, a control panel 8 is fixedly mounted on the front surface of the cooling box 9, a controller 12 is fixedly mounted on the front surface of the heat exchange box 14, the control panel 8 is electrically connected with the controller 12 through a wire, and the controller 12 is electrically connected with the circulating pump 5, the semiconductor refrigeration sheet 7 and the heat dissipation fan 15 through wires respectively.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould is moulded plastics can conveniently control circulative cooling device.
Furthermore, the left side surface of the heat exchange box 14 is fixedly communicated with a water inlet valve 13 through a pipeline, the left side surface of the heat exchange box 14 is fixedly communicated with a water tap 11 through a pipeline, a liquid level sensor 18 is fixedly arranged in the heat exchange box 14, and the front surface of the water storage tank 2 is provided with a liquid level window 3.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould is moulded plastics can the inside water level of real-time supervision heat exchange box 14, be convenient for in time supply heat exchange water.
Furthermore, the bottom surface of the heat exchange box 14 and the bottom surface of the water storage tank 2 are both fixedly connected with the upper surface of the base 1, and two sets of symmetrical supporting legs 10 are fixedly connected with the bottom surface of the base 1.
Through adopting above-mentioned technical scheme, make a circulative cooling device for mould injection moulding can play the effect of support.
The working principle is as follows: when the cooling device is used, the cooling coil 6 is arranged in the fixed die 19 of the die at first, then the cooling coil 6 is communicated with the circulating pump 5 and the spiral pipe 17 of the circulating cooling device, the power supply and the water inlet valve 13 of the device are switched on, the circulating cooling device is started, the circulating pump 5 pumps water in the water storage tank 2 through the water supply pipe 4 to circulate, circulating water circulating out of the fixed die 19 of the die is introduced into the heat exchange tank 14, the spiral pipe 17 is arranged in the heat exchange tank 14 to exchange heat, the semiconductor refrigerating sheet 7 arranged at the top of the cooling tank 9 is used for supplying cold for the cooling tank 9, circulating water after heat exchange is convenient to cool, circulating water after being cooled by the cooling tank 9 is sprayed out through the spray head 16 in the water storage tank 2, and the effect of cooling is achieved again.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121925269.2U CN215969954U (en) | 2021-08-17 | 2021-08-17 | Circulating cooling device for injection molding of mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121925269.2U CN215969954U (en) | 2021-08-17 | 2021-08-17 | Circulating cooling device for injection molding of mold |
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| Publication Number | Publication Date |
|---|---|
| CN215969954U true CN215969954U (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121925269.2U Expired - Fee Related CN215969954U (en) | 2021-08-17 | 2021-08-17 | Circulating cooling device for injection molding of mold |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116847634A (en) * | 2023-07-21 | 2023-10-03 | 中国石油大学(华东) | A big data analysis power transaction processing device and an intelligent analysis method for settlement document data |
-
2021
- 2021-08-17 CN CN202121925269.2U patent/CN215969954U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116847634A (en) * | 2023-07-21 | 2023-10-03 | 中国石油大学(华东) | A big data analysis power transaction processing device and an intelligent analysis method for settlement document data |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220308 |
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| CF01 | Termination of patent right due to non-payment of annual fee |