CN215952332U - Multi-layer copper powder layer structure for heat dissipation - Google Patents
Multi-layer copper powder layer structure for heat dissipation Download PDFInfo
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- CN215952332U CN215952332U CN202121702747.3U CN202121702747U CN215952332U CN 215952332 U CN215952332 U CN 215952332U CN 202121702747 U CN202121702747 U CN 202121702747U CN 215952332 U CN215952332 U CN 215952332U
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Abstract
The utility model discloses a multilayer copper powder layer structure for heat dissipation, which relates to the field of heat dissipation materials and comprises a base plate, wherein a copper powder layer is sprayed on the upper side of the base plate and consists of a plurality of copper particles, a copper alloy layer is sprayed on the upper side of the copper powder layer and consists of a plurality of copper alloy particles, the copper powder layer is arranged, the copper particles in the copper powder layer can quickly discharge the heat on the base plate, the heat dissipation efficiency of the base plate is improved, the volume of the copper particles is 1.0cm 3-1.5 cm3, the volume of the copper particles is small and exquisite, the copper particles can be sprayed on the base plate and do not occupy a large amount of space, the copper alloy particles are copper-silver alloy, the heat dissipation efficiency is further improved, the volume of the copper-copper alloy particles is 0.5cm 3-0.8 cm3, the surfaces of the copper particles and the copper alloy particles are rough, the contact area with the external air can be increased, and the heat can be quickly discharged, the heat dissipation efficiency is improved.
Description
Technical Field
The utility model relates to the field of heat dissipation materials, in particular to a multi-layer copper powder layer structure for heat dissipation.
Background
Copper is the electronics industry, the important former material of machine-building industry and automotive industry, in the electronics industry field, the general application of copper material is in radiating field, copper coefficient of heat conductivity is 401(W/m.K), can pass through copper discharge with the too high heat of electronic components, improve electronic components's life, but the space in the electronic components is comparatively narrow and small, can increase the volume of electron and device through the copper billet heat dissipation, and the heat conduction efficiency of simple copper material is lower, can not be fine with electronic components's heat discharge.
Accordingly, those skilled in the art have provided a multi-layer copper powder layer structure for heat dissipation to solve the above problems of the background art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a multilayer copper powder layer structure for heat dissipation, which can improve the heat dissipation efficiency through a copper alloy layer without increasing the volume of an electronic component through the arranged copper powder.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a be used for radiating multilayer copper powder layer structure, includes the base plate, the upside spraying of base plate has the copper powder layer, and the copper powder layer comprises a plurality of copper granules, and the upside spraying of copper powder layer has the copper alloy layer, and the copper alloy layer comprises a plurality of copper alloy granules.
In a still further aspect of the present invention, the copper powder layer and the copper alloy layer have irregular particle compositions.
As a further proposal of the utility model, the volume of the copper particles is between 1.0cm3 and 1.5cm3, and the surface of the copper particles is rough and honeycomb-shaped.
As a still further scheme of the utility model, the volume of the copper-copper alloy particles is 0.5cm 3-0.8 cm3, and the surfaces of the copper alloy particles are rough and are not provided with holes and gaps.
In a still further aspect of the present invention, the copper powder layer has a thickness of 0.1mm to 0.2mm and a tap density of 1.5 to 1.8g/cm 3.
In a still further aspect of the present invention, the copper alloy layer has a thickness of 0.15mm to 0.27mm and a tap density of 1.43 to 1.90g/cm 3.
Compared with the prior art, the utility model has the beneficial effects that:
1. through being provided with the copper powder layer, the inside copper particle of copper powder layer can discharge the heat on the basic board fast, improves the radiating efficiency of basic board, and the copper particle volume is at 1.0cm 3-1.5 cm3, and the copper particle volume is comparatively small and exquisite, can spray on the basic board, can not occupy a large amount of spaces.
2. Through being provided with the copper alloy granule, the copper alloy granule is the copper-silver alloy, has further improved radiating efficiency, and the volume of copper-copper alloy granule is at 0.5cm 3-0.8 cm3, and copper granule and copper alloy granule surface are the rugosity, can increase with outside air's area of contact, can be quick discharge the heat, improve the radiating efficiency.
Drawings
Fig. 1 is a schematic structural view of a multilayer copper powder layer structure for heat dissipation.
In the figure: 1. a base plate; 2. a copper powder layer; 201. copper particles; 3. a copper alloy layer; 301. copper alloy particles.
Detailed Description
Referring to fig. 1-1, in an embodiment of the utility model, a multi-layer copper powder layer structure for heat dissipation includes a substrate 1, a copper powder layer 2 is sprayed on an upper side of the substrate 1, the copper powder layer 2 is composed of a plurality of copper particles 201, a copper alloy layer 3 is sprayed on an upper side of the copper powder layer 2, and the copper alloy layer 3 is composed of a plurality of copper alloy particles 301.
As shown in figure 1, the copper powder layer 2 and the copper alloy layer 3 are irregular particle compositions, the volume of the copper particle 201 is 1.0cm 3-1.5 cm3, the surface of the copper particle 201 is rough and honeycomb-shaped, the volume of the copper alloy particle 301 is 0.5cm 3-0.8 cm3, the surface of the copper alloy particle 301 is rough and has no holes or gaps, the thickness of the copper powder layer 2 is 0.1 mm-0.2 mm, the tap density is 1.5-1.8 g/cm3, the thickness of the copper alloy layer 3 is 0.15 mm-0.27 mm, and the tap density is 1.43-1.90 g/cm 3.
The first embodiment is as follows: the copper alloy particle 301 is produced by dispersing copper powder as a core material in water, adding a chelating agent, adding a silver salt soluble in water to perform a substitution reaction, substituting the surface layer of the copper powder particle with silver, taking the obtained silver-coated copper powder out of the solution, washing the silver-coated copper powder with the chelating agent, and drying the washed copper alloy particle 301.
The copper particles 201 are produced by immersing an anode and a cathode in a sulfuric acid-based electrolyte containing copper ions, electrolyzing the electrolyte by passing a direct current therethrough to deposit copper as a powder on the surface of the cathode, scraping the powder by mechanical or electrical means, recovering the powder, washing the powder, drying the powder, and optionally subjecting the powder to a sieving step or the like.
The working principle of the utility model is as follows: the copper powder layer 2 is uniformly sprayed on the base plate 1 through spraying equipment, heat on the base plate 1 can be quickly discharged through the copper particles 201 in the copper powder layer 2, the heat dissipation efficiency of the base plate 1 is improved, the volume of the copper particles 201 is 1.0cm 3-1.5 cm3, the volume of the copper particles 201 is small, the copper particles 201 can be sprayed on the base plate 1, and a large amount of space cannot be occupied; the copper alloy layer 3 is sprayed on the copper powder layer 2, the copper alloy particles 301 are copper-silver alloy, the heat dissipation efficiency is further improved, the surfaces of the copper particles 201 and the copper alloy particles 301 are rough, the contact area with the outside air can be increased, heat can be rapidly discharged, and the heat dissipation efficiency is improved; this embodiment has solved through the volume that the copper billet heat dissipation can increase electron and device, and the heat conduction efficiency of simple copper material is lower, can not be fine with electronic components's heat exhaust problem.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to or changed within the scope of the present invention.
Claims (6)
1. A multilayer copper powder layer structure for heat dissipation comprises a base plate (1), and is characterized in that: the copper powder layer (2) is sprayed on the upper side of the base plate (1), the copper powder layer (2) is composed of a plurality of copper particles (201), a copper alloy layer (3) is sprayed on the upper side of the copper powder layer (2), and the copper alloy layer (3) is composed of a plurality of copper alloy particles (301).
2. The structure of multilayer copper powder layers for heat dissipation according to claim 1, characterized in that the copper powder layers (2) and the copper alloy layers (3) are of irregular grain composition.
3. The structure of claim 1, wherein the volume of the copper particles (201) is in the range of 1.0cm 3-1.5 cm3, and the surface of the copper particles (201) is rough and cellular.
4. The structure of claim 1, wherein the volume of said copper alloy particles (301) is in the range of 0.5cm 3-0.8 cm3, and wherein the surface of said copper alloy particles (301) is rough and free of voids and seams.
5. The structure of multilayer copper powder layers for heat dissipation according to claim 1, characterized in that the thickness of the copper powder layer (2) is between 0.1mm and 0.2mm and the tap density is between 1.5 and 1.8g/cm 3.
6. The multilayer copper powder layer structure for heat dissipation according to claim 1, wherein the copper alloy layer (3) has a thickness of 0.15mm to 0.27mm and a tap density of 1.43 to 1.90g/cm 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121702747.3U CN215952332U (en) | 2021-07-26 | 2021-07-26 | Multi-layer copper powder layer structure for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121702747.3U CN215952332U (en) | 2021-07-26 | 2021-07-26 | Multi-layer copper powder layer structure for heat dissipation |
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| Publication Number | Publication Date |
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| CN215952332U true CN215952332U (en) | 2022-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121702747.3U Active CN215952332U (en) | 2021-07-26 | 2021-07-26 | Multi-layer copper powder layer structure for heat dissipation |
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| CN (1) | CN215952332U (en) |
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2021
- 2021-07-26 CN CN202121702747.3U patent/CN215952332U/en active Active
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