CN215951616U - Large-capacity dehumidifying device - Google Patents
Large-capacity dehumidifying device Download PDFInfo
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- CN215951616U CN215951616U CN202122466917.9U CN202122466917U CN215951616U CN 215951616 U CN215951616 U CN 215951616U CN 202122466917 U CN202122466917 U CN 202122466917U CN 215951616 U CN215951616 U CN 215951616U
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Abstract
The utility model discloses a large-capacity dehumidifying device which comprises a ventilating hood, a dehumidifying mechanism and a water receiving box, wherein the ventilating hood is provided with a plurality of air inlets and a plurality of air outlets, the air inlets are uniformly distributed around the side wall of the ventilating hood, and the air outlets are positioned at the top of the ventilating hood; the dehumidifying mechanism comprises an air guide shell, a heat dissipation component, a condensation component and a semiconductor refrigerating device, wherein the heat dissipation component is arranged inside the air guide shell, the condensation component is arranged outside the air guide shell, and the semiconductor refrigerating device is arranged between the heat dissipation component and the condensation component; the hollow wind guide channel is arranged in the wind guide shell, the inlet of the wind guide channel is positioned at the bottom of the wind guide shell, the outlet of the wind guide channel is positioned at the top of the wind guide shell, and the outlet area of the wind guide channel is larger than the inlet area of the wind guide channel. The large-capacity dehumidifier provided by the technical scheme can effectively increase the dehumidification capacity of the dehumidifier, is convenient to cover the dehumidification capacity range which cannot be covered by the existing dehumidifier product, and is simple and reasonable in structure and convenient and quick to install.
Description
Technical Field
The utility model relates to the technical field of dehumidification devices, in particular to a high-capacity dehumidification device.
Background
The dehumidifier is also called as a dehumidifier, a dryer and a dehumidifier, is widely applied to the occasions sensitive to humidity, and covers the industrial field and the civil field, wherein the dehumidifier comprises various production workshops, process manufacturing and laboratory application, and the dehumidifier comprises planting and breeding, household dehumidification and the like.
The principle of dehumidification is that excess water vapor in the air is condensed into water by a dehumidifier so as to reduce the moisture content of the air and meet the requirement. Currently, two common methods of dehumidification are used: the first is physical adsorption dehumidification, and the first is electronic refrigeration dehumidification. Physical adsorption dehumidification is to absorb water molecules in air by using a chemical absorbent or a drying agent so as to achieve the purpose of reducing air humidity, and the dehumidification fails due to moisture absorption or chemical reaction after being used for a period of time. Compared with the prior art, the electronic refrigeration and dehumidification has obvious advantages of good dehumidification effect, large dehumidification amount and long-term use.
At present, electronic refrigeration dehumidifier products on the market are generally divided into a semiconductor refrigeration dehumidifier and a compressor refrigeration dehumidifier, under standard working conditions (the ambient temperature is 30 ℃ and the ambient humidity is 80%), the maximum dehumidification capacity of the semiconductor refrigeration dehumidifier is about 800 ml/day, the minimum dehumidification capacity of the compressor refrigeration dehumidifier is about 4000 ml/day, and a proper dehumidifier product which can cover the dehumidification capacity interval of 800-4000 ml/day does not appear on the market.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-capacity dehumidifier which can effectively increase the dehumidification capacity of the dehumidifier, is convenient to cover the dehumidification capacity range which cannot be covered by the existing dehumidifier products, has a simple and reasonable structure, is convenient and quick to install, and overcomes the defects in the prior art.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a large-capacity dehumidification device comprises a ventilation hood, a dehumidification mechanism and a water receiving box, wherein a cavity for mounting the dehumidification mechanism is defined by the ventilation hood and the water receiving box;
the ventilation hood is provided with a plurality of air inlets and a plurality of air outlets, the air inlets are uniformly distributed around the side wall of the ventilation hood, and the air outlets are positioned at the top of the ventilation hood;
the dehumidifying mechanism comprises an air guide shell, a heat dissipation component, a condensation component and a semiconductor refrigerating device, wherein the heat dissipation component is arranged inside the air guide shell, the condensation component is arranged outside the air guide shell, the semiconductor refrigerating device is arranged between the heat dissipation component and the condensation component, the hot end face of the semiconductor refrigerating device is connected with the heat dissipation component, and the cold end face of the semiconductor refrigerating device is connected with the condensation component;
the air guide shell is characterized in that a hollow air guide channel is formed in the air guide shell, an inlet of the air guide channel is located at the bottom of the air guide shell, an outlet of the air guide channel is located at the top of the air guide shell, and the outlet area of the air guide channel is larger than the inlet area of the air guide channel.
Preferably, the air outlets are all located in a vertical projection plane corresponding to the outlet of the air guide channel.
Preferably, the dehumidification mechanism is installed at the top of the inner side of the ventilation hood, and the top surface of the inner side of the ventilation hood abuts against the upper surface of the air guide shell.
Preferably, the heat dissipation assembly and the condensation assembly are both provided in plurality.
Preferably, the heat dissipation assembly includes a heat dissipation plate and a plurality of heat dissipation fins, one surface of the heat dissipation plate is mounted on the inner side wall of the air guide shell, the other surface of the heat dissipation plate is mounted with the heat dissipation fins arranged at intervals, and the extending direction of the heat dissipation fins is parallel to the air guide direction of the air guide channel.
Preferably, the condensing assembly includes a condensing plate and a plurality of condensing fins, one surface of the condensing plate is mounted on the outer side wall of the air guide shell, the other surface of the condensing plate is mounted with the condensing fins arranged at intervals, and the extending direction of the condensing fins is parallel to the air guide direction of the air guide channel.
Preferably, the side wall of the air guide shell is provided with a mounting hole, and the semiconductor refrigeration device is mounted on the air guide shell through the mounting hole; the semiconductor refrigeration device is located between the heat dissipation plate and the condensation plate, the hot end face of the semiconductor refrigeration device is tightly attached to the heat dissipation plate, and the cold end face of the semiconductor refrigeration device is tightly attached to the condensation plate.
Preferably, the heat dissipation assembly further comprises a heat dissipation fan, and the heat dissipation fan is mounted at the top and/or the bottom of the air guide shell.
Preferably, the dehumidification mechanism further comprises a protective cover, the heat dissipation fan and the protective cover are both mounted at the bottom of the air guide shell, and the protective cover is located between the air guide shell and the heat dissipation fan.
Preferably, the top of the air guide shell extends outwards to form a mounting strip, and a fastener penetrates through the ventilation hood and the mounting strip to connect the dehumidification mechanism with the ventilation hood.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
1. the ventilation hood is provided with a plurality of air inlets and a plurality of air outlets, so that the air inlet amount and the air outlet amount of the dehumidifying device can be increased, the large-capacity dehumidifying effect of the dehumidifying device is realized, the air inlets are uniformly distributed around the side wall of the ventilation hood, and the air inlets are used for enabling the gas to be dehumidified to enter the dehumidifying device, so that the gas to be dehumidified can enter the dehumidifying device from the side wall of the dehumidifying device at 360 degrees without dead angles, and the gas to be dehumidified can be ensured to enter the dehumidifying device without hindrance; the air outlet is located the top of draft hood, and the air outlet is used for dry gas exhaust dehydrating unit, and the air outlet that is located the draft hood top is favorable to ensureing that business turn over dehydrating unit's gaseous flow direction can not influence each other, guarantees gaseous smooth and easy flow among the dehydrating unit, promotes dehydrating unit's dehumidification effect.
2. The dehumidifying device is divided into a dehumidifying area and a heat dissipation area from outside to inside, after the dehumidifying gas enters the dehumidifying device from the air inlet, the dehumidifying gas firstly passes through the dehumidifying area positioned on the periphery of the dehumidifying device, the dehumidifying gas is enabled to be condensed into liquid beads from air separation due to low temperature cooling, the condensing and dehumidifying purpose is realized, then the dried cold air after dehumidification enters the heat dissipation area positioned on the periphery of the dehumidifying device to carry out heat exchange, and the dehumidifying device is exhausted from the air outlet at the top of the ventilating hood after the gas temperature returns to the normal temperature state. The gas is dehumidified in a semiconductor refrigeration condensation mode, a complex mechanical structure is omitted, the structure and the compression volume can be effectively simplified, mute refrigeration is convenient to realize, and the semiconductor refrigeration device is safe, reliable, convenient, practical, low in manufacturing cost and wide in application range.
3. After the to-be-dehumidified gas enters the dehumidification area of the dehumidification device from the air inlet, the to-be-dehumidified gas enters the heat dissipation area from the bottom of the air guide shell, and finally the to-be-dehumidified gas is discharged from the top of the air guide shell, so that the gas in the dehumidification device flows to form a U-shaped passage, water vapor in the air can be rapidly removed, and the dehumidification effect of the dehumidification device is improved.
4. The U-shaped channel that dehumidification mechanism's subregion set up the gaseous flow direction of cooperation can make the cold air of dehumidification district bottom can all get into the heat dissipation district effectively to make dry air's air supply volume greatly increased, make the dehumidification effect obviously improve. And the outlet area of the air guide channel in the technical scheme is larger than the inlet area of the air guide channel, so that the air output of the dehumidifying device is favorably increased, and the large air input is matched with the large air output, thereby realizing the large-capacity dehumidifying purpose of the dehumidifying device.
Drawings
FIG. 1 is a schematic structural diagram of a large capacity dehumidifier according to the present invention.
Fig. 2 is a sectional view of a large capacity dehumidifying apparatus according to the present invention.
Fig. 3 is an exploded view of a first perspective of a high capacity dehumidification device of the present invention.
Fig. 4 is an exploded view from a second perspective of a high capacity dehumidification device in accordance with the present invention.
Fig. 5 is a schematic view illustrating the installation of the heat dissipating assembly in the first embodiment of the high capacity dehumidifying apparatus according to the present invention.
Fig. 6 is an exploded view of a dehumidifying mechanism in a second embodiment of a large capacity dehumidifying apparatus according to the present invention.
Wherein: the air conditioner comprises a ventilation hood 1, an air inlet 101, an air outlet 102, a dehumidification mechanism 2, an air guide shell 21, a mounting hole 211, a mounting bar 212, a heat dissipation assembly 22, a heat dissipation plate 221, heat dissipation fins 222, a heat dissipation fan 223, a condensation assembly 23, a condensation plate 231, condensation fins 232, a semiconductor refrigeration device 24 and a water receiving box 3;
a first heat dissipation assembly 201, a second heat dissipation assembly 202, a first heat dissipation assembly 203, a second heat dissipation assembly 204, a third heat dissipation assembly 205, and a fourth heat dissipation assembly 206.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.
In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The technical scheme provides a high-capacity dehumidifying device which comprises a ventilating hood 1, a dehumidifying mechanism 2 and a water receiving box 3, wherein a cavity for mounting the dehumidifying mechanism 2 is formed by the ventilating hood 1 and the water receiving box 3 in a surrounding manner;
the ventilation hood 1 is provided with a plurality of air inlets 101 and a plurality of air outlets 102, the air inlets 101 are uniformly distributed around the side wall of the ventilation hood 1, and the air outlets 102 are positioned at the top of the ventilation hood 1;
the dehumidification mechanism 2 comprises an air guide shell 21, a heat dissipation component 22, a condensation component 23 and a semiconductor refrigeration device 24, wherein the heat dissipation component 22 is installed inside the air guide shell 21, the condensation component 23 is installed outside the air guide shell 21, the semiconductor refrigeration device 24 is installed between the heat dissipation component 22 and the condensation component 23, the hot end face of the semiconductor refrigeration device 24 is connected with the heat dissipation component 22, and the cold end face of the semiconductor refrigeration device 24 is connected with the condensation component 23;
the air guide shell 21 is internally provided with a hollow air guide channel, an inlet of the air guide channel is positioned at the bottom of the air guide shell 21, an outlet of the air guide channel is positioned at the top of the air guide shell 21, and the outlet area of the air guide channel is larger than the inlet area of the air guide channel.
At present, electronic refrigeration dehumidifier products on the market are generally divided into a semiconductor refrigeration dehumidifier and a compressor refrigeration dehumidifier, under standard working conditions (the ambient temperature is 30 ℃ and the ambient humidity is 80%), the maximum dehumidification capacity of the semiconductor refrigeration dehumidifier is about 800 ml/day, the minimum dehumidification capacity of the compressor refrigeration dehumidifier is about 4000 ml/day, and a proper dehumidifier product which can cover the dehumidification capacity interval of 800-4000 ml/day does not appear on the market.
In order to effectively increase the dehumidification capacity of the dehumidification device and facilitate the coverage of the dehumidification capacity range which cannot be covered by the existing dehumidifier products, the technical scheme provides a large-capacity dehumidification device, as shown in fig. 1-6, which comprises a ventilation hood 1, a dehumidification mechanism 2 and a water receiving box 3, wherein the ventilation hood 1 is used for allowing gas to be dehumidified to enter the dehumidification device and dry gas to be discharged out of the dehumidification device, the dehumidification mechanism 2 is used for dehumidifying the gas to be dehumidified, the water receiving box 3 is used for collecting condensed water generated in the dehumidification process to realize the collection and diversion or storage of water, a cavity for installing the dehumidification mechanism 2 is enclosed by the ventilation hood 1 and the water receiving box 3, and thus the sealed encapsulation of the dehumidification mechanism 2 is realized.
Specifically, the ventilation hood 1 is provided with a plurality of air inlets 101 and a plurality of air outlets 102, which is beneficial to increasing the air inlet volume and the air outlet volume of the dehumidifying device, so that the large-capacity dehumidifying function of the dehumidifying device is realized, the air inlets 101 are uniformly distributed around the side wall of the ventilation hood 1, and the air inlets 101 are used for allowing the gas to be dehumidified to enter the dehumidifying device, so that the gas to be dehumidified can enter the dehumidifying device from the side wall of the dehumidifying device at 360 degrees without dead angles, and the gas to be dehumidified is ensured to enter the dehumidifying device without hindrance; air outlet 102 is located the top of draft hood 1, and air outlet 102 is used for dry gas exhaust dehydrating unit, and air outlet 102 that is located the top of draft hood 1 is favorable to ensureing that the gaseous flow direction of business turn over dehydrating unit can not influence each other, guarantees gaseous smooth and easy flow among the dehydrating unit, promotes dehydrating unit's dehumidification effect.
More specifically, the dehumidifying mechanism 2 includes an air guiding casing 21, a heat dissipating component 22, a condensing component 23 and a semiconductor refrigeration device 24, wherein the heat dissipating component 22 is installed inside the air guiding casing 21, and the condensing component 23 is installed outside the air guiding casing 21. Above-mentioned structural design makes this technical scheme's dehydrating unit divide into dehumidification district and radiating area from outer to inner, treat that dehumidification gas gets into dehydrating unit from air intake 101 after, at first through being located the outlying dehumidification district of dehydrating unit, make and treat that dehumidification gas makes the steam condensation wherein for the liquid pearl from air separation because of the low temperature cooling, realize the condensation dehumidification purpose, then dry cold air after the dehumidification gets into the radiating area that is located the interior circumference of dehydrating unit and carries out heat exchange, treat that gas temperature returns the air outlet 102 discharge dehydrating unit at room temperature state back from radome fume 1 top. The semiconductor refrigeration device 24 is arranged between the heat dissipation assembly 22 and the condensation assembly 23, the hot end face of the semiconductor refrigeration device 24 is connected with the heat dissipation assembly 22, and the cold end face of the semiconductor refrigeration device 24 is connected with the condensation assembly 23; the semiconductor refrigerating device 24 is provided with a hot end and a cold end, and the semiconductor refrigerating device 24 is manufactured by using the Peltier effect, wherein the Peltier effect refers to the phenomenon that when direct current passes through a couple consisting of two semiconductor materials, one end of the couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration device 24 is made of two semiconductor materials to form a hot end and a cold end, and the cold end continuously absorbs heat to realize refrigeration; the hot junction is continuously exothermic, and this technical scheme dehumidifies gas with the refrigerated condensation mode of semiconductor, has saved complicated mechanical structure, can effectively simplify structure and compression volume, is convenient for realize the silence refrigeration, and safe and reliable, convenient and practical, low in manufacturing cost, application scope is wide.
Furthermore, a hollow air guide channel is formed in the air guide shell 21, an inlet of the air guide channel is located at the bottom of the air guide shell 21, an outlet of the air guide channel is located at the top of the air guide shell 21, after the gas to be dehumidified enters the dehumidification area of the dehumidification device from the air inlet 101, the gas enters the heat dissipation area from the bottom of the air guide shell 21, and finally the gas is discharged out of the dehumidification device from the top of the air guide shell 21, so that the gas in the dehumidification device flows to form a U-shaped passage, water vapor in the air can be removed quickly, and the dehumidification effect of the dehumidification device is improved; the U-shaped channel matched with the gas flow direction is arranged in the partition of the dehumidifying mechanism 2, so that cold air at the bottom of the dehumidifying area can enter the heat dissipation area completely, the air supply volume of dry air is greatly increased, and the dehumidifying effect is obviously improved. And the outlet area of the air guide channel in the technical scheme is larger than the inlet area of the air guide channel, so that the air output of the dehumidifying device is favorably increased, and the large air input is matched with the large air output, thereby realizing the purpose of large-capacity dehumidification of the dehumidifying device.
More specifically, the air outlets 102 are all located in a vertical projection plane corresponding to the outlet of the air guide channel.
In a preferred embodiment of the present technical solution, the air outlets 102 are all located in a vertical projection plane corresponding to the outlet of the air guiding channel, that is, the air outlets 102 are all located in an area surrounded by the outlet of the air guiding channel, which is beneficial to timely discharging the dehumidified and heat-dissipated dry gas out of the dehumidifier, and shortening the flow stroke of the gas in the dehumidifier, thereby improving the dehumidification efficiency of the dehumidifier.
More specifically, the dehumidifying mechanism 2 is mounted on the top of the inside of the ventilation hood 1, and the top surface of the inside of the ventilation hood 1 abuts against the upper surface of the air guiding shell 21.
In a more preferred embodiment of the present technical solution, the dehumidifying mechanism 2 is installed at the top of the inside of the ventilation hood 1, and the top surface of the inside of the ventilation hood 1 abuts against the upper surface of the air guiding shell 21, so that the air in the dehumidifying apparatus has only a single flow path, thereby effectively preventing the gas to be dehumidified from directly discharging from the air outlet 102 without being dehumidified, and the design of the above structure is favorable for improving the dehumidifying effect of the dehumidifying apparatus.
Further, the heat dissipation assembly 22 and the condensation assembly 23 are provided in plurality.
This technical scheme's dehumidification mechanism 2 is provided with a plurality of radiator unit 22 and condensation unit 23 in, is favorable to ensureing dehydrating unit's dehumidification effect, will advance the structural design of air output greatly and combine with a plurality of radiator unit 22 and the cooperation of condensation unit 23, is favorable to promoting dehydrating unit's dehumidification volume, realizes dehydrating unit's the purpose of the big easy dehumidification.
Furthermore, the heat dissipation assembly 22 includes a heat dissipation plate 221 and a plurality of heat dissipation fins 222, one plate surface of the heat dissipation plate 221 is installed on the inner sidewall of the air guiding casing 21, the other plate surface of the heat dissipation plate 221 is installed with the heat dissipation fins 222 arranged at intervals, and the extending direction of the heat dissipation fins 222 is parallel to the air guiding direction of the air guiding channel.
Further, the heat dissipation assembly 22 of this technical scheme includes a heat dissipation plate 221 and a plurality of radiating fins 222, a face of the heat dissipation plate 221 is installed on the inside wall of the air guide shell 21, the radiating fins 222 arranged at intervals are installed on the other face of the heat dissipation plate 221, a through flow channel is formed between the plurality of radiating fins 222 to guide air, so that the contact area between dry and cold air and the heat dissipation assembly 22 is increased, the heat dissipation effect is improved, the extending direction of the radiating fins 222 is parallel to the air guide direction of the air guide channel, smooth flow of air in the dehumidification device is ensured, and the heat dissipation effect of the dehumidification device is ensured.
In the first embodiment of the present technical solution, there are 2 heat dissipation assemblies 22, as shown in fig. 5, there are a first heat dissipation assembly 201 and a second heat dissipation assembly 202, respectively, and the first heat dissipation assembly 201 and the second heat dissipation assembly 202 are oppositely disposed, so that the flowing speed of the air can be effectively increased, and the heat dissipation efficiency of the dehumidification device is increased.
In the second embodiment of the present technical solution, there are 4 heat dissipation assemblies 22, as shown in fig. 6, there are a first heat dissipation assembly 203, a second heat dissipation assembly 204, a third heat dissipation assembly 205, and a fourth heat dissipation assembly 206, where the first heat dissipation assembly 203 and the second heat dissipation assembly 204 are disposed oppositely, and the third heat dissipation assembly 205 and the fourth heat dissipation assembly 206 are disposed on two sides of the first heat dissipation assembly 203 and the second heat dissipation assembly 204 respectively, which is beneficial to effectively increasing the flowing speed of air, so as to increase the heat dissipation efficiency of the dehumidification device, and on the other hand, the contact area between dry and cold air and the heat dissipation assembly 22 can be further increased, thereby improving the heat dissipation effect.
Furthermore, the condensing assembly 23 includes a condensing plate 231 and a plurality of condensing fins 232, one plate surface of the condensing plate 231 is mounted on the outer side wall of the air guiding casing 21, the other plate surface of the condensing plate 231 is mounted with the condensing fins 232 arranged at intervals, and the extending direction of the condensing fins 232 is parallel to the air guiding direction of the air guiding channel.
Further, the condensing assembly 23 of this technical scheme includes condensing plate 231 and a plurality of condensing fin 232, a face of condensing plate 231 is installed in the lateral wall of wind-guiding shell 21, condensing fin 232 that the interval set up is installed to another face of condensing plate 231, form between a plurality of condensing fin 232 and link up the runner and water conservancy diversion air, be convenient for increase the area of contact of treating dehumidification air and condensing assembly 23, promote dehumidification effect, and condensing fin 232's extending direction is parallel to each other with the wind-guiding direction of wind-guiding passageway, guarantee to treat in the dehumidification device that the smooth and easy flow of dehumidification gas, guarantee the dehumidification effect of dehumidification device.
More specifically, a mounting hole 211 is formed in a side wall of the air guide casing 21, and the semiconductor refrigeration device 24 is mounted to the air guide casing 21 through the mounting hole 211; the semiconductor refrigeration device 24 is located between the heat dissipation plate 221 and the condensation plate 231, the hot end face of the semiconductor refrigeration device 24 is tightly attached to the heat dissipation plate 221, and the cold end face of the semiconductor refrigeration device 24 is tightly attached to the condensation plate 231.
In a preferred embodiment of the present technical solution, a mounting hole 211 is formed in a side wall of the air guide casing 21, and the semiconductor refrigeration device 24 is mounted on the air guide casing 21 through the mounting hole 211, so as to ensure stable mounting of the semiconductor refrigeration device 24; semiconductor refrigeration device 24 is located between heating panel 221 and cold plate 231, and semiconductor refrigeration device 24's hot junction surface hugs closely in heating panel 221, and semiconductor refrigeration device 24's cold junction surface hugs closely in cold plate 231, and the design of above-mentioned structure does benefit to the thermal directness of semiconductor refrigeration device 24, effective conduction to promote dehydrating unit's condensation radiating effect.
More specifically, the heat dissipation assembly 22 further includes a heat dissipation fan 223, and the heat dissipation fan 223 is mounted on the top and/or the bottom of the air guiding shell 21.
The heat dissipation assembly 22 of the present technical solution further includes a heat dissipation fan 223, the heat dissipation fan 223 is installed at the top and/or the bottom of the air guiding shell 21, which is beneficial to improving the flow speed of air in the dehumidifying device, thereby improving the dehumidifying efficiency of the dehumidifying device.
In a preferred embodiment of the present technical solution, one heat dissipation fan 223 is disposed, so as to effectively reduce heat dissipation wind resistance, and the heat dissipation fan 223 is mounted at the bottom of the air guiding shell 21, so that the gas to be dehumidified firstly passes through the condensation component 23 to condense water vapor, and then enters the heat dissipation fan 223, and then the heat dissipation fan 223 transmits dry and cold gas to the heat dissipation component 22, so as to enhance the heat dissipation effect of the dehumidification device.
More specifically, the dehumidifying mechanism 2 further includes a protective cover, the heat dissipating fan 223 and the protective cover are both installed at the bottom of the air guiding casing 21, and the protective cover is located between the air guiding casing 21 and the heat dissipating fan 223.
In a preferred embodiment of the present invention, the dehumidifying mechanism 2 further includes a protective cover (not shown in the figure), the heat dissipating fan 223 and the protective cover are both installed at the bottom of the air guiding casing 21, and the protective cover is located between the air guiding casing 21 and the heat dissipating fan 223, and the protective cover can effectively prevent the condensed water from entering the heat dissipating fan 233 to cause a safety hazard.
More specifically, a mounting bar 212 extends outwards from the top of the air guiding casing 21, and a fastening member passes through the ventilation hood 1 and the mounting bar 212 to connect the dehumidification mechanism 2 with the ventilation hood 1.
Further, in the present embodiment, a mounting bar 212 extends outward from the top of the air guiding casing 21, and a fastening member (not shown) passes through the ventilation hood 1 and the mounting bar 212, so that the dehumidification mechanism 2 and the ventilation hood 1 are stably mounted. It should be noted that, the fastening member in the present technical solution may be a screw, a bolt, or other structural members for installation and fixation.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A large capacity dehydrating unit which characterized in that: the dehumidifying device comprises a ventilating hood, a dehumidifying mechanism and a water receiving box, wherein a cavity for mounting the dehumidifying mechanism is enclosed by the ventilating hood and the water receiving box;
the ventilation hood is provided with a plurality of air inlets and a plurality of air outlets, the air inlets are uniformly distributed around the side wall of the ventilation hood, and the air outlets are positioned at the top of the ventilation hood;
the dehumidifying mechanism comprises an air guide shell, a heat dissipation component, a condensation component and a semiconductor refrigerating device, wherein the heat dissipation component is arranged inside the air guide shell, the condensation component is arranged outside the air guide shell, the semiconductor refrigerating device is arranged between the heat dissipation component and the condensation component, the hot end face of the semiconductor refrigerating device is connected with the heat dissipation component, and the cold end face of the semiconductor refrigerating device is connected with the condensation component;
the air guide shell is characterized in that a hollow air guide channel is formed in the air guide shell, an inlet of the air guide channel is located at the bottom of the air guide shell, an outlet of the air guide channel is located at the top of the air guide shell, and the outlet area of the air guide channel is larger than the inlet area of the air guide channel.
2. A high capacity dehumidifying device as claimed in claim 1, wherein: the air outlets are all located in the vertical projection plane corresponding to the outlet of the air guide channel.
3. A high capacity dehumidifying device as claimed in claim 2, wherein: the dehumidification mechanism is arranged at the top of the inner side of the ventilation hood, and the top surface of the inner side of the ventilation hood is abutted to the upper surface of the air guide shell.
4. A high capacity dehumidifying device as claimed in claim 1, wherein: the heat dissipation assembly and the condensation assembly are provided with a plurality of heat dissipation assemblies.
5. A high capacity dehumidifying device as claimed in claim 4, wherein: the radiating assembly comprises a radiating plate and a plurality of radiating fins, one plate surface of the radiating plate is arranged on the inner side wall of the air guide shell, the other plate surface of the radiating plate is provided with the radiating fins arranged at intervals, and the extending direction of the radiating fins is parallel to the air guide direction of the air guide channel.
6. A high capacity dehumidifying device as claimed in claim 5, wherein: the condensation component comprises a condensation plate and a plurality of condensation fins, one surface of the condensation plate is arranged on the outer side wall of the air guide shell, the condensation fins are arranged on the other surface of the condensation plate at intervals, and the extension directions of the condensation fins are parallel to the air guide direction of the air guide channel.
7. A high capacity dehumidifying device as claimed in claim 6, wherein: the side wall of the air guide shell is provided with a mounting hole, and the semiconductor refrigeration device is mounted on the air guide shell through the mounting hole; the semiconductor refrigeration device is located between the heat dissipation plate and the condensation plate, the hot end face of the semiconductor refrigeration device is tightly attached to the heat dissipation plate, and the cold end face of the semiconductor refrigeration device is tightly attached to the condensation plate.
8. A high capacity dehumidifying device as claimed in claim 5, wherein: the heat dissipation assembly further comprises a heat dissipation fan, and the heat dissipation fan is mounted at the top and/or the bottom of the air guide shell.
9. A high capacity dehumidifying device as claimed in claim 8, wherein: the dehumidification mechanism further comprises a protective cover, the heat dissipation fan and the protective cover are both arranged at the bottom of the air guide shell, and the protective cover is located between the air guide shell and the heat dissipation fan.
10. A high capacity dehumidifying device as claimed in claim 3, wherein: the top of the air guide shell extends outwards to form a mounting strip, and a fastener penetrates through the ventilation hood and the mounting strip to enable the dehumidification mechanism to be connected with the ventilation hood.
Priority Applications (1)
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CN115143547A (en) * | 2022-08-08 | 2022-10-04 | 珠海格力电器股份有限公司 | Dehumidifier and dehumidification method |
CN115143547B (en) * | 2022-08-08 | 2024-10-11 | 珠海格力电器股份有限公司 | Dehumidifier and dehumidification method |
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