CN215947435U

CN215947435U - PCB lifting device capable of improving electroplating efficiency

Info

Publication number: CN215947435U
Application number: CN202121710957.7U
Authority: CN
Inventors: 吴莉莉
Original assignee: Nippon (boluo) Electronics Co ltd
Current assignee: Nippon (boluo) Electronics Co ltd
Priority date: 2021-07-27
Filing date: 2021-07-27
Publication date: 2022-03-04
Anticipated expiration: 2031-07-27

Abstract

The utility model discloses a PCB lifting device capable of improving electroplating efficiency, belonging to the technical field of PCB processing, comprising a lifting frame, wherein the bottom of the lifting frame is symmetrically provided with a connecting band, the bottom end of the connecting band is fixedly provided with a mounting frame, the bottom inside the mounting frame is provided with a plurality of mechanical arms at equal intervals, the insides of two side walls of the lifting frame are provided with first adjusting components, the positions, close to two sides, of the bottom of the mounting frame are fixedly connected with first mounting plates, the bottom of the first mounting plates is connected with a liquid absorbing component in a sliding way, the liquid absorbing component can enable electroplating solution on the surface of a PCB to be absorbed by a liquid absorbing layer in the process of downwards dropping the electroplating solution flowing through the surface of the PCB, the quantity of the electroplating solution on the surface of the PCB dropping on an object outside an electroplating solution pool in the process of moving the lifting device is greatly reduced, and the electroplating solution is prevented from corroding objects outside the electroplating pool, the service life of the articles is prolonged.

Description

PCB lifting device capable of improving electroplating efficiency

Technical Field

The utility model relates to the technical field of PCB processing, in particular to a PCB lifting device capable of improving electroplating efficiency.

Background

The PCB, a so-called printed circuit board in chinese, is an important electronic component, a support for electronic components, a carrier for electrical interconnection of electronic components, and is called a "printed" circuit board because it is manufactured by electronic printing.

The PCB board need electroplate at the in-process of processing, can use PCB board elevating gear to press from both sides the PCB board at the in-process of electroplating, in order to promote the efficiency of electroplating, press from both sides the in-process at hoisting device, hoisting device need move to the position department that corresponds with the PCB board, at the in-process that removes, do not press from both sides the PCB board on the hoisting device, need not to promote to the highest point through inductor control hoisting device this moment, only need promote hoisting device to the height that does not contact with other objects and can make hoisting device remove, when pressing from both sides the PCB board on hoisting device, in order to avoid the bottom of PCB board to touch with other objects, need promote hoisting device to the highest point through inductor control this moment, again control hoisting device removes, can improve hoisting device's work efficiency through this kind of mode, thereby promote the efficiency of electroplating.

However, after the PCB is lifted out of the electroplating solution by the device, in the process that the lifting device drives the PCB to move, the electroplating solution on the PCB is easy to drip out of the electroplating solution pool, and then the dripping electroplating solution and objects outside the electroplating solution pool are subjected to chemical reaction, so that the objects are corroded, and the service life of the objects is shortened.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

The utility model aims to provide a PCB lifting device capable of improving electroplating efficiency, which can absorb a solution on the surface of a PCB through a liquid absorbing layer in the process of enabling an electroplating solution on the PCB to flow through the surface of the PCB and drop downwards, and greatly reduces the quantity of the electroplating solution on the surface of the PCB dropping to an object outside an electroplating solution pool in the process of moving a lifting device, so that the electroplating solution is prevented from corroding objects outside the electroplating pool, and the service life of the objects is prolonged.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

The utility model provides a can improve PCB board elevating gear of electroplating efficiency, includes the crane, the bottom symmetry of crane is provided with the connecting band, the bottom mounting of connecting band is provided with the mounting bracket, the equidistant a plurality of arms that are provided with in the inside bottom of mounting bracket, the inside of crane both sides wall is provided with first adjusting part, the mounting bracket bottom is close to the first mounting panel of the position fixedly connected with of both sides department, the bottom sliding connection of first mounting panel has the imbibition subassembly, the second spout has been seted up to the bottom of first mounting panel, first mounting panel passes through the top sliding connection of second spout and imbibition subassembly, the inside of second spout is provided with the spring, and the both ends fixed connection of imbibition subassembly and spring, two one side fixedly connected with second adjusting part that first mounting panel deviates from each other.

Further, first adjusting part includes the dwang, the dwang rotates to be connected in the inside of crane both sides wall, the helicla flute has been seted up to the outer wall of dwang, and the bottom fixedly connected with slide bar of dwang.

Further, the both sides fixedly connected with sliding sleeve of mounting bracket, sliding sleeve and the mutual adaptation of dwang, sliding sleeve extends to the inside of crane, and crane inner wall and the corresponding position department of sliding sleeve have seted up logical groove, the outside of slide bar is located to the sliding sleeve cover, and sliding sleeve's inner wall does not contact with the outer wall of slide bar, the fixed ball that is provided with of inner wall of slide bar, and ball and the mutual adaptation of helicla flute.

Furthermore, the position department that the slide bar outer wall is close to the bottom is provided with the screw thread, and slide bar outer wall and the corresponding position department threaded connection of screw thread have an internal thread sleeve pipe, two the fixed slider that is provided with of position department that is close to the top of the relative one side of internal thread sleeve pipe outer wall, first spout has been seted up with the corresponding position department of slider in mounting bracket both sides, and slider and first spout sliding connection.

Further, the imbibition subassembly includes two second mounting panels, the arm is located between two second mounting panels, two the top of second mounting panel is close to the position department of both sides and the inside sliding connection of second spout, two fixed screw fixedly connected with third mounting panel, two are passed through to one side that the second mounting panel is relative one side fixedly connected with imbibition layer made by polymer resin of third mounting panel.

Further, the second adjusting part includes miniature electric cylinder, miniature electric cylinder passes through mount fixed mounting in the one side that two first mounting panels deviate from each other, miniature electric cylinder's output fixedly connected with U-shaped adjusting plate, the both sides fixedly connected with adjusting ball that U-shaped adjusting plate and second mounting panel are relative, two one side fixedly connected with arc regulating plate that the second mounting panel deviates from each other, and the position of arc regulating plate and adjusting ball corresponds each other.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages that:

(1) when the U-shaped adjusting plate removes to a locating position, the adjusting ball contacts with the arc regulating plate, thereby it removes to the direction that is close to each other to drive two second mounting panels through mutually supporting of adjusting ball and arc regulating plate, thereby make the imbibition layer contact with the outside of PCB board, because the imbibition layer is made by polymer resin, make the electroplating solution on the PCB board absorb the solution on PCB board surface through the imbibition layer at the in-process that flows through PCB board surface drippage downwards, the quantity on the external object of electroplating solution pond is drippaged to the electroplating solution on the in-process PCB surface of the greatly reduced removal of hoisting device, thereby avoid electroplating solution to corrode the outside article of electroplating pond, promote the service life of these articles.

Drawings

FIG. 1 is a front cross-sectional view of the present invention;

FIG. 2 is a bottom view of the second mounting plate of the present invention;

FIG. 3 is a schematic view of the position of the ball of the present invention;

FIG. 4 is an enlarged view taken at A of FIG. 1 in accordance with the present invention;

FIG. 5 is an enlarged view taken at B of FIG. 1 in accordance with the present invention;

fig. 6 is an enlarged view of the utility model at C in fig. 2.

The reference numbers in the figures illustrate:

1. a lifting frame; 2. a connecting belt; 3. a mounting frame; 4. a mechanical arm; 5. rotating the rod; 6. a helical groove; 7. a slide bar; 8. an internally threaded sleeve; 9. a first chute; 10. a slider; 11. a sliding sleeve; 12. a first mounting plate; 13. a second mounting plate; 14. a miniature electric cylinder; 15. a U-shaped adjustment plate; 16. an arc-shaped adjusting plate; 17. adjusting the ball; 18. a third mounting plate; 19. a liquid absorption layer; 20. a ball bearing; 21. a second chute; 22. a spring.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

Example 1:

referring to fig. 1-6, a PCB lifting device capable of improving electroplating efficiency comprises a lifting frame 1, wherein the bottom of the lifting frame 1 is symmetrically provided with a connecting band 2, the bottom end of the connecting band 2 is fixedly provided with a mounting frame 3, the connecting mode of the connecting band 2, the lifting frame 1 and the mounting frame 3 is the prior art and is not specifically described, the bottom inside the mounting frame 3 is provided with a plurality of mechanical arms 4 at equal intervals, the inside of two side walls of the lifting frame 1 is provided with a first adjusting component, the position of the bottom of the mounting frame 3 close to two sides is fixedly connected with a first mounting plate 12, the bottom of the first mounting plate 12 is slidably connected with a liquid absorbing component, the bottom of the first mounting plate 12 is provided with a second chute 21, the first mounting plate 12 is slidably connected with the top of the liquid absorbing component through the second chute 21, the inside of the second chute 21 is provided with a spring 22, and the liquid absorbing component is fixedly connected with two ends of the spring 22, two first mounting panels 12 are fixedly connected with the second adjusting component on the side that deviates from each other.

Referring to fig. 1, the first adjusting assembly includes a rotating rod 5, the rotating rod 5 is rotatably connected to the inside of two side walls of the lifting frame 1, the outer wall of the rotating rod 5 is provided with a spiral groove 6, the bottom of the rotating rod 5 is fixedly connected with a sliding rod 7, two sides of the mounting frame 3 are fixedly connected with sliding sleeves 11, the sliding sleeves 11 are mutually matched with the rotating rod 5, the sliding sleeves 11 extend to the inside of the lifting frame 1, the inner wall of the lifting frame 1 is provided with a through groove at a position corresponding to the sliding sleeves 11, the sliding sleeves 11 are sleeved outside the sliding rods 7, the inner wall of the sliding sleeves 11 is not contacted with the outer wall of the sliding rods 7, the inner wall of the sliding rods 7 is fixedly provided with balls 20, the balls 20 are mutually matched with the spiral groove 6, the outer wall of the sliding rods 7 is provided with threads at a position close to the bottom, and the outer wall of the sliding rods 7 is in threaded connection with an internal thread sleeve 8 at a position corresponding to the threads, two 8 outer wall opposite sides of internal thread sleeve pipe are close to the fixed slider 10 that is provided with in position department at top, first spout 9 has been seted up with slider 10 corresponding position department in mounting bracket 3 both sides, and slider 10 and first spout 9 sliding connection, when mounting bracket 3 upwards moves, mounting bracket 3 drives sliding sleeve 11 and upwards moves, when sliding sleeve 11 moves to a certain position, the inside ball 20 of sliding sleeve 11 gets into the inside of helicla flute 6, along with lasting the shifting up of sliding sleeve 11, make dwang 5 rotate through mutually supporting of ball 20 and helicla flute 6, dwang 5 drives slide bar 7 and rotates, thereby make internal thread sleeve pipe 8 drive first mounting panel 12 and move down, and then make first mounting panel 12 drive imbibition subassembly move down, adjust the position of subassembly.

Referring to fig. 2 and 6, the pipetting assembly includes two second mounting plates 13, the robot arm 4 is located between the two second mounting plates 13, the top portions of the two second mounting plates 13 near both sides are slidably connected to the inside of the second chute 21, the opposite sides of the two second mounting plates 13 are fixedly connected to the third mounting plate 18 through fixing screws, after the third mounting plate 18 is used for a period of time, the third mounting plate 18 can be disassembled, so that the third mounting plate 18 can be replaced, the opposite sides of the two third mounting plates 18 are fixedly connected to the pipetting layer 19 made of polymer resin, when the third mounting plate 18 is in contact with the outer side of the PCB near the bottom portion, the third mounting plate 18 absorbs the electroplating solution flowing downward on the surface of the PCB, thereby reducing the amount of the electroplating solution dropping on the objects outside the electroplating solution tank when the lifting device moves, thereby avoiding the articles outside the electroplating pool from being corroded and prolonging the service life of the articles.

Referring to fig. 2 and 6, the second adjusting assembly includes a micro electric cylinder 14, the micro electric cylinder 14 is fixedly mounted on one side of two first mounting plates 12 deviating from each other through a fixing frame, an output end of the micro electric cylinder 14 is fixedly connected with a U-shaped adjusting plate 15, two sides of the U-shaped adjusting plate 15 opposite to the second mounting plates 13 are fixedly connected with adjusting balls 17, one side of the two second mounting plates 13 deviating from each other is fixedly connected with an arc-shaped adjusting plate 16, the arc-shaped adjusting plate 16 corresponds to the adjusting balls 17, when the second mounting plates 13 descend to a position where the PCB is close to the bottom, the micro electric cylinder 14 is controlled to start, the output end of the micro electric cylinder 14 pushes the two U-shaped adjusting plates 15 to move towards a direction close to each other, after the U-shaped adjusting plates 15 move to a certain position, the adjusting balls 17 contact with the arc-shaped adjusting plates 16, so that the two second mounting plates 13 move towards a direction close to each other through the arc-shaped adjusting plates 16 and the adjusting balls 17 And moving to enable the third mounting plate 18 to be in contact with the PCB, so that the third mounting plate 18 absorbs the electroplating solution on the surface of the PCB to prevent the solution from dripping.

When in use: controlling the lifting frame 1 to move to a position corresponding to the PCB, controlling the mounting frame 3 to descend at the moment, clamping the PCB inside the electroplating solution pool through the mechanical arm 4, controlling the mounting frame 3 to ascend after the clamping is finished, driving the sliding sleeve 11 to ascend through the mounting frame 3, driving the rolling ball 20 inside the sliding sleeve 11 to enter the spiral groove 6 after the mounting frame 3 ascends to a certain position, driving the rotating rod 5 to rotate through the mutual matching of the rolling ball 20 and the spiral groove 6 in the continuous ascending process of the sliding sleeve 11, driving the sliding rod 7 to rotate through the rotating rod 5 at the moment, gradually moving the internal thread sleeve 8 downwards on the sliding rod 7 in the rotating process of the sliding rod 7, driving the second mounting plate 13 to move downwards through the first mounting plate 12, controlling the micro electric cylinder 14 to start when the second mounting plate 13 moves to a position close to the bottom of the PCB, the output of miniature electric cylinder 14 promotes two U-shaped adjusting plates 15 and removes to the direction that is close to each other, when U-shaped adjusting plate 15 removes to a locating position, adjusting ball 17 contacts with arc regulating plate 16, thereby drive two second mounting panels 13 and remove to the direction that is close to each other through mutually supporting of adjusting ball 17 and arc regulating plate 16, thereby make the outside of imbibition layer 19 and PCB board contact, because imbibition layer 19 is made by macromolecular resin, make the solution of electroplating on the PCB board absorb the solution on PCB board surface through imbibition layer 19 at the in-process of flowing through PCB board surface drippage, the quantity on the object of electroplating solution pond outside is dripped to the electroplating solution of the in-process PCB surface of the greatly reduced removal at hoisting device.

The foregoing is only a preferred embodiment of the present invention; the scope of the utility model is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims

1. The utility model provides a can improve PCB board elevating gear of electroplating efficiency, includes crane (1), its characterized in that: the bottom of the lifting frame (1) is symmetrically provided with connecting belts (2), the bottom end of the connecting belts (2) is fixedly provided with a mounting frame (3), a plurality of mechanical arms (4) are arranged at the bottom inside the mounting rack (3) at equal intervals, the inner parts of the two side walls of the lifting frame (1) are provided with first adjusting components, the positions of the bottom of the mounting frame (3) close to the two sides are fixedly connected with first mounting plates (12), the bottom of the first mounting plate (12) is connected with a liquid suction assembly in a sliding way, the bottom of the first mounting plate (12) is provided with a second sliding chute (21), the first mounting plate (12) is connected with the top of the liquid suction component in a sliding way through a second sliding groove (21), a spring (22) is arranged inside the second sliding groove (21), and the two ends of the liquid suction component and the spring (22) are fixedly connected, and the two sides of the first mounting plates (12) deviate from each other are fixedly connected with a second adjusting component.

2. The PCB lifting device capable of improving the electroplating efficiency as claimed in claim 1, wherein: first adjusting part includes dwang (5), dwang (5) are rotated and are connected in the inside of crane (1) both sides wall, helicla flute (6) have been seted up to the outer wall of dwang (5), and the bottom fixedly connected with slide bar (7) of dwang (5).

3. The PCB lifting device capable of improving the electroplating efficiency as claimed in claim 1, wherein: the both sides fixedly connected with slip sleeve (11) of mounting bracket (3), slip sleeve (11) and dwang (5) adaptation each other, slip sleeve (11) extend to the inside of crane (1), and crane (1) inner wall and the corresponding position department of slip sleeve (11) have seted up logical groove, the outside of slide bar (7) is located to slip sleeve (11) cover, and the inner wall of slip sleeve (11) does not contact with the outer wall of slide bar (7), the inner wall of slide bar (7) is fixed and is provided with ball (20), and ball (20) and helicla flute (6) adaptation each other.

4. The lifting device for PCB board capable of improving electroplating efficiency as claimed in claim 2, wherein: the utility model discloses a slide bar, including mounting bracket (3), slide bar (7) outer wall, slider (10), slide bar (7) outer wall and screw thread are provided with the screw thread near the position department of bottom, and slide bar (7) outer wall and the corresponding position department threaded connection of screw thread have internal thread sleeve pipe (8), two the relative one side of internal thread sleeve pipe (8) outer wall is close to the fixed slider (10) that is provided with in position department at top, first spout (9) have been seted up with slider (10) corresponding position department to mounting bracket (3) both sides, and slider (10) and first spout (9) sliding connection.

5. The PCB lifting device capable of improving the electroplating efficiency as claimed in claim 1, wherein: imbibition subassembly includes two second mounting panels (13), arm (4) are located between two second mounting panels (13), two the top of second mounting panel (13) is close to the position department of both sides and the inside sliding connection of second spout (21), two there is third mounting panel (18), two through fixed screw fixedly connected with in one side that second mounting panel (13) is relative liquid absorption layer (19) that one side fixedly connected with that third mounting panel (18) is relative is made by polymer resin.

6. The PCB lifting device capable of improving the electroplating efficiency as claimed in claim 1, wherein: the second adjusting part includes miniature electric cylinder (14), miniature electric cylinder (14) are through mount fixed mounting in the one side that deviates from each other of two first mounting panels (12), output fixedly connected with U-shaped adjusting plate (15) of miniature electric cylinder (14), both sides fixedly connected with adjusting ball (17), two that U-shaped adjusting plate (15) are relative with second mounting panel (13) one side fixedly connected with arc regulating plate (16) that second mounting panel (13) deviate from each other, and arc regulating plate (16) and the position of adjusting ball (17) correspond to each other.