CN215943482U - Novel semiconductor plastic package mould - Google Patents
Novel semiconductor plastic package mould Download PDFInfo
- Publication number
- CN215943482U CN215943482U CN202122358258.7U CN202122358258U CN215943482U CN 215943482 U CN215943482 U CN 215943482U CN 202122358258 U CN202122358258 U CN 202122358258U CN 215943482 U CN215943482 U CN 215943482U
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- China
- Prior art keywords
- fixedly connected
- die
- novel semiconductor
- plastic package
- semiconductor plastic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004033 plastic Substances 0.000 title claims abstract description 22
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 230000005494 condensation Effects 0.000 claims abstract description 19
- 238000009833 condensation Methods 0.000 claims abstract description 19
- 238000001704 evaporation Methods 0.000 claims abstract description 18
- 230000008020 evaporation Effects 0.000 claims abstract description 18
- 230000002457 bidirectional effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005213 imbibition Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel semiconductor plastic package mold, which comprises a workbench, wherein the top of the workbench is fixedly connected with a limiting assembly, the top of the workbench is fixedly connected with a fixing assembly, the top of the workbench is fixedly connected with a lower mold, the upper end of the lower mold is provided with an upper mold, mounting grooves are formed in the lower mold and the upper mold, a mounting plate is arranged in each mounting groove, one side of each mounting plate is fixedly connected with an embedded block, and one side of each embedded block is fixedly connected with a heat pipe assembly; according to the technical scheme provided by the utility model, the upper die and the lower die are used for primarily radiating the heat of the die through the radiating fins in the upper die and the lower die, then the working liquid in the heat conducting assembly absorbs heat in the evaporation layer of the tube body to evaporate, the working liquid enters the condensation layer through the liquid absorbing core to further radiate the heat, and the condensed working liquid returns to the evaporation layer through the liquid absorbing core again, so that continuous heat radiation is ensured in a circulating manner, and the problem of poor heat radiation effect of the die is solved.
Description
Technical Field
The utility model relates to the technical field of semiconductor plastic package, in particular to a novel semiconductor plastic package mold.
Background
In the semiconductor plastic package mold, the main component of the plastic package material is silicon dioxide particles. In the production process of the product, the plastic package material is required to flow at a high speed after being softened, so that a large amount of heat is generated, the heat dissipation effect of the existing mold is poor, and the working efficiency is influenced.
The prior art has the following defects or problems:
1. the existing mold has poor heat dissipation effect and influences the working efficiency;
2. when the upper mold and the lower mold plate of the existing plastic package mold are connected, repeated micromotion causes abrasion, and the positioning precision is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a novel semiconductor plastic package mold aiming at the defects in the prior art so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel semiconductor plastic envelope mould, comprises a workbench, the spacing subassembly of workstation top fixedly connected with, the fixed subassembly of workstation top fixedly connected with, workstation top fixedly connected with bed die, the bed die upper end is provided with the mould, the mounting groove has been seted up with last mould inside to the bed die, the inside mounting panel that is provided with of mounting groove, mounting panel one side fixedly connected with inlays the piece, inlay piece one side fixedly connected with heat pipe assembly, the bed die is provided with a plurality of fin with last mould inside.
Preferably, the limiting assembly comprises a fixing block, a screw rod is arranged inside the fixing block, a limiting block is arranged on the outer wall of the screw rod, and a belt is arranged at one end of the screw rod.
Preferably, the fixing assembly comprises a fixing column, a screw rod, a movable plate and a fixed plate, the bottom end of the fixing column is fixedly connected to the upper end of the workbench, one end of the fixed plate is fixedly connected to the inside of the fixing column, one end of the movable plate is fixedly connected to the outer wall of the upper die, and the screw rod is arranged inside the fixing column.
Preferably, the heat pipe assembly comprises a pipe body, a condensation layer, liquid absorbing cores, working liquid and an evaporation layer, the pipe body is fixedly connected to one side of the embedding block, the condensation layer is arranged at one end inside the pipe body, the liquid absorbing cores are arranged on two sides inside the pipe body, the evaporation layer is arranged at one end of the condensation layer far away from the inside of the pipe body, and the working liquid is arranged between the condensation layer and the evaporation layer.
Preferably, the surfaces of the screw rods are in a bidirectional thread structure by using central axes to be symmetrical, and the two screw rods form a transmission structure through a belt.
Preferably, the feed inlet has been seted up at last mould top middle part, feed inlet, bed die and last mould constitute the intercommunication structure, and bed die and last mould cross sectional area equal.
Preferably, the heat pipe assembly is fixedly connected with the embedded block and the mounting plate to form a splicing structure, and the cross sections of the lower die and the upper die of the heat pipe assembly are in a symmetrical structure.
Compared with the prior art, the utility model provides a novel semiconductor plastic package mold, which has the following beneficial effects:
1. according to the novel semiconductor plastic package mold, the mold is subjected to preliminary heat dissipation through the heat dissipation fins in the upper mold and the lower mold, then the working liquid in the heat conduction assembly absorbs heat in the evaporation layer of the tube body to evaporate, the working liquid enters the condensation layer through the liquid absorption core to further dissipate the heat, the condensed working liquid returns to the evaporation layer through the liquid absorption core again, continuous heat dissipation is ensured in such a circulating manner, and the problem of poor heat dissipation effect of the mold is solved;
2. this novel semiconductor plastic envelope mould through mutually supporting of fixed column, screw rod, movable plate and the fixed plate in the fixed subassembly, makes the screw rod pass through movable plate, last mould, bed die and fixed plate when being connected with the bed die and be in the same place their zonulae occludens, and the problem of influence positioning accuracy is moved in the fine motion repeatedly when solving last mould and being connected with the lower bolster.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic view of a fixing assembly according to the present invention;
fig. 5 is a schematic view of the heat pipe assembly of the present invention.
In the figure: 1. a work table; 2. a lower die; 3. an upper die; 4. a screw rod; 5. a limiting block; 6. a belt; 7. mounting a plate; 8. embedding a block; 9. a feed inlet; 10. mounting grooves; 11. a heat sink; 12. fixing a column; 13. a screw; 14. a movable plate; 15. fixing a plate; 16. a pipe body; 17. a condensation layer; 18. a wick; 19. a working liquid; 20. an evaporation layer; 21. and (5) fixing blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be further noted that, unless otherwise specifically stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected through an intermediate medium, or connected through the insides of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-5, in this embodiment: the novel semiconductor plastic package mold comprises a workbench 1, wherein a limiting assembly is fixedly connected to the top of the workbench 1, a fixing assembly is fixedly connected to the top of the workbench 1, a lower mold 2 is fixedly connected to the top of the workbench 1, an upper mold 3 is arranged at the upper end of the lower mold 2, mounting grooves 10 are formed in the lower mold 2 and the upper mold 3, a mounting plate 7 is arranged in the mounting groove 10, an embedded block 8 is fixedly connected to one side of the mounting plate 7, a heat pipe assembly is fixedly connected to one side of the embedded block 8, and a plurality of radiating fins 11 are arranged in the lower mold 2 and the upper mold 3; can fix the mould on workstation 1 through spacing subassembly, can make upper mould 3 be connected more stably with bed die 2 through fixed subassembly, can carry out quick cooling to the mould through heat pipe subassembly and fin 11, increase work efficiency.
In the embodiment, the limiting assembly comprises a fixing block 21, a screw rod 4 is arranged inside the fixing block 21, a limiting block 5 is arranged on the outer wall of the screw rod 4, and a belt 6 is arranged at one end of the screw rod 4; support lead screw 4 through fixed block 21, rotate lead screw 4 and drive stopper 5 and carry out spacingly to the mould, reduce rocking of mould, reduce the influence to moulding the membrane.
In this embodiment, the fixing assembly includes a fixing column 12, a screw 13, a movable plate 14 and a fixed plate 15, the bottom end of the fixing column 12 is fixedly connected to the upper end of the worktable 1, one end of the fixed plate 15 is fixedly connected to the inside of the fixing column 12, one end of the movable plate 14 is fixedly connected to the outer wall of the upper die 3, and the screw 13 is arranged inside the fixing column 12; when the lower mold 2 is connected with the upper mold 3, the movable plate 14, the lower mold 2, the upper mold 3 and the fixed plate 15 are connected with each other through the screw 13, so that the lower mold 2 is more tightly connected with the upper mold 3, and the precision is increased.
In this embodiment, the heat pipe assembly includes a pipe body 16, a condensation layer 17, wicks 18, a working liquid 19 and an evaporation layer 20, the pipe body 16 is fixedly connected to one side of the embedded block 8, the condensation layer 17 is arranged at one end inside the pipe body 16, the wicks 18 are arranged at two sides inside the pipe body 16, the evaporation layer 20 is arranged at one end of the condensation layer 17 far away from the inside of the pipe body 16, and the working liquid 19 is arranged between the condensation layer 17 and the evaporation layer 20; the working liquid 19 absorbs heat in the evaporation layer 20 of the tube 16 to evaporate, the working liquid 18 enters the condensation layer 17 through the wick 18 to further dissipate the heat, and the condensed working liquid 19 returns to the evaporation layer 20 through the wick 18 again, so that the circulation ensures continuous heat dissipation.
In the embodiment, the surfaces of the screw rods 4 are mutually opposite to each other by using a central axis to form a bidirectional thread structure, and the two screw rods 4 form a transmission structure through a belt 6; the transmission structure enables the two screw rods 4 to rotate simultaneously, and the two limiting blocks 5 slide towards the lower die 2 through the two-way thread structures on the surfaces of the screw rods 4 to limit the lower die 2.
In the embodiment, the middle part of the top end of the upper die 3 is provided with a feed inlet 9, the lower die 2 and the upper die 3 form a communicating structure, and the cross section areas of the lower die 2 and the upper die 3 are equal; make bed die 2 and bed die 3 laminate more, improve the interface precision.
In the embodiment, the heat pipe assembly is fixedly connected with the embedded block 8 and the mounting plate 7 to form a splicing structure, and the cross sections of the lower die 2 and the upper die 3 of the heat pipe assembly are of a symmetrical structure; the splicing structure can be replaced quickly when the heat pipe assembly is damaged, the working efficiency is improved, and the symmetrical structure enables heat dissipation to be more uniform and comprehensive, so that the working progress is accelerated.
The working principle and the using process of the utility model are as follows: firstly, a lower die 2 and an upper die 3 are connected through a fixing component, and a movable plate 14, the lower die 2, the upper die 3 and a fixed plate 15 are connected with each other through a screw 13, so that the lower die 2 and the upper die 3 are connected more tightly, and the positioning precision is increased; secondly, the belt 6 is driven to synchronously rotate the two screw rods 4 through the rotation of the screw rods 4 in the limiting assembly, the two limiting blocks 5 slide towards the lower die 2 through the bidirectional thread structure on the surfaces of the screw rods 4, the lower die 2 is limited, and the die is stabilized to reduce the module shaking and influence on a plastic film; then pour the material into the mould through feed inlet 9, through the fin 11 preliminary cooling in lower mould 2 and the last mould 3, work liquid 19 in the rethread heat pipe subassembly absorbs the heat at the evaporation layer 20 of body 16 and evaporates, get into condensation layer 17 through imbibition core 18 and further distribute away the heat, work liquid 19 after the condensation gets back to evaporation layer 20 again through imbibition core 18, so circulation guarantees to last the heat dissipation, dispel the heat fast to the mould, because heat pipe subassembly fixed connection inlays piece 8 and mounting panel 7 formation mosaic structure, can carry out quick replacement when making the heat pipe subassembly damage, thereby increase work efficiency.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. The utility model provides a novel semiconductor plastic envelope mould which characterized in that: including workstation (1), workstation (1) top fixedly connected with is spacing subassembly, workstation (1) top fixedly connected with fixed subassembly, workstation (1) top fixedly connected with bed die (2), bed die (2) upper end is provided with mould (3), mounting groove (10) have been seted up to bed die (2) and last mould (3) inside, mounting groove (10) inside are provided with mounting panel (7), mounting panel (7) one side fixedly connected with embedding piece (8), embedding piece (8) one side fixedly connected with heat pipe assembly, bed die (2) and last mould (3) inside are provided with a plurality of fin (11).
2. The novel semiconductor plastic package mold according to claim 1, characterized in that: the limiting assembly comprises a fixing block (21), a screw rod (4) is arranged inside the fixing block (21), a limiting block (5) is arranged on the outer wall of the screw rod (4), and a belt (6) is arranged at one end of the screw rod (4).
3. The novel semiconductor plastic package mold according to claim 1, characterized in that: the fixing assembly comprises a fixing column (12), a screw rod (13), a movable plate (14) and a fixed plate (15), the bottom end of the fixing column (12) is fixedly connected to the upper end of the workbench (1), one end of the fixed plate (15) is fixedly connected to the inside of the fixing column (12), one end of the movable plate (14) is fixedly connected to the outer wall of the upper die (3), and the screw rod (13) is arranged inside the fixing column (12).
4. The novel semiconductor plastic package mold according to claim 1, characterized in that: the heat pipe component comprises a pipe body (16), a condensation layer (17), a liquid absorbing core (18), working liquid (19) and an evaporation layer (20), wherein the pipe body (16) is fixedly connected to one side of the embedded block (8), the condensation layer (17) is arranged at one end inside the pipe body (16), the liquid absorbing core (18) is arranged on two sides inside the pipe body (16), the evaporation layer (20) is arranged at one end, far away from the condensation layer (17) in the pipe body (16), of the condensation layer (17), and the working liquid (19) is arranged between the condensation layer (17) and the evaporation layer (20).
5. The novel semiconductor plastic package mold according to claim 2, characterized in that: the surface of the screw rod (4) is in a bidirectional thread structure by using mutual symmetry of a central axis, and the two screw rods (4) form a transmission structure through a belt (6).
6. The novel semiconductor plastic package mold according to claim 1, characterized in that: feed inlet (9) have been seted up at last mould (3) top middle part, feed inlet (9), bed die (2) and last mould (3) constitute the connectivity, and bed die (2) and last mould (3) cross sectional area equal.
7. The novel semiconductor plastic package mold according to claim 1, characterized in that: the heat pipe component is fixedly connected with the embedded block (8) and the mounting plate (7) to form a splicing structure, and the cross sections of the lower die (2) and the upper die (3) of the heat pipe component are of a symmetrical structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122358258.7U CN215943482U (en) | 2021-09-28 | 2021-09-28 | Novel semiconductor plastic package mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122358258.7U CN215943482U (en) | 2021-09-28 | 2021-09-28 | Novel semiconductor plastic package mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215943482U true CN215943482U (en) | 2022-03-04 |
Family
ID=80424363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122358258.7U Expired - Fee Related CN215943482U (en) | 2021-09-28 | 2021-09-28 | Novel semiconductor plastic package mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215943482U (en) |
-
2021
- 2021-09-28 CN CN202122358258.7U patent/CN215943482U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220304 |