CN215943184U - Double faced adhesive tape anti-overflow gluing mould for flexible circuit board - Google Patents
Double faced adhesive tape anti-overflow gluing mould for flexible circuit board Download PDFInfo
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- CN215943184U CN215943184U CN202122573502.1U CN202122573502U CN215943184U CN 215943184 U CN215943184 U CN 215943184U CN 202122573502 U CN202122573502 U CN 202122573502U CN 215943184 U CN215943184 U CN 215943184U
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Abstract
The utility model discloses a double faced adhesive tape anti-overflow glue mould for a flexible circuit board, which is used for punching the double faced adhesive tape and comprises: the upper die is provided with a punch, a continuous cutting edge is arranged along the profile of the lower end face of the punch, the cutting edge is limited by a first cutting surface which is flush with the outer wall surface of the punch and a second cutting surface which is obliquely crossed with the first cutting surface, the second cutting surface is crossed with the first cutting surface to form a cutting edge of the cutting edge, the plane of the cutting edge is vertical to the longitudinal axis of the punch, and the cutting edge forms a glue overflow groove at the lower end of the punch; and the lower die is provided with a blanking hole, the blanking hole is coaxial with the axial direction of the punch, and the edge of the upper end of the blanking hole is matched with the cutting edge of the punch to cut the double-faced adhesive tape. The cutting edge is provided with a blade point, and the sharp blade point reduces the deformation at the cut and reduces the stretching effect on the material; the contact area between the cutting edge and the double-sided adhesive tape is small, so that the extrusion of the double-sided adhesive tape is reduced, and the amount of the overflowing adhesive is reduced; the second knife face has the tendency of pushing the waste material to the glue overflow groove, thereby reducing glue overflow on the product side.
Description
Technical Field
The utility model relates to the technical field of die cutting, in particular to a double-sided adhesive tape anti-overflow mould for a flexible circuit board.
Background
In the process of manufacturing a flexible circuit board or the like, it is often necessary to perform a cutting molding process on the surface of a tape such as a double-sided tape by using a die. The punch of a general punching die is a plane knife edge, the punch is matched with a female die to break materials and punch down waste materials through shearing force, the direct punching and waste discharge of the die are realized, manual waste discharge is not needed, and for thicker double-sided adhesive tapes, the size of a product exceeds tolerance due to the fact that the excessive adhesive is large due to material stretching.
SUMMERY OF THE UTILITY MODEL
According to one aspect of the utility model, the utility model provides a double-sided adhesive tape overflow-proof mold for a flexible circuit board, which is used for solving the problem of adhesive overflow when a thick double-sided adhesive tape is punched.
The utility model provides a two-sided adhesive tape anti-overflow glues mould for flexible circuit board for die-cut two-sided adhesive tape includes:
the upper die is provided with a punch, a continuous cutting edge is arranged along the profile of the lower end face of the punch, the cutting edge is limited by a first cutting surface which is flush with the outer wall surface of the punch and a second cutting surface which is obliquely crossed with the first cutting surface, the second cutting surface is crossed with the first cutting surface to form a cutting edge of the cutting edge, the plane of the cutting edge is vertical to the longitudinal axis of the punch, and the cutting edge forms a glue overflow groove at the lower end of the punch; and
the lower die is provided with a blanking hole, the blanking hole is coaxial with the axial direction of the punch, and the edge of the upper end of the blanking hole is matched with the cutting edge of the punch to cut the double faced adhesive tape.
In some embodiments, the punch has a circular, square, or rectangular cross-section.
In some embodiments, the depth of the glue overflow groove is greater than the thickness of the double-sided adhesive tape.
In some embodiments, the upper die comprises a first upper die plate, a second upper die plate, a third upper die plate and a fourth upper die plate which are sequentially arranged from top to bottom, the punch is connected with the second upper die plate, a spring is arranged between the second upper die plate and the third upper die plate, and the spring is sleeved outside the punch.
In some embodiments, the lower surface of the second upper template is provided with a first groove, the upper surface of the third upper template is provided with a second groove opposite to the first groove, and two ends of the spring are respectively arranged in the first groove and the second groove.
In some embodiments, the blanking hole penetrates through the lower die, and the cross-sectional dimension of the blanking hole is enlarged from top to bottom in sequence.
In some embodiments, the lower die comprises a first lower die plate, a second lower die plate, a third lower die plate and a lower die base which are sequentially arranged from top to bottom, and the cross section sizes of the blanking hole parts on the first lower die plate, the second lower die plate, the third lower die plate and the lower die base are sequentially increased.
The utility model has the beneficial effects that:
(1) the cutting edge is provided with a blade point, and the sharp blade point reduces the deformation at the cut and reduces the stretching effect on the material;
(2) the contact area between the cutting edge and the double-sided adhesive tape is small, so that the extrusion of the double-sided adhesive tape is reduced, and the amount of the overflowing adhesive is reduced;
(3) the second knife face has the tendency of pushing the waste material to the glue overflow groove, thereby reducing glue overflow on the product side.
Drawings
Fig. 1 is a cross-sectional view of a double-sided adhesive tape mold for a flexible circuit board in an open state according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of a double-sided adhesive tape mold for a flexible circuit board according to an embodiment of the present invention in a mold clamping state.
Fig. 3 is a partial cross-sectional view of the lower end of the punch of the double-sided adhesive tape overflow preventing mold for a flexible circuit board according to an embodiment of the present invention.
Description of the symbols:
the device comprises an upper die 1, a lower die 2, a guide pillar 3, a guide sleeve 4, a punch 5, a blanking hole 6, a cutting edge 7, an outer wall surface 8, a first knife surface 9, a second knife surface 10, an adhesive overflow groove 11, a knife edge 12, a plane 13, a longitudinal axis 14, a first upper die plate 15, a second upper die plate 16, a third upper die plate 17, a fourth upper die plate 18, a spring 19, a first groove 20, a second groove 21, a first lower die plate 22, a second lower die plate 23, a third lower die plate 24 and a lower die holder 25
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, a double-sided adhesive tape overflow preventing mold for a flexible circuit board, which is used for punching a double-sided adhesive tape, includes an upper mold 1 and a lower mold 2 matched with the upper mold 1. The upper die 1 can move towards and away from the lower die 2 along a straight line under the guidance of the guide post 3 and the guide sleeve 4. The upper die 1 is provided with a punch 5, and the lower die 2 is provided with a blanking hole 6 matched with the punch 5. The punch 5 and the blanking hole 6 have a circular, square or rectangular cross-section for punching a circular, square or rectangular hole in the double-sided adhesive tape.
Referring to fig. 3, a continuous cutting edge 7 is provided along the profile of the lower end face of the punch 5, the cutting edge 7 being defined by a first cutting face 9 flush with the outer wall surface 8 of the punch 5 and a second cutting face 10 oblique to the first cutting face 9. As is clear from fig. 3, the cross-section of the cutting edge 7 is wedge-shaped. The cutting edge 7 encloses a glue overflow groove 11 at the lower end of the punch 5, and the second knife face 10 faces the glue overflow groove 11. Preferably, the depth of the glue overflow groove 11 is greater than the thickness of the double-sided adhesive tape, so that the entire double-sided adhesive tape is completely cut by the blade 7. The second knife face 10 and the first knife face 9 intersect to form a knife edge 12 of the knife edge 7, and a plane 13 where the knife edge 12 is located is perpendicular to a longitudinal axis 14 of the punch 5, so that all positions of the knife edge 7 during punching are kept, double-sided adhesive tape is punched simultaneously, and incomplete cutting caused by cutting of parts and non-cutting of parts is avoided. The blanking hole 6 is coaxial with the longitudinal axis 14 of the punch 5, and the upper end edge of the blanking hole 6 is matched with the cutting edge 7 of the punch 5 to cut the double-sided adhesive tape. In the embodiment, the blade 7 is provided with the blade 12, and the sharp blade 12 reduces the deformation amount at the cut part, reduces the stretching effect on the material and further reduces the glue overflow; the contact area of the cutting edge 7 and the double-sided adhesive tape is small, so that the extrusion of the double-sided adhesive tape is reduced, and the amount of the overflowing adhesive tape is reduced; the second blade face 10 has a tendency to push the scrap toward the glue overflow groove 11, thereby suppressing glue overflow on the product side.
In some embodiments, referring to fig. 1 and 2, the upper die 1 includes a first upper die plate 15, a second upper die plate 16, a third upper die plate 17, and a fourth upper die plate 18, which are sequentially disposed from top to bottom, the punch 5 is connected to the second upper die plate 16, a spring 19 is disposed between the second upper die plate 16 and the third upper die plate 17, and the spring 19 is sleeved outside the punch 5. The third upper die plate 17 and the fourth upper die plate 18 are connected and elastically movable back and forth relative to the first upper die plate 15 and the second upper die plate 16 by a spring 19. When not closed, the spring 19 pushes the third upper template 17 and the fourth upper template 18 away from the second upper template 16; after the mold is closed, the lower mold 2 pushes the fourth upper platen 18, causing the spring 19 to compress and give the second upper platen 16 a reaction force, and the larger this reaction force is with the downward movement of the upper mold 1, so the spring 19 can limit the blanking depth of the punch 5.
In some embodiments, referring to fig. 1 and 2, the lower surface of the second upper mold plate 16 is provided with a first groove 20, the upper surface of the third upper mold plate 17 is provided with a second groove 21 opposite to the first groove 20, and two ends of the spring 19 are respectively disposed in the first groove 20 and the second groove 21.
In some embodiments, referring to fig. 1 and 2, the blanking hole 6 penetrates through the lower mold 2, and the cross-sectional dimension of the blanking hole 6 is enlarged from top to bottom. Specifically, the lower die 2 includes a first lower die plate 22, a second lower die plate 23, a third lower die plate 24 and a lower die base 25 which are sequentially arranged from top to bottom, and the cross-sectional sizes of the blanking holes 6 on the first lower die plate 22, the second lower die plate 23, the third lower die plate 24 and the lower die base 25 are sequentially increased. The cross section of the blanking hole 6 is gradually enlarged, which has the advantages of facilitating the removal of waste materials and preventing the waste materials from blocking the blanking hole 6.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the utility model.
Claims (7)
1. The utility model provides a two-sided adhesive tape anti-overflow glues mould for flexible circuit board for die-cut two-sided adhesive tape, its characterized in that includes:
the upper die is provided with a punch, a continuous cutting edge is arranged along the profile of the lower end face of the punch, the cutting edge is limited by a first cutting surface which is flush with the outer wall surface of the punch and a second cutting surface which is obliquely crossed with the first cutting surface, the second cutting surface is crossed with the first cutting surface to form a cutting edge of the cutting edge, the plane of the cutting edge is vertical to the longitudinal axis of the punch, and the cutting edge forms a glue overflow groove at the lower end of the punch; and
the lower die is provided with a blanking hole, the blanking hole is coaxial with the axial direction of the punch, and the edge of the upper end of the blanking hole is matched with the cutting edge of the punch to cut the double faced adhesive tape.
2. The double-sided tape overflow preventing die for the flexible circuit board as recited in claim 1, wherein the cross section of the punch is circular, square or rectangular.
3. The double-sided adhesive tape overflow preventing mold for the flexible circuit board as recited in claim 1, wherein the depth of the overflow groove is greater than the thickness of the double-sided adhesive tape.
4. The double sided tape glue overflow prevention die for the flexible circuit board as recited in claim 1, wherein the upper die comprises a first upper die plate, a second upper die plate, a third upper die plate and a fourth upper die plate sequentially arranged from top to bottom, the punch is connected with the second upper die plate, a spring is arranged between the second upper die plate and the third upper die plate, and the spring is sleeved outside the punch.
5. The mold of claim 4, wherein a first groove is formed on a lower surface of the second upper mold plate, a second groove opposite to the first groove is formed on an upper surface of the third upper mold plate, and two ends of the spring are respectively disposed in the first groove and the second groove.
6. The double-sided adhesive tape overflow preventing mold for the flexible circuit board as recited in claim 1, wherein the blanking hole penetrates through the lower mold, and the cross-sectional dimensions of the blanking hole are enlarged sequentially from top to bottom.
7. The double-sided adhesive tape overflow-preventing die for the flexible circuit board as recited in claim 1, wherein the lower die comprises a first lower die plate, a second lower die plate, a third lower die plate and a lower die base which are sequentially arranged from top to bottom, and the cross-sectional sizes of the blanking hole portions on the first lower die plate, the second lower die plate, the third lower die plate and the lower die base are sequentially increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122573502.1U CN215943184U (en) | 2021-10-25 | 2021-10-25 | Double faced adhesive tape anti-overflow gluing mould for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122573502.1U CN215943184U (en) | 2021-10-25 | 2021-10-25 | Double faced adhesive tape anti-overflow gluing mould for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215943184U true CN215943184U (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122573502.1U Active CN215943184U (en) | 2021-10-25 | 2021-10-25 | Double faced adhesive tape anti-overflow gluing mould for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215943184U (en) |
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2021
- 2021-10-25 CN CN202122573502.1U patent/CN215943184U/en active Active
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