CN215942700U - Attaching jig - Google Patents

Abstract

The utility model provides an attaching jig which is used for attaching a heat conduction material and comprises a bottom plate and at least one protruding part. The at least one protrusion extends from the bottom plate towards a first direction, the first direction is perpendicular to the bottom plate, each of the at least one protrusion has a top surface, the top surface is perpendicular to the first direction and is attached with the heat conduction material, the attaching jig is configured to move along the first direction to contact a heat sink, and the heat conduction material of each of the at least one protrusion is transferred and attached to the heat sink.

Description

Attaching jig

Technical Field

The present invention relates to an attaching jig, and more particularly, to an attaching jig for attaching a heat conductive material.

Background

With the progress of technology, various electronic products are gradually developed toward a design concept of being light, thin, short, small, and more electronic components (such as a sensor, a chip, a central processing unit, and the like) are required to achieve higher performance inside the electronic products.

In the conventional method, the heat conductive material is attached to each electronic component, and because the electronic components often have different sizes and heights, the heat conductive material can only be manually attached to each electronic component one by one, thereby ensuring that the heat conductive material is accurately attached to each electronic component. However, such a method is relatively labor-consuming and time-consuming, and is also prone to reduce the yield of the product due to improper manual operation, so how to quickly attach the heat conductive material is still a big problem.

SUMMERY OF THE UTILITY MODEL

Therefore, in the embodiment of the utility model, the attaching jig is provided, the heat conduction material can be rapidly and accurately attached between all the electronic elements and the heat radiator at one time, and in addition, the heat conduction material can be positioned and attached between partial electronic elements and the heat radiator only aiming at a specific area by virtue of the combinability of the attaching jig, so that the labor time cost can be greatly reduced, and the product yield can be improved.

An embodiment of the present disclosure provides an attaching jig for attaching a heat conductive material, including a base plate and at least one protrusion. The at least one protrusion extends from the bottom plate in a first direction perpendicular to the bottom plate, wherein each of the at least one protrusion has a top surface perpendicular to the first direction and attached to the heat conductive material, and wherein the attaching jig is configured to move along the first direction to contact a heat sink and transfer and attach the heat conductive material of each of the at least one protrusion to the heat sink.

According to some embodiments of the present disclosure, the at least one protrusion is two or more, and each of the plurality of protrusions has a different height when viewed along a second direction perpendicular to the first direction. Wherein each of the plurality of projections has a different one of the sizes when viewed along the first direction. Wherein at least one of the projections includes a first projection, a second projection, and a third projection, and when viewed along the first direction, a distance between any two of the first projection, the second projection, and the third projection is different.

According to some embodiments of the present disclosure, the heat sink includes at least one boss, and each of the at least one protrusion of the attachment jig corresponds to each of the at least one boss of the heat sink and has the same shape. Each of the at least one boss is any one of an electronic component and a bump, wherein the bump is made of the same material as the heat sink and extends from the heat sink along the first direction.

According to some embodiments of the present disclosure, the backplane includes a plurality of daughter boards. The daughter boards differ in shape.

According to some embodiments of the present disclosure, the attaching jig further includes a plurality of positioning holes disposed through the bottom plate, wherein the heat sink includes a plurality of positioning posts, and the positioning holes and the positioning posts are matched with each other.

According to some embodiments of the present disclosure, the bottom plate has a first surface and a second surface, the first surface and the second surface face opposite directions, and the first surface and the second surface are perpendicular to the first direction. At least one projection extends from the first surface along a first direction. The second surface is configured to be grasped by a human or an automated device to move the first surface toward the heat sink and in a first direction.

Drawings

The present disclosure will become more fully understood from the detailed description given herein below and the accompanying drawings. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of presentation.

Fig. 1 is a perspective view of an attachment jig according to an embodiment of the disclosure.

Fig. 2 is an exploded view of an electronic assembly according to an embodiment of the present disclosure.

Fig. 3 is a perspective view of a circuit board according to an embodiment of the disclosure.

Fig. 4 is a schematic view of an attachment jig and an electronic component according to an embodiment of the disclosure.

Fig. 5 is a perspective view of an attachment jig according to another embodiment of the disclosure.

Description of the reference numerals

1, 1' attaching jig

10, 10' bottom plate

11' daughter board

20: bulge

20A first projection

20B second projection

20C third projection

21 top surface

30, positioning hole

100 electronic component

110: outer casing

120: circuit board

130 heat sink

131 the bottom surface

132 boss

133 positioning column

D1 first direction

D2 second direction

E electronic component

H is height

S surface

S1 first surface

S2 second surface

Detailed Description

In order to make the objects, features and advantages of the present disclosure more comprehensible, embodiments accompanied with figures are described in detail below. The arrangement of the components in the embodiments is illustrative and not intended to limit the disclosure. And the reference numerals in the drawings are repeated for simplicity of explanation, and do not necessarily indicate any relationship between the different embodiments. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are referred to only in the direction of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. Moreover, the use of ordinal numbers such as first, second and third does not necessarily imply a sequential sense of rank, but may merely distinguish between multiple instances of an action or structure.

Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

First, please refer to fig. 1 and fig. 2 to understand an attaching jig 1 for attaching a heat conductive material and an electronic component 100 assembled by applying the attaching jig 1. Fig. 1 is a perspective view of an attachment jig 1 according to an embodiment of the present disclosure, and fig. 2 is an exploded view of an electronic component 100 according to an embodiment of the present disclosure. The attaching jig 1 has a flat plate shape and includes a base plate 10, at least one protrusion 20, and a plurality of positioning holes 30. The base plate 10 has a first surface S1 and a second surface S2 (shown in fig. 4), the first surface S1 and the second surface S2 are parallel to each other and face in opposite directions. In the example of fig. 1, a plurality of projections 20 are shown, and the projections 20 extend from the first plane S1 of the base plate 10 toward a first direction D1, the first direction D1 being perpendicular to the first surface S1 and the second surface S2 of the base plate 10. The positioning hole 30 is provided through the base plate 10.

In the embodiment, the electronic assembly 100 is a combination of some components applied to a vehicle-mounted system, but is not limited thereto, and may be applied to other systems. The electronic assembly 100 includes a housing 110, a circuit board 120, and a heat sink 130. The housing 110 loads the circuit board 120 and the heat sink 130 therein to protect components loaded therein from damage.

Fig. 3 is a perspective view of a circuit board 120 according to an embodiment of the disclosure. The circuit board 120 has a shape similar to the heat sink 130, wherein a surface S of the circuit board 120 is configured with a plurality of electronic components E, such as sensors, chips, and cpus. As shown in fig. 2, the circuit board 120 is mounted on the heat sink 130 such that the surface S on which the plurality of electronic components E are arranged faces the heat sink 130.

The heat sink 130 may be a water-cooling plate made of metal material, which helps to remove the waste heat generated by the electronic components E on the circuit board 120 during operation. The heat sink 130 includes a bottom surface 131, at least one protrusion 132, and a plurality of positioning posts 133. The bosses 132 protrude from the bottom surface 131 in the first direction D1. The positioning posts 133 are matched with the positioning holes 30 of the attaching jig 1.

In the present embodiment, a plurality of bosses 132 are shown, and each electronic component E on the circuit board 120 has a corresponding boss 132. In some embodiments, the plurality of bumps 132 may all be bumps made of the same material as the heat spreader 130 (e.g., the metal material mentioned above), integrally formed by protruding from a bottom surface 131 of the heat spreader 130 along the first direction D1, or formed by soldering the bumps to the bottom surface 131. In other embodiments, some of the plurality of bumps 132 may be the above bumps, and other portions may be the electronic element E disposed on the bottom surface 131 of the heat sink 130.

Referring back to fig. 1, each protrusion 20 of the attaching jig 1 has a top surface 21, the top surface 21 is perpendicular to the first direction D1 and is attached with a heat conductive material (not shown), which may be a heat conductive paste or a sheet-shaped heat conductive adhesive with different double-sided adhesive properties, but is not limited thereto and may be changed as required. Each of the plurality of protrusions 20 may have a different height H when viewed along a second direction D2 perpendicular to the first direction D1. And each of the plurality of protrusions 20 has a different one size when viewed along the first direction D1, respectively. Wherein the plurality of protruding portions 20 include a first protruding portion 20A, a second protruding portion 20B, and a third protruding portion 20C, when viewed along the first direction D1, a distance between any two of the first protruding portion 20A, the second protruding portion 20B, and the third protruding portion 20C is different.

That is, each protrusion 20 of the attaching jig 1 is disposed in a manner that each protrusion 20 of the attaching jig 1 corresponds to each protrusion 132 of the heat sink 130 and has the same shape according to the protrusion 132 of the heat sink 130.

Next, the operation of the attachment jig 1 to attach the heat conductive material between the heat sink 130 and the electronic component E will be described with reference to fig. 1 to 4, and fig. 4 is a schematic view of the attachment jig 1 and the electronic component 100 according to an embodiment of the disclosure. As shown in fig. 4, before the circuit board 120 is assembled on the heat sink 130, the attachment jig 1 to which the thermal conductive material is attached is oriented toward the heat sink 130 with the first surface S1, and the positioning holes 30 of the attachment jig 1 are aligned with the positioning posts 133 of the heat sink 130, and then the attachment jig 1 is moved close to the heat sink 130 along the first direction D1.

In some embodiments, the assembly process may be accelerated by, for example, an automated device to grasp the second surface S2 of the attachment jig 1 and move the attachment jig 1, but the assembly process is not limited thereto, and a manual grasping manner may be used.

In some embodiments, the attaching jig 1 may be moved to the correct assembly position above the electronic component 100 by using an image Device having a Charge Coupled Device (CCD), for example, instead of being positioned by the positioning holes and the positioning posts. By positioning the heat sink 130 by using the above-mentioned automatic apparatus and moving the attaching jig 1 in the first direction D1, the heat conductive material can be accurately attached between the heat sink 130 and the electronic component E by reducing the attaching skew during the subsequent attaching of the heat conductive material.

Since the shape, size, height and configuration of each protrusion 20 of the attaching jig 1 correspond to each corresponding boss 132 on the heat sink 130, when the attaching jig 1 approaches the heat sink 130 to a certain distance, the heat conductive material on the protrusion 20 of the attaching jig 1 contacts the boss 132 of the heat sink 130.

In some embodiments, the side with smaller viscosity can be attached to the top surface 21 of the protrusion 20 of the attaching jig 1 in advance by using a heat conductive material (e.g., a sheet-shaped heat conductive adhesive) with different viscosities at two sides, and the other side with larger viscosity faces the boss 132, so that when the heat conductive material on the protrusion 20 of the attaching jig 1 contacts the boss 132 of the heat sink 130, the heat conductive material can be transferred to each corresponding boss 132 attached to the heat sink 130 by the other side with larger viscosity.

Alternatively, in other embodiments, the heat conductive material may be applied to the top surfaces 21 of the protrusions 20 of the attaching jig 1 in advance by using a paste-like heat conductive material (e.g., a heat conductive paste), so that when the heat conductive material on the protrusions 20 of the attaching jig 1 contacts the bosses 132 of the heat sink 130, the paste-like heat conductive material can be transferred to each of the bosses 132 of the heat sink 130.

Next, after confirming that the heat conductive material is attached to each of the corresponding bosses 132 of the heat sink 130, the attaching jig 1 is moved to be away from the heat sink 130 along the first direction D1, and then the circuit board 120 is mounted on the heat sink 130 such that the surface S on which the plurality of electronic components E are disposed faces the heat sink 130. Since each electronic element E on the circuit board 120 has a corresponding boss 132, when the circuit board 120 is mounted on the heat sink 130, the heat conductive material transferred to the bosses 132 is attached between each electronic element E and the corresponding boss 132, so as to enhance the heat conduction efficiency, improve the operation performance of the electronic element E, and prevent the life reduction thereof.

Therefore, the attaching jig 1 of the embodiment can rapidly and widely attach the heat conductive material, in addition, the material of the attaching jig 1 can include plastic, metal, acryl, polyethylene terephthalate, and the like, and a suitable material can be selected according to the requirement, and since the attaching jig 1 can be easily formed by the above materials and the cost is low, the attaching jig 1 has the advantages of easy manufacture and low cost.

In other embodiments, as shown in fig. 5, fig. 5 is a perspective view of an attachment jig 1 ' according to another embodiment of the disclosure, in which a bottom plate 10 ' includes a plurality of sub-plates 11 ' having different shapes, and each of the sub-plates 11 ' having different shapes forms a bottom plate 10 ' having a nearly rectangular shape. Under the condition that the heat conduction materials between part of the electronic component E and the heat sink 130 may need to be re-attached, the attaching jig 1 'of the present disclosure may not need to replace all the heat conduction materials, but only needs to re-attach the heat conduction materials to the corresponding sub-board 11' for a specific partial area, thereby more rapidly completing the replacement of the heat conduction materials and reducing the replacement cost. Although the number of sub-boards is three and the shape of the composition is approximately rectangular in the embodiment of fig. 5, the number of sub-boards, the respective shapes, and the shape of the composition may be changed as desired.

In summary, the present disclosure provides an attachment jig including a base plate and at least one protrusion. The attaching jig is configured to move along a first direction to contact the heat sink, and transfer and attach the heat conductive material of each of the at least one protrusion to the heat sink. By the attaching jig disclosed in the present disclosure, the heat conductive material can be attached to all electronic components and the heat sink at one time quickly and accurately, thereby increasing the operation efficiency of the electronic components and avoiding the reduction of the lifetime thereof. In addition, by means of the combinability of the attaching jig, the attaching jig can be positioned and attached between partial electronic components and the radiator only aiming at a specific area, so that the labor, the time and the cost can be greatly reduced, and the product yield can be improved.

Although embodiments of the present invention and their advantages have been described above, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will be obvious to one skilled in the art from this disclosure may be utilized according to the present application as many equivalents of the presently available embodiments of the present application are possible and equivalents may be developed in that way. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.

Claims (10)

1. An attaching jig for attaching a heat conductive material, comprising:

a base plate; and

at least one protrusion extending from the base plate in a first direction perpendicular to the base plate, wherein each of the at least one protrusion has a top surface perpendicular to the first direction and attached to the thermally conductive material,

the attaching jig is configured to move along the first direction to contact a heat sink, and transfer and attach the heat conductive material of each of the at least one protrusion to the heat sink.

2. The attaching jig of claim 1, wherein the at least one protrusion is two or more, and each of the at least one protrusion has a different height when viewed along a second direction perpendicular to the first direction.

3. The attachment jig of claim 2, wherein each of the at least one protrusion has a different size when viewed along the first direction.

4. The attachment jig of claim 2, wherein the at least one protrusion includes a first protrusion, a second protrusion, and a third protrusion, and a distance between any two of the first protrusion, the second protrusion, and the third protrusion is different when viewed along the first direction.

5. The attaching jig of claim 1, wherein the heat spreader includes at least one protrusion, and each of the at least one protrusion of the attaching jig corresponds to each of the at least one protrusion of the heat spreader and has a same shape.

6. The attaching jig of claim 5, wherein each of the at least one boss is any one of an electronic component and a bump, the bump having the same material as the heat sink and extending from the heat sink along the first direction.

7. The attachment jig of claim 1, wherein the bottom plate comprises a plurality of sub-plates.

8. The attaching jig of claim 7, wherein the plurality of sub-boards are different in shape.

9. The attachment jig of claim 1, further comprising a plurality of positioning holes disposed through the base plate, wherein the heat spreader comprises a plurality of positioning posts, and the plurality of positioning holes and the plurality of positioning posts are engaged with each other.

10. The attachment jig of claim 1, wherein the base plate has a first surface and a second surface, the first surface and the second surface facing opposite directions and the first surface and the second surface being perpendicular to the first direction, wherein the at least one protrusion extends from the first surface along the first direction, and the second surface is configured to be grasped by one of a human or an automated device to move the first surface toward the heat sink and along the first direction.

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