CN215941275U

CN215941275U - Hardware processing is with mould that has heat radiation structure

Info

Publication number: CN215941275U
Application number: CN202121993061.4U
Authority: CN
Inventors: 陈德; 毛新; 张�诚; 蔡达
Original assignee: Huizhou Xiangzhen Hardware Products Co ltd
Current assignee: Huizhou Xiangzhen Hardware Products Co ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-03-04
Anticipated expiration: 2031-08-23

Abstract

The utility model discloses a die with a heat dissipation structure for hardware machining, and belongs to the technical field of hardware machining. When the stamping die is used for radiating heat, the first heat radiating device and the second heat radiating device can carry out omnibearing heat radiating operation on hardware in the stamping die.

Description

Hardware processing is with mould that has heat radiation structure

Technical Field

The utility model relates to the technical field of hardware machining, in particular to a mold with a heat dissipation structure for hardware machining.

Background

The tools and products used in daily production and life are as large as the base and the body shell of a machine tool and as small as the shell of a button screw and a button and various household appliances, and have no close relation with a die, while a hardware die is a necessary tool for producing hardware parts in industrial production and is a part in a required shape by manufacturing metal materials.

The patent publication No. CN212494929U relates to a hardware processing is with mould that has heat radiation structure, including workstation main part, mould main part and stamping workpiece main part, the mould main part is installed on workstation main part top, the stamping workpiece main part is installed on mould main part top, workstation main part top is provided with heat dissipation mechanism, mould main part top is provided with buffer gear. According to the device, the first valve is opened, cold water enters the conduit through the water injection tank, so that the main body of the die is cooled, when water in the conduit needs to be replaced, the second valve is opened, at the moment, waste water enters the waste water tank through the connecting pipe, so that the waste water is recycled.

However, the above device has the following problems that when the mold is radiated, the radiating effect is not good, and the subsequent hardware processing is affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a die with a heat dissipation structure for hardware processing, and aims to solve the problems in the prior art.

The embodiment of the utility model adopts the following technical scheme: the utility model provides a hardware processing is with mould that has heat radiation structure, includes mounting bracket, stamping device, stamping die, first heat abstractor and second heat abstractor, stamping die sets up the top at the mounting bracket, stamping device is located the top of mounting bracket, first heat abstractor is located stamping die, second heat abstractor is located the mounting bracket, second heat abstractor's air-out end is towards stamping die.

Furthermore, a storage groove is formed in the stamping die, and a plurality of heat dissipation holes are formed in the stamping die.

Further, first heat abstractor includes circulating pipe, inlet tube, outlet pipe and header tank, the circulating pipe is equipped with a plurality ofly, and is a plurality of the circulating pipe is linked together, and is a plurality of the equidistant storage tank that sets up in stamping die of circulating pipe, the inlet tube is located stamping die and is linked together with the circulating pipe, the outlet pipe is linked together with the circulating pipe, the header tank is located the bottom of mounting bracket.

Furthermore, three air outlet fans are arranged on the stamping die and face the circulating pipe in the storage tank.

Furthermore, the second heat dissipation device comprises a heat dissipation fan, two moving blocks, two moving screw rods and two moving motors, wherein the two moving blocks are symmetrically arranged at two ends of the heat dissipation fan, and an air outlet end of the heat dissipation fan faces towards the bottom of the stamping die.

Further, stamping device includes stamping frame, punching press jar, mounting panel, punching press piece and two carriage release levers, the stamping frame erects in the bottom of mounting bracket and is located stamping die's top, the punching press jar is located stamping frame's top, the mounting panel is located the flexible of punching press jar and serves, the punching press piece is located the bottom of mounting panel, two the carriage release lever symmetry sets up on stamping die, mounting panel and two carriage release lever sliding fit, the bottom of mounting panel is located and is equipped with buffer spring on two carriage release levers.

The embodiment of the utility model adopts at least one technical scheme which can achieve the following beneficial effects:

firstly, the cold air is conveyed into the hardware through the heat dissipation holes, the heat dissipation holes can dissipate heat of the stamping die, the cold water can be fed into the water inlet pipe, the hardware in the stamping die is subjected to heat dissipation operation through the circulation pipes, and the heat dissipated water is conveyed to the water collection tank through the water outlet pipe after heat dissipation.

Secondly, the three air outlet fans can radiate the water in the circulating pipe, and can also convey the radiated cold air into the stamping die through the radiating holes to radiate the stamping die.

Thirdly, the two moving motors work to drive the two moving screw rods to rotate, the two moving blocks move to drive the heat dissipation fan to move, the heat dissipation fan moves to dissipate heat at different positions at the bottom of the stamping die, the heat dissipation is guaranteed to be uniform, and the stamping die is subjected to all-dimensional heat dissipation.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a first perspective view of the present invention;

FIG. 2 is a schematic perspective view of the present invention;

FIG. 3 is a front view of the present invention;

fig. 4 is a partial perspective view of the present invention.

Reference numerals:

the air-cooling device comprises a mounting frame 1, a stamping device 2, a stamping frame 21, a stamping cylinder 22, a mounting plate 23, a stamping block 24, a moving rod 25, a buffer spring 26, a stamping die 3, a storage tank 31, a heat dissipation hole 32, a first heat dissipation device 4, a circulating pipe 41, a water inlet pipe 42, a water outlet pipe 43, a water collection tank 44, a second heat dissipation device 5, a heat dissipation fan 51, a moving block 52, a moving screw 53, a moving motor 54 and an air outlet fan 6.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, an embodiment of the present invention provides a die with a heat dissipation structure for hardware processing, including a mounting frame 1, a stamping device 2, a stamping die 3, a first heat dissipation device 4, and a second heat dissipation device 5, where the stamping die 3 is disposed at the top of the mounting frame 1, the stamping device 2 is located at the top of the mounting frame 1, the first heat dissipation device 4 is located on the stamping die 3, the second heat dissipation device 5 is located on the mounting frame 1, and an air outlet end of the second heat dissipation device 5 faces the stamping die 3. Stamping device 2 carries out stamping operation to the five metals through stamping die 3, and when dispelling the heat to stamping die 3, first heat abstractor 4 and second heat abstractor 5 can carry out the omnidirectional operation that dispels the heat by the hardware in stamping die 3.

Specifically, a storage groove 31 is arranged in the stamping die 3, and a plurality of heat dissipation holes 32 are arranged on the stamping die 3; the first heat dissipation device 4 comprises a plurality of circulation pipes 41, a plurality of water inlet pipes 42, a plurality of water outlet pipes 43 and a water collection tank 44, the circulation pipes 41 are communicated with one another, the circulation pipes 41 are arranged in the storage grooves 31 in the stamping die 3 at equal intervals, the water inlet pipes 42 are located on the stamping die 3 and communicated with the circulation pipes 41, the water outlet pipes 43 are communicated with the circulation pipes 41, and the water collection tank 44 is located at the bottom of the mounting frame 1. Storage tank 31 is used for depositing circulating pipe 41, carries air conditioning to the hardware in through louvre 32, and a plurality of louvres 32 can dispel the heat to stamping die 3, and cold water can be advanced to inlet tube 42, dispels the heat the operation through the hardware in a plurality of circulating pipes 41 pair stamping die 3, carries radiating water to header tank 44 through outlet pipe 43 after the heat dissipation.

Specifically, three air outlet fans 6 are arranged on the stamping die 3, and the three air outlet fans 6 face the circulating pipe 41 in the storage tank 31. The three air outlet fans 6 can radiate the water in the circulation pipe 41, and can also convey the radiated cold air into the stamping die 3 through the plurality of radiating holes 32 to radiate the stamping die 3.

Specifically, the second heat dissipation device 5 includes a heat dissipation fan 51, two moving blocks 52, two moving screws 53 and two moving motors 54, the two moving blocks 52 are symmetrically disposed at two ends of the heat dissipation fan 51, and an air outlet end of the heat dissipation fan 51 faces the bottom of the stamping die 3. Two mobile motors 54 work to drive two mobile screws 53 to rotate, two moving blocks 52 move to drive a heat dissipation fan 51 to move, the heat dissipation fan 51 moves to dissipate heat of different positions at the bottom of the stamping die 3, the heat dissipation is guaranteed to be even, and the stamping die 3 is dissipated in all directions.

Specifically, stamping device 2 includes stamping frame 21, punching press jar 22, mounting panel 23, punching press piece 24 and two movable rods 25, stamping frame 21 erects in the bottom of mounting bracket 1 and is located stamping die 3's top, punching press jar 22 is located stamping frame 21's top, mounting panel 23 is located stamping cylinder 22's flexible end, punching press piece 24 is located mounting panel 23's bottom, two the symmetry of movable rod 25 sets up on stamping die 3, mounting panel 23 and two movable rod 25 sliding fit, mounting panel 23's bottom is located and is equipped with buffer spring 26 on two movable rods 25. The work of punching press jar 22 drives mounting panel 23 downstream, thereby mounting panel 23 downstream drives punching press piece 24 downstream and carries out stamping operation to the hardware in stamping die 3, and two movable rods 25 are at the in-process of punching press, and it is spacing to the removal of mounting panel 23, and two buffer spring 26 cushion the punching press of punching press piece 24.

The working principle of the utility model is as follows: when the utility model is used, the punching cylinder 22 works to drive the mounting plate 23 to move downwards, the mounting plate 23 moves downwards to drive the punching block 24 to move downwards so as to punch hardware in the punching die 3, the two moving rods 25 limit the movement of the mounting plate 23 in the punching process, the two buffer springs 26 buffer the punching of the punching block 24, the storage groove 31 is used for storing the circulating pipe 41, cold air is conveyed into the hardware through the heat dissipation holes 32, the heat dissipation holes 32 can dissipate the heat of the punching die 3, the water inlet pipe 42 can feed cold water, the hardware in the punching die 3 is subjected to heat dissipation operation through the circulating pipes 41, the heat dissipated water is conveyed to the water collection tank 44 through the water outlet pipe 43 after heat dissipation, the three air outlet fans 6 can dissipate the heat of the water in the circulating pipe 41, and the dissipated cold air can also be conveyed into the punching die 3 through the heat dissipation holes 32, the heat dissipation operation is performed on the stamping die 3, the two moving motors 54 work to drive the two moving screw rods 53 to rotate, the two moving blocks 52 move to drive the heat dissipation fan 51 to move, the heat dissipation fan 51 moves to dissipate heat at different positions at the bottom of the stamping die 3, the heat dissipation is guaranteed to be uniform, and the stamping die 3 is subjected to all-dimensional heat dissipation.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a hardware processing is with mould that has heat radiation structure, a serial communication port, including mounting bracket (1), stamping device (2), stamping die (3), first heat abstractor (4) and second heat abstractor (5), stamping die (3) set up the top at mounting bracket (1), stamping device (2) are located the top of mounting bracket (1), first heat abstractor (4) are located stamping die (3), second heat abstractor (5) are located mounting bracket (1), the air-out end of second heat abstractor (5) is towards stamping die (3).

2. The mold with the heat dissipation structure for hardware processing according to claim 1, characterized in that: a storage groove (31) is formed in the stamping die (3), and a plurality of heat dissipation holes (32) are formed in the stamping die (3).

3. The mold with the heat dissipation structure for hardware processing according to claim 2, characterized in that: first heat abstractor (4) are including circulating pipe (41), inlet tube (42), outlet pipe (43) and header tank (44), circulating pipe (41) are equipped with a plurality ofly, and a plurality ofly circulating pipe (41) are linked together, and a plurality of equidistant storage tank (31) of setting in stamping die (3) of circulating pipe (41), inlet tube (42) are located stamping die (3) and are linked together with circulating pipe (41), outlet pipe (43) are linked together with circulating pipe (41), header tank (44) are located the bottom of mounting bracket (1).

4. The mold with the heat dissipation structure for hardware processing according to claim 3, characterized in that: and three air outlet fans (6) are arranged on the stamping die (3), and the three air outlet fans (6) face to the circulating pipe (41) in the storage tank (31).

5. The mold with the heat dissipation structure for hardware processing according to claim 1, characterized in that: the second heat dissipation device (5) comprises a heat dissipation fan (51), two moving blocks (52), two moving screw rods (53) and two moving motors (54), the two moving blocks (52) are symmetrically arranged at two ends of the heat dissipation fan (51), and an air outlet end of the heat dissipation fan (51) faces the bottom of the stamping die (3).

6. The mold with the heat dissipation structure for hardware processing according to claim 1, characterized in that: stamping device (2) are including stamping frame (21), punching press jar (22), mounting panel (23), punching press piece (24) and two carriage release levers (25), stamping frame (21) erect in the bottom of mounting bracket (1) and are located the top of stamping die (3), punching press jar (22) are located the top of stamping frame (21), mounting panel (23) are located the flexible of punching press jar (22) and serve, punching press piece (24) are located the bottom of mounting panel (23), two carriage release lever (25) symmetry sets up on punching die (3), mounting panel (23) and two carriage release levers (25) sliding fit, the bottom of mounting panel (23) is located and is equipped with buffer spring (26) on two carriage release levers (25).