CN215935157U - Circuit board with shielding cavity - Google Patents
Circuit board with shielding cavity Download PDFInfo
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- CN215935157U CN215935157U CN202121892250.2U CN202121892250U CN215935157U CN 215935157 U CN215935157 U CN 215935157U CN 202121892250 U CN202121892250 U CN 202121892250U CN 215935157 U CN215935157 U CN 215935157U
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- dielectric layer
- shielding metal
- shielding
- cavity
- metal pillar
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Abstract
The utility model discloses a circuit board with a shielding cavity, which comprises a first dielectric layer, a first shielding metal column and a second shielding metal column, wherein the first dielectric layer is provided with a first surface and a second surface which are opposite, the first dielectric layer is provided with a first cavity, the first cavity penetrates through the first surface and the second surface of the first dielectric layer, the first shielding metal column is vertically embedded in the first dielectric layer and distributed on the periphery of the first cavity, the two ends of the first shielding metal column are distributed and exposed on the first surface and the second surface of the first dielectric layer, the second shielding metal column is vertically embedded in the first dielectric layer and distributed on the periphery of the first cavity, the second shielding metal column and the first shielding metal column are distributed at intervals, and the second shielding metal column is connected with the first shielding metal column. First shielding metal post and second shielding metal post interval are arranged and interconnect, and seamless between the two is favorable to providing better electromagnetic shield effect.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with a shielding cavity.
Background
For some electronic products, electromagnetic interference is a problem that must be considered when designing the product. In the prior art, in order to realize electromagnetic shielding, a circuit board is usually provided with a shielding structure formed by using via holes, but certain gaps exist between adjacent via holes, so that the electromagnetic shielding effect is not ideal.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides the circuit board with the shielding cavity, which can provide better electromagnetic shielding effect.
The circuit board with the shielding cavity comprises a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first dielectric layer is provided with a first cavity, and the first cavity penetrates through the first surface and the second surface of the first dielectric layer; the first shielding metal column is vertically embedded in the first dielectric layer and distributed on the peripheral side of the first cavity, and two ends of the first shielding metal column are exposed on the first surface and the second surface of the first dielectric layer; and the second shielding metal column is vertically embedded in the first dielectric layer and distributed on the peripheral side of the first cavity, and is arranged at intervals with the first shielding metal column and connected with the first shielding metal column.
The circuit board with the shielding cavity provided by the embodiment of the utility model at least has the following beneficial effects:
first shielding metal post and second shielding metal post interval are arranged and interconnect, and seamless between the two is favorable to providing better electromagnetic shield effect.
According to some embodiments of the present invention, a first metal seed layer is connected between the first shielding metal pillar and the second shielding metal pillar.
According to some embodiments of the utility model, the first metal seed layer is one of titanium, nickel, vanadium, copper, aluminum alloy, tungsten alloy, chromium alloy, silver, or gold.
According to some embodiments of the present invention, at least one of the first surface of the first dielectric layer and the second surface of the first dielectric layer is connected to a second dielectric layer, the second dielectric layer is provided with a shielding metal wire and a second cavity adapted to the first cavity, and the shielding metal wire is disposed on the periphery of the second cavity and connected to the first shielding metal pillar and the second shielding metal pillar.
According to some embodiments of the utility model, a line width of the shielding metal line is greater than a width of the first shielding metal pillar or the second shielding metal pillar.
According to some embodiments of the utility model, a second metal seed layer is connected between the shielding metal line and the first dielectric layer.
According to some embodiments of the utility model, the second metal seed layer is one of titanium, nickel, vanadium, copper, aluminum alloy, tungsten alloy, chromium alloy, silver, or gold.
According to some embodiments of the utility model, the number of the first dielectric layers and the second dielectric layers is multiple, and the multiple first dielectric layers and the multiple second dielectric layers are arranged at intervals.
According to some embodiments of the utility model, a thickness of the first dielectric layer is greater than a thickness of the second dielectric layer.
According to some embodiments of the utility model, a projection of the first shielding metal pillar on the first surface of the first dielectric layer is circular or square, and a projection of the second shielding metal pillar on the first surface of the first dielectric layer is circular or square.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a longitudinal section of a circuit board with a shielding cavity according to an embodiment of the present invention;
FIG. 2 is a second schematic diagram of a longitudinal section of a circuit board with a shielding cavity according to an embodiment of the present invention;
FIG. 3 is a schematic bottom view of the circuit board with shielded cavities shown in FIG. 2;
fig. 4 is a third schematic diagram of a longitudinal section structure of a circuit board with a shielding cavity according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to, for example, the upper, lower, etc., is indicated based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, "a plurality" means one or more, "a plurality" means two or more, and greater than, less than, more than, etc. are understood as excluding the present number, and "greater than", "lower than", "inner", etc. are understood as including the present number. If the description of "first", "second", etc. is used for the purpose of distinguishing technical features, it is not intended to indicate or imply relative importance or to implicitly indicate the number of indicated technical features or to implicitly indicate the precedence of the indicated technical features.
In the description of the present invention, unless otherwise explicitly limited, terms such as "disposed," "mounted," "connected," and the like are to be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the terms in the present invention by combining the specific contents of the technical solutions.
Referring to fig. 1, 2 and 3, the present embodiment discloses a circuit board with a shielding cavity, including a first dielectric layer 100, a first shielding metal pillar 200 and a second shielding metal pillar 300, where the first dielectric layer 100 has a first surface and a second surface opposite to each other, the first dielectric layer 100 is provided with a first cavity 110, the first cavity 110 penetrates through the first surface and the second surface of the first dielectric layer 100, the first shielding metal pillar 200 is vertically embedded in the first dielectric layer 100 and distributed around the first cavity 110, two ends of the first shielding metal pillar 200 are distributed and exposed on the first surface and the second surface of the first dielectric layer 100, the second shielding metal pillar 300 is vertically embedded in the first dielectric layer 100 and distributed around the first cavity 110, the second shielding metal pillar 300 is spaced from the first shielding metal pillar 200, and the second shielding metal pillar 300 is connected to the first shielding metal pillar 200.
The first shielding metal posts 200 and the second shielding metal posts 300 are arranged at intervals and connected with each other without a gap therebetween, which is beneficial to providing better electromagnetic shielding effect.
The following describes the manufacturing process of the circuit board with the shielding cavity, so as to further understand the technical solution of the present embodiment. The manufacturing process of the circuit board with the shielding cavity comprises the following steps:
s100, providing a base plate (not shown), and processing the first shielding metal pillar 200 and the second shielding metal pillar 300 on the base plate, wherein the specific processing steps include steps S110 to S170:
s110, applying a first photosensitive mask (not shown) on the base plate to form a first pattern corresponding to the first shielding metal pillar 200;
s120, carrying out pattern electroplating on the first pattern to form a first shielding metal column 200;
s130, removing the first photosensitive masking film;
s140, a second photosensitive mask (not shown) is applied on the base plate processed with the first shielding metal pillar 200 to form a second pattern corresponding to the second shielding metal pillar 300, wherein the second pattern includes a plurality of windowed sites, it being understood that the windowed sites are obtained by exposing the second photosensitive mask. The windowing level is disposed between two adjacent first shielding metal pillars 200, and the sidewall of the first shielding metal pillar 200 is exposed to the inner side of the windowing level, so that the subsequent second shielding metal pillar 300 is connected to the first shielding metal pillar 200. It should be noted that, before the second photosensitive mask film is applied, a first metal seed layer (not shown) may be processed on the base plate to improve the bonding force of the plated metal in the subsequent pattern plating process;
s150, carrying out pattern electroplating on the second pattern to form a second shielding metal column 300; under the condition that the first metal seed layer is processed, the first metal seed layer is connected between the first shielding metal column 200 and the second shielding metal column 300, which is beneficial to improving the bonding force between the first shielding metal column 200 and the second shielding metal column 300, so that the first shielding metal column 200 and the second shielding metal column 300 are connected more tightly, the gap between the first shielding metal column and the second shielding metal column is reduced, and the electromagnetic shielding effect is beneficial to improving, wherein the first metal seed layer adopts one of titanium, nickel, vanadium, copper, aluminum alloy, tungsten alloy, chromium alloy, silver or gold.
S160, removing the second dry film shielding film;
s170, laminating and pressing the bottom plate processed with the second shielding metal pillar 300 to obtain the first dielectric layer 100. Wherein, the first shielding metal pillar 200 and the second shielding metal pillar 300 form a ring-shaped metal structure in the first dielectric layer 100;
s200, thinning the first dielectric layer 100 until the surfaces of the first shielding metal column 200 and the second shielding metal column 300 are exposed;
s300, separating the bottom plate from the first medium layer 100 to obtain a first semi-finished product;
s400, cutting the first semi-finished product along the inner sides of the first shielding metal pillar 200 and the second shielding metal pillar 300 to form a first cavity 110, so as to obtain a circuit board with a shielding cavity. It should be noted that the cutting mode may be mechanical cutting or laser cutting.
Before step S300, steps S210-S220 are also included;
s210, processing a shielding metal line 500 on a second surface of the first dielectric layer 100, wherein the first surface of the first dielectric layer 100 is connected to the bottom plate, and the first surface and the second surface of the first dielectric layer 100 are disposed opposite to each other. The shielding metal line 500 may be processed by pattern transfer and pattern plating, referring to fig. 2 and 3, the shielding metal line 500 is connected to the first shielding metal pillar 200 and the second shielding metal pillar 300 in the first dielectric layer 100;
s220, laminating and pressing are carried out on the basis of the first dielectric layer 100 to obtain a second dielectric layer 400, and the second dielectric layer 400 is thinned until the surface of the shielding metal wire 500 is exposed;
it should be noted that the second dielectric layer 400 may be disposed on the first surface of the first dielectric layer 100, and the processing is performed on the first surface of the first dielectric layer 100 after the processing step 300, specifically refer to steps S210 and S220:
thus, at least one of the first surface of the first dielectric layer 100 and the second surface of the first dielectric layer 100 is connected with the second dielectric layer 400, the second dielectric layer 400 is provided with the shielding metal wire 500 and the second cavity 410 adapted to the first cavity 110, and the shielding metal wire 500 is arranged on the periphery of the second cavity 410 and connected with the first shielding metal pillar 200 and the second shielding metal pillar 300.
The line width of the shielding metal line 500 is greater than the width of the first shielding metal pillar 200 or the second shielding metal pillar 300, so that the shielding metal line can be connected between different dielectric layers and can be conveniently aligned. In order to improve the bonding force between the shielding metal line 500 and the first dielectric layer 100, a second metal seed layer (not shown) is connected between the shielding metal line 500 and the first dielectric layer 100, and specifically, the second metal seed layer is made of one of titanium, nickel, vanadium, copper, aluminum alloy, tungsten alloy, chromium alloy, silver or gold.
Referring to fig. 4, on the basis of the second dielectric layer 400, the third dielectric layer 100b is obtained by repeating steps S110 to S170, and on the basis of the third dielectric layer, the fourth dielectric layer (not shown) is obtained by repeating steps S200, S210, and S220, and so on, so that the number of the first dielectric layers 100 and the second dielectric layers 400 is multiple, and the multiple first dielectric layers 100 and the multiple second dielectric layers 400 are arranged at intervals.
In this embodiment, the thickness of the first dielectric layer 100 is greater than that of the second dielectric layer 400, and the thickness of the stacked layers can be adjusted according to different circuit board thickness requirements.
Referring to fig. 3, the projection of the first shielding metal pillar 200 on the first surface of the first dielectric layer 100 is circular or square, and the projection of the second shielding metal pillar 300 on the first surface of the first dielectric layer 100 is circular or square, so that the processing is convenient, the first shielding metal pillar 200 and the second shielding metal pillar can be connected tightly, the gap between the first shielding metal pillar and the second shielding metal pillar is reduced, and the better electromagnetic shielding effect is provided.
In application, a shielding metal block (not shown) may be covered on one side of the second cavity 410, for example, on the surface of the second dielectric layer 400 and corresponding to the second cavity 410, to form an electromagnetic shield. Of course, referring to fig. 4, after the electronic component 600 is packaged in the first cavity 110 and the second cavity 410 by the packaging material 610, the shielding metal surface 700 covering the electronic component 600 may be processed to perform electromagnetic shielding on the electronic component 600.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A wiring board having a shielded cavity, comprising:
the dielectric layer (100) comprises a first dielectric layer (100) and a second dielectric layer (100), wherein the first dielectric layer (100) is provided with a first cavity (110), and the first cavity (110) penetrates through the first surface and the second surface of the first dielectric layer (100);
the first shielding metal columns (200) are vertically embedded in the first dielectric layer (100) and distributed on the peripheral side of the first cavity (110), and two ends of the first shielding metal columns (200) are distributed and exposed on the first surface and the second surface of the first dielectric layer (100);
the second shielding metal column (300) is vertically embedded in the first dielectric layer (100) and distributed on the peripheral side of the first cavity (110), the second shielding metal column (300) is arranged at intervals with the first shielding metal column (200), and the second shielding metal column (300) is connected with the first shielding metal column (200).
2. The wiring board with a shielding cavity according to claim 1, wherein a first metal seed layer is connected between the first shielding metal pillar (200) and the second shielding metal pillar (300).
3. The circuit board with the shielding cavity according to claim 2, wherein the first metal seed layer is made of one of titanium, nickel, vanadium, copper, aluminum alloy, tungsten alloy, chromium alloy, silver or gold.
4. The wiring board with a shielding cavity according to claim 1, wherein at least one of the first surface of the first dielectric layer (100) and the second surface of the first dielectric layer (100) is connected with a second dielectric layer (400), the second dielectric layer (400) is provided with a shielding metal wire (500) and a second cavity (410) adapted to the first cavity (110), and the shielding metal wire (500) is disposed on the periphery side of the second cavity (410) and connected with the first shielding metal pillar (200) and the second shielding metal pillar (300).
5. The wiring board with a shielding cavity according to claim 4, wherein the line width of the shielding metal line (500) is larger than the width of the first shielding metal pillar (200) or the second shielding metal pillar (300).
6. The wiring board with a shielding cavity according to claim 4, wherein a second metal seed layer is connected between the shielding metal line (500) and the first dielectric layer (100).
7. The circuit board with the shielding cavity according to claim 6, wherein the second metal seed layer is made of one of titanium, nickel, vanadium, copper, aluminum alloy, tungsten alloy, chromium alloy, silver or gold.
8. The wiring board with a shielding cavity according to any one of claims 4 to 7, wherein the number of the first dielectric layer (100) and the second dielectric layer (400) is multiple, and the multiple layers of the first dielectric layer (100) and the second dielectric layer (400) are arranged at intervals.
9. The wiring board with shielded cavity of claim 8, wherein the thickness of the first dielectric layer (100) is greater than the thickness of the second dielectric layer (400).
10. The wiring board with a shielding cavity according to claim 1, wherein the projection of the first shielding metal pillar (200) on the first surface of the first dielectric layer (100) is circular or square, and the projection of the second shielding metal pillar (300) on the first surface of the first dielectric layer (100) is circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121892250.2U CN215935157U (en) | 2021-08-13 | 2021-08-13 | Circuit board with shielding cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121892250.2U CN215935157U (en) | 2021-08-13 | 2021-08-13 | Circuit board with shielding cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215935157U true CN215935157U (en) | 2022-03-01 |
Family
ID=80422671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121892250.2U Active CN215935157U (en) | 2021-08-13 | 2021-08-13 | Circuit board with shielding cavity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215935157U (en) |
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2021
- 2021-08-13 CN CN202121892250.2U patent/CN215935157U/en active Active
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