CN215929901U - Heat dissipation support and air conditioner - Google Patents
Heat dissipation support and air conditioner Download PDFInfo
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- CN215929901U CN215929901U CN202121845174.XU CN202121845174U CN215929901U CN 215929901 U CN215929901 U CN 215929901U CN 202121845174 U CN202121845174 U CN 202121845174U CN 215929901 U CN215929901 U CN 215929901U
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- bracket
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- heat dissipation
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Abstract
The utility model provides a heat dissipation bracket and an air conditioner, wherein the heat dissipation bracket comprises a bracket body; the bracket body is provided with an accommodating space for accommodating the heat dissipation assembly; the cover body is used for covering the accommodating space; the cover body is rotatably connected with one end of the support body so as to open or close the accommodating space. The cover body is rotatably connected with the support body, and the containing space can be opened or closed through the rotation of the cover body, so that the cover body is connected with the support body, the disassembly and assembly of parts are reduced, and the integral installation steps are reduced; simultaneously, also make things convenient for radiator unit to install in accommodation space, improve the installation effectiveness.
Description
Technical Field
The utility model relates to the technical field of air conditioners, in particular to a heat dissipation support and an air conditioner.
Background
The multi-connected air conditioner external unit is usually operated by one external unit driving a plurality of internal units, wherein an electric control module of the external unit plays a key role in the operation of the whole air conditioner unit. The electric control module comprises a plurality of electric elements, and when the air conditioner works, the electric elements can generate heat when running. When the air conditioner is operated for an excessively long time, the electric components accumulate much heat. If the heat can not be dissipated in time, the air conditioner is easy to have hidden troubles such as faults, and meanwhile, the service life of the control panel is shortened, and the service performance of the air conditioner is seriously influenced.
Generally, a radiator is arranged for radiating, a plastic support is placed on a PCB, then a lower radiator is placed on the plastic support, a plastic piece and the lower radiator are fixed through screws, and then the upper radiator is placed; the refrigerant radiating pipe is arranged between the upper radiator and the lower radiator, and the upper radiator and the lower radiator are fixed by screws.
In the installation process of the radiator, the installation procedures are multiple, the installation process is complex, and the installation efficiency is low.
SUMMERY OF THE UTILITY MODEL
The problems solved by the utility model are as follows: the radiator has low installation efficiency, a plurality of installation procedures and complex installation.
In order to solve the above problems, an embodiment of the present invention provides a heat dissipation bracket, including; the bracket body is provided with an accommodating space for accommodating the heat dissipation assembly; the cover body is used for covering the accommodating space; the cover body is rotatably connected with one end of the support body so as to open or close the accommodating space.
Compared with the prior art, the embodiment of the utility model has the following beneficial effects: the cover body is rotatably connected with the support body, and the containing space can be opened or closed through the rotation of the cover body, so that the cover body is connected with the support body, the disassembly and assembly of parts are reduced, and the integral installation steps are reduced; simultaneously, also make things convenient for radiator unit to install in accommodation space, improve the installation effectiveness.
In an alternative embodiment, the method further comprises: the holding tank, follow support body length direction, locate on the support body, constitute accommodation space.
It can be understood that the accommodating groove is arranged for placing the heat dissipation assembly.
In an alternative embodiment, the method further comprises: and the plurality of heat dissipation through holes are arranged at intervals at the bottom of the accommodating groove.
It can be understood that, through the tank bottom at the holding tank, the interval sets up a plurality of heat dissipation through-holes for the tank bottom forms the grid form, is used for supporting the radiator unit who places in the holding tank on the one hand, and on the other hand, through a plurality of heat dissipation through-holes, dispels the heat to the electrical components on the PCB board, promotes the radiating effect.
In an alternative embodiment, the cover body is provided with a second groove, and the second groove extends along the length direction of the cover body; the second groove is matched with the heat dissipation assembly.
It can be understood that, through set up on the lid with radiator unit assorted second recess, the radiator support of being convenient for assembles with radiator unit, improves the degree of agreeing with between the two assembles, increases the assembly steadiness, prevents not hard up.
In an alternative embodiment, the stent body further comprises: a rotating part connected between the bracket body and the cover body; wherein, the cover body can rotate around the bracket body through the rotating part.
It can be understood that, through set up the rotation portion between lid and support body, be convenient for realize rotating between lid and the support body and be connected to realize the purpose of radiating component dismouting in the heat dissipation support through opening and closed lid, reached that the installation procedure is few, the installation is simple, the effect that the installation effectiveness is high.
In an alternative embodiment, the rotating portion includes: the rotating shaft is arranged on the side surface of the cover body; the groove is arranged on the side surface of the bracket body; wherein, the rotating shaft is rotatably connected in the groove.
It can be understood that the rotating shaft and the groove which are matched with each other are arranged on the side face of the cover body and the side face of the support body respectively, so that the cover body is driven to rotate relative to the support body through the rotation of the rotating shaft in the groove, the assembling efficiency of the heat dissipation support is improved simply and conveniently.
In an alternative embodiment, the stent body further comprises: the locking structure is arranged between the bracket body and the cover body and is opposite to the rotating part; when the cover body covers the support body, the locking structure locks the cover body and the support body.
It can be understood that the locking mechanism is arranged to lock the support body and the cover body, so that the connection firmness of the heat dissipation assembly and the heat dissipation support is improved, and the heat dissipation assembly is prevented from loosening in the using process.
In an alternative embodiment, the locking structure comprises: the buckle is arranged on the side surface of the bracket body and is opposite to the rotating part; the clamping groove is arranged on the side surface of the cover body and is opposite to the rotating part; the buckle and the clamping groove are correspondingly arranged, and when the cover body covers the bracket body, the buckle and the clamping groove are locked.
As can be understood, the buckle and the clamping groove which are matched with each other are respectively arranged on the side surface of the cover body and the side surface of the bracket body, so that the cover body and the other side of the bracket body are buckled and locked; meanwhile, the cover body can be conveniently rotated and opened relative to the support body, and the assembly efficiency of the radiating support is improved.
The utility model also provides an air conditioner, which comprises the heat dissipation bracket and the heat dissipation assembly in any embodiment, wherein the heat dissipation assembly is arranged in the heat dissipation bracket.
It can be understood that the heat dissipation function is realized by arranging the heat dissipation assembly in the heat dissipation bracket.
In an alternative embodiment, the heat dissipation assembly comprises: the radiator is arranged in the accommodating space; and the refrigerant pipe is arranged in the accommodating space and is arranged on the surface of the radiator.
It can be understood that through set up refrigerant pipe and radiator in accommodation space, be convenient for through radiator with the heat that components and parts on the PCB board produced, transmit to the refrigerant pipe, through the intraductal refrigerant flow of refrigerant, realize radiating purpose.
In an alternative embodiment, the heat sink comprises: the first groove is arranged on one side, close to the refrigerant pipe, of the radiator, and the first groove is attached to the surface of the refrigerant pipe.
As can be understood, the surface of the radiator is provided with the first groove attached to the surface of the refrigerant pipe, so that on one hand, the refrigerant pipe is positioned in the installation process, the refrigerant pipe is convenient to install, and the assembly efficiency is improved; on the other hand, be convenient for increase heat transfer's area of contact between radiator and the refrigerant pipe, promote the radiating effect.
In an alternative embodiment, the heat sink further comprises: and the limiting groove is arranged at one end of the radiator in the length direction.
It can be understood that, one end on radiator length direction sets up the spacing groove, can carry out further installation location to the refrigerant pipe of installing on the radiator surface, prevents that in the installation, the refrigerant pipe shifts, promotes assembly efficiency.
The utility model has the following beneficial effects:
1) according to the heat dissipation bracket provided by the utility model, the cover body is rotatably connected with the bracket body, so that the mounting steps are reduced in the mounting process, the mounting process is simple, and the mounting efficiency is high;
2) the cover body is provided with the second groove matched with the heat dissipation assembly, so that the heat dissipation support and the heat dissipation assembly can be conveniently assembled, the fit between the heat dissipation support and the heat dissipation assembly is improved, the assembly stability is improved, and looseness is prevented;
3) the surface of the radiator is provided with the first groove attached to the surface of the refrigerant pipe, so that on one hand, the refrigerant pipe is positioned in the installation process, the refrigerant pipe is convenient to install, and the assembly efficiency is improved; on the other hand, be convenient for increase heat transfer's area of contact between radiator and the refrigerant pipe, promote the radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation bracket 100 according to the present invention;
FIG. 2 is a schematic structural view of the stent body 120 in FIG. 1;
FIG. 3 is a schematic structural diagram of the cover 110 in FIG. 1;
FIG. 4 is a bottom view of FIG. 3;
fig. 5 is a schematic view of a connection structure between the refrigerant pipe 150 and the heat dissipation bracket 100;
fig. 6 is a schematic structural diagram of the heat sink 160.
Description of reference numerals:
100-a heat dissipation bracket; 110-a cover; 111-a second groove; 120-a stent body; 121-accommodating grooves; 122-heat dissipating through holes; 123-a support; 130-a locking structure; 131-buckling; 132-a card slot; 140-a rotating part; 141-a groove; 142-a bump; 143-a rotating shaft; 144-a connecting plate; 150-refrigerant pipe; 160-a heat sink; 161-a first groove; 162-limit groove.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
[ first embodiment ] A method for manufacturing a semiconductor device
Referring to fig. 1, an embodiment of the present invention provides a heat dissipation bracket 100, including; a bracket body 120 and a cover 110.
Specifically, referring to fig. 2 and 3, an accommodating space (not shown) is provided at one side of the bracket body 120 for accommodating a heat dissipation assembly (not shown); a cover body 110 for covering the accommodating space; the cover 110 is rotatably connected to one end of the bracket body 120 to open or close the accommodating space.
The cover body 110 is arranged to rotate to connect the support body 120, the containing space can be opened or closed through rotation of the cover body 110, the heat dissipation assembly is convenient to install and fix in the containing space, the whole installation steps are reduced, and the installation efficiency is improved.
Further, referring to fig. 2, the method further includes: and a receiving groove 121 formed on the holder body 120 along a length direction of the holder body 120 to constitute the receiving space. Through setting up holding tank 121 for place radiator unit.
Further, the method also comprises the following steps: the plurality of heat dissipation through holes 122 are disposed at intervals at the bottom of the accommodating groove 121.
Through the tank bottom at holding tank 121, the interval sets up a plurality of heat dissipation through-holes 122 for the tank bottom forms the grid form, is used for supporting the radiator unit who places in holding tank 121 on the one hand, and on the other hand, through a plurality of heat dissipation through-holes 122, dispels the heat to the electrical components on the PCB board, promotes the radiating effect.
Further, in the accommodation groove 121, a plurality of supporting members 123 are further disposed at intervals, and are disposed in the accommodation groove 121, and a supporting height of each supporting member 123 is lower than a depth of the accommodation groove 121.
Through set up support piece 123 in holding tank 121 for the radiator unit who places in holding tank 121 is supported, makes it place more steadily, simultaneously, and a plurality of support pieces 123 that the interval set up for form the clearance between radiator unit and holding tank 121 tank bottom, the circulation conversion between the heat of being convenient for promotes the radiating effect.
Further, referring to fig. 4, the cover 110 is provided with a second groove 111, and the second groove 111 extends along the length direction of the cover 110; the second groove 111 is matched with the heat dissipation assembly.
Through set up on lid 110 with radiator unit assorted second recess 111, be convenient for radiator support 100 assembles with radiator unit, improves the degree of agreeing with between the two assembles, increases the assembly steadiness, prevents not hard up.
For example, grooves of different shapes, such as a square shape, a triangular shape, etc., which are matched with the heat dissipation assembly may be provided according to different surface shapes of the heat dissipation assembly, and details are not repeated herein.
Further, referring to fig. 1, the stent body 120 further includes: a rotating part 140 connected between the bracket body 120 and the cover body 110; the cover 110 can rotate around the bracket body 120 through the rotating part 140.
The rotating part 140 is arranged between the cover body 110 and the bracket body 120, so that the cover body 110 and the bracket body 120 can be connected in a rotating manner, the cover body 110 can be opened and closed to achieve the purpose that the heat dissipation assembly is assembled and disassembled in the heat dissipation bracket 100, and the effects of few installation procedures, simplicity in installation and high installation efficiency are achieved.
Further, referring to fig. 2 and 3, the rotating part 140 includes: a rotation shaft 143 and a groove 141.
Specifically, the rotating shaft 143 is disposed on the side surface of the cover 110, and the groove 141 is disposed on the side surface of the bracket body 120; wherein, the rotating shaft 143 is rotatably connected in the groove 141.
The rotating shaft 143 and the groove 141 which are matched with each other are respectively arranged on the side surface of the cover body 110 and the side surface of the bracket body 120, so that the cover body 110 is driven to rotate relative to the bracket body 120 through the rotation of the rotating shaft 143 in the groove 141, the assembling efficiency of the heat dissipation bracket 100 is improved simply and conveniently.
For example, a groove 141 may be disposed on the side surface of the cover 110; the side of the bracket body 120 is provided with a rotating shaft 143; and will not be described in detail herein.
Further, referring to fig. 2, at least one protrusion 142 is disposed on a side of the bracket body 120 away from the receiving groove 121, and the protrusion 142 is bent toward the side away from the bracket body 120 to form a groove 141. So as to improve the assembly firmness with the rotating shaft 143 and prevent the rotating shaft 143 from separating from the groove 141 during the rotation process.
Further, referring to fig. 3, both ends of the rotation shaft 143 are respectively connected to the side surfaces of the cover 110 by connection plates 144 to improve the connection strength; meanwhile, a rotation gap (not shown) is provided between the rotation shaft 143 and the side surface of the cover 110; the rotating shaft 143 is assembled and connected with the groove 141, and the assembling efficiency is improved.
Further, referring to fig. 1, the stent body 120 further includes: a locking structure 130 disposed between the bracket body 120 and the cover 110 and opposite to the rotating part 140; when the cover 110 covers the bracket body 120, the locking structure 130 locks the cover 110 and the bracket body 120.
By forming and locking the locking mechanism between the bracket body 120 and the cover body 110, the connection firmness of the heat dissipation assembly and the heat dissipation bracket 100 is improved, and the heat dissipation assembly is prevented from loosening in the use process.
Further, referring to fig. 2 and 3, the locking structure 130 includes: a snap 131 and a catch 132.
Specifically, the buckle 131 is disposed on the side surface of the bracket body 120, and is disposed opposite to the rotating portion 140; the engaging groove 132 is disposed on a side surface of the cover 110 and opposite to the rotating portion 140; the buckle 131 and the slot 132 are correspondingly disposed, and when the cover 110 covers the bracket body 120, the buckle 131 and the slot 132 are locked.
The buckle 131 and the slot 132 which are matched with each other are respectively arranged on the side surface of the cover body 110 and the side surface of the bracket body 120, so that the cover body 110 and the other side of the bracket body 120 are buckled and locked; meanwhile, the cover body 110 can be conveniently rotated and opened relative to the bracket body 120, and the assembly efficiency of the heat dissipation bracket 100 is improved.
For example, the side surface of the bracket body 120 may be provided with a slot 132; the side of the cover 110 is provided with a buckle 131, which is not described in detail herein.
[ second embodiment ]
Referring to fig. 5, an embodiment of the present invention further provides an air conditioner, including the heat dissipation bracket 100 of the first embodiment and a heat dissipation assembly (not shown in the figure), where the heat dissipation assembly is disposed in the heat dissipation bracket 100. The heat dissipation function is realized by providing the heat dissipation assembly in the heat dissipation bracket 100.
Further, referring to fig. 5 and 6, the heat dissipating assembly includes: a heat sink 160 disposed in the accommodating space; the refrigerant pipe 150 is disposed in the accommodating space and disposed on the surface of the heat sink 160.
Through set up refrigerant pipe 150 and radiator 160 in accommodation space, be convenient for through radiator 160 with the components and parts on the PCB board produce the heat, transmit to refrigerant pipe 150, through the refrigerant flow in refrigerant pipe 150, realize radiating purpose.
Further, referring to fig. 6, the heat sink 160 includes: the first groove 161 is disposed on one side of the heat sink 160 close to the refrigerant pipe 150, and the first groove 161 is attached to the surface of the refrigerant pipe 150.
The first groove 161 attached to the surface of the refrigerant pipe 150 is formed in the surface of the radiator 160, so that on one hand, the refrigerant pipe 150 is positioned in the installation process, the refrigerant pipe 150 is convenient to install, and the assembly efficiency is improved; on the other hand, the heat dissipation effect is improved by increasing the contact area of heat transfer between the heat sink 160 and the refrigerant pipe 150.
Further, the heat sink 160 further includes: and a stopper groove 162 provided at one end of the heat sink 160 in the longitudinal direction.
Set up spacing groove 162 in radiator 160 one end on the length direction, can carry out further installation location to installing refrigerant pipe 150 on radiator 160 surface, prevent in the installation, refrigerant pipe 150 shifts, promotes assembly efficiency.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (12)
1. A heat dissipation support is characterized by comprising;
the bracket body (120) is provided with an accommodating space for accommodating the heat dissipation assembly;
a cover body (110) for covering the accommodating space;
the cover body (110) is rotatably connected with one end of the bracket body (120) to open or close the accommodating space.
2. The heat dissipating bracket of claim 1, further comprising: and the accommodating groove (121) is arranged on the support body (120) along the length direction of the support body (120) and forms the accommodating space.
3. The heat dissipating bracket of claim 2, further comprising: and the heat dissipation through holes (122) are arranged at the bottom of the accommodating groove (121) at intervals.
4. The heat dissipation bracket according to any one of claims 1 to 3, wherein the cover (110) is provided with a second groove (111), and the second groove (111) extends along the length direction of the cover (110); the second groove (111) is matched with the heat dissipation component.
5. The heat dissipating bracket of any of claims 1-3, wherein the bracket body (120) further comprises:
a rotating part (140) connected between the holder body (120) and the cover body (110);
wherein the cover body (110) can rotate around the bracket body (120) through the rotating part (140).
6. The heat dissipating bracket according to claim 5, wherein the rotating portion (140) comprises:
a rotating shaft (143) provided on a side surface of the cover body (110);
the groove (141) is arranged on the side surface of the bracket body (120);
wherein, the rotating shaft (143) is rotatably connected in the groove (141).
7. The heat dissipating bracket of any of claims 1-3, wherein the bracket body (120) further comprises:
a locking structure (130) provided between the holder body (120) and the cover body (110), and disposed opposite to the rotating portion (140);
when the cover body (110) covers the bracket body (120), the locking structure (130) locks the cover body (110) and the bracket body (120).
8. The heat dissipating bracket of claim 7, wherein the locking structure (130) comprises:
the buckle (131) is arranged on the side surface of the bracket body (120) and is opposite to the rotating part (140);
a slot (132) disposed on a side surface of the cover (110) and opposite to the rotating part (140);
the buckle (131) and the clamping groove (132) are correspondingly arranged, and when the cover body (110) covers the bracket body (120), the buckle (131) and the clamping groove (132) are locked.
9. An air conditioner, characterized in that, comprising the heat dissipating support (100) of any one of claims 1 to 8 and a heat dissipating component, the heat dissipating component being provided in the heat dissipating support (100).
10. The air conditioner of claim 9, wherein the heat dissipating assembly comprises:
a heat sink (160) provided in the accommodation space;
and the refrigerant pipe (150) is arranged in the accommodating space and is arranged on the surface of the radiator (160).
11. The air conditioner according to claim 10, wherein the radiator (160) comprises:
the first groove (161) is arranged on one side, close to the refrigerant pipe (150), of the radiator (160), and the first groove (161) is attached to the surface of the refrigerant pipe (150).
12. The air conditioner according to claim 10, wherein the radiator (160) further comprises:
and the limiting groove (162) is arranged at one end of the radiator (160) in the length direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121845174.XU CN215929901U (en) | 2021-08-09 | 2021-08-09 | Heat dissipation support and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121845174.XU CN215929901U (en) | 2021-08-09 | 2021-08-09 | Heat dissipation support and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215929901U true CN215929901U (en) | 2022-03-01 |
Family
ID=80421709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121845174.XU Active CN215929901U (en) | 2021-08-09 | 2021-08-09 | Heat dissipation support and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215929901U (en) |
-
2021
- 2021-08-09 CN CN202121845174.XU patent/CN215929901U/en active Active
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221027 Address after: 315191 No. 1166 Mingguang North Road, Jiangshan Town, Ningbo, Zhejiang, Yinzhou District Patentee after: NINGBO AUX ELECTRIC Co.,Ltd. Patentee after: AUX AIR CONDITIONING LIMITED BY SHARE Ltd. Address before: 315100 No. 1166 Mingguang North Road, Jiangshan Town, Ningbo, Zhejiang, Yinzhou District Patentee before: NINGBO AUX ELECTRIC Co.,Ltd. Patentee before: Ningbo Oxfam intelligent commercial air conditioning manufacturing Co.,Ltd. |