CN215927821U - Fan module - Google Patents

Abstract

The present disclosure provides a fan module including a housing, an impeller, and heat dissipation fins. The housing has a base and an upper cover. The upper cover is detachably covered on the base and is provided with an air inlet. The impeller is arranged between the base and the upper cover. The heat dissipation fins are connected with the shell. At least one part of the shell is composed of a temperature equalizing plate, and at least one part of the shell surrounds the air inlet.

Description

Fan module

Technical Field

The present disclosure relates to a fan module. More particularly, the present disclosure relates to a fan module with increased heat dissipation efficiency.

Background

In modern society, computer-related electronic devices have become indispensable electronic products in life, and for example, a smart phone, a tablet computer, a desktop computer, or a notebook computer is a very popular product. Among them, notebook computers are popular and popular in consumer products, and users can execute various applications on the notebook computers to achieve various required purposes, such as watching movies, playing games, browsing web pages or watching electronic books.

Generally, a heat dissipation module is disposed in an electronic device to solve the problem of heat dissipation when the electronic device is operating. However, when the desktop computer or the notebook computer is in the high performance mode, the heat dissipation module generates a large noise, and the heat generated by the electronic device cannot be effectively dissipated by the heat dissipation module, so that the performance of the desktop computer or the notebook computer is limited by the temperature.

Therefore, how to design a fan module that can increase heat dissipation efficiency, reduce operation noise, and achieve light weight is a subject worth of discussion and solution.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present disclosure provides a fan module to solve the above problems.

The present disclosure provides a fan module including a housing, an impeller, and heat dissipation fins. The housing has a base and an upper cover. The upper cover is detachably covered on the base and is provided with an air inlet. The impeller is arranged between the base and the upper cover. The heat dissipation fins are connected with the shell. At least one part of the upper cover is composed of a temperature equalizing plate (vapor chamber), the temperature equalizing plate is provided with a chamber, and the chamber is annularly arranged at the air inlet.

According to some embodiments of the present disclosure, at least a portion of the base is formed by another vapor chamber.

According to some embodiments of the present disclosure, the impeller includes a rotation axis, and the upper cover shields the heat dissipation fins when viewed along the rotation axis.

According to some embodiments of the present disclosure, the top cover further has an upper member and a lower member, and the heat sink fins are connected between the upper member and the lower member.

According to some embodiments of the present disclosure, the impeller includes a rotation shaft, a shape of the upper cover corresponds to a shape of the base when viewed along a direction of the rotation shaft, and an entirety of the upper cover is formed of the temperature equalizing plate.

According to some embodiments of the present disclosure, the heat dissipation fin includes an air outlet, the top cover further has a first section and a second section, a groove is formed between the first section and the second section, the groove is disposed between the air outlet and the first section, and the groove is configured to accommodate a heat dissipation tube.

According to some embodiments of the present disclosure, the heat sink fins are connected to the housing by solder or heat sink glue.

According to some embodiments of the present disclosure, the housing is fixed to a portable electronic device by riveting, locking or buckling.

According to some embodiments of the present disclosure, the vapor chamber further includes an upper member, a lower member, and a capillary structure, the upper member is fixedly connected to the lower member, the chamber is formed between the upper member and the lower member, the capillary structure is disposed on the lower member, and the upper member is formed with a plurality of support pillars located in the chamber.

The present disclosure provides a fan module including a housing, an impeller, and heat dissipation fins. The casing includes base and upper cover, and the upper cover detachably covers the base to the upper cover has the air intake. The impeller is arranged between the base and the upper cover. The heat dissipation fins are connected with the shell. At least one part of the base is composed of a temperature equalizing plate.

The present disclosure provides a fan module having a housing and heat dissipation fins, wherein a part or all of the housing may be formed by a temperature equalization plate. The heat dissipation area and the heat capacity of the fan module can be increased through the temperature equalizing characteristic of the temperature equalizing plate. Compared with a fan module using a traditional sheet metal part, under the condition of the same shell thickness, the weight of the fan module is lighter than that of a traditional sheet metal part because the inside of the temperature-equalizing plate is formed by hollow designs such as a capillary structure and a cavity, for example, the weight of the shell designed by the temperature-equalizing plate can be reduced by 30-40%.

Therefore, based on the design of the present disclosure, the fan module of the present disclosure can increase the heat dissipation efficiency, reduce the operation noise, and achieve the advantages of light weight.

Drawings

FIG. 1 is a bottom schematic view of a portable electronic device according to an embodiment of the present disclosure;

FIG. 2 is a perspective view of a fan module according to an embodiment of the present disclosure;

FIG. 3 is an exploded view of a portion of a fan module according to one embodiment of the present disclosure;

FIG. 4 is a side view of a top cover and heat sink fins according to one embodiment of the present disclosure;

FIG. 5 is a side view of a top cover and heat sink fins according to another embodiment of the present disclosure;

fig. 6 is a schematic cross-sectional view illustrating a housing according to an embodiment of the disclosure.

[ notation ] to show

50 portable electronic device

52 casing

54 main circuit board

541 central processing unit

60 radiating pipe

62: screw

100 fan module

102 casing

1021 base

1022 air inlet

1023 Upper cover

1024 the first section

1025: second section

1026 groove

1027 Upper part

1028 lower part

1030 upper member

1031 lower member

1032 capillary structure

1033 Chamber

1036 support column

104 impeller

106 radiating fins

1061 air outlet

Z is the direction of the rotation axis

Detailed Description

Referring to fig. 1, fig. 1 is a bottom schematic view of a portable electronic device according to an embodiment of the disclosure. The portable electronic device 50 may be a notebook computer, which includes a housing 52, a main circuit board 54 and a fan module 100. The main circuit board 54 and the fan module 100 are disposed in the housing 52. The main circuit board 54 has a plurality of electronic devices and chips, such as a cpu 541.

The fan module 100 is detachably disposed on the main circuit board 54, and the portable electronic device 50 may further include a heat dissipation tube 60, one end of which abuts against the cpu 541 and the other end of which is connected to the fan module 100. When the portable electronic device 50 is in operation, the heat generated by the cpu 541 can be dissipated to the external environment of the portable electronic device 50 through the heat dissipation tube 60 and the fan module 100.

Referring to fig. 2, fig. 2 is a perspective view of a fan module 100 according to an embodiment of the disclosure. In this embodiment, the fan module 100 includes a housing 102, an impeller 104, and a heat sink 106. The housing 102 includes a base 1021 and a top cover 1023, wherein the top cover 1023 is detachably covered on the base 1021 and has an air inlet 1022.

The impeller 104 is disposed between the base 1021 and the top 1023, and the impeller 104 is rotatable to allow external airflow to enter the housing 102 through the air inlet 1022. The heat dissipation fins 106 are connected to the housing 102, and the external air flow enters the housing 102 and is blown out by the heat dissipation fins 106, so as to dissipate the heat generated by the cpu 541 to the external environment.

In addition, as shown in fig. 2, the casing 102 of the present disclosure can be fixed to the casing 52 of the portable electronic device 50 by fastening with screws 62, but is not limited thereto. For example, in other embodiments, the housing 102 may be riveted, or snapped, to the housing 52.

Referring to fig. 2 to 4, fig. 3 is an exploded view of a part of a structure of a fan module 100 according to an embodiment of the disclosure, and fig. 4 is a side view of an upper cover 1023 and heat dissipation fins 106 according to an embodiment of the disclosure. As shown, the top cover 1023 includes a first section 1024 and a second section 1025, and the heat dissipation fins 106 are fixedly connected to the second section 1025. For example, the heat dissipation fins 106 can be fixedly connected to the second section 1025 of the top cover 1023 by soldering or by using heat dissipation glue, but is not limited thereto.

In this embodiment, the impeller 104 has a rotation axis (not shown), and the second section 1025 of the top cover 1023 shields the portion of the heat dissipation fins 106 when viewed along the rotation axis direction Z. Further, the shape of the upper cover 1023 when viewed in the rotation axis direction Z corresponds to the shape of the base 1021, so that the upper cover 1023 can be quickly mounted on the base 1021.

Furthermore, the heat sink 106 has an air outlet 1061, and a groove 1026 is formed between the first section 1024 and the second section 1025. The recess 1026 is disposed between the air outlet 1061 and the first section 1024, and the recess 1026 is configured to accommodate the heat pipe 60. Specifically, the heat dissipation tube 60 is disposed in the groove 1026 and abuts against the second section 1025, so as to dissipate heat energy to the external environment through the second section 1025 and the heat dissipation fins 106.

It is noted that the power density of electronic devices is increasing due to the miniaturization requirement of the electronic devices, and the heat dissipation efficiency of the heat dissipation apparatus must be high enough to satisfy the heat dissipation requirement. Therefore, in the present disclosure, at least a portion of the upper cover 1023 is formed by a temperature-uniforming plate, which may have a cavity, and the cavity is disposed around the air inlet 1022. For example, in some embodiments of the present disclosure, the first section 1024 of the top cover 1023 is made of a temperature-equalizing plate, and the second section 1025 is made of a metal material such as copper, iron, or aluminum.

In addition, in some embodiments of the present disclosure, the whole of the upper cover 1023 is made of a temperature equalizing plate. That is, the whole of the upper cover 1023 (including the first section 1024 and the second section 1025) is made of a temperature equalizing plate.

Furthermore, in some embodiments of the present disclosure, at least a portion of the base 1021 may be formed from another vapor chamber. In addition, in some embodiments, the top cover 1023 and the base 1021 can be made of temperature equalization plates. Based on this structural configuration, the heat dissipation efficiency of the fan module 100 can be further increased.

Referring to fig. 5, fig. 5 is a side view of the upper cover 1023 and the heat dissipation fins 106 according to another embodiment of the present disclosure. In this embodiment, the second section 1025 of the top cover 1023 has an upper part 1027 and a lower part 1028, and the heat sink fins 106 are fixedly connected between the upper part 1027 and the lower part 1028. Since the heat sink fins 106 are sandwiched by the upper part 1027 and the lower part 1028, which are formed by the temperature equalizing plate, the contact area between the upper cover 1023 and the heat sink fins 106 can be further increased, thereby enhancing the heat dissipation effect.

Next, referring to fig. 6, fig. 6 is a schematic cross-sectional structure diagram of the housing 102 according to an embodiment of the disclosure. As shown in fig. 6, the housing 102 is formed of a vapor plate structure, and includes an upper member 1030, a lower member 1031, a capillary structure 1032, a chamber 1033, and a working liquid. The upper member 1030 is fixedly connected to the lower member 1031, and a chamber 1033 is formed between the upper member 1030 and the lower member 1031. The capillary structure 1032 is disposed on the lower member 1031, and the upper member 1030 is formed with a plurality of support columns 1036, located within the chamber 1033. Support columns 1036 are configured to increase the structural strength of upper member 1030.

The heat transfer process of the vapor chamber can be roughly divided into four stages, namely (1) the heat source is transferred from the lower member 1031, so that the working liquid in the capillary structure 1032 absorbs the heat energy and is converted into steam; (2) the steam in the chamber 1033 flows upward through the upper member 1030 by the pressure difference; (3) steam condenses at the upper member 1030, dissipating heat from the top of the upper member 1030; (4) the condensed working liquid returns to the lower member 1031 and is collected by the capillary structure 1032.

Since the vapor transfers heat in the chamber 1033 from the movement in all directions, the vapor chamber has a better heat dissipation effect than a conventional heat pipe.

The present disclosure provides a fan module 100 having a housing 102 and heat dissipation fins 106, wherein a part or all of the housing 102 may be formed by a temperature equalization plate. The heat dissipation area and the heat capacity of the fan module 100 can be increased by the temperature equalization characteristic of the temperature equalization plate. Compared with a fan module using a traditional sheet metal part, under the condition of the same shell thickness, because the inside of the temperature-equalizing plate is formed by the capillary structure 1032 and the cavity 1033, etc. which are hollow, the weight of the fan module is lighter than that of the traditional sheet metal part, for example, the weight of the shell 102 designed by the temperature-equalizing plate can be reduced by 30-40%.

Therefore, based on the design of the present disclosure, the fan module of the present disclosure can increase the heat dissipation efficiency, reduce the operation noise, and achieve the advantages of light weight.

Although embodiments of the present disclosure and their advantages have been described above, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure by those skilled in the art.

Claims (10)

1. A fan module, comprising:

the shell comprises a base and an upper cover, wherein the upper cover is detachably covered on the base and is provided with an air inlet;

the impeller is arranged between the base and the upper cover; and

a heat dissipation fin connected to the housing;

at least one part of the upper cover is composed of a temperature-equalizing plate, the temperature-equalizing plate is provided with a cavity, and the cavity is annularly arranged on the air inlet.

2. The fan module of claim 1 wherein at least a portion of the base is formed from another vapor chamber.

3. The fan module as claimed in claim 1, wherein the impeller includes a rotation axis, and the upper cover shields a portion of the heat dissipating fins when viewed along the rotation axis.

4. The fan module as claimed in claim 1, wherein the upper cover further has an upper member and a lower member, and the heat dissipation fin is connected between the upper member and the lower member.

5. The fan module as claimed in claim 1, wherein the impeller includes a rotation axis, the upper cover has a shape corresponding to that of the base when viewed in a direction of the rotation axis, and the entirety of the upper cover is formed of the temperature uniforming plate.

6. The fan module as claimed in claim 1, wherein the heat sink fin includes an air outlet, the top cover further has a first section and a second section, a groove is formed between the first section and the second section, the groove is disposed between the air outlet and the first section, and the groove is configured to receive a heat sink.

7. The fan module of claim 1, wherein the heat sink fins are attached to the housing by solder or heat sink glue.

8. The fan module as claimed in claim 1, wherein the housing is fixed to a portable electronic device by riveting, locking or snapping.

9. The fan module as claimed in claim 1, wherein the vapor chamber further comprises an upper member, a lower member and a capillary structure, the upper member is fixedly connected to the lower member, the chamber is formed between the upper member and the lower member, the capillary structure is disposed on the lower member, and the upper member is formed with a plurality of support pillars positioned in the chamber.

10. A fan module, comprising:

the shell comprises a base and an upper cover, wherein the upper cover is detachably covered on the base and is provided with an air inlet;

the impeller is arranged between the base and the upper cover; and

a heat dissipation fin connected to the housing;

wherein, at least one part of the base is composed of a temperature equalizing plate.

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