CN215896331U

CN215896331U - Wafer cutting machine with adjustable workstation

Info

Publication number: CN215896331U
Application number: CN202122301046.5U
Authority: CN
Inventors: 赵康
Original assignee: Suzhou Cuizhu Semiconductor Co ltd
Current assignee: Suzhou Cuizhu Semiconductor Co ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-02-22
Anticipated expiration: 2031-09-23

Abstract

The utility model relates to a wafer cutting machine with an adjustable workbench, which comprises a base and a workbench, the middle part of the end surface of the base is provided with a first fixed block, two groups of first connecting seats are arranged at two sides of the first fixed block, a second fixed block is arranged in the middle of the bottom end of the workbench, two groups of second connecting seats are arranged on two sides of the second fixed block, the lifting mechanism is connected between the first fixing block and the second fixing block, when the utility model is used, the second fixing block is pushed to move upwards through the first connecting seat and the second connecting seat by the angle movement of the first connecting rod and the second connecting rod, and the first fixed block plays a role in supporting the first connecting rod, so that the stability of the workbench in the process of up-regulation is further ensured, thereby realize the lift adjustment work of workstation, just this practicality makes things convenient for the staff with taking and placing of wafer work piece, the clearance of the staff to the sweeps on the workstation of being convenient for simultaneously.

Description

Wafer cutting machine with adjustable workstation

Technical Field

The utility model belongs to the technical field of wafer cutting, and particularly relates to a wafer cutting machine with an adjustable workbench.

Background

Wafer dicing is an important ring in the manufacturing process of a wafer that is cut into small chips by a dicing process. Because wafer cutting is the first step in the semiconductor subsequent packaging process, the area to be cut on the wafer is already well distributed in advance, once the wafer cutting fails or the precision cannot be achieved, the loss cost is very high, the requirements on the precision and the stability of equipment for wafer cutting are extremely high, and the equipment for wafer cutting comprises a grinding wheel and a rotary worktable arranged below the grinding wheel. The laser cutting head is used for cutting placing the wafer at rotatory work, and wafer cutting machine's workstation height is fixed can not go up and down by oneself at present, gets to put the work piece and all need the user of service to follow the workstation of cutting machine with the wafer on the workstation, because workstation and cutting machine are relatively nearer, the staff can lead to the fact certain influence to self safety when getting like this, because the workstation is too high, the inconvenient clean waste material of remaining on the workstation moreover.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer cutting machine with an adjustable worktable, which solves the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: a wafer cutting machine with an adjustable workbench comprises a base and a workbench, wherein a first fixing block is arranged in the middle of the end face of the base, two groups of first connecting seats are arranged on two sides of the first fixing block, a second fixing block is arranged in the middle of the bottom end of the workbench, two groups of second connecting seats are arranged on two sides of the second fixing block, a lifting mechanism is connected between the first fixing block and the second fixing block, risers are symmetrically arranged on two sides of the end face of the base, a groove is formed in the end face of the workbench, a first motor is arranged in the groove, a fixing sleeve is sleeved on a rotating shaft of the first motor, supporting plates are arranged on two sides of the fixing sleeve, a first air cylinder is arranged on one side of the end face of each supporting plate, a rubber supporting piece is arranged at the top end of a piston rod of the first air cylinder, a working turntable is horizontally arranged at the top end of the rotating shaft of the first motor, through holes are symmetrically formed in the middle of the working turntable, the work turntable is characterized in that second cylinders are arranged on two sides of the end face of the work turntable, a workpiece clamping plate is fixed to one end of a piston rod of each second cylinder, a top plate is horizontally arranged on the inner side of the top end of the corresponding vertical plate, a positioning sliding groove is formed in the bottom surface of the top plate, a second motor is fixed to one side wall of the corresponding vertical plate, a guide screw rod is connected to a rotating shaft of the second motor in a transmission mode, a moving block is sleeved on the guide screw rod in a threaded mode, and a telescopic rod is fixed to the bottom of the moving block.

As a further optimization of this technical scheme elevating system includes biax synchronous machine, biax synchronous machine's both ends are equipped with two sets of threaded rods, realize removing the effect of seat and remove, and are two sets of equal threaded sleeve has two sets of seats of removing, two on the threaded rod one side of removing the seat all is equipped with two sets of third connecting seats, and is two sets of the activity is equipped with head rod and second connecting rod respectively on the third connecting seat, and swing joint between head rod one end and the first connecting seat, swing joint between the one end of second connecting rod and the second connecting seat to the realization is to the lift adjustment function of workstation.

As a further optimization of the technical scheme, a semicircular groove is formed in the periphery of the surface of the workbench, balls are movably arranged in the semicircular groove, the top surfaces of the balls and the bottom surface of the working turntable are matched to rotate, and the working turntable drives the wafer to rotate at a uniform circumferential speed.

According to the technical scheme, the rubber supporting piece arranged on the first air cylinder is vertically and correspondingly arranged with the through hole arranged on the working turntable, the diameter of the rubber supporting piece is smaller than that of the through hole, and the wafer is protected and supported.

As a further optimization of the technical scheme, the top of the moving block arranged on the guide screw is in positioning sliding connection with the positioning sliding groove, so that the left and right adjustment and movement of the laser cutting head are realized.

As a further optimization of the technical scheme, a mounting plate is fixed on the right side of the bottom of the telescopic rod, a laser cutting head is fixed on the mounting plate, and the laser cutting head and the working turntable are vertically and correspondingly arranged, so that laser cutting of wafers is realized.

The utility model has the technical effects and advantages that: this wafer cutting machine with adjustable workstation, at first, the elevating system through setting up descends the regulation to the workstation, thereby workstation and work carousel downstream, and then make the work carousel descend to the suitable position of putting the wafer work piece, the staff places the wafer work piece on the work carousel afterwards, and the extension through the first cylinder piston rod that sets up promotes rubber support spare and carries out unsettled support to the wafer work piece, so that laser cutting machine is to the laser cutting of wafer work piece, drive two sets of threaded rods that set up through the biax synchronous machine that sets up on the elevating system afterwards and rotate, the rotation of threaded rod drives two sets of moving seats that set up simultaneously and to one side screw thread movement of threaded rod, make two sets of moving blocks that set up simultaneously drive the one end of head rod and second connecting rod through the third connecting seat and become the inboard regulation removal, the angular displacement of head rod and second connecting rod at this moment promotes the second connecting seat through first connecting seat and second connecting seat The fixed block shifts up to first fixed block plays the supporting role to the head rod, further guarantees the workstation and adjusts the stability of in-process at the rising, thereby realizes the lift adjustment work of workstation.

Then the second fixed block pushes the workbench to ascend, the wafer workpiece on the working turntable is pushed to ascend simultaneously, the wafer workpiece is further moved to a position suitable for laser cutting, then the piston rod of the second air cylinder is pushed to move in an extending mode, meanwhile, the piston rod pushes the workpiece clamping plate to clamp the wafer workpiece, therefore, the stability of the wafer workpiece is improved in the cutting process, the wafer is prevented from shaking to influence the cutting quality of the wafer, then, the second motor drives the guide screw to slide left and right, meanwhile, the telescopic rod drives the laser cutting head to move left and right, further, the left and right adjustment of the laser cutting head is achieved, the cutting work is convenient to be carried out at different positions, the use range of the device is enlarged, and the moving block is adjusted and moved in the positioning sliding chute in an oriented mode, so that the stability of the laser cutting head is improved when the cutting work is carried out, just this practicality realizes adjusting the height of workstation through elevating system to make things convenient for the staff with taking and placing of wafer work piece, the staff of being convenient for simultaneously is to the clearance of sweeps on the workstation, and then has solved because workstation and cutting machine are more nearer, and the staff can constitute dangerous problem to self safety when getting like this.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the working turntable according to the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 1 according to the present invention.

In the figure: 1. a base; 2. a vertical plate; 3. a top plate; 4. a work table; 5. a first fixed block; 6. a first connecting seat; 7. a first connecting rod; 8. a lifting mechanism; 9. a threaded rod; 10. a movable seat; 11. A third connecting seat; 12. a second fixed block; 13. a second connecting seat; 14. a second connecting rod; 15. A groove; 16. a first motor; 17. fixing a sleeve; 18. a support plate; 19. a first cylinder; 20. a rubber support; 21. a ball bearing; 22. a working turntable; 23. a through hole is penetrated; 24. a second cylinder; 25. A workpiece clamping plate; 26. positioning the chute; 27. a second motor; 28. a moving block; 29. a telescopic rod; 30. Mounting a plate; 31. a lead screw; 32. laser cutting head.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a wafer cutting machine with an adjustable workbench comprises a base 1 and a workbench 4, wherein a first fixed block 5 is arranged in the middle of the end face of the base 1, two groups of first connecting seats 6 are arranged on two sides of the first fixed block 5, the first connecting seats 7 are conveniently and movably connected, a second fixed block 12 is arranged in the middle of the bottom end of the workbench 4, two groups of second connecting seats 13 are arranged on two sides of the second fixed block 12, the second connecting seats 13 are conveniently and movably connected, a lifting mechanism 8 is connected between the first fixed block 5 and the second fixed block 12, the lifting mechanism 8 is arranged, the workbench 4 and a working turntable 22 are conveniently lifted, the lifting mechanism 8 comprises a double-shaft synchronous motor, two groups of threaded rods 9 are arranged at two ends of the double-shaft synchronous motor, the threaded rods 9 are arranged to drive the movable seat 10 to horizontally move left and right, two groups of moving seats 10 are sleeved on the two groups of threaded rods 9 in a threaded manner, and the first connecting rod 7 and the second connecting rod 14 are driven to be supported and adjusted in angle through the arrangement of the moving seats 10.

Two groups of third connecting seats 11 are respectively arranged on one side of the two moving seats 10, the arrangement of the third connecting seats 11 is convenient for the movable installation of a first connecting rod 7 and a second connecting rod 14, the first connecting rod 7 and the second connecting rod 14 are respectively movably arranged on the two groups of third connecting seats 11 to realize the height lifting of the workbench 4, one end of the first connecting rod 7 is movably connected with the first connecting seat 6, one end of the second connecting rod 14 is movably connected with the second connecting seat 13 to realize the angle adjustment of the first connecting rod 7 and the second connecting rod 14, vertical plates 2 are symmetrically arranged on two sides of the end surface of the base 1, the horizontal fixed arrangement of the top plate 3 is convenient through the arrangement of the vertical plates 2, a groove 15 is arranged on the end surface of the workbench 4, the installation and the fixation of the first motor 16 are convenient through the arrangement of the groove 15, the first motor 16 is arranged inside the groove 15, and the arrangement of the first motor 16 is convenient, causing the working turret 22 to rotate.

The fixed sleeve 17 is sleeved on the rotating shaft of the first motor 16, the fixed arrangement of the fixed sleeve 17 is convenient, the connection and the fixation of the supporting plates 18 are convenient, the supporting plates 18 are arranged on two sides of the fixed sleeve 17, the supporting plates 18 are arranged, the fixed arrangement of the first air cylinder 19 is convenient, the first air cylinder 19 is arranged on one side of the end surface of each supporting plate 18, a rubber supporting piece 20 is arranged at the top end of a piston rod of each first air cylinder 19, the wafer is acted, a working turntable 22 is horizontally arranged at the top end of the rotating shaft of the first motor 16, the wafer is convenient to place through the arrangement of the working turntable 22, a semicircular groove is arranged on the periphery of the surface of the workbench 4, balls 21 are movably arranged in the semicircular groove, the working turntable 22 is operated at a constant speed, the ball grooves arranged on the top surface of the ball 21 and the bottom surface of the working turntable 22 are matched for rotation, and the stability of the working turntable 22 can be improved in the rotation process, through the middle part symmetry of work carousel 22 is equipped with through-hole 23, and the setting of through-hole 23, can make rubber support 20 support the wafer.

The rubber support 20 arranged on the first cylinder 19 is vertically arranged corresponding to the through hole 23 arranged on the working turntable 22, the diameter of the rubber support 20 is smaller than that of the through hole 23, the supporting effect on the wafer is achieved, the second cylinder 24 is arranged on two sides of the end face of the working turntable 22, a workpiece clamping plate 25 is fixed at one end of a piston rod of the second cylinder 24, the firm positioning of the wafer workpiece is achieved, the top plate 3 is horizontally arranged on the inner side of the top end of the vertical plate 2, the positioning sliding groove 26 is arranged on the bottom face of the top plate 3, the directional sliding of the moving block 28 is achieved, the laser cutting head 32 keeps certain stability, the second motor 27 is fixed on one side wall of the vertical plate 2, the guide screw rod 31 is connected to the rotating shaft of the second motor 27 in a transmission mode, the dog moving block 28 moves leftwards and rightwards, the moving block 28 is sleeved on the guide screw rod 31 through the screw thread, and the moving block 28 is arranged, the fixed setting of telescopic link 29 one end of being convenient for, through location sliding connection between the movable block 28 top and the location spout 26 that establish on lead screw 31, the bottom of movable block 28 is fixed with telescopic link 29, and the bottom right side of telescopic link 29 is fixed with mounting panel 30, is fixed with laser cutting head 32 on the mounting panel 30, and corresponds the setting perpendicularly between laser cutting head 32 and the work carousel 22, makes things convenient for laser cutting head 32's height to adjust.

It is specific, during the use at first drive two sets of threaded rods 9 that set up through the biax synchronous machine who sets up on elevating system 8 afterwards and rotate, threaded rod 9's rotation drives two sets of removal seats 10 that set up to one side threaded movement of threaded rod 9 simultaneously, make two sets of movable blocks that set up drive the one end of head rod 7 and second connecting rod 14 simultaneously and become the inboard regulation removal through third connecting seat 11, the angular movement of head rod 7 and second connecting rod 14 passes through head rod 6 and second connecting seat 13 promotion second fixed block 12 and moves upward this moment, and first fixed block 5 plays the supporting role to head rod 7, further guarantee workstation 4 at the stability of adjusting the in-process, thereby realize the lift adjustment work of workstation 4.

Then the second fixed block 12 pushes the worktable 4 to ascend, adjust and move, and simultaneously pushes the wafer workpiece on the working turntable 22 to ascend, so that the wafer workpiece is moved to a position suitable for laser cutting, then the piston rod moves by the extension of the second cylinder 24, and the piston rod pushes the workpiece clamping plate 25 to clamp the wafer workpiece, thereby improving the stability of the wafer workpiece in the cutting process, avoiding the influence of the wafer on the cutting quality, then driving the guide screw 31 to slide left and right through the second motor 27, driving the laser cutting head 32 to move left and right through the telescopic rod 29, thereby realizing the left-right adjustment of the laser cutting head 32, facilitating the cutting work at different positions, therefore, the application range of the device is increased, and the moving block 28 is directionally adjusted and moved in the positioning chute 26, so that the stability of the laser cutting head 32 can be improved when the cutting work is carried out.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a wafer cutting machine with adjustable workstation, includes base (1), workstation (4), its characterized in that: the improved automatic welding machine is characterized in that a first fixed block (5) is arranged in the middle of the end face of the base (1), two groups of first connecting seats (6) are arranged on two sides of the first fixed block (5), a second fixed block (12) is arranged in the middle of the bottom end of the workbench (4), two groups of second connecting seats (13) are arranged on two sides of the second fixed block (12), a lifting mechanism (8) is connected between the first fixed block (5) and the second fixed block (12), risers (2) are symmetrically arranged on two sides of the end face of the base (1), a groove (15) is arranged on the end face of the workbench (4), a first motor (16) is arranged inside the groove (15), a fixed sleeve (17) is sleeved on a rotating shaft of the first motor (16), supporting plates (18) are arranged on two sides of the fixed sleeve (17), a first air cylinder (19) is arranged on one side of the end face of each supporting plate (18), a rubber supporting piece (20) is arranged on the top end of a piston rod of each first air cylinder (19), the utility model discloses a quick-witted structure, including first motor (16), work carousel (22) is equipped with to the pivot top level of first motor (16), the middle part symmetry of work carousel (22) is equipped with runs through-hole (23), work carousel (22) terminal surface both sides all are equipped with second cylinder (24), the piston rod one end of second cylinder (24) is fixed with work piece grip block (25), the inboard level in top of riser (2) is equipped with roof (3), the bottom surface of roof (3) is equipped with location spout (26), a lateral wall of riser (2) is fixed with second motor (27), the transmission is connected with lead screw (31) in the pivot of second motor (27), threaded sleeve has movable block (28) on lead screw (31), the bottom of movable block (28) is fixed with telescopic link (29).

2. The wafer cutting machine with adjustable table as set forth in claim 1, wherein: elevating system (8) are including biax synchronous machine, biax synchronous machine's both ends are equipped with two sets of threaded rod (9), and are two sets of equal thread bush has two sets of removal seat (10), two on threaded rod (9) one side of removing seat (10) all is equipped with two sets of third connecting seat (11), and is two sets of the activity is equipped with head rod (7) and second connecting rod (14) respectively on third connecting seat (11), and swing joint between head rod (7) one end and head rod (6), swing joint between the one end of second connecting rod (14) and second connecting seat (13).

3. The wafer cutting machine with adjustable table as set forth in claim 1, wherein: a semicircular groove is formed in the periphery of the surface of the workbench (4), balls (21) are movably arranged in the semicircular groove, and the top surfaces of the balls (21) and the bottom surface of the working turntable (22) are matched to rotate.

4. The wafer cutting machine with adjustable table as set forth in claim 1, wherein: the rubber supporting piece (20) arranged on the first air cylinder (19) is vertically and correspondingly arranged with the through hole (23) arranged on the working turntable (22), and the diameter of the rubber supporting piece (20) is smaller than that of the through hole (23).

5. The wafer cutting machine with adjustable table as set forth in claim 1, wherein: the top of a moving block (28) arranged on the guide screw (31) is in positioning sliding connection with the positioning sliding groove (26).

6. The wafer cutting machine with adjustable table as set forth in claim 1, wherein: the bottom right side of telescopic link (29) is fixed with mounting panel (30), be fixed with laser cutting head (32) on mounting panel (30), and correspond the setting perpendicularly between laser cutting head (32) and work carousel (22).