CN215894362U - Dirty automatic checkout device of chip - Google Patents
Dirty automatic checkout device of chip Download PDFInfo
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- CN215894362U CN215894362U CN202122133463.3U CN202122133463U CN215894362U CN 215894362 U CN215894362 U CN 215894362U CN 202122133463 U CN202122133463 U CN 202122133463U CN 215894362 U CN215894362 U CN 215894362U
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Abstract
The utility model discloses an automatic detection device for chip contamination, which comprises a detection assembly, a detection module and a detection module, wherein the detection assembly is used for photographing and taking images of a chip to be detected so as to acquire position information of dust points on the chip; the illumination subassembly for treat the chip that detects and throw light on and assist and accomplish detection achievement, it includes: the first light source piece is arranged on one side of the detection assembly and is fixedly connected with the detection assembly; the second light source pieces comprise a plurality of groups, and the plurality of groups of second light source pieces are uniformly distributed at the output end of the detection assembly at intervals along the circumferential direction. The automatic detection device also comprises a vertically arranged mounting plate; the detection assembly comprises: an image sensor assembled with the mounting plate by a first fixing member; and the detection lens is parallel to the mounting plate and is assembled with the mounting plate through a second fixing piece, and the top end of the detection lens is connected with the image sensor. The first light source part is assembled on the side wall of the detection lens, and an illumination light path of the first light source part is coaxial with a detection light path of the detection lens.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip detection equipment, in particular to an automatic detection device for chip contamination.
Background
To meet the requirements of mass production, the electrical properties of semiconductor chips must be predictable and stable, and the control of the purity of dopants, the semiconductor lattice structure, and various factors including the external environment must be strict. The presence of smudges and dust spots on the semiconductor chip is even impermissible and can have an unwanted effect on the performance of the semiconductor chip. The reason for the formation is mainly that the chip is stuck with dust manually when the microscope is used for visual detection, the efficiency of manual detection is low, the omission and secondary pollution are easily caused, a large amount of manpower and material resources are consumed, and the quality of semiconductor chip production cannot be guaranteed.
Therefore, the present invention provides an automatic chip contamination detection apparatus to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic detection device for chip contamination, which aims to solve the problems in the background technology.
In order to solve the technical problems, the utility model provides the following technical scheme: an automatic detection device for chip contamination, comprising:
a mounting plate disposed in a vertical direction;
the detection assembly is used for photographing and capturing images of a chip to be detected so as to acquire position information of dust points on the chip;
and the illumination assembly is used for illuminating the chip to be detected to assist in completing the detection work.
Further, the detection assembly includes:
an image sensor assembled with the mounting plate by a first fixing member;
and the detection lens is parallel to the mounting plate and is assembled with the mounting plate through a second fixing piece, and the top end of the detection lens is connected with the image sensor.
Further, the lighting assembly includes:
the first light source piece is fixedly assembled on the side wall of the detection lens, and an illumination light path of the first light source piece is coaxial with a detection light path of the detection lens, so that the detection lens can more accurately acquire image information under coaxial illumination of the first light source piece according to the characteristics of a camera module;
the second light source piece comprises a plurality of groups, wherein the second light source pieces are uniformly distributed at intervals along the circumferential direction at the output end of the detection lens, and the second light source pieces and the central axis of the detection lens are obliquely arranged to realize multi-angle illumination of the chip, so that the auxiliary detection lens can accurately acquire defect type images such as dirt and dust points on the wafer.
Furthermore, the illumination light paths of the first light source and the second light source are converged into one point and fall onto the chip to be measured, and the chip is illuminated from a plurality of sides and different angles due to the fact that the dirt, dust and the like have thickness and volume, namely the position information of the defects of the dirt, dust and the like on the wafer is accurately acquired.
Further, the second light source spare through adjust the mount with the mounting panel links to each other, it includes to adjust the mount:
the fixing ring is transversely fixed at the bottom end of the mounting plate and is coaxially arranged with the detection lens;
the group of second light source pieces are correspondingly provided with one adjusting lifting lug, and the plurality of adjusting lifting lugs are vertically fixed at the bottom of the fixing ring in a centrosymmetric mode;
the second light source part is assembled with the adjusting lifting lug through the connecting piece, a strip-shaped arc-shaped sliding groove is formed in the adjusting lifting lug, and the connecting piece is connected with the adjusting lifting lug in a sliding mode through the sliding groove. The purpose is as follows: firstly, the second light source element is fixed, so that the stability in the detection process is ensured; secondly, through setting up the spout, conveniently realize the angle modulation of second light source spare, improve detection device's universality.
Furthermore, the inclination angle range of the second light source piece is 15-75 degrees, the multi-angle illumination of the chip is realized, and the auxiliary detection lens can accurately acquire defect type images such as dirt and dust points on the wafer.
Furthermore, an angle conversion prism of an emission light path is arranged between the first light source piece and the detection lens, so that the illumination light path of the first light source piece and the detection light path of the detection lens are ensured to be emitted coaxially.
Compared with the prior art, the utility model has the following beneficial effects: according to the automatic detection device for the chip dirt, the special detection assembly for the chip is set up according to the characteristics of the camera module through the high-precision illumination technology of the illumination assembly, and defect type images such as dirt, dust points and the like on the wafer are obtained from multiple sides and different angles, so that the positions of the dirt and the dust points are automatically positioned. The device can effectively avoid various problems of manual detection, and has the advantages of high automation degree, high production yield and stable quality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
fig. 1 is a three-dimensional schematic diagram of the overall structure of an automatic chip contamination detection apparatus according to the present invention;
fig. 2 is a side view showing the overall structure of an automatic chip contamination detecting apparatus according to the present invention;
fig. 3 is a bottom view of the overall structure of an automatic chip contamination detecting apparatus according to the present invention;
in the figure: 1. a detection component 11, an image sensor 12 and a detection lens; 2. a lighting assembly, 21, a first light source, 22, a second light source; 3. mounting a plate; 4. a first fixing member; 5. a second fixing member; 6. a fixing ring; 7. the adjusting lifting lug 71 and the sliding chute; 8. a connecting member.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: an automatic detection device for chip contamination, comprising:
a mounting plate 3 disposed in a vertical direction;
the detecting component 1 is used for taking a picture of a chip to be detected so as to acquire position information of dust points on the chip, and comprises:
an image sensor 11 assembled with the mounting board 3 by a first fixing member 4;
and a detection lens 12 which is parallel to the mounting plate 3 and assembled with the mounting plate 3 through a second fixing member 5, and the top end of which is connected with the image sensor 11.
In one embodiment, the image sensor 11 is a CCD sensor, which is called a CCD image sensor 11 in chinese, and is made of a semiconductor material with high sensitivity, and is a novel photoelectric conversion device. This type of image sensor 11 can be better to the characteristics of camera module to realize automatic positioning dirt point.
In one embodiment, the detection lens 12 is a telecentric lens, and includes a specific parallel optical path design, so that the magnification of the obtained image is not changed within a certain range of object distance. The detection lens 12 of this type can acquire defect type images such as dirt and dust on a chip wafer more accurately.
The lighting assembly 2 is used for lighting the chip to be detected to assist in completing the detection work, and comprises:
a first light source element 21 fixedly mounted on a side wall of the detection lens 12, and an illumination light path thereof is coaxially arranged with a detection light path of the detection lens 12;
the second light source 22 includes a plurality of groups, and the plurality of groups of the second light source 22 are spaced and uniformly arranged at the output end of the detection lens 12 along the circumferential direction, and are inclined from the central axis of the detection lens 12.
In one embodiment, the second light source 22 is provided in four groups, and is disposed around the output end of the detection lens 12. In other embodiments, the specific number of second light source elements 22 is determined by the environment of use and requirements, in combination with cost calculations.
In one embodiment, the first light source 21 is a coaxial light source, which uniformly illuminates the detection chip, and the dirt, dust, etc. has thickness and volume, so that the coaxial light source overcomes the interference caused by light reflection, and the unevenness of the surface is highlighted, that is, the position information of the dirt, dust, etc. on the wafer is accurately acquired.
The illumination light paths of the first light source device 21 and the second light source device 22 are converged into one point and fall onto the chip to be tested.
In one embodiment, the second light source 22 is a point light source, and since the dirt, the dust, and the like are thick and bulky, the chip is illuminated from the side by the point light source, so as to assist the inspection lens 12 in acquiring the image of the defect type such as the dirt, the dust, and the like on the wafer.
The second light source 22 is connected to the mounting plate 3 through an adjusting fixing frame, which includes:
the fixing ring 6 is transversely fixed at the bottom end of the mounting plate 3 and is coaxially arranged with the detection lens 12;
the adjusting lifting lugs 7 are correspondingly arranged on one group of second light source pieces 22, and a plurality of adjusting lifting lugs 7 are vertically fixed at the bottom of the fixing ring 6 in a central symmetry mode;
the second light source part 22 is assembled with the adjusting lifting lug 7 through the connecting part 8, a strip-shaped arc-shaped sliding groove 71 is formed in the adjusting lifting lug 7, and the connecting part 8 is connected with the adjusting lifting lug 7 in a sliding mode through the sliding groove 71.
In one embodiment, four adjusting lugs 7 are provided corresponding to the second light source 22. In other embodiments, the specific number of the adjusting lugs 7 is set corresponding to the second light source element 22, and then determined by reasonable arrangement and spatial arrangement.
In other embodiments, the connection between the fitting part and the adjusting lug 7 may also take other forms, and only the angle adjustment of the second light source 22 is required.
The inclination angle of the second light source 22 is 15-75 °.
In one embodiment, the angle of inclination of the second light source 22 is set to 45 °, which is generally applicable to a chip of a camera module.
An angle conversion prism of an emission light path is arranged between the first light source part 21 and the telecentric lens.
In one embodiment, the first light source 21 is perpendicular to the detection lens 12, and the angle conversion prism is formed by combining a plurality of prisms to convert the illumination path of the first light source 21 by ninety degrees.
The working principle of the utility model is as follows:
1. manually moving the second light source 22 to drive the connecting member 8 to move in the sliding groove 71, and changing the relative position of the connecting member 8 and the adjusting lifting lug 7, so as to realize the angle adjustment of the second light source 22;
2. when the chip to be detected reaches the designated detection position, the power supply is connected, and the lighting assembly 2 is started;
3. the first light source unit 21 and the second light source unit 22 start to operate to illuminate the chip;
4. the detection assembly 1 is started, and the upper surface of the wafer is photographed and imaged through the detection lens 12 and the image sensor 11, that is, the detection is completed.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. An automatic detection device for chip contamination, comprising:
a mounting plate (3) disposed in a vertical direction;
detection element (1), be used for treating the chip that detects and take a picture to obtain the positional information of dirt point on the chip, it includes:
an image sensor (11) assembled with the mounting plate (3) by a first fixing member (4);
a detection lens (12) which is parallel to the mounting plate (3) and is assembled with the mounting plate (3) through a second fixing piece (5), and the top end of the detection lens is connected with the image sensor (11);
the lighting assembly (2) is used for lighting the chip to be detected to assist in completing the detection work, and comprises:
the first light source part (21) is fixedly assembled on the side wall of the detection lens (12), and an illumination light path of the first light source part is coaxial with a detection light path of the detection lens (12);
the second light source pieces (22) comprise a plurality of groups, and the second light source pieces (22) in the plurality of groups are uniformly distributed at the output end of the detection lens (12) at intervals along the circumferential direction and are obliquely arranged with the central axis of the detection lens (12);
and the illumination light paths of the first light source part (21) and the second light source part (22) are converged into one point and fall onto a chip to be tested.
2. An automatic chip contamination detection apparatus according to claim 1, wherein the second light source device (22) is connected to the mounting plate (3) through an adjustment fixture, the adjustment fixture comprising:
the fixing ring (6) is transversely fixed at the bottom end of the mounting plate (3) and is coaxially arranged with the detection lens (12);
the adjusting lifting lugs (7) are correspondingly arranged on one group of second light source pieces (22), and the adjusting lifting lugs (7) are vertically fixed at the bottom of the fixing ring (6) in a centrosymmetric mode;
the second light source part (22) is assembled with the adjusting lifting lug (7) through the connecting part (8), a strip-shaped arc-shaped sliding groove (71) is formed in the adjusting lifting lug (7), and the connecting part (8) is connected with the adjusting lifting lug (7) in a sliding mode through the sliding groove (71).
3. The automatic detection device for chip contamination according to claim 1, wherein: the inclination angle range of the second light source (22) is 15-75 degrees.
4. The automatic detection device for chip contamination according to claim 1, wherein: an angle conversion prism of an emission light path is arranged between the first light source piece (21) and the detection lens (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122133463.3U CN215894362U (en) | 2021-09-06 | 2021-09-06 | Dirty automatic checkout device of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122133463.3U CN215894362U (en) | 2021-09-06 | 2021-09-06 | Dirty automatic checkout device of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215894362U true CN215894362U (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122133463.3U Active CN215894362U (en) | 2021-09-06 | 2021-09-06 | Dirty automatic checkout device of chip |
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|---|---|
| CN (1) | CN215894362U (en) |
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2021
- 2021-09-06 CN CN202122133463.3U patent/CN215894362U/en active Active
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