CN215892993U - Silicon wafer drying device - Google Patents
Silicon wafer drying device Download PDFInfo
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- CN215892993U CN215892993U CN202120379719.6U CN202120379719U CN215892993U CN 215892993 U CN215892993 U CN 215892993U CN 202120379719 U CN202120379719 U CN 202120379719U CN 215892993 U CN215892993 U CN 215892993U
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Abstract
The application relates to the technical field of silicon wafer cleaning, and discloses a silicon wafer drying device, including storage tank, fan and heating device, the storage tank is equipped with the lid, be equipped with the air intake on a lateral wall of storage tank, be equipped with the air outlet on another lateral wall of storage tank, the air supply end of fan passes through inlet air channel intercommunication the air intake, the air outlet passes through exhaust pipe way intercommunication the inlet air end of fan, heating device locates on the inlet air channel. The silicon wafer is placed in the containing groove, the upper cover body is arranged in the containing groove, air is conveyed to the air inlet channel through the fan under the driving of the fan, hot air is obtained after the air is heated by the heating device, the hot air is introduced into the containing groove to efficiently dry the silicon wafer, and then the silicon wafer is conveyed into the fan through the exhaust pipeline to be recycled, so that the silicon wafer drying system with automatic circulation is formed. The heating device is arranged outside the drying groove, so that the heating precision can be effectively controlled, the heating efficiency is improved, and dirt is not easy to generate.
Description
Technical Field
The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer drying device.
Background
With the increasing demand for efficient energy, solar cells are increasingly receiving attention from all over the world as one of green energy sources. Silicon wafers are crucial to solar cells as substrates thereof.
The development level of the silicon wafer cleaning technology is continuously improved at present, but the technical problem that the silicon wafer is not dried and dirty is always existed. The existing drying equipment mainly adopts resistance wire to heat air for airtight drying, and has the problems of low heating efficiency and residual dirt.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a silicon wafer drying apparatus.
The utility model provides a silicon wafer drying device which comprises a containing groove, a fan and a heating device, wherein the containing groove is provided with a cover body, an air inlet is formed in one side wall of the containing groove, an air outlet is formed in the other side wall of the containing groove, an air supply end of the fan is communicated with the air inlet through an air inlet channel, the air outlet is communicated with an air inlet end of the fan through an exhaust pipeline, and the heating device is arranged on the air inlet channel.
In one embodiment, the air outlet is disposed on a bottom wall of the accommodating groove, and the air inlet is disposed on one side wall of the accommodating groove.
In one embodiment, a plurality of grooves are uniformly formed on the inner wall of the accommodating groove, and the grooves are formed on two opposite side walls perpendicular to the side wall and the bottom wall.
In one embodiment, a support is arranged in the accommodating groove, and a clamping groove for positioning the object to be dried is arranged on the support.
In one embodiment, a filtering structure is arranged below the bracket, and the filtering structure adopts a filter screen or a filter bag.
In one embodiment, the filter screen comprises at least one collection unit comprising an inclined portion having a plurality of filter holes formed therein.
In one embodiment, the heating device is an induction heating device, the induction heating device comprises a heating controller, a magnetic core and a coil, the air inlet channel is arranged as the magnetic core, the coil is wound outside the air inlet channel, and the heating controller is used for controlling the power loaded on the coil.
In one embodiment, the heating device comprises a heating controller and a resistance wire, the resistance wire is arranged in the air inlet channel in a sealing mode, and the controller is used for controlling power loaded on the resistance wire.
In one embodiment, the air inlet channel and the exhaust pipeline are coated with insulating layers.
In one embodiment, a filtering device is arranged on the exhaust pipeline, the filtering device comprises at least one high-temperature air filter, the high-temperature air filter comprises an outer frame and a filtering net arranged on an opening of the filtering frame, and the filtering pore size of the filtering net is larger than 0.3 μm.
Compared with the prior art, the utility model has the beneficial effects that:
this scheme provides a silicon chip drying device, including storage tank, fan and heating device, the storage tank is equipped with the lid, be equipped with the air intake on one side wall of storage tank, be equipped with the air outlet on another lateral wall of storage tank, the air supply end of fan passes through inlet air duct intercommunication the air intake, the air outlet passes through exhaust pipe intercommunication the air inlet end of fan, heating device locates on the inlet air duct. The silicon wafer is placed in the containing groove, the upper cover body is arranged in the containing groove, air is conveyed to the air inlet channel through the fan under the driving of the fan, hot air is obtained after the air is heated by the heating device, the hot air is introduced into the containing groove to efficiently dry the silicon wafer, and then the silicon wafer is conveyed into the fan through the exhaust pipeline to be recycled, so that the silicon wafer drying system with automatic circulation is formed. The heating device is arranged outside the drying groove, so that the heating precision can be effectively controlled, the heating efficiency is improved, and dirt is not easy to generate.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic structural diagram of a silicon wafer drying apparatus according to an embodiment of the present application;
FIG. 2 is a schematic view showing another structure of a silicon wafer drying apparatus according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a high temperature air filter according to an embodiment of the present disclosure;
fig. 4 is a schematic view illustrating an internal structure of a receiving groove according to an embodiment of the present disclosure.
In the figure: 10-a heating controller, 11-a fan, 12-an air inlet channel, 13-a coil, 14-a heat insulation layer, 15-an exhaust pipeline, 16-a filtering device, 17-a containing groove, 18-a cover body, 19-a resistance wire, 20-a filtering structure, 21-a support, 22-an air outlet, 23-an air inlet, 24-a groove, 25-an outer frame and 26-a filtering screen.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1 to 4, the application provides a silicon wafer drying device, including storage tank 17, fan 11 and heating device, storage tank 17 upper portion is equipped with lid 18, be equipped with air intake 23 on one side wall of storage tank 17, be equipped with air outlet 22 on another lateral wall of storage tank 17, fan 11's air supply end passes through inlet air channel 12 intercommunication air intake 23, air outlet 22 passes through exhaust duct 15 intercommunication fan 11's inlet air end, heating device locates on the inlet air channel 12.
The silicon wafer is placed in the accommodating groove 17, the upper cover body 18 is covered on the inner cover, air is conveyed to the air inlet channel 12 through the fan 11 under the driving of the fan 11, hot air is obtained after heating through the heating device, the hot air is introduced into the accommodating groove 17 to efficiently dry the silicon wafer, and then the silicon wafer is conveyed into the fan 11 through the exhaust pipeline 15 to be recycled, so that the automatic-circulation silicon wafer drying system is formed. The heating device is arranged outside the drying groove, so that the heating precision can be effectively controlled, and the heating efficiency is improved.
The side wall refers to any one of the six wall surfaces of the accommodating groove.
In an embodiment of the present application, the air outlet 22 is disposed on a bottom wall of the accommodating groove 17, and the air inlet 23 is disposed on one side wall of the accommodating groove 17. The fan 11 adopts a centrifugal fan, can resist high temperature and is not easy to rust after surface spraying treatment. The cover 18 is hinged with the receiving groove 17, and the opening and closing of the cover 18 is controlled by an air cylinder. The air inlet channel 12 is hermetically connected with the fan 11 through a flange; the exhaust pipeline 15 is connected with the fan 11 and the accommodating groove 17 in a flange sealing mode.
The heating device can efficiently and accurately control the heating temperature and power. Wherein the heating means includes, but is not limited to, resistance heating, induction heating.
As shown in fig. 1, the heating device is an induction heating device, the induction heating device includes a heating controller 10, a magnetic core and a coil 13, the air inlet channel 12 is configured as the magnetic core, the coil is wound outside the air inlet channel 12, and the heating controller 10 is configured to control power applied to the coil 13. The air inlet channel 12 is a carrier with good magnetic conductivity, and can be made of carbon steel, iron, stainless iron and the like. The coil 13 surrounds the air inlet pipeline and is electrified to enable the internal magnetic conduction pipeline to cut the magnetic induction line to form vortex heating, the heating power and the temperature are set through the controller and are used for heating air flowing through, and the heated air is introduced into the air inlet 23 of the accommodating groove 17 from the pipeline under the action of the fan 11.
As shown in fig. 2, when the heating device is a structural schematic diagram of resistance heating, the heating device comprises a heating controller 10 and a resistance wire 19, the resistance wire 19 is hermetically arranged in the air intake channel 12, and the controller 10 is used for controlling the power loaded on the resistance wire 19. Air in the air inlet pipeline is heated under the action of the heating controller 10, the fan 11 blows air into the air inlet channel 12 continuously, heated air continuously enters the accommodating groove 17 to heat silicon wafers in the accommodating groove 17, and the heating device is arranged outside the accommodating groove 17 to dry the silicon wafers in the accommodating groove 17.
Further, the outer sides of the air inlet channel 12 and the exhaust pipeline 15 are both coated with a heat insulation layer 14, and the heat insulation layer 14 mainly plays a role in accommodating grooves for heat insulation and heat insulation. In addition, the outside of the containing groove can be provided with a heat preservation material to preserve and insulate the containing groove.
In an embodiment of the present application, a filtering device 16 is disposed on the exhaust pipeline 15, the exhaust pipeline 15 includes two exhaust pipe sections, one of the two ends of the exhaust pipe section is respectively communicated with the air outlet 22 and the air inlet end of the filtering device 16, and the other end of the exhaust pipe section is respectively communicated with the air outlet end of the filtering device 16 and the air inlet end of the fan 11. The filter device 16 filters the reflowed air and then leads the reflowed air into the air inlet end of the fan, so that clean hot air is ensured to be led into the accommodating groove 17, and the high efficiency and high quality of silicon wafer drying are realized. It should be noted that the two exhaust duct sections, the accommodating groove 17, the filter device 16 and the fan 11 are hermetically connected by flanges, and both the two exhaust duct sections adopt corrugated pipes.
As shown in fig. 3, the filtering device 16 includes at least one high temperature air filter, one or more of the high temperature air filters can be used in parallel, the air inlet end of the high temperature air filter is connected to the air outlet 22 of the accommodating groove 17, and the air outlet end of the high temperature air filter is connected to the air inlet end of the fan 11. The high-temperature air filter comprises an outer frame 25 and a filter screen 26 arranged on the outer frame 25, wherein the filter aperture of the filter screen 26 is larger than 0.3 μm, and particles with the diameter larger than 0.3 μm can be filtered. Preferably, the outer frame 25 is a galvanized outer frame, and the filter screen 26 is made of glass fiber.
As shown in fig. 4, in an embodiment of the present application, a plurality of grooves 24 are uniformly formed on an inner wall of the accommodating groove 17, and the plurality of grooves 24 are formed on two opposite side walls perpendicular to the one side wall and the bottom wall. The air flow directly entering from the air inlet 23 of the accommodating groove 17 is large, the grooves are formed in the two side walls of the accommodating groove 17, the direction of the air flow is changed, and the air flow entering the accommodating groove 17 is uniformly dispersed in the accommodating groove.
In an embodiment of the present application, a bracket 21 is disposed in the accommodating groove 17, and a slot for positioning an object to be dried is disposed on the bracket 21. The silicon wafer flower basket is positioned through the clamping groove, and the positioning is very convenient.
A filtering structure 20 is arranged below the support 21, and the filtering structure 20 adopts a filter screen or a filter bag. When the filtering structure is a filter screen, the filtering structure 20 below the support 21 can be obliquely arranged, so that fragments of the silicon wafer can be conveniently collected, and the air flow in the accommodating groove 17 is ensured to be smooth. The filter structure 20 is disposed below the bracket 21, and the air outlet 22 is disposed below the filter structure 20.
Further, the filtering structure 20 includes at least one collecting unit, which includes an inclined portion having a plurality of filtering holes. A plurality of collecting units may be provided, which are connected in series. The collecting unit is provided with an inclined portion to facilitate the collection of debris. Alternatively, the collecting unit may be provided with two inclined portions combined into a structure having a center protruding outward. Preferably, a drawing opening (not shown) may be formed in the bottom wall of the accommodating groove 17, so that the debris collected by the collecting unit can be conveniently cleaned.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the disclosure herein is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the spirit of the disclosure. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. The utility model provides a silicon chip drying device, its characterized in that, includes storage tank, fan and heating device, the storage tank is equipped with the lid, be equipped with the air intake on one side wall of storage tank, be equipped with the air outlet on another lateral wall of storage tank, the air supply end of fan passes through inlet air duct intercommunication the air intake, the air outlet passes through exhaust pipe intercommunication the inlet air end of fan, heating device locates on the inlet air duct.
2. The silicon wafer drying device according to claim 1, wherein the air outlet is formed in a bottom wall of the accommodating groove, and the air inlet is formed in one side wall of the accommodating groove.
3. The silicon wafer drying device according to claim 2, wherein a plurality of grooves are uniformly formed on the inner wall of the accommodating groove, and the plurality of grooves are formed on the other two opposite side walls perpendicular to the one side wall and the bottom wall.
4. The silicon wafer drying device according to claim 1, wherein a support is provided in the accommodating groove, and a slot for positioning the object to be dried is provided on the support.
5. The silicon wafer drying device according to claim 4, wherein a filtering structure is arranged below the support, and the filtering structure is a filter screen or a filter bag.
6. The silicon wafer drying apparatus of claim 5, wherein the filter structure comprises at least one collecting unit, the collecting unit comprises an inclined portion, and the inclined portion is provided with a plurality of filter holes.
7. The silicon wafer drying device according to claim 1, wherein the heating device is an induction heating device, the induction heating device comprises a heating controller, a magnetic core and a coil, the air inlet channel is configured as the magnetic core, the coil is wound outside the air inlet channel, and the heating controller is used for controlling power loaded on the coil.
8. The silicon wafer drying device according to claim 1, wherein the heating device comprises a heating controller and a resistance wire, the resistance wire is hermetically arranged in the air inlet channel, and the controller is used for controlling power loaded on the resistance wire.
9. The silicon wafer drying device of claim 1, wherein the outside of the air inlet channel and the air exhaust pipeline are coated with heat insulating layers.
10. The silicon wafer drying device according to claim 1, wherein a filter device is disposed on the exhaust duct, the filter device comprises at least one high temperature air filter, the high temperature air filter comprises an outer frame and a filter screen mounted on an opening of the outer frame, and a filter aperture of the filter screen is larger than 0.3 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120379719.6U CN215892993U (en) | 2021-02-19 | 2021-02-19 | Silicon wafer drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120379719.6U CN215892993U (en) | 2021-02-19 | 2021-02-19 | Silicon wafer drying device |
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| Publication Number | Publication Date |
|---|---|
| CN215892993U true CN215892993U (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120379719.6U Active CN215892993U (en) | 2021-02-19 | 2021-02-19 | Silicon wafer drying device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114993028A (en) * | 2022-06-17 | 2022-09-02 | 广东高景太阳能科技有限公司 | Silicon wafer drying treatment method and system |
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2021
- 2021-02-19 CN CN202120379719.6U patent/CN215892993U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114993028A (en) * | 2022-06-17 | 2022-09-02 | 广东高景太阳能科技有限公司 | Silicon wafer drying treatment method and system |
| CN114993028B (en) * | 2022-06-17 | 2023-05-30 | 高景太阳能股份有限公司 | Silicon wafer drying treatment method and system |
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