CN215882582U - Device for attaching conductive film - Google Patents
Device for attaching conductive film Download PDFInfo
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- CN215882582U CN215882582U CN202122107531.9U CN202122107531U CN215882582U CN 215882582 U CN215882582 U CN 215882582U CN 202122107531 U CN202122107531 U CN 202122107531U CN 215882582 U CN215882582 U CN 215882582U
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- 230000007246 mechanism Effects 0.000 claims abstract description 136
- 238000001179 sorption measurement Methods 0.000 claims abstract description 69
- 238000010030 laminating Methods 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims description 40
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 90
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The utility model relates to a device for attaching a conductive film, which is characterized in that: the device comprises an adsorption mechanism for adsorbing a conductive film, a first moving mechanism for driving the conductive film to horizontally move, a second moving mechanism for driving the conductive film to lift and a rotating mechanism for driving the conductive film to horizontally turn; the second moving mechanism is arranged at the driving end of the first moving mechanism; the rotating mechanism is arranged at the driving end of the second moving mechanism; the adsorption mechanism is rotatably arranged at the driving end of the rotating mechanism. The problems of low laminating efficiency, low laminating position precision and deviation in laminating in the existing scheme are solved.
Description
Technical Field
The utility model relates to the field of film pasting equipment, in particular to a device for pasting a conductive film.
Background
The metal components of the digital electronic products widely adopt a contact type electric conduction mode to realize the requirements of electromagnetic shielding and the like. The ACF conductive adhesive film is composed of high-quality resin and conductive particles, and is mainly applied to a process that high-temperature lead-tin soldering cannot be carried out on an electronic circuit board, namely a conventional Bonding process. The conductive film is a thin film having good conductivity and flexibility. The touch screen is mainly applied to the fields of touch screens and the like at present, and has extremely wide market space. A conventional conductive film includes a substrate and a conductive layer formed on the substrate. The conductive layer is formed on the substrate by coating, spraying and other processes. At present, a great variety of electronic products increasingly enter the lives of people and influence and change the lives of people.
The conductive film is attached to the product in two steps, namely, the conductive film is attached to the product and then the conductive film is hot-pressed on the product. The conducting film is in the laminating in-process, and current scheme adopts and sets up the conducting film on the membrane area with interval side by side, takes off the conducting film from the membrane area and laminate on the product through artificial mode. However, such a bonding method has low bonding efficiency, low bonding position accuracy, and variation in bonding. How to solve this problem becomes crucial.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a device for bonding a conductive film, so as to solve the problems of low bonding efficiency, low bonding position precision and bonding deviation in the prior art.
In order to achieve the purpose, the technical scheme of the utility model is as follows:
a device for conductive film lamination;
the device comprises an adsorption mechanism for adsorbing a conductive film, a first moving mechanism for driving the conductive film to horizontally move, a second moving mechanism for driving the conductive film to lift and a rotating mechanism for driving the conductive film to horizontally turn; the second moving mechanism is arranged at the driving end of the first moving mechanism; the rotating mechanism is arranged at the driving end of the second moving mechanism; the adsorption mechanism is rotatably arranged at the driving end of the rotating mechanism.
The further technical scheme is as follows: the first moving mechanism comprises a first power device, a first moving bracket, a first screw rod rotationally arranged on the first moving bracket, a guide plate horizontally arranged on the first moving bracket and a first sliding frame sliding along the guide plate; the first power device drives the first screw rod to rotate; the second moving mechanism is arranged on the first carriage; the first screw rod is in threaded connection with the first movable support.
The further technical scheme is as follows: a first guide rail is arranged on the first movable support along the moving direction of the conductive film; the first guide rail is arranged on one side, close to the product, of the first moving bracket; a first sliding block is arranged on the first guide rail in a sliding manner; the first sliding block is connected with the first movable bracket.
The further technical scheme is as follows: the second moving mechanism comprises a second power device, a second moving frame, a second screw rod rotationally arranged on the second moving frame, a second guide rail vertically arranged on the second moving frame, a second sliding block arranged on the second guide rail in a sliding manner and a second sliding frame sliding along the second guide rail; the second power device drives the second screw rod to rotate; the second sliding block is connected with the second sliding frame; the rotating mechanism is arranged on the second sliding frame; the second screw rod is in threaded connection with the second sliding frame.
The further technical scheme is as follows: the rotating mechanism comprises a coupler, a rotating bracket, a rotating shaft rotationally arranged on the rotating bracket and a third power device for driving the rotating shaft to rotate; the coupling is respectively and coaxially connected with the driving end of the third power device and the rotating shaft; the rotary support is rotatably arranged on the rotary support, and the rotary shaft is connected with the adsorption mechanism.
The further technical scheme is as follows: the adsorption mechanism comprises an adsorption block and a sensor for detecting the rotation angle of the conductive film; the rotating shaft is connected with the sensor; the detection end of the sensor is connected with the adsorption block; a plurality of adsorption holes are formed in the adsorption block and communicated with an air source.
The further technical scheme is as follows: the adsorption block is provided with a connecting groove; limiting grooves are formed in the two sides of the connecting groove; limiting blocks are arranged on two sides of the detection end of the sensor; the detection end of the sensor slides along the connecting groove; the limiting block slides along the limiting groove; the adsorption block is provided with a guide rod and an elastic device which pushes the adsorption block downwards; the elastic device is sleeved on the guide rod; the guide rod slides through the rotating bracket.
The further technical scheme is as follows: the conductive film positioning device also comprises a positioning mechanism for positioning the conductive film; the positioning mechanism comprises a photographic mechanism for shooting the conductive film and a first light source for irradiating light to the conductive film; the camera mechanism is arranged on the rotating mechanism; the first light source is arranged on the rotating mechanism and close to the conductive film.
The further technical scheme is as follows: the detection mechanism is used for detecting the rotating position of the conductive film; the detection mechanism comprises a detection bracket, a camera shooting mechanism for shooting the conductive film, a second light source for irradiating light to the conductive film and a light-transmitting piece; the light-transmitting piece is arranged on one side, close to the conductive film, of the detection support; the second light source is arranged in the detection bracket around the camera shooting mechanism.
The further technical scheme is as follows: the detection mechanism further comprises a light shielding plate; the light shielding plate is arranged on the detection bracket around the light-transmitting piece.
Compared with the prior art, the utility model has the following beneficial technical effects: (1) the first power device drives the first lead screw to rotate, the first lead screw drives the first sliding frame to slide left and right, the first sliding frame drives the second moving mechanism, the rotating mechanism and the conductive film to horizontally move left and right, the front end of the first moving support slides along the guide plate, the rear end of the first moving support slides along the first guide rail, and the guide plate and the first guide rail play a role in stably supporting the first moving support, so that the first moving support can stably slide; (2) the second power device drives the second screw rod to rotate, the second screw rod drives the second sliding frame to slide up and down along the second guide rail, the second sliding frame drives the rotating mechanism and the conductive film to move up and down, and the conductive film can stably and smoothly move up and down through the second guide rail; (3) the adsorption block adsorbs the conductive film through the adsorption hole, the third power device drives the rotating shaft to rotate through the coupler, the rotating shaft drives the sensor, the adsorption block and the conductive film to rotate, the rotating angle of the conductive film can be known through the sensor, and the rotating position of the conductive film can be conveniently adjusted; (4) the adsorption of the conductive film is completed through the adsorption mechanism, the conductive film is prevented from being damaged by pressure in the moving process of the adsorption block, the reset is automatically completed after the adsorption, and the laminating quality of the conductive film is ensured; (5) shoot the conducting film through camera mechanism, can learn the position of conducting film, make things convenient for adsorption apparatus to remove the position of conducting film and adsorb, adsorption apparatus drives the conducting film and removes the top of detection mechanism, shoot the conducting film through camera mechanism, learn the deflection angle of conducting film, drive adsorption apparatus and the rotatory certain angle of conducting film through slewing mechanism for the conducting film position is just changeed, has guaranteed the accuracy of conducting film laminating, has improved the quality of conducting film laminating.
Drawings
Fig. 1 is a schematic structural diagram illustrating an apparatus for attaching a conductive film according to an embodiment of the present invention.
Fig. 2 shows an enlarged structural view at a in fig. 1.
Fig. 3 is a schematic structural view showing a second moving mechanism according to the embodiment of the present invention.
Fig. 4 shows a schematic structural diagram of a detection mechanism according to an embodiment of the present invention.
In the drawings, the reference numbers: 1. an adsorption mechanism; 11. an adsorption block; 12. a sensor; 13. connecting grooves; 14. a limiting groove; 15. a limiting block; 16. a guide bar; 17. an elastic device; 2. a first moving mechanism; 21. a first moving support; 22. a first lead screw; 23. a guide plate; 24. a first carriage; 25. a first power unit; 26. a first guide rail; 27. a first slider; 3. a second moving mechanism; 31. a second movable frame; 32. a second lead screw; 33. a second guide rail; 34. a second slider; 35. a second carriage; 36. a second power unit; 4. a rotating mechanism; 41. rotating the bracket; 42. a rotating shaft; 43. a third power unit; 44. a coupling; 5. a positioning mechanism; 51. a camera mechanism; 52. a first light source; 6. a detection mechanism; 61. detecting the bracket; 62. a camera mechanism; 63. a second light source; 64. a light transmissive member; 65. a light shield.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of the present invention is provided with reference to the accompanying drawings and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is a schematic structural diagram illustrating an apparatus for attaching a conductive film according to an embodiment of the present invention. Fig. 2 shows an enlarged structural view at a in fig. 1. Fig. 3 is a schematic structural view showing a second moving mechanism according to the embodiment of the present invention. Fig. 4 shows a schematic structural diagram of a detection mechanism according to an embodiment of the present invention. Referring to fig. 1, 2, 3 and 4, the present invention discloses a device for attaching a conductive film. The direction of X in the figure is the upper end of the structural schematic diagram of the utility model, and the direction of Y in the figure is the right end of the structural schematic diagram of the utility model.
The device for adhering the conductive film comprises an adsorption mechanism 1 for adsorbing the conductive film, a first moving mechanism 2 for driving the conductive film to horizontally move, a second moving mechanism 3 for driving the conductive film to ascend and descend and a rotating mechanism 4 for driving the conductive film to horizontally turn. The second moving mechanism 3 is provided at the driving end of the first moving mechanism 2. The rotating mechanism 4 is provided at the driving end of the second moving mechanism 3. The adsorption mechanism 1 is rotatably arranged at the driving end of the rotating mechanism 4.
The first moving mechanism 2 includes a first power unit 25, a first moving bracket 21, a first lead screw 22 rotatably provided on the first moving bracket 21, a guide plate 23 horizontally provided on the first moving bracket 21, and a first carriage 24 sliding along the guide plate 23. The first power device 25 drives the first lead screw 22 to rotate. The second moving mechanism 3 is provided on the first carriage 24. The first lead screw 22 is threadedly coupled to the first carriage 24.
Preferably, the first power device 25 is an electric motor. The first movable bracket 21 is provided in the left-right direction. The first lead screw 22 is rotatably provided in the first moving frame 21 in the left-right direction. The driving end of the first power device 25 is connected with the first screw rod 22. The guide plate 23 is horizontally provided at the upper end of the first moving frame 21 in the left-right direction.
The first moving frame 21 is provided with a first guide rail 26 along the moving direction of the conductive film. The first guide rail 26 is provided on the first moving frame 21 on the side near the product. A first slider 27 is slidably disposed on the first rail 26. The first slider 27 is connected to the first moving bracket 21.
The first guide rail 26 is provided at an upper end of the first moving bracket 21 in the left-right direction. The first guide rail 26 is located on the rear side of the guide plate 23. The upper end of the first slider 27 is connected to the rear end of the first moving bracket 21. The front end of the first movable bracket 21 is slidably coupled to the guide plate 23.
The first power device 25 drives the first lead screw 22 to rotate, and the first lead screw 22 drives the first sliding frame 24 to slide left and right. The second moving mechanism 3, the rotating mechanism 4 and the conductive film are horizontally moved left and right by the first carriage 24. The guide plate 23 and the first guide rail 26 play a role of stably supporting the first moving bracket 21 by the front end of the first moving bracket 21 sliding along the guide plate 23 and the rear end of the first moving bracket 21 sliding along the first guide rail 26, so that the first moving bracket 21 can smoothly slide.
The second moving mechanism 3 includes a second power device 36, a second moving frame 31, a second lead screw 32 rotatably disposed on the second moving frame 31, a second guide rail 33 vertically disposed on the second moving frame 31, a second slider 34 slidably disposed on the second guide rail 33, and a second carriage 35 sliding along the second guide rail 33. The second power device 36 drives the second lead screw 32 to rotate. The second slider 34 is connected to the second carriage 35. The rotating mechanism 4 is provided on the second carriage 35. The second screw 32 is screwed to the second carriage 35.
Preferably, the second power device 36 is an electric motor. The second moving frame 31 is provided at the rear end of the first carriage 24 in the vertical direction. The second screw 32 is vertically rotatably provided on the second moving frame 31. The second guide rail 33 is vertically disposed on the second moving frame 31. The second guide rails 33 are located on the left and right sides of the second lead screw 32. The second power unit 36 is vertically disposed at the upper end of the second moving frame 31. The lower end of the second power means 36 is the drive end of the second power means 36. The lower end of the second power device 36 is connected with the upper end of the second screw rod 32. The rear end of the second slider 34 is connected to a second carriage 35.
The second power device 36 drives the second lead screw 32 to rotate, and the second lead screw 32 drives the second sliding frame 35 to slide up and down along the second guide rail 33. The second carriage 35 drives the rotating mechanism 4 and the conductive film to move up and down, and the conductive film can smoothly move up and down through the second guide rail 33.
The rotating mechanism 4 includes a coupling 44, a rotating bracket 41, a rotating shaft 42 rotatably disposed on the rotating bracket 41, and a third power device 43 for driving the rotating shaft 42 to rotate. The coupling 44 is coaxially connected to the driving end of the third power unit 43 and the rotating shaft 42, respectively. The adsorption mechanism 1 is rotatably arranged on the rotating bracket 41, and the rotating shaft 42 is connected with the adsorption mechanism 1.
Preferably, the third power device 43 is an electric motor. The rotating bracket 41 is disposed in the vertical direction. The third power unit 43 is provided at an upper end of the rotating bracket 41 in the up-down direction. The lower end of the third power means 43 is the drive end of the third power means 43. The upper end of the coupling 44 is connected to the lower end of the third power unit 43. The lower end of the coupling 44 is connected to the upper end of the shaft 42. The rotation shaft 42 is rotatably provided in the rotation bracket 41 in the vertical direction.
The adsorption mechanism 1 includes an adsorption block 11 and a sensor 12 that detects a rotation angle of the conductive film. The shaft 42 is connected to the sensor 12. The detection end of the sensor 12 is connected with the adsorption block 11. The adsorption block 11 is provided with a plurality of adsorption holes which are communicated with an air source.
The upper end of the sensor 12 is connected to the lower end of the shaft 42. The lower end of the sensor 12 is the sensing end of the sensor 12. The upper end of the adsorption block 11 is connected with the lower end of the sensor 12. The adsorption holes are arranged in parallel on the lower surface of the adsorption block 11.
The adsorption block 11 adsorbs the conductive film through the adsorption hole, the third power device 43 drives the rotation shaft 42 to rotate through the coupling 44, and the rotation shaft 42 drives the sensor 12, the adsorption block 11 and the conductive film to rotate. The rotation angle of the conductive film can be known through the sensor 12, and the rotation position of the conductive film can be conveniently adjusted.
The adsorption block 11 is provided with a connecting groove 13. The connecting groove 13 is provided with a limiting groove 14 at both sides. The two sides of the detection end of the sensor 12 are provided with limiting blocks 15. The sensing end of the sensor 12 slides along the coupling groove 13. The restricting block 15 slides along the restricting groove 14. The suction block 11 is provided with a guide rod 16 and an elastic means 17 for pushing the suction block 11 downward. The elastic device 17 is sleeved on the guide rod 16. The guide bar 16 slides through the rotating bracket 41.
Preferably, the elastic means 17 are springs. The connection groove 13 is opened on the upper surface of the adsorption block 11. The restricting grooves 14 are formed vertically on both sides of the coupling groove 13. The sensing end of the sensor 12 slides up and down along the connecting groove 13. The restricting block 15 slides up and down along the restricting slot 14. The guide rod 16 is vertically disposed on the suction block 11. The guide bar 16 slides through the lower end of the rotating bracket 41. The elastic device 17 is sleeved on the outer surface of the guide rod 16 in the vertical direction. The lower end of the elastic means 17 abuts against the suction block 11. The upper end of the elastic means 17 abuts against the lower end of the rotating bracket 41.
When the adsorption mechanism 1 moves downwards, the adsorption block 11 contacts the conductive film, the adsorption block 11 stops moving, the detection end of the sensor 12 slides along the connecting groove 13, the limiting block 15 slides along the limiting groove 14, the guide rod 16 slides along the rotating bracket 41, and the elastic device 17 is extruded. After the adsorption block 11 adsorbs the conductive film, the adsorption mechanism 1 moves upwards, the adsorption block 11 moves upwards, the elastic device 17 expands elastically, the detection end of the sensor 12 resets by sliding along the connection groove 13, the limiting block 15 resets by sliding along the limiting groove 14, and the guide rod 16 resets by sliding along the rotating bracket 41.
The adsorption of the conductive film is completed through the adsorption mechanism 1, meanwhile, the conductive film is prevented from being damaged by pressure in the moving process of the adsorption block 11, the reset is automatically completed after the adsorption, and the laminating quality of the conductive film is ensured.
The device for attaching the conductive film further includes a positioning mechanism 5 for positioning the conductive film. The positioning mechanism 5 includes a camera mechanism 51 for photographing the conductive film and a first light source 52 for irradiating light to the conductive film. The camera mechanism 51 is provided on the rotation mechanism 4. The first light source 52 is provided on the rotating mechanism 4 at a position close to the conductive film.
Preferably, the lower end of the first light source 52 is the irradiation end of the first light source 52. Preferably, the CCD camera mechanism 51 is a camera. The lower end of the camera mechanism 51 is the shooting end of the camera mechanism 51. The camera mechanism 51 is disposed at the upper end of the left side of the rotating bracket 41. The first light source 52 is disposed at the lower end of the left side of the rotating bracket 41.
The apparatus for bonding a conductive film further includes a detection mechanism 6 for detecting a rotational position of the conductive film. The detection mechanism 6 includes a detection holder 61, an image pickup mechanism 62 for picking up an image of the conductive film, a second light source 63 for irradiating light to the conductive film, and a light transmitting member 64. The light-transmitting member 64 is provided on the side of the detection support 61 close to the conductive film. The second light source 63 is disposed in the detection holder 61 around the imaging mechanism 62.
The detection mechanism 6 further includes a light shielding plate 65. The light shielding plate 65 is disposed on the detection bracket 61 around the light transmitting member 64.
Preferably, the optically transparent member 64 is glass. Preferably, the imaging mechanism 62 is a CCD camera. The upper end of the camera 62 is the shooting end of the camera 62. The upper end of the second light source 63 is an irradiation end of the second light source 63. The imaging mechanism 62 is provided at the lower end inside the detection bracket 61. The second light source 63 is disposed at a lower end inside the detection bracket 61 around the imaging mechanism 62. The light-transmitting member 64 is horizontally disposed at the upper end of the detection bracket 61.
The light shielding plate 65 is disposed in the vertical direction. The light shielding plate 65 is disposed around the light transmitting member 64 at the upper end of the detection bracket 61.
The position of the conductive film can be known by shooting the conductive film through the camera mechanism 51, so that the adsorption mechanism 1 can be conveniently moved to the position of the conductive film for adsorption. The adsorption mechanism 1 drives the conductive film to move above the detection mechanism 6, the conductive film is shot through the camera mechanism 62, the deflection angle of the conductive film is known, the adsorption mechanism 1 and the conductive film are driven to rotate by a certain angle through the rotating mechanism 4, the position of the conductive film is rotated, the laminating accuracy of the conductive film is guaranteed, and the laminating quality of the conductive film is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A device for conducting film laminating is characterized in that: the device comprises an adsorption mechanism (1) for adsorbing the conductive film, a first moving mechanism (2) for driving the conductive film to horizontally move, a second moving mechanism (3) for driving the conductive film to lift and a rotating mechanism (4) for driving the conductive film to horizontally turn; the second moving mechanism (3) is arranged at the driving end of the first moving mechanism (2); the rotating mechanism (4) is arranged at the driving end of the second moving mechanism (3); the adsorption mechanism (1) is rotatably arranged at the driving end of the rotating mechanism (4).
2. The apparatus for conductive film conformable of claim 1, wherein: the first moving mechanism (2) comprises a first power device (25), a first moving bracket (21), a first screw rod (22) rotatably arranged on the first moving bracket (21), a guide plate (23) horizontally arranged on the first moving bracket (21) and a first sliding frame (24) sliding along the guide plate (23); the first power device (25) drives the first screw rod (22) to rotate; the second movement mechanism (3) is arranged on the first carriage (24); the first screw rod (22) is in threaded connection with the first movable bracket (21).
3. The apparatus for conductive film conformable of claim 2, wherein: a first guide rail (26) is arranged on the first moving support (21) along the moving direction of the conductive film; the first guide rail (26) is arranged on one side, close to the product, of the first moving bracket (21); a first sliding block (27) is arranged on the first guide rail (26) in a sliding manner; the first slider (27) is connected with the first moving bracket (21).
4. The apparatus for conductive film conformable of claim 1, wherein: the second moving mechanism (3) comprises a second power device (36), a second moving frame (31), a second screw rod (32) rotatably arranged on the second moving frame (31), a second guide rail (33) vertically arranged on the second moving frame (31), a second sliding block (34) slidably arranged on the second guide rail (33), and a second sliding frame (35) sliding along the second guide rail (33); the second power device (36) drives the second screw rod (32) to rotate; the second sliding block (34) is connected with the second sliding frame (35); the rotating mechanism (4) is arranged on the second carriage (35); the second screw rod (32) is in threaded connection with the second carriage (35).
5. The apparatus for conductive film conformable of claim 1, wherein: the rotating mechanism (4) comprises a coupler (44), a rotating bracket (41), a rotating shaft (42) rotatably arranged on the rotating bracket (41) and a third power device (43) for driving the rotating shaft (42) to rotate; the coupling (44) is respectively and coaxially connected with the driving end of the third power device (43) and the rotating shaft (42); the adsorption mechanism (1) is rotationally arranged on the rotating support (41), and the rotating shaft (42) is connected with the adsorption mechanism (1).
6. The apparatus for conductive film conformable of claim 5, wherein: the adsorption mechanism (1) comprises an adsorption block (11) and a sensor (12) for detecting the rotation angle of the conductive film; the rotating shaft (42) is connected with the sensor (12); the detection end of the sensor (12) is connected with the adsorption block (11); a plurality of adsorption holes are formed in the adsorption block (11), and the adsorption holes are communicated with an air source.
7. The apparatus for conductive film conformable of claim 6, wherein: the adsorption block (11) is provided with a connecting groove (13); limiting grooves (14) are formed in the two sides of the connecting groove (13); limiting blocks (15) are arranged on two sides of the detection end of the sensor (12); the detection end of the sensor (12) slides along the connecting groove (13); the limiting block (15) slides along the limiting groove (14); the adsorption block (11) is provided with a guide rod (16) and an elastic device (17) which pushes the adsorption block (11) downwards; the elastic device (17) is sleeved on the guide rod (16); the guide rod (16) slides through the rotating bracket (41).
8. The apparatus for conductive film conformable of claim 1, wherein: the device also comprises a positioning mechanism (5) for positioning the conductive film; the positioning mechanism (5) comprises a camera mechanism (51) for shooting the conductive film and a first light source (52) for irradiating light to the conductive film; the photographic mechanism (51) is arranged on the rotating mechanism (4); the first light source (52) is arranged on the rotating mechanism (4) at a position close to the conductive film.
9. The apparatus for conductive film conformable of claim 1, wherein: the device also comprises a detection mechanism (6) for detecting the rotation position of the conductive film; the detection mechanism (6) comprises a detection bracket (61), a camera mechanism (62) for shooting the conductive film, a second light source (63) for irradiating light to the conductive film and a light transmission piece (64); the light-transmitting piece (64) is arranged on one side, close to the conductive film, of the detection support (61); the second light source (63) is disposed in the detection holder (61) around the imaging mechanism (62).
10. The apparatus for conductive film conformable of claim 9, wherein: the detection mechanism (6) further comprises a light shielding plate (65); the light shielding plate (65) is disposed on the detection support (61) around the light transmitting member (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122107531.9U CN215882582U (en) | 2021-09-02 | 2021-09-02 | Device for attaching conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122107531.9U CN215882582U (en) | 2021-09-02 | 2021-09-02 | Device for attaching conductive film |
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| Publication Number | Publication Date |
|---|---|
| CN215882582U true CN215882582U (en) | 2022-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122107531.9U Active CN215882582U (en) | 2021-09-02 | 2021-09-02 | Device for attaching conductive film |
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| Country | Link |
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| CN (1) | CN215882582U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117377229A (en) * | 2023-12-07 | 2024-01-09 | 深圳清大电子科技有限公司 | Hot pressing process and equipment for bonding conductive film |
-
2021
- 2021-09-02 CN CN202122107531.9U patent/CN215882582U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117377229A (en) * | 2023-12-07 | 2024-01-09 | 深圳清大电子科技有限公司 | Hot pressing process and equipment for bonding conductive film |
| CN117377229B (en) * | 2023-12-07 | 2024-02-20 | 深圳清大电子科技有限公司 | Hot pressing process and equipment for bonding conductive film |
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Address after: 214000 No.3, Hudai Road, South District, Hudai Industrial Park, Binhu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Teliliang New Material Technology Co.,Ltd. Address before: 214000 No.3, Hudai Road, South District, Hudai Industrial Park, Binhu District, Wuxi City, Jiangsu Province Patentee before: JIANGSU TELI LIANG COATING TECHNOLOGY CO.,LTD. |