CN215872434U - Can encapsulate through heat radiation structure - Google Patents
Can encapsulate through heat radiation structure Download PDFInfo
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- CN215872434U CN215872434U CN202121767268.XU CN202121767268U CN215872434U CN 215872434 U CN215872434 U CN 215872434U CN 202121767268 U CN202121767268 U CN 202121767268U CN 215872434 U CN215872434 U CN 215872434U
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Abstract
The utility model discloses a direct-through type heat dissipation structure capable of being packaged, which comprises a filling and sealing frame used as a heat radiator frame; heating components are mounted on the front end face and the rear end face of the encapsulating frame, an airflow outlet is formed in the bottom end of the encapsulating frame, and an airflow inlet is formed in the top end of the encapsulating frame; at least two brazing connection plates are arranged in the air inlet, a fin mounting hole is formed in a gap between every two adjacent brazing connection plates, and a straight fin assembly is vertically arranged in the fin mounting hole. The straight fins are adopted, so that the circulation of cooling air can be increased, the accumulation of hot air in the heat dissipation fins is reduced, the transformer can be encapsulated and installed to achieve the due heat dissipation effect, the heat dissipation effect on electronic equipment is improved, the reliable operation of all components in the electronic equipment is guaranteed, and meanwhile, the whole radiator is lighter and more convenient.
Description
Technical Field
The utility model relates to the field of heat dissipation structures, in particular to a through type heat dissipation structure capable of being packaged.
Background
With the development of electronic devices, power consumption elements in the electronic devices have increased. Therefore, the heat generated by the electronic equipment is increased, and in order to ensure that the electronic equipment is in the optimal working state, the heat dissipation treatment is carried out on the electronic equipment by using the radiator; the radiator is divided into natural cooling radiation and forced cooling radiation according to a cooling method; forced cooling heat dissipation can be divided into air cooling heat dissipation and liquid cooling heat dissipation.
Transformers in electronic equipment are commonly used for power devices, resistors, motors, power supplies and the like; the natural cooling and heat dissipation utilizes the heat exchange between the heat dissipation fins and the air to achieve the purpose of heat dissipation; therefore, the larger the contact area between the radiating fin and the air is, the larger the heat radiation amount in the same time and space is; in the heat dissipation fins, if the hot air after heat exchange cannot be effectively conducted to the ambient air, the heat dissipation efficiency of the heat sink is affected, the heat dissipation effect is reduced, and the effective work of the electronic equipment is seriously affected.
In the existing heat dissipation structure, a heating element is usually installed on one side of a heat sink, but for some special products, such as a rectifying device, heat dissipation needs to be performed on a transformer, a rectifying diode, a power consumption resistor and the like at the same time; however, how to realize heat dissipation of the heating element in a limited space, the heat dissipation structure and the installation of the heating element have high requirements, and the existing single-installation-surface heat dissipation mode cannot meet the use requirement.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a straight-through type heat dissipation structure capable of being packaged, which aims to solve the problems that elements such as a transformer and the like are installed in an electronic device in an embedding mode, and other elements can be subjected to a heat dissipation structure on the other side of a heat radiator.
In order to achieve the purpose, the utility model provides the following technical scheme:
a kind of can capsulate the through type heat-dissipating structure, the heat-dissipating structure includes the embedding shelf used for acting as heat sink frame; heating components are mounted on the front end face and the rear end face of the encapsulating frame, an airflow outlet is formed in the bottom end of the encapsulating frame, and an airflow inlet is formed in the top end of the encapsulating frame; at least two brazing plates are arranged in the air inlet, a fin mounting hole is formed in a gap between every two adjacent brazing plates, and a straight fin assembly is vertically arranged in the fin mounting hole; the front end face of the encapsulation frame is provided with an encapsulation groove, the upper side and the lower side of the encapsulation groove are respectively provided with a lightening hole, and the left side and the right side of the encapsulation groove are respectively provided with a lightening groove.
Preferably, the straight fin assembly is formed by butt joint of at least two groups of straight fins side by side, the overall section appearance of the straight fin is of a structure like a Chinese character 'ji', the outer surface of the straight fin is provided with a binding surface, and the binding surface and the brazing plate are tightly attached and installed into a whole.
Preferably, the heating component comprises a rectifier diode, a voltage limiting resistor and a transformer, the transformer is encapsulated in a groove cavity of the encapsulation groove, and the voltage limiting resistor and the rectifier diode are both mounted on the rear end face of the encapsulation frame through fasteners.
Preferably, the top end of the potting frame is provided with an upper flange surface at the peripheral edge position of the airflow inlet, and the bottom end of the potting frame is provided with a lower flange surface at the peripheral edge position of the airflow outlet.
Preferably, the outer edges of the upper flange surface and the lower flange surface are symmetrically provided with mounting lug assemblies, and the mounting lug assemblies comprise at least four groups of mounting lugs.
Compared with the prior art, the utility model has the beneficial effects that:
the straight fins adopted by the utility model can ensure that the environment-controlled ventilation is from top to bottom, the cooling air flow enters the radiator from the air flow inlet, the air flow flows out from the air flow outlet after passing through the straight fins, and the heat dissipation treatment is carried out on heating elements such as the rectifier diode and the transformer, so that the circulation of the cooling air is increased, the accumulation of the hot air in the heat dissipation fins is reduced, the transformer can be encapsulated and installed to realize the due heat dissipation effect, the heat dissipation effect of components such as the voltage limiting resistor and the rectifier diode in the electronic equipment is improved, the reliable operation of each component in the electronic equipment is ensured, and the better heat dissipation effect is achieved; meanwhile, the set lightening holes and the lightening grooves can greatly lighten the whole weight of the heat dissipation structure, so that the whole heat dissipation structure is lighter and more convenient, and the heat dissipation structure is favorable for popularization and use.
Drawings
FIG. 1 is a schematic view of the present invention in an assembled state;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic structural view of a straight fin according to the present invention;
FIG. 4 is a schematic cross-sectional view of a straight fin of the present invention.
In the figure: the device comprises a potting frame 1, a rectifier diode 2, a straight fin assembly 3, a 31 binding surface, a transformer 4, a voltage limiting resistor 5, an airflow inlet 6, an airflow outlet 7, a potting groove 11, a brazing plate 12, a fin mounting hole 13, a lightening hole 14, a lightening groove 15, a mounting lug 16, a lower flange surface 17 and an upper flange surface 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a kind of can capsulate the through type heat-dissipating structure, the heat-dissipating structure includes the embedding frame 1 used for acting as heat sink frame; heating components are mounted on the front end face and the rear end face of the encapsulation frame 1, and an encapsulation groove 11 is formed in the front end face of the encapsulation frame 1; the bottom end of the encapsulation frame 1 is provided with an airflow outlet 7, and the top end of the encapsulation frame 1 is provided with an airflow inlet 6; at least two brazing plates 12 are arranged in the airflow inlet 6, a fin mounting hole 13 is formed in a gap between every two adjacent brazing plates 12, and a straight fin assembly 3 is vertically arranged in the fin mounting hole 13; an upper flange surface 18 is arranged at the peripheral edge position of the airflow inlet 6 at the top end of the encapsulation frame 1, a lower flange surface 17 is arranged at the peripheral edge position of the airflow outlet 7 at the bottom end of the encapsulation frame 1, and mounting lug assemblies are symmetrically arranged at the outer edges of the upper flange surface 18 and the lower flange surface 17 and comprise at least four groups of mounting lugs 16; wherein, brazing plate 12 can be selected from aluminum alloy brazing plate, and is used as the support frame of straight fin component 3.
Referring to fig. 1, when the encapsulated straight-through heat dissipation structure is used, an encapsulation frame 1 used as a heat sink frame is mounted on upper and lower cover plates of an electronic device through mounting lugs 16 of an upper flange surface 18 and a lower flange surface 17; the heating component comprises a rectifier diode 2, a voltage limiting resistor 5 and a transformer 4, the transformer 4 is encapsulated in a groove cavity of the encapsulating groove 11, and the voltage limiting resistor 5 and the rectifier diode 2 are both installed on the rear end face of the encapsulating frame 1 through fasteners; wherein the fastener is selected from the group consisting of, but not limited to, a screw and a bolt.
Referring to fig. 1 and 2, in order to reduce the overall weight of the potting frame 1, weight-reducing holes 14 are respectively formed in the upper side and the lower side of the potting groove 11, six weight-reducing holes 14 are formed in each side surface, and the overall structure of each weight-reducing hole 14 is a circular, oval or rectangular structure; the left side and the right side of the encapsulation groove 11 are respectively provided with a weight reduction groove 15; two weight-reducing grooves 15 are arranged on each side surface, and the overall appearance of the encapsulation groove 11 is of a rectangular structure or a rounded rectangular structure; in order to ensure that the encapsulation frame 1 used as a radiator frame and the electronic equipment are more firmly and reliably installed, ten installing lugs 16 which are symmetrically distributed are respectively arranged on an upper flange surface 18 and a lower flange surface 17 of the encapsulation frame 1, and round holes for installing fasteners are arranged on the installing lugs 16.
Referring to fig. 3 and 4, the straight fin assembly 3 is formed by at least two groups of straight fins abutting against each other side by side, the overall cross-sectional shape of the straight fins is a structure like a Chinese character ji, and the outer surfaces of the straight fins are provided with attachment surfaces 31, and the attachment surfaces 31 and the brazing plate 12 are attached to each other in a tight fit manner to form a whole, so as to increase the overall heat dissipation effect of the potting frame 1 used as a heat sink frame; in order to reduce the aggregation of cooling airflow in the radiator formed by the encapsulation frame 1, the radiating fins are designed into straight fins in a structure like a Chinese character 'ji', the upper end surface of the radiator is an airflow inlet 6, and the lower end surface of the radiator is an airflow outlet 7; when the radiator works, the air flow enters the radiator from the air flow inlet 6 at the upper end of the radiator, after the heat exchange between the air in the radiator and the straight fins is completed, the air flow flows out of the radiator from the air flow outlet 7 of the radiator, so that the heat dissipation process is completed, namely when the radiator works, the environment-controlled ventilation is performed from top to bottom, the cooling air flow enters the radiator from the air flow inlet 6, the air flow flows out of the air flow outlet 7 after passing through the straight fins, and the heat dissipation is performed on heating elements such as the rectifying diode 2, the voltage limiting resistor 5 and the transformer 4.
In order to reduce the weight of the encapsulation frame 1, six lightening holes 14 are respectively arranged at the upper side and the lower side of an encapsulation groove 11, four lightening grooves 15 are respectively arranged at the left side and the right side of the encapsulation frame 1, and a straight fin component 3 is arranged between two brazing plates 12 of the encapsulation frame 1; in order to reduce the aggregation of airflow in the radiating fins and influence the radiating effect of the radiator, the straight fins are designed into a shape like a Chinese character 'ji'; the electronic equipment can effectively solve the problem that devices need to be encapsulated and installed and have double-side installation and heat dissipation requirements.
Examples
The radiator composed of the encapsulation frame 1 and straight fins is used as an important part in the rectifier device, the radiator is arranged on the upper cover plate and the lower cover plate of the rectifier through the mounting lugs 16 on the upper flange surface 18 and the lower flange surface 17, and the encapsulation frame 1 is used as a frame support and is provided with heating elements such as a rectifier diode 2, a voltage limiting resistor 5, a transformer 4 and the like; the transformer 4 is installed in a potting mode, and the rectifier diode 2 and the voltage limiting resistor 5 are fixed on the rear end face of the radiator through screws; when the rectifier works, the straight fins are used for circularly controlling ventilation from top to bottom, cooling airflow enters the radiator from the airflow inlet 6, flows out from the airflow outlet 7 after passing through the straight-through heat dissipation fins, and dissipates heat of heating elements such as the rectifier diode 2 and the transformer 4.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be a mechanical connection; either directly or indirectly through intervening media, either internally or in any other relationship. The detachable installation mode has various modes, for example, a mode of matching with a buckle through plugging, for example, a mode of connecting through a bolt, and the like.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A kind of can capsulate the through type heat-dissipating structure, the heat-dissipating structure includes the embedding shelf used for acting as heat sink frame; the method is characterized in that: heating components are mounted on the front end face and the rear end face of the encapsulating frame, an airflow outlet is formed in the bottom end of the encapsulating frame, and an airflow inlet is formed in the top end of the encapsulating frame; at least two brazing plates are arranged in the air inlet, a fin mounting hole is formed in a gap between every two adjacent brazing plates, and a straight fin assembly is vertically arranged in the fin mounting hole; the front end face of the encapsulation frame is provided with an encapsulation groove, the upper side and the lower side of the encapsulation groove are respectively provided with a lightening hole, and the left side and the right side of the encapsulation groove are respectively provided with a lightening groove.
2. A packageable flow-through heat dissipation structure as recited in claim 1, wherein: the straight fin assembly is formed by butt joint of at least two groups of straight fins side by side, the overall section appearance of each straight fin is of a structure like a Chinese character 'ji', the outer surface of each straight fin is provided with a binding surface, and the binding surface and the brazing plate are tightly attached and installed into a whole.
3. A packageable flow-through heat dissipation structure as recited in claim 1, wherein: the heating component comprises a rectifier diode, a voltage limiting resistor and a transformer, the transformer is encapsulated in a groove cavity of the encapsulation groove, and the voltage limiting resistor and the rectifier diode are both mounted on the rear end face of the encapsulation frame through fasteners.
4. A packageable flow-through heat dissipation structure as recited in claim 1, wherein: the top end of the encapsulation frame is provided with an upper flange surface at the peripheral edge position of the airflow inlet, and the bottom end of the encapsulation frame is provided with a lower flange surface at the peripheral edge position of the airflow outlet.
5. A packageable flow-through heat dissipation structure as recited in claim 4, wherein: the outer edge of the upper flange surface and the outer edge of the lower flange surface are symmetrically provided with mounting lug assemblies, and each mounting lug assembly comprises at least four groups of mounting lugs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121767268.XU CN215872434U (en) | 2021-07-31 | 2021-07-31 | Can encapsulate through heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121767268.XU CN215872434U (en) | 2021-07-31 | 2021-07-31 | Can encapsulate through heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215872434U true CN215872434U (en) | 2022-02-18 |
Family
ID=80329061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121767268.XU Active CN215872434U (en) | 2021-07-31 | 2021-07-31 | Can encapsulate through heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215872434U (en) |
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2021
- 2021-07-31 CN CN202121767268.XU patent/CN215872434U/en active Active
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