CN215872369U - Heat dissipation type circuit board buffer memory machine - Google Patents
Heat dissipation type circuit board buffer memory machine Download PDFInfo
- Publication number
- CN215872369U CN215872369U CN202122403680.XU CN202122403680U CN215872369U CN 215872369 U CN215872369 U CN 215872369U CN 202122403680 U CN202122403680 U CN 202122403680U CN 215872369 U CN215872369 U CN 215872369U
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- China
- Prior art keywords
- circuit board
- buffer memory
- heat dissipation
- lead screw
- storage plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 238000007664 blowing Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 10
- 238000000429 assembly Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000007669 thermal treatment Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of circuit board storage, in particular to a heat dissipation type circuit board cache machine which comprises a cache frame for storing a circuit board, wherein the cache frame comprises two storage plates arranged at intervals, a plurality of embedded grooves arranged at intervals are formed in the storage plates, and blowing equipment is arranged on the outer sides of the storage plates; the buffer frame is driven to lift by the lifting driving mechanism, so that one embedded groove is flush with the conveying mechanism, and the circuit board enters the embedded groove of the buffer frame; when the subsequent circuit board reaches the front end of the cache frame, the cache frame is driven to lift by the lifting driving mechanism, the conveying mechanism is flush with the other embedded groove, and the circuit board enters the embedded groove of the cache frame; from this, the buffer memory frame can be gone up and down to collect the buffer memory to a plurality of circuit boards, and the cooperation equipment of blowing is blown the scattered thermal treatment of blowing simultaneously to the circuit board that the polylith stacked, can buffer memory polylith circuit board simultaneously and realize the efficient radiating effect, dispels the heat to the circuit board fast.
Description
Technical Field
The utility model relates to the technical field of circuit board storage, in particular to a heat dissipation type circuit board cache machine.
Background
After being pasted, the circuit boards need to be subjected to high-temperature tin dipping or heated and welded by a heating furnace, so that the electronic components are solidified and mounted on the circuit boards, and the circuit boards are conveyed to a station of the next process by a conveying belt to be processed after the processes.
However, the temperature of these circuit boards is extremely high, which is not favorable for the next process, so that the circuit boards need to be radiated; in the existing heat dissipation, heat dissipation fans are arranged on a conveyor belt and blow air to a circuit board passing on the conveyor belt, so that the heat dissipation effect is achieved; however, the heat dissipation effect is not obvious, and only one circuit board can be cooled at a time, which results in poor efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation type circuit board buffer memory machine aiming at the defects of the prior art.
In order to achieve the purpose, the technical scheme of the utility model is as follows:
the utility model provides a heat dissipation type circuit board buffer memory machine, is including the buffer memory frame that is used for depositing the circuit board, and the buffer memory frame includes the board of depositing that two above intervals set up, and the mounting panel shaping has the embedded groove that a plurality of intervals set up, and the storing plate outside is provided with the equipment of blowing, and the storing plate bottom is provided with the lift actuating mechanism who drives the buffer memory frame and go up and down.
Further: the storage plates are vertically arranged in parallel, and a width adjusting mechanism for adjusting the distance between two adjacent storage plates is further arranged on the cache frame.
Further: the embedded groove is formed in the inner side wall of the storage plate along the horizontal direction at a given interval, the embedded grooves on two adjacent storage plates are horizontally coaxially arranged, and heat dissipation holes matched with a blowing system are uniformly formed in each storage plate.
Further: the width adjusting mechanism comprises a sliding rail used for slidably mounting the storage plates, a first lead screw assembly is arranged between every two adjacent storage plates and is used for sliding connection, and the first lead screw assembly comprises a plurality of first lead screws and first guide rods which are arranged in parallel.
Further: the storage plate is provided with a guide port for guiding the circuit board to enter, the guide port comprises a rolling wheel which is flush with the embedded groove, and the other end of the rolling wheel penetrates through the storage plate and is embedded with a driving wheel.
Further: the lifting driving mechanism comprises a sliding seat used for supporting the sliding rail, more than two groups of second lead screw assemblies are vertically nested at two ends of the sliding seat, each second lead screw assembly comprises a second lead screw, and one of the second lead screw assemblies further comprises second guide rods which are arranged on two sides of the second lead screw in parallel.
Further: the sliding seat is provided with a threaded sleeve in sliding fit with the second lead screw and a sleeve in coaxial fit with the second guide rod, the number of the second lead screw assemblies is two, and one of the second lead screws is provided with a power assembly and is connected to the other second lead screw through a transmission mechanism.
Further: the blowing equipment is a plurality of fans installed along the side wall of the storage plate, and air outlets of the fans are aligned with the radiating holes.
Further: the storage plate is provided with a lifting driving assembly in transmission connection with the driving wheel, the lifting driving assembly comprises a lifting seat arranged on the storage plate in a lifting mode, a telescopic cylinder piece is arranged on the lifting seat, a driving motor is horizontally arranged at the telescopic end of the telescopic cylinder piece, and the driving motor is provided with a driving wheel in transmission fit with the driving wheel.
The utility model has the beneficial effects that: according to the heat dissipation type circuit board caching machine, the caching frame can be used for collecting and caching a plurality of circuit boards in a lifting mode, the air blowing equipment is matched for carrying out air blowing heat dissipation treatment on a plurality of stacked circuit boards at the same time, the plurality of circuit boards can be cached at the same time, the efficient heat dissipation effect is achieved, and the circuit boards can be quickly cooled.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board buffer.
Fig. 2 is a schematic structural view of the connection between the storage plate and the width adjustment mechanism.
Fig. 3 is another view structure diagram of the connection between the storage plate and the width adjustment mechanism.
Fig. 4 is a partial structural schematic view of the storage plate, which includes a lifting driving assembly.
The reference numerals include:
1-cache frame
10-storage plate 11-embedded groove 12-radiating hole 13-fan
2-Width adjustment mechanism
21-slide rail 22-first lead screw component 23-first lead screw 24-first guide rod
25-screw sleeve 26-sleeve 27-knob handle
3-lifting driving mechanism
31-sliding seat 32-second lead screw assembly 33-second lead screw 34-second guide rod
35-power assembly
4-guide port
41-rolling wheel 42-transmission wheel 43-lifting driving component 44-linear module
45-lifting seat 46-telescopic cylinder member 47-driving motor 48-driving wheel.
Detailed Description
The present invention is described in detail below with reference to the attached drawings.
As shown in fig. 1-4, a heat dissipation type circuit board buffer memory machine includes a buffer memory frame 1 for storing a circuit board, the buffer memory frame 1 includes two storage plates 10 arranged at intervals, the storage plates 10 are formed with a plurality of embedded slots 11 arranged at intervals, a blowing device is arranged outside the storage plates 10, the buffer memory machine further includes a lifting driving mechanism 3 for driving the buffer memory frame 1 to lift, the circuit board to be cooled is conveyed to the front end of the buffer memory frame 1 by a conveying mechanism, the buffer memory frame 1 is driven to lift by the lifting driving mechanism 3, so that one of the embedded slots 11 is flush with the conveying mechanism, and the circuit board thereby enters the embedded slot 11 of the buffer memory frame 1; when the subsequent circuit board reaches the front end of the cache frame 1, the cache frame 1 is driven to lift by the lifting driving mechanism 3, the conveying mechanism is flush with the other embedded groove 11, and the circuit board enters the embedded groove 11 of the cache frame 1; from this, buffer memory frame 1 can collect the buffer memory to a plurality of circuit boards simultaneously, and the cooperation equipment of blowing is blown the scattered thermal treatment of blowing simultaneously to the circuit board that the polylith stacked, can buffer memory polylith circuit board simultaneously and realize the efficient radiating effect, dispels the heat to the circuit board fast.
The two storage plates 10 are vertically arranged in parallel, the cache frame 1 is further provided with a width adjusting mechanism 2 for adjusting the distance between the two adjacent storage plates 10, the width adjusting mechanism 2 comprises a slide rail 21 for slidably mounting the storage plates 10, a first lead screw assembly 22 is arranged between the two adjacent storage plates 10 for sliding connection, the first lead screw assembly 22 comprises a plurality of first lead screws 23 arranged in parallel, two of the first lead screws 23 are horizontally arranged at the top of the storage plates 10, one of the first lead screws 23 is arranged at the bottom of the storage plates 10 in parallel, one horizontal side of each first lead screw 23 is provided with a first guide rod 24, the storage plates 10 are provided with screw sleeves 25 coaxially matched with the first lead screws 23 and sleeves 26 in sliding fit with the first guide rods 24, one end of each of the two first lead screws 23 is provided with a knob handle 27, the knob handles 27 are twisted to drive the first lead screws 23 to rotate, the two storage plates 10 are close to or far away from each other through the screw sleeve 25 and the sleeve 26, and the gap between the two storage plates 10 is adjusted to adapt to circuit boards with more sizes.
Embedded groove 11 is with given interval along the horizontal direction shaping in storing plate 10 inside wall, the coaxial setting of embedded groove 11 level on two adjacent storing plate 10, thereby guarantee the depth of parallelism of every circuit board, do benefit to and conveying mechanism cooperation, the circuit board can easily seamlessly enter into in embedded groove 11, evenly formed has on every storing plate 10 with blast system complex louvre 12, blast apparatus is for following a plurality of fans 13 of storing plate 10 lateral wall installation, fan 13's air outlet aligns with louvre 12, the wind that fan 13 blew out enters into in buffer memory frame 1 along louvre 12, dispel the heat to the circuit board of placing, the radiating effect has been improved.
In addition, the storage plate 10 is provided with a guide port 4 for guiding the circuit board to enter, the guide port 4 comprises rolling wheels 41 flush with the embedded grooves 11, the rolling wheels 41 are mounted at two ends of each embedded groove 11, the other end of each rolling wheel 41 penetrates through the storage plate 10 and is embedded with a driving wheel 42, a lifting driving assembly 43 in transmission connection with the driving wheel 42 is mounted on one side of the storage plate 10, the lifting driving assembly 43 comprises a lifting seat 45 which is mounted on the storage plate 10 in a lifting mode, the lifting seat 45 is controlled to lift by a linear module 44 carrier, a telescopic cylinder 46 is mounted on the lifting seat 45, a driving motor 47 is mounted at the telescopic end of the telescopic cylinder 46 in horizontal installation, a driving wheel 48 in transmission fit with the driving wheel 42 is mounted on the driving motor 47, and the driving wheel 48 and the driving wheel 42 are gears.
When a part of the circuit board of the conveying mechanism enters the embedded groove 11, the linear module 44 works to drive the lifting seat 45 to a specified horizontal position, the driving motor 47 of the telescopic cylinder part 46 is driven to extend out, the driving wheel 48 is meshed with the corresponding driving wheel 42, the driving wheel 48 rotates to drive the driving wheel 42 to rotate, the circuit board is in rolling fit with the rolling wheel 41, and the conveying mechanism is driven into the embedded groove 11 by the circuit board to realize conveying; when the circuit board needs to be conveyed to different embedded grooves 11, the lifting seat 45 is lifted to a corresponding position to perform the same operation, so that the conveying is realized.
The lifting driving mechanism 3 comprises a sliding seat 31 for supporting the sliding rail 21, two second lead screw assemblies 32 are vertically nested at two ends of the sliding seat 31 and are respectively vertically installed at two ends of the sliding rail 21, each second lead screw assembly 32 comprises a second lead screw 33, one second lead screw assembly 32 further comprises a second guide rod 34 which is arranged at two sides of the second lead screw 33 in parallel, a threaded sleeve 25 in sliding fit with the second lead screw 33 and a sleeve 26 in coaxial fit with the second guide rod 34 are installed on the sliding seat 31, and one second lead screw 33 is provided with a power assembly 35 and is connected to the other second lead screw 33 through a transmission mechanism; one of them second lead screw 33 rotates, is connected and rotate simultaneously through taking transport mechanism and another second lead screw 33 transmission, makes sliding seat 31 slide from top to bottom along second lead screw 33 simultaneously through swivel nut 25, and the sleeve 26 of sliding seat 31 slides along second guide bar 34 is vertical simultaneously, has improved gliding stability, therefore buffer memory frame 1 can constantly go up and down to in receiving the circuit board and entering into embedded groove 11, realize the buffer memory heat dissipation.
In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the performance of the prior art and has practicability, and becomes a product with practical value.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (9)
1. The utility model provides a heat dissipation type circuit board buffer memory machine, includes the buffer memory frame that is used for depositing the circuit board, its characterized in that: the buffer memory frame includes the storage plate that two above intervals set up, and the storage plate shaping has the embedded groove that a plurality of intervals set up, and the storage plate outside is provided with the equipment of blowing, and the storage plate bottom is provided with the lift actuating mechanism who drives the buffer memory frame and go up and down.
2. The heat dissipation type circuit board buffer memory machine according to claim 1, characterized in that: the storage plates are vertically arranged in parallel, and a width adjusting mechanism for adjusting the distance between every two adjacent storage plates is further arranged on the cache frame.
3. The heat dissipation type circuit board buffer memory machine according to claim 1, characterized in that: the embedded groove is formed in the inner side wall of the storage plate along the horizontal direction at a given interval, the embedded grooves on two adjacent storage plates are horizontally coaxially arranged, and heat dissipation holes matched with a blowing system are uniformly formed in each storage plate.
4. The heat dissipation type circuit board buffer memory machine according to claim 2, characterized in that: the width adjusting mechanism comprises a sliding rail used for slidably mounting the storage plates, a first lead screw assembly is arranged between every two adjacent storage plates and is used for sliding connection, and the first lead screw assembly comprises a plurality of first lead screws and first guide rods which are arranged in parallel.
5. The heat dissipation type circuit board buffer memory machine according to claim 2, characterized in that: the storage plate is provided with a guide port for guiding the circuit board to enter, the guide port comprises a rolling wheel which is flush with the embedded groove, and the other end of the rolling wheel penetrates through the storage plate and is embedded with a driving wheel.
6. The heat dissipation type circuit board buffer memory machine according to claim 4, characterized in that: the lifting driving mechanism comprises a sliding seat used for supporting the sliding rail, more than two groups of second lead screw assemblies are vertically nested at two ends of the sliding seat, each second lead screw assembly comprises a second lead screw, and one second lead screw assembly further comprises second guide rods which are arranged on two sides of the second lead screw in parallel.
7. The heat dissipation type circuit board buffer memory machine according to claim 6, characterized in that: the sliding seat is provided with a threaded sleeve in sliding fit with the second lead screw and a sleeve in coaxial fit with the second guide rod, the number of the second lead screw assemblies is two, and one of the second lead screws is provided with a power assembly and is connected to the other second lead screw through a transmission mechanism.
8. The heat dissipation type circuit board buffer memory machine according to claim 3, characterized in that: the blowing equipment is a plurality of fans arranged along the side wall of the storage plate, and air outlets of the fans are aligned with the radiating holes.
9. The heat dissipation type circuit board buffer memory machine according to claim 5, characterized in that: the storage plate is provided with a lifting driving assembly in transmission connection with the driving wheel, the lifting driving assembly comprises a lifting seat arranged on the storage plate in a lifting mode, a telescopic cylinder piece is arranged on the lifting seat, a driving motor is horizontally arranged at the telescopic end of the telescopic cylinder piece, and the driving motor is provided with a driving wheel in transmission fit with the driving wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122403680.XU CN215872369U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation type circuit board buffer memory machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122403680.XU CN215872369U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation type circuit board buffer memory machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215872369U true CN215872369U (en) | 2022-02-18 |
Family
ID=80259988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122403680.XU Active CN215872369U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation type circuit board buffer memory machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215872369U (en) |
-
2021
- 2021-09-30 CN CN202122403680.XU patent/CN215872369U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 201, Building 1, No. 25 Jiling Industrial Road, Dalingshan Town, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Huayan Electronic Technology Co.,Ltd. Country or region after: China Address before: 523000 Room 101, building 3, No. 4, Jingye Road, Dalingshan Town, Dongguan City, Guangdong Province Patentee before: Dongguan Huayan Electronic Technology Co.,Ltd. Country or region before: China |