CN215872032U

CN215872032U - Solder resist jet printing equipment

Info

Publication number: CN215872032U
Application number: CN202122100072.1U
Authority: CN
Inventors: 刘俊峰; 黄德业; 莫雪生; 齐国栋
Original assignee: GCI Science and Technology Co Ltd; Zhuhai GCI Science and Technology Co Ltd
Current assignee: GCI Science and Technology Co Ltd; Zhuhai GCI Science and Technology Co Ltd
Priority date: 2021-09-01
Filing date: 2021-09-01
Publication date: 2022-02-18
Anticipated expiration: 2031-09-01

Abstract

The utility model relates to the technical field of PCB manufacturing, and discloses solder mask spray printing equipment which comprises a rack, and a material moving plate, a spray printing component and a curing component which are arranged on the rack, wherein the material moving plate is used for positioning and mounting a PCB and can move left and right and front and back relative to the rack; the jet printing assembly comprises a jet printing head and a positioning probe, the positioning probe is used for identifying the solder mask layer required to be reserved by the PCB, and the jet printing head can jet printing ink towards the solder mask layer required to be reserved by the PCB; the curing component comprises a UV light source and is used for curing ink sprayed and printed on the PCB, after the equipment is adopted, the solder resisting process can be simplified into the processes of solder resisting pretreatment → solder resisting plug holes (the step is canceled without the requirement of the plug holes) → solder resisting spray printing → solder resisting post baking, the processes of pre-baking, exposure, development and the like are not needed, the production process can be greatly simplified, the processing cost and the input cost of the equipment are reduced, the reject ratio and the rejection ratio of products can be reduced, the production efficiency can be improved, and the delivery period of the products is ensured.

Description

Solder resist jet printing equipment

Technical Field

The utility model relates to the technical field of PCB manufacturing, in particular to solder mask spray printing equipment.

Background

In the manufacturing process of the PCB, the traditional solder resist flow is a multi-step flow, the solder resist pretreatment, the solder resist plug hole (the step is canceled without the requirement of the plug hole), the solder resist printing, the solder resist pre-baking, the solder resist exposure, the solder resist development, the solder resist post-baking and other flows are required to be sequentially carried out, the processing cost is increased through the multi-step production flow, the input cost of production equipment is increased, meanwhile, the product reject ratio and the rejection ratio in the production process are also increased, in addition, the retention time of a production board is overlong, the production efficiency is lower, and the product delivery delay is caused.

SUMMERY OF THE UTILITY MODEL

Aiming at the technical problems in the prior art, the utility model provides solder mask spray printing equipment which can simplify a solder mask flow, reduce the production cost, improve the production efficiency and ensure the delivery period of products.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a solder mask spray printing device comprises a rack, and a material moving plate, a spray printing component and a curing component which are arranged on the rack, wherein the material moving plate is used for positioning and mounting a PCB and can move left and right and front and back relative to the rack; the jet printing assembly comprises a jet printing head and a positioning probe, the positioning probe is used for identifying the solder mask layer required to be reserved by the PCB, and the jet printing head can jet printing ink towards the solder mask layer required to be reserved by the PCB; the curing assembly includes a UV light source for curing ink jetted on the PCB.

Foretell hinder and spout seal equipment still includes prevents the UV optical gate, prevent that the UV optical gate is located in the frame, just prevent that the UV optical gate is located spout the printer head with between the UV light source.

According to the solder mask jet printing equipment, the jet printing head can move left and right relative to the rack.

In the solder mask jet printing equipment, the jet printing heads are provided with a plurality of jet printing heads.

Foretell hinder and weld and spout seal equipment, it still includes the printing ink bucket to spout the seal subassembly, the printing ink bucket passes through printing ink conveyer pipe intercommunication spout printer head.

In the solder mask spray printing equipment, the rack is provided with the workbench, and the material moving plate is connected in a left-right sliding manner and connected with the workbench in a front-back sliding manner.

The solder mask spray printing equipment disclosed by the utility model at least has the following beneficial effects: before spray printing, inputting solder resist pattern layer data required by a PCB into equipment, positioning and mounting the PCB on a material moving plate, driving the PCB to move left and right and move back and forth relative to a rack by the material moving plate during spray printing, starting to identify a solder resist layer required to be reserved on the PCB by a positioning probe in a spray printing assembly, then spraying printing ink towards the solder resist layer required to be reserved on the PCB by a spray printing head, moving the PCB to the lower part of a curing assembly after the printing ink is sprayed, irradiating the PCB by a UV light source, and directly curing the solder resist ink sprayed and printed on the PCB, wherein after the equipment is adopted, a solder resist flow can be simplified into pre-solder resist treatment → plug hole (the step is cancelled without the requirement of plug hole), solder resist spray printing → solder resist post-baking, flows such as pre-baking, exposure, development and the like are not required, the production flow can be greatly simplified, the processing cost and the investment cost of the equipment are reduced, and the reject ratio and the rejection ratio of products can be reduced, the waste of production and material cost is avoided, the production efficiency can be improved, and the delivery period of the product is ensured.

Drawings

The utility model will be further described with reference to the following figures and examples, in which:

fig. 1 is a schematic structural diagram of a solder resist jet printing apparatus according to an embodiment of the present invention.

In the drawings: 100 racks, 110 tables, 200 transfer plates, 310 inkjet heads, 320 ink barrels, 330 ink delivery tubes, 410UV light source, 500 UV light shutter.

Detailed Description

The embodiment of the utility model is described in detail below, and referring to fig. 1, the embodiment of the utility model provides a solder mask spray printing device, which comprises a frame 100, and a material moving plate 200, a spray printing component and a curing component which are arranged on the frame 100, wherein the material moving plate 200 is used for positioning and mounting a PCB and can move left and right and back and forth relative to the frame 100; the jet printing assembly comprises a jet printing head 310 and a positioning probe, wherein the positioning probe is used for identifying the solder mask layer required to be reserved by the PCB, and the jet printing head 310 can jet printing ink towards the solder mask layer required to be reserved by the PCB; the curing assembly includes a UV light source 410 for curing the ink jetted on the PCB.

Before spray printing, inputting the solder resist pattern layer data required by the PCB into the equipment, positioning and installing the PCB on the material moving plate 200, driving the PCB to move left and right and back and forth relative to the rack 100 by the material moving plate 200 during spray printing, identifying the solder resist layer required to be reserved on the PCB by a positioning probe in a spray printing assembly, then spraying printing ink towards the solder resist layer required to be reserved on the PCB by the spray printing head 310, not spraying printing ink on the solder resist layer not required to be reserved, moving the PCB to the lower part of a curing assembly after spraying printing ink, irradiating the PCB by the UV light source 410, directly curing the solder resist ink sprayed and printed on the PCB, simplifying the solder resist flow into pre-solder resist treatment → solder resist (eliminating the step without the requirement of a plug hole) → solder resist spray printing → post-baking, not needing pre-baking, exposing, developing and the like, and greatly simplifying the production flow, the processing cost and the equipment investment cost are reduced, the reject ratio and the rejection rate of products can be reduced, the waste of production, materials and other costs is avoided, the production efficiency can be improved, and the delivery period of the products is ensured.

Specifically, the rack 100 is provided with the workbench 110, the material moving plate 200 is connected with the workbench 110 in a left-right sliding manner and connected with the workbench 110 in a front-back sliding manner, further, the solder mask printing device further comprises a UV-proof shutter 500, the UV-proof shutter 500 is arranged on the rack 100, the UV-proof shutter 500 is positioned between the printing head 310 and the UV light source 410, ink curing of the printing head 310 by the UV light source 410 can be avoided, and blocking of the printing head 310 is avoided. Further, the jet-printing head 310 can move left and right relative to the frame 100, so that the positioning probe can be conveniently used for rapidly identifying the solder mask layer to be reserved on the PCB, and the jet-printing head 310 can be provided with a plurality of nozzles, so that the jet-printing efficiency is improved.

Further, the jet printing assembly further comprises an ink barrel 320, the ink barrel 320 is communicated with the jet printing head 310 through an ink delivery pipe 330, ink is continuously delivered to the jet printing head 310 through the ink delivery pipe 330, specifically, multiple groups of the ink barrel 320 and the ink delivery pipe 330 can be arranged, a liquid level sensor and an alarm are arranged in the ink barrel 320, a valve switch is arranged between the ink barrel 320 and the ink delivery pipe 330, one group of valve switches is firstly opened, ink is delivered to the jet printing head 310 through the ink barrel 320 and the ink delivery pipe 330, when the liquid level sensor identifies that the ink value in the ink barrel 320 is low, the alarm gives an alarm, at the moment, another group of switch valves can be opened by a worker, and the ink barrel 320 which has used up the ink is replaced.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims

1. The solder mask jet printing equipment is characterized by comprising a rack (100), and a material moving plate (200), a jet printing component and a curing component which are arranged on the rack (100);

the material moving plate (200) is used for positioning and mounting a PCB and can move left and right and front and back relative to the rack (100);

the jet printing assembly comprises a jet printing head (310) and a positioning probe, the positioning probe is used for identifying the solder mask layer required to be reserved by the PCB, and the jet printing head (310) can jet printing ink towards the solder mask layer required to be reserved by the PCB;

the curing assembly includes a UV light source (410) for curing ink jetted on the PCB.

2. The solder mask printing apparatus according to claim 1, further comprising a UV light shutter (500), wherein the UV light shutter (500) is provided on the frame (100), and wherein the UV light shutter (500) is located between the inkjet head (310) and the UV light source (410).

3. The solder mask printing apparatus of claim 1, wherein the print head (310) is movable to the left and right relative to the frame (100).

4. The solder mask printing apparatus according to claim 1, wherein the print head (310) is provided in plurality.

5. The solder mask jet printing apparatus according to claim 1, wherein the jet printing assembly further comprises an ink tank (320), the ink tank (320) communicating with the jet head (310) through an ink delivery tube (330).

6. The solder mask printing device according to claim 1, wherein a workbench (110) is arranged on the frame (100), and the material moving plate (200) is connected with the workbench (110) in a sliding manner from side to side and back and forth.