CN215871954U - Radio frequency channel isolation structure, circuit board and active antenna unit - Google Patents
Radio frequency channel isolation structure, circuit board and active antenna unit Download PDFInfo
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- CN215871954U CN215871954U CN202121163233.5U CN202121163233U CN215871954U CN 215871954 U CN215871954 U CN 215871954U CN 202121163233 U CN202121163233 U CN 202121163233U CN 215871954 U CN215871954 U CN 215871954U
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Abstract
The utility model discloses a radio frequency channel isolation structure, a circuit board and an active antenna unit, wherein a first device and a second device of a first radio frequency channel of the radio frequency channel isolation structure are arranged on the front surface of the circuit board; the third device and the fourth device of the second radio frequency channel are arranged on the reverse side of the circuit board; the first shielding wall is arranged between the first device and the second device, the first shielding wall is provided with a first heat dissipation assembly, and the third device is connected to the first heat dissipation assembly through the circuit board; and the second shielding wall is arranged between the third device and the fourth device and is provided with a second heat dissipation assembly, and the first device is connected to the second heat dissipation assembly through the circuit board. The utility model realizes the composite use of the heat dissipation structure and the isolation structure, skillfully combines the staggered layout of the front and the back of the circuit board, increases the usable board distribution area on the circuit board and realizes the miniaturized design of 5 GAAU.
Description
Technical Field
The utility model relates to the field of active antenna unit equipment, in particular to a radio frequency channel isolation structure, a circuit board and an active antenna unit.
Background
With the continuous development of 5G technology, 5G base stations are increasing, 5GAAU (Active Antenna Unit) is also widely used, and compared with 4GRRU (Radio Remote Unit), the number of channels in the AAU is increased, so that the size and weight of the AAU are also increased, and huge cost pressure is brought to production, transportation, station building and other work.
In the device arrangement structure of the circuit board in the existing AAU, two adjacent channels need to be separated through a partition wall, and in order to avoid collision between devices and between devices in the same channel and between devices and the partition wall, the distance between the devices and the surrounding structure is required to be not less than a specified distance, so that the effective utilization area on the circuit board is severely limited, and the size of the AAU cannot be further reduced.
SUMMERY OF THE UTILITY MODEL
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the utility model provides a radio frequency channel isolation structure, a circuit board and an active antenna unit, which can effectively reduce the board distribution size of the circuit board and realize the miniaturization design of equipment.
In a first aspect, an embodiment of the present invention provides a radio frequency channel isolation structure, including:
a circuit board including a first surface and a second surface which are front and back sides of each other;
a first radio frequency channel comprising a first device and a second device, the first device and the second device disposed on the first surface;
a second radio frequency channel comprising third and fourth devices disposed on the second surface;
the first shielding wall is arranged between the first device and the second device and is connected with the first surface, the first shielding wall is provided with a first heat dissipation assembly, and the third device is connected to the first heat dissipation assembly through the circuit board;
and the second shielding wall is arranged between the third device and the fourth device and is connected with the second surface, the second shielding wall is provided with a second heat dissipation assembly, and the first device is connected to the second heat dissipation assembly through the circuit board.
In a second aspect, an embodiment of the present invention further provides a circuit board, including at least one radio frequency channel isolation structure as described in the first aspect.
In a third aspect, an embodiment of the present invention further provides an active antenna unit, including at least one circuit board as described in the second aspect.
The radio frequency channel isolation structure provided by the embodiment of the utility model at least has the following beneficial effects: for the devices of two adjacent radio frequency channels, the upper surface and the lower surface of the circuit board are isolated, for the devices of the same radio frequency channel, the device of the same radio frequency channel is isolated through the isolation wall, meanwhile, the heat dissipation assembly is arranged at the position of the isolation wall, and a heat dissipation structure is provided for the devices on the other surface of the circuit board.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the example serve to explain the principles of the utility model and not to limit the utility model.
FIG. 1 is a top view of a typical radio frequency channel isolation structure;
FIG. 2 is a front view of an exemplary radio frequency channel isolation structure;
FIG. 3 is a perspective view of a typical radio frequency channel isolation structure;
FIG. 4 is a top view of an RF channel isolation structure provided in accordance with one embodiment of the present invention;
FIG. 5 is a front view of an RF channel isolation structure provided by one embodiment of the present invention;
fig. 6 is a perspective view of an rf channel isolation structure provided in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
It should be noted that the terms first, second and the like in the description and in the claims, and in the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Fig. 1 to fig. 3 can be referred to for structural schematic diagrams of two adjacent radio frequency channels in a typical 5GAAU structure at present, in fig. 1, the two radio frequency channels are arranged side by side, each channel (taking the radio frequency channel on the left as an example) has a power amplifier 101 and a peripheral device 102, where the power amplifier is a device for amplifying terminal power in an AAU radio frequency, and under a normal operation condition, the device has a large heat generation amount, and a corresponding heat dissipation structure 103 needs to be designed for the device, so as to avoid over-temperature of the power amplifier, and even influence on normal operation of other devices; in the structural distribution manner, referring to fig. 2 and 3, the heat dissipation structure 103 is located below the circuit board 104, the power amplifier 101 is located above the circuit board 104, and the peripheral device 102 is located below the circuit board 104 and isolated from the power amplifier 101 by the circuit board 104, so that the left rf channel realizes mutual isolation of devices in the same rf channel and the heat dissipation structure of the power amplifier; the layout of the right rf channel is similar to that of the left rf channel, and the power amplifier 201 and the peripheral device 202 are isolated by the circuit board 104, and the heat dissipation structure 203 is disposed below the power amplifier 201 to assist in heat dissipation; and the following isolation structure is also adopted between two adjacent radio frequency channels: the isolation wall 105 is arranged above the circuit board 104, the power amplifier 101 and the power amplifier 201 above the circuit board 104 are isolated by the isolation wall 105, the isolation wall 205 is arranged below the circuit board 104, and the peripheral device 102 and the peripheral device 202 below the circuit board 104 are isolated by the isolation wall 205, so that the isolation between two adjacent radio frequency channels is realized.
The above structure has a problem that in order to avoid the collision of the peripheral device 102 under the circuit board 104 during the production and installation processes, the peripheral device 102 must avoid the heat dissipation structure 103 and the isolation wall 105, and the collision avoidance space generally requires the device to be at least 2mm away from the surrounding structure, which results in a severe limitation of the effective utilization area on the circuit board 104 and a limitation of the AAU's further size reduction for the circuit board 104 with high integration.
Taking 5G 64TAAU as an example, there are generally 4 rows of power amplifiers, each row of power amplifiers has 16 rf channels, and the design according to the typical rf channel isolation structure described above makes the AAU have too large size and weight, and the installation manner of the conventional 4GRRU is no longer suitable for 5GAAU, which brings huge cost pressure for production, transportation, station building and other work.
Based on this, embodiments of the present invention provide a radio frequency channel isolation structure, a circuit board, and an active antenna unit, which are used to implement multiplexing of a heat dissipation structure and an isolation structure, to implement isolation between a channel and a device, and to increase an available board layout area on the circuit board, and to implement a miniaturized design of 5GAAU, aiming at the problem of a small effective utilization area in the existing side-by-side radio frequency channel design.
The embodiments of the present invention will be further explained with reference to the drawings.
Referring to fig. 4, an embodiment of the present invention provides a radio frequency channel isolation structure, including
A circuit board 304 including a first surface and a second surface that are front and back sides of each other;
a first rf channel including a first device 301 and a second device 302, the first device 301 and the second device 302 being disposed on a first surface;
a second rf channel comprising a third device 401 and a fourth device 402, the third device 401 and the fourth device 402 being disposed on a second surface;
a first shielding wall 303 disposed between the first device 301 and the second device 302, the first shielding wall 303 being connected to the first surface, the first shielding wall 303 being provided with a first heat dissipating member 305, the third device 401 being connected to the first heat dissipating member 305 through a circuit board 304;
and a second shielding wall 403 disposed between the third device 401 and the fourth device 402, the second shielding wall 403 being connected to the second surface, the second shielding wall 403 being provided with a second heat dissipation member 405, the first device 301 being connected to the second heat dissipation member 405 through the circuit board 304.
In this embodiment, each of the two rf channels includes a device with a larger heat generation amount and requiring to arrange a heat dissipation structure to assist heat dissipation, as can be seen from the distribution of the heat dissipation assemblies in the structures of fig. 5 and 6, the first device 301 of the first rf channel is a device with a larger heat generation amount, the third device 401 of the second rf channel is a device with a larger heat generation amount, and the two devices may be power amplifiers, or other devices with high energy consumption and high heat generation, such as a high-performance processor, and the like, which is not limited herein.
Unlike the typical 5GAAU structure, the first rf channel and the second rf channel of the present embodiment are separated by the front and back sides of the circuit board 304, the first surface of the circuit board 304, i.e. the upper surface of the circuit board 304 in fig. 5, is used for carrying the first device 301 and the second device 302 of the first rf channel, and the second surface of the circuit board 304, i.e. the lower surface of the circuit board 304 in fig. 5, is used for carrying the third device 401 and the fourth device 402 of the second rf channel, while in the same rf channel, the first device 301 and the second device 302 are separated by the first shielding wall 303, and the third device 401 and the fourth device 402 are separated by the second shielding wall, and in order to assist the first device 301 and the third device 401 to dissipate heat, the first heat dissipation assembly 305 is further disposed at the first shielding wall 303, the second heat dissipation assembly 405 is disposed at the second shielding wall 403, so that the first heat dissipation assembly 305 is disposed above the third device 401, the second heat dissipation device is located below the first device 301, so that the composite use of the heat dissipation structure and the isolation structure is realized, compared with a typical 5GAAU structure, the front and back staggered layout of the circuit board 304 is skillfully utilized in the embodiment, so that the isolation wall between two adjacent channels does not exist any more, an independent heat dissipation structure is not required to be additionally added, the avoidance size between the peripheral device and the heat dissipation structure is also saved, the available area on the circuit board 304 is increased, and the further compression of the equipment size is realized.
It should be noted that the first rf channel is not limited to only the first device 301 and the second device 302, and actually a single AAU rf channel includes a large number of electronic devices, the electronic devices are arranged on the circuit board 304, and a part of the electronic devices need to be isolated from the first device 301, so that the electronic devices can be arranged as the second device 302 in the manner of this embodiment, and another part of the electronic devices need not be isolated from the first device 301, and can be arranged in a conventional board arrangement manner. The second rf channel is the same as the first rf channel, and a description thereof will not be repeated.
It can be understood that a single rf channel isolation structure of this embodiment can accommodate and isolate two rf channels, and for an AAU in which multiple rf channels are arranged side by side, it is sufficient to combine multiple rf channel isolation structures of this embodiment according to data of the rf channels. Therefore, the boundary of the single radio frequency channel isolation structure of the embodiment is also provided with a corresponding isolation structure, so that two adjacent radio frequency channel isolation structures can be isolated from each other. Specifically, referring to fig. 5, the radio frequency channel isolation structure further includes:
a first shield 306, the first shield 306 covering the first surface to surround the first rf channel;
and a second shield 406, the second shield 406 covering the second surface to enclose the second rf channel.
The first shielding cover 306 is used to surround the first rf channel, so that the first shielding cover 306 covers the first surface in the form of a cover, and each device corresponding to the first rf channel is surrounded in the cover, so that a shielding space for shielding the first rf channel is formed between the first shielding cover 306 and the circuit board 304, thereby realizing isolation between the first rf channel and the other rf channels on the left and right. The second shielding can 406, similar to the first shielding can 306, is used for surrounding each device corresponding to the second rf channel, so as to achieve isolation between the second rf channel and other rf channels on the left and right.
In actual design, in order to reduce the difficulty of production and installation and save the production and installation procedures, some structures in the embodiment can be integrally produced. For example, the first shielding wall 303, the first shielding can 306, and the first heat dissipating member 305 are integrally connected, and the second shielding wall 403, the second shielding can 406, and the second heat dissipating member 405 are integrally connected. Since the first shielding wall 303 and the second shielding case 406 both have shielding functions and have a connection relationship therebetween, they can be integrally designed and produced, and for the first heat dissipation assembly 305, when a shielding material with good thermal conductivity is used, the first heat dissipation assembly 305 and the first shielding wall 303 can also be integrally designed and produced, so that the first shielding wall 303, the first shielding case 306 and the first heat dissipation assembly 305 are combined into a single assembly, which is integrally made of the same material, and can be directly mounted on the first surface of the circuit board 304, thereby saving the mounting process. The second shielding wall 403, the second shielding cover 406 and the second heat dissipation assembly 405 may also be integrally designed and produced, which also saves the installation process.
It is understood that if the heat conducting property of the shielding material is not good, the first heat dissipation assembly 305 may be considered to be additionally disposed, for example, the first heat dissipation assembly 305 is attached to the first shielding wall 303 as an additional component, as long as the first heat dissipation assembly 305 contacts the third device 401 through the circuit board 304 to achieve auxiliary heat dissipation; for another example, a gap is left at a position of the first shielding wall 303, and the first heat dissipation assembly 305 is mounted at the gap and contacts the third device 401 through the circuit board 304, which can also satisfy the multiplexing structure of the embodiment.
In some cases, the first shield wall 303 is connected to a sidewall of the first shield can 306, and the second shield wall 403 is connected to a sidewall of the second shield can 406. In order to further improve the shielding effect, the shielding wall is connected to the side wall of the shielding case, so that the space above the first surface of the circuit board 304 can be divided and isolated, and for the second device 302, the side wall of the first shielding wall 303 and the side wall of the first shielding case 306 enclose an independent space, so that the first device 301 and the second device 302 can be well isolated. Similarly, another independent space is also defined between the second shielding wall 403 and the sidewall of the second shielding can 406 for isolating the fourth device 402.
In order to realize the regularization design, a plurality of radio frequency channels which are arranged side by side are orderly arranged in the same mode; for example, the first shielding wall 303 and the second shielding wall 403 are both strip-shaped, and the first shielding wall 303 and the second shielding wall 403 are arranged in parallel
It is understood that different shapes of heat dissipation assemblies may be used to aid in heat dissipation depending on the size of the first device 301 and the third device 401 on the circuit board 304. For example, referring to fig. 4, the first heat dissipation assembly 305 is a three-dimensional rectangle, and a projection size of the first heat dissipation assembly 305 on the circuit board 304 is larger than a projection size of the third device 401 on the circuit board 304. In the case where the third device 401 is a rectangular chip, in order to ensure that the heat dissipation portion of the first heat dissipation assembly 305 can cover the entire surface of the third device 401, on the circuit board 304, the length and width of the projection of the first heat dissipation assembly 305 are larger than those of the projection of the third device 401, respectively. It should be noted that, by default, the first heat dissipation assembly 305 is formed by a single component, for example, the first heat dissipation assembly 305 and the first shielding wall 303 are integrated, that is, the first shielding wall 303 is partially enlarged to form the first heat dissipation assembly 305, and for example, the first heat dissipation assembly 305 is attached to one side of the first shielding wall 303 in a single component. Regarding the relationship between the second heat sink 405 and the projection area of the first device 301 on the circuit board 304, the relationship is similar to the above, i.e. the second heat sink 405 is a solid rectangle, and the projection size of the second heat sink 405 on the circuit board 304 is larger than the projection size of the first device 301 on the circuit board 304, and the description is not repeated here.
It should be noted that, although the projection of the third device 401 on the circuit board 304 is not necessarily rectangular, the first heat dissipation assembly 305 is not necessarily designed according to the shape of the third device 401, as long as the first heat dissipation assembly 305 can cover the heat generating surface of the third device 401, and the second heat dissipation assembly 405 is the same.
Through the structure of the embodiment, the composite use of the shielding wall and the heat dissipation assembly is utilized, and the staggered layout of the front side and the back side of the circuit board 304 is combined, so that the usable board distribution area on the circuit board 304 can be increased, the miniaturized design of 5GAAU is realized, and the competitiveness of the whole machine is improved.
The following describes an embodiment of the present invention with a practical example:
referring to fig. 4 to 6, a single rf channel isolation structure may accommodate two rf channels, including a first rf channel and a second rf channel, where the first rf channel includes a first device 301 and a second device 302, the second rf channel includes a third device 401 and a fourth device 402, the first device 301 and the third device 401 are power amplifiers with large heat generation, and a heat dissipation assembly is required to be arranged to perform auxiliary heat dissipation.
Two radio frequency channels are separated by the front side and the back side of a circuit board 304, a first radio frequency channel is positioned on the upper surface of the circuit board 304, a second radio frequency channel is positioned on the lower surface of the circuit board 304, the first radio frequency channel separates a first device 301 and a second device 302 through a first separating wall, the first separating wall is locally expanded to form a first heat dissipation assembly 305, the first heat dissipation assembly 305 is connected with a third device 401 through the circuit board 304, the second radio frequency channel separates the third device 401 and a fourth device 402 through a second separating wall, the second separating wall is locally expanded to form a second heat dissipation assembly 405, and the second heat dissipation assembly 405 is connected with the first device 301 through the circuit board 304; a first shield 306 and a second shield 406 are also included, the first shield 306 and the second shield 406 covering the first rf path and the second rf path, respectively, from the front and back sides of the circuit board 304.
The structure ensures the heat dissipation requirements of the first device 301 and the third device 401, and simultaneously, the front and back staggered layout of the circuit board 304 is skillfully utilized to compound the isolation structure and the heat dissipation structure, so that the available board distribution area on the circuit board 304 is increased, the size and the weight of 5GAAU are further reduced, and the competitiveness of the whole machine is improved.
The embodiment of the utility model also provides a circuit board which comprises the at least one radio frequency channel isolation structure. Under the condition that the circuit board bears a plurality of radio frequency channels, the radio frequency channel isolation structure is applied, so that the occupation of the radio frequency channels in the area of the circuit board can be reduced, the size of the circuit board can be reduced, and the integration level is improved.
The embodiment of the utility model also provides an active antenna unit which comprises the at least one circuit board. The active antenna unit is an AAU (antenna unit), an even number of radio frequency channels are usually integrated, and the radio frequency channel isolation structure can be applied by installing the circuit board provided with at least one radio frequency channel isolation structure, so that the occupation of the radio frequency channels on the area of the circuit board can be reduced, the size of the circuit board can be reduced, and the integration level can be improved.
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope of the present invention defined by the claims.
Claims (11)
1. A radio frequency channel isolation structure, comprising:
a circuit board including a first surface and a second surface which are front and back sides of each other;
a first radio frequency channel comprising a first device and a second device, the first device and the second device disposed on the first surface;
a second radio frequency channel comprising third and fourth devices disposed on the second surface;
the first shielding wall is arranged between the first device and the second device and is connected with the first surface, the first shielding wall is provided with a first heat dissipation assembly, and the third device is connected to the first heat dissipation assembly through the circuit board;
and the second shielding wall is arranged between the third device and the fourth device and is connected with the second surface, the second shielding wall is provided with a second heat dissipation assembly, and the first device is connected to the second heat dissipation assembly through the circuit board.
2. The radio frequency channel isolation structure of claim 1, further comprising:
a first shield covering the first surface to enclose the first radio frequency channel.
3. The radio frequency channel isolation structure of claim 2, wherein the first shielding wall, the first shield, and the first heat sink assembly are integrally connected, and the first shielding wall is connected to a sidewall of the first shield.
4. The radio frequency channel isolation structure of claim 2 or 3, further comprising:
a second shield covering the second surface to enclose the second radio frequency channel.
5. The radio frequency channel isolation structure of claim 4, wherein the second shielding wall, the second shielding can, and the second heat sink assembly are integrally connected, the second shielding wall being connected to a sidewall of the second shielding can.
6. The rf channel isolation structure of claim 1, wherein the first shielding wall and the second shielding wall are both strip-shaped, and the first shielding wall and the second shielding wall are disposed in parallel.
7. The rf channel isolation structure of claim 1, wherein the first heat dissipation assembly is a rectangular solid, and a projection dimension of the first heat dissipation assembly on the circuit board is larger than a projection dimension of the third device on the circuit board.
8. The rf channel isolation structure of claim 1, wherein the second heat dissipation assembly is a rectangular solid, and a projection dimension of the second heat dissipation assembly on the circuit board is larger than a projection dimension of the first device on the circuit board.
9. The radio frequency channel isolation structure of claim 1, wherein the first device and the third device are both power amplifiers.
10. A circuit board comprising at least one radio frequency channel isolation structure as claimed in any one of claims 1 to 9.
11. An active antenna element comprising at least one circuit board as claimed in claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121163233.5U CN215871954U (en) | 2021-05-27 | 2021-05-27 | Radio frequency channel isolation structure, circuit board and active antenna unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121163233.5U CN215871954U (en) | 2021-05-27 | 2021-05-27 | Radio frequency channel isolation structure, circuit board and active antenna unit |
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| Publication Number | Publication Date |
|---|---|
| CN215871954U true CN215871954U (en) | 2022-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121163233.5U Active CN215871954U (en) | 2021-05-27 | 2021-05-27 | Radio frequency channel isolation structure, circuit board and active antenna unit |
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| Country | Link |
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| CN (1) | CN215871954U (en) |
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2021
- 2021-05-27 CN CN202121163233.5U patent/CN215871954U/en active Active
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