CN215871158U - Embedment type isolated power heat exchange device - Google Patents

Embedment type isolated power heat exchange device Download PDF

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Publication number
CN215871158U
CN215871158U CN202122339707.3U CN202122339707U CN215871158U CN 215871158 U CN215871158 U CN 215871158U CN 202122339707 U CN202122339707 U CN 202122339707U CN 215871158 U CN215871158 U CN 215871158U
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CN
China
Prior art keywords
heat
adhesive layer
power supply
isolated power
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202122339707.3U
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Chinese (zh)
Inventor
谷海辉
黄县标
周三喜
谷庆伟
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Au Southernsky Electronics Co ltd
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Au Southernsky Electronics Co ltd
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Publication date
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Priority to CN202122339707.3U priority Critical patent/CN215871158U/en
Application granted granted Critical
Publication of CN215871158U publication Critical patent/CN215871158U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a potting type isolated power supply heat exchange device which comprises a packaging shell, wherein a switching power supply module, an insulating heat-conducting adhesive layer, a metal shielding net layer and a packaging adhesive layer are sequentially arranged in the packaging shell from inside to outside; a plurality of radiating fins fixed or attached to the metal shielding net layer penetrate through the upper surface or the side surface of the packaging adhesive layer; the outer surface of the packaging shell is provided with a plurality of slots correspondingly accommodating the radiating fins and radiating fans for blowing and cooling air in the slots; change original encapsulating layer into insulating heat-conducting glue film, metallic shield stratum reticulare and encapsulation glue film three-layer, metallic shield stratum reticulare when shielding the inductance with the quick absorption switching power module heat that produces of insulating heat-conducting glue film cooperation to through the quick effluvium of radiating fin to the outside, whole encapsulation good reliability, interference immunity is strong, can carry out thermal effluvium comparatively the efficient simultaneously, avoids the heat to pile up.

Description

Embedment type isolated power heat exchange device
Technical Field
The utility model relates to the technical field of switching power supply modules, in particular to a potting type isolated power supply heat exchange device.
Background
The isolated power supply is a power supply which uses a transformer to reduce the voltage of 220V to a lower voltage and then rectifies the voltage to direct current output for power supply, in order to obtain better external interference resistance, the isolated power supply is often encapsulated by glue filling during use, at present, a device for enhancing heat dissipation aiming at encapsulation is not provided, and certain heat accumulation hidden trouble exists when the power supply operates in a high-compound mode.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a potting isolated power heat exchanger, which solves the above-mentioned drawbacks of the prior art.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the encapsulated isolated power supply heat exchange device comprises an encapsulation shell, wherein a switching power supply module, an insulating heat-conducting adhesive layer, a metal shielding net layer and an encapsulation adhesive layer are sequentially arranged inside the encapsulation shell from inside to outside; a plurality of radiating fins fixed or attached to the metal shielding net layer penetrate through the upper surface or the side surface of the packaging adhesive layer; the outer surface of the packaging shell is provided with a plurality of slots correspondingly accommodating the radiating fins and a plurality of radiating fans for blowing and cooling in the slots.
The utility model relates to a potting type isolated power supply heat exchange device, wherein a concave groove corresponding to an air outlet surface of a cooling fan is arranged on the outer surface of a packaging shell, and a plurality of grooves and the concave groove are positioned on the same surface of the packaging shell and are communicated.
The utility model relates to a potting type isolated power supply heat exchange device, wherein a plurality of slots are all positioned on the outer side surface of a packaging shell.
The utility model relates to a potting isolated power supply heat exchange device, wherein the metal shielding mesh layer is partially embedded on the outer surface of the insulating heat-conducting adhesive layer.
The utility model relates to a potting type isolated power supply heat exchange device, wherein an air deflector for controlling the air outlet direction is connected and arranged in a slot through a damping rotating shaft.
The utility model has the beneficial effects that: change original encapsulating layer into insulating heat-conducting glue film, metallic shield stratum reticulare and encapsulation glue film three-layer, metallic shield stratum reticulare when shielding the inductance with the quick absorption switching power module heat that produces of insulating heat-conducting glue film cooperation to through the quick effluvium of radiating fin to the outside, whole encapsulation good reliability, interference immunity is strong, can carry out thermal effluvium comparatively the efficient simultaneously, avoids the heat to pile up.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
fig. 1 is a cross-sectional view of a potted isolated power heat exchange device according to a preferred embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
As shown in fig. 1, the encapsulated isolated power heat exchanger according to the preferred embodiment of the present invention includes an encapsulation casing 1, and a switching power module 2, an insulating heat-conducting adhesive layer 10, a metal shielding mesh layer 11, and an encapsulation adhesive layer 12 are sequentially disposed inside the encapsulation casing 1 from inside to outside; a plurality of radiating fins 13 fixed or attached to the metal shielding mesh layer 11 penetrate through the upper surface or the side surface of the packaging adhesive layer 12; the outer surface of the package housing 1 is provided with a plurality of slots 14 correspondingly accommodating the radiating fins 13 and a radiating fan 15 for cooling air blown into the plurality of slots 14;
change original encapsulating layer into insulating heat-conducting glue film 10, metallic shield stratum reticulare 11 and encapsulation glue film 12 three-layer, metallic shield stratum reticulare 11 when shielding the inductance with the quick heat that absorbs switching power supply module 2 production of insulating heat-conducting glue film 10 cooperation to through the quick effluvium of radiating fin 13 to the outside, whole encapsulation reliability is good, interference immunity is strong, can carry out thermal effluvium comparatively the efficient simultaneously, avoids the heat to pile up.
Preferably, the outer surface of the package housing 1 is provided with a concave groove 16 corresponding to the air outlet surface of the cooling fan 15, and the plurality of slots 14 and the concave groove 16 are located on the same surface of the package housing 1 and are communicated; the structure is succinct, and can effectually carry out the cooling of the synchronous air inlet of a plurality of fluting, and the wholeness is good, and the outward appearance is pleasing to the eye.
Preferably, the plurality of slots 14 are located on the outer side surface of the package housing 1.
Preferably, the metal shielding mesh layer 11 is partially embedded in the outer surface of the insulating heat-conducting adhesive layer 10; avoid becoming flexible, ensure laminating heat conduction effect simultaneously.
Preferably, an air deflector 18 for controlling the air outlet direction is connected and arranged in the slot 14 through a damping rotating shaft 17; the adjustment of air-out is convenient to carry out.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the utility model as defined in the appended claims.

Claims (5)

1. A sealed isolated power supply heat exchange device is characterized by comprising a packaging shell, wherein a switching power supply module, an insulating heat-conducting adhesive layer, a metal shielding net layer and a packaging adhesive layer are sequentially arranged inside the packaging shell from inside to outside; a plurality of radiating fins fixed or attached to the metal shielding net layer penetrate through the upper surface or the side surface of the packaging adhesive layer; the outer surface of the packaging shell is provided with a plurality of slots correspondingly accommodating the radiating fins and a plurality of radiating fans for blowing and cooling in the slots.
2. The encapsulated isolated power heat exchanger of claim 1, wherein the outer surface of the encapsulating housing is provided with a concave groove corresponding to the air outlet surface of the cooling fan, and the plurality of slots and the concave groove are located on the same surface of the encapsulating housing and communicated with each other.
3. The potted isolated power heat exchange device of claim 2 wherein the plurality of slots are each located on an outside surface of the encapsulating housing.
4. The heat exchanger of isolated power supply of any of claims 1-3, wherein the metal shielding mesh layer is partially embedded in the outer surface of the insulating and heat conducting adhesive layer.
5. The heat exchanger of isolated power supply of any of claims 1-3, wherein a wind deflector for controlling the wind direction is connected and arranged in the slot through a damping rotating shaft.
CN202122339707.3U 2021-09-26 2021-09-26 Embedment type isolated power heat exchange device Expired - Fee Related CN215871158U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122339707.3U CN215871158U (en) 2021-09-26 2021-09-26 Embedment type isolated power heat exchange device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122339707.3U CN215871158U (en) 2021-09-26 2021-09-26 Embedment type isolated power heat exchange device

Publications (1)

Publication Number Publication Date
CN215871158U true CN215871158U (en) 2022-02-18

Family

ID=80260782

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122339707.3U Expired - Fee Related CN215871158U (en) 2021-09-26 2021-09-26 Embedment type isolated power heat exchange device

Country Status (1)

Country Link
CN (1) CN215871158U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220218

CF01 Termination of patent right due to non-payment of annual fee